Chip Resistor Surface Mount
Temperature
Coefficient of
Resistance
(T.C.R.)
At +25/–55 °C and +25/+125 °C
×106 (ppm/°C)
Where
t1=+25 °C or specified room temperature
t2=–55 °C or +125 °C test temperature
R1=resistance at reference temperature in ohms
R2=resistance at test temperature in ohms
MIL-STD-202G Method 108A
IEC 60115-1 4.25.1
At 70± 5℃ for 1,000 hours; RCWV applied for
1.5 hours on and 0.5 hour off, still air required
± (1%+0.05Ω) for D/F tol
± (3%+0.05Ω) for J tol
<100mR for jumper
High
Temperature
Exposure
MIL-STD-202G Method 108A
IEC 60115-1 4.25.3
1,000 hours at maximum operating temperature
depending on specification, unpowered.
± (1%+0.05Ω) for D/F tol
± (2%+0.05Ω) for J tol
<50mR for jumper
MIL-STD-202G Method 106F
IEC 60115-1 4.24.2
Each temperature / humidity cycle is defined at
8 hours (method 106F), 3 cycles / 24 hours for
10d with 25 °C / 65 °C 95% R.H, without steps
7a & 7b, unpowered
Parts mounted on test-boards, without
condensation on parts
± (0.5%+0.05Ω) for D/F tol
± (2%+0.05Ω) for J tol
<100mR for jumper
Steady state for 1000 hours at 40 °C / 95% R.H.
RCWV applied for 1.5 hours on and
0.5 hour off
± (1%+0.05Ω) for D/F tol
± (2%+0.05Ω) for J tol
<100mR for jumper
-55/+125℃
Note Number of cycles required is 300 Devices
mounted
Maximum transfer time is 20 seconds Dwell time
is 15 minutes. Air - Air
± (0.5%+0.05Ω) for D/F tol
± (1%+0.05Ω) for J tol
<50mR for jumper
2.5 times RCWV or maximum overload voltage
which is less for 5 seconds at room temperature
± (1%+0.05Ω) for D/F tol
± (2%+0.05Ω) for J tol
<50mR for jumper
No visible damage
Device mounted or as described only 1 board
bending required
bending time: 60± 5 seconds
0100/0201/0402:5mm;
0603/0805:3mm;
1206 and above:2mm
± (1%+0.05Ω) for D/F/J Tol
<50mR for jumper
No visible damage
Table 8 Test condition, procedure and requirements