LED CL-190IR-X Miniature Surface Mountable Infrared Chip LED CL-190IR-X Features 1. Dimensions : 1.6(L)x0.8(W)x0.8(H) mm, being Ultra-small size 1. 1.6(L)x0.8(W)x0.8 (H)mm Application /Outline drawing /Absolute Maximum Rating LED die Resin Soldering terminal /Item /Power dissipation /Forward current /Pulse forward current /Reverse voltage /Operating temperature range /Storage temperature range 1 (1.2) (1.08) Polarity (0.2) 0.3 1.6 (0.3) LED (0.4) 0.28 Cathode mark P.C.board 0.8 0.8 1.Duty 1 1.Duty ratio1 /Unit : mm /Symbol Pd IF IFP VR TOP TST (Ta 25) /Rating 80 50 11 5 -25+80 -30+85 /Unit mW mA A V f=1KHz Frequensy=1KHz /Electro-optical characteristics The following soldering patterns are recommended for 0.8 For reflow soldering 0.7 (Ta 25) /Item Symbol Conditions Min Typ /Forward voltage VF IF=20mA 1.2 /Reverse current IR VR=5V /Capacitance between terminals Ct V=0V f=1MHz 13 /Response time Tr,Tf IF=20mA 2 /Radiant intensity Ie IF=20mA 0.25 0.6 /Peak wave length p IF=20mA 950 /Spectrum width of half value IF=20mA 45 reflow-soldering: 0.8 1. ID registration for pager 2. Other optical communication 1. ID 2. 0.8 Max Unit 1.6 V 100 A pF S - mW/sr nm nm Characteristics Ie-IF Ie-IF Characteristics IF-VF IF-VF Characteristics 1000 VF-Ta VF-Ta Characteristics Ie-Ta Ie-Ta Characteristics 5 10 IF=20mA 1.6 1 10 VF (V) IF (mA) Relative le 1.5 Ie(mw/sr) 100 1 IF=20mA 1.1 1 1.5 10 0.1 -40 100 -20 0 20 IF (mA) VF(V) Spectral Distribution 40 60 1.0 -40 80 IFmax-Ta IFmax-Ta Characteristics IF=50mA Ta=25C Directive Characteristics 60 40 IFmax(mA) 50 60 40 40 50 60 20 10 nm 78 0 -40 40 50 80 30 20 0 880 900 920 940 960 980 1000 1020 30 20 10 0 10 20 30 120 100 -20 0 20 40 Ta(C) 60 80 60 60 70 40 70 80 20 80 90 0 -20 0 20 40 Ta (C) Ta(C) 100 80 1.3 1.2 0.1 1 1.0 1.4 90 60 80 100