DMN2004WKQ
Document number: DS39166 Rev. 1 - 2
1 of 6
www.diodes.com
August 2016
© Diodes Incorporated
DMN2004WKQ
N-CHANNEL ENHANCEMENT MODE MOSFET
Product Summary
BVDSS
RDS(ON) max
ID
TC = +25°C
20V
550 mGS = 4.5V
0.54 mA
Description and Applications
This MOSFET is designed to meet the stringent requirements of
Automotive applications. It is qualified to AEC-Q101, supported by a
PPAP and is ideal for use in:
Engine Management Systems
DC-DC Converters
Body Control Electronics
Ordering Information (Note 5)
Part Number
Case
Packaging
DMN2004WKQ-7
SOT-323
3,000/Tape & Reel
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html ogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. Automotive products are AEC-Q101 qualified and are PPAP capable. Refer to http://www.diodes.com/product_compliance_definitions.html
5. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Marking Information
Date Code Key
Year
2016
2017
2018
2019
2020
2021
2022
Code
D
E
F
G
H
I
J
Month
Jan
Feb
Mar
Apr
May
Jun
Jul
Aug
Sep
Oct
Nov
Dec
Code
1
2
3
4
5
6
7
8
9
O
N
D
SOT-323
TOP VIEW
TOP VIEW
G S
D
NAB = Product Type Marking Code
YM = Date Code Marking
Y  = Year (ex: D = 2016)
M = Month (ex: 9 = September)
NAB
YM
D
S
G
Gate Protection
Diode
Internal Schematic
ESD protected Gate
DMN2004WKQ
Document number: DS39166 Rev. 1 - 2
2 of 6
www.diodes.com
August 2016
© Diodes Incorporated
DMN2004WKQ
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Value
Units
Drain-Source Voltage
VDSS
20
V
Gate-Source Voltage
VGSS
±8
V
Drain Current (Note 6) Steady
State
TA = +25°C
TA = +85°C
ID
540
390
mA
Pulsed Drain Current (Note 7)
IDM
1.5
A
Thermal Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Value
Units
Total Power Dissipation (Note 6)
PD
200
mW
Thermal Resistance, Junction to Ambient
RJA
625
°C/W
Operating and Storage Temperature Range
TJ, TSTG
-55 to +150
°C
Notes: 6. Device mounted on FR-4 PCB.
7. Pulse width 10µS, Duty Cycle 1%.
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Min
Typ
Max
Unit
Test Condition
OFF CHARACTERISTICS (Note 8)
Drain-Source Breakdown Voltage
BVDSS
20
V
VGS = 0V, ID = 10A
Zero Gate Voltage Drain Current
IDSS
1
A
VDS = 16V, VGS = 0V
Gate-Source Leakage
IGSS
1
A
VGS = 4.5V, VDS = 0V
ON CHARACTERISTICS (Note 8)
Gate Threshold Voltage
VGS(th)
0.5
1.0
V
VDS = VGS, ID = 250A
Static Drain-Source On-Resistance
RDS (ON)
0.4
0.5
0.7
0.55
0.70
0.9
VGS = 4.5V, ID = 540mA
VGS = 2.5V, ID = 500mA
VGS = 1.8V, ID = 350mA
Forward Transfer Admittance
|Yfs|
200
ms
VDS =10V, ID = 0.2A
Diode Forward Voltage (Note 8)
VSD
0.5
1.4
V
VGS = 0V, IS = 115mA
DYNAMIC CHARACTERISTICS(Note 9)
Input Capacitance
Ciss
150
pF
VDS = 16V, VGS = 0V
f = 1.0MHz
Output Capacitance
Coss
25
pF
Reverse Transfer Capacitance
Crss
20
pF
Notes: 8. Short duration pulse test used to minimize self-heating effect.
9. Guaranteed by design. Not subject to production testing.
DMN2004WKQ
Document number: DS39166 Rev. 1 - 2
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© Diodes Incorporated
DMN2004WKQ
0
01 2 3 4 5
V , DRAIN-SOURCE VOLTAGE (V)
Fig. 1 Typical Output Characteristics
DS
I , DRAIN CURRENT (A)
D
V , GATE-SOURCE VOLTAGE (V)
Fig. 2 GS
Reverse Drain Current vs. Source-Drain Voltage
T , CHANNEL TEMPERATURE (°C)
Fig. 3 Gate Threshold Voltage vs. Channel Temperature
ch
0.1
I DRAIN CURRENT (A)
Fig. 4 Static Drain-Source On-Resistance vs. Drain Current
D,
1
R , STATIC DRAIN-SOURCE
ON-RESISTANCE ( )
DS(on)
I , DRAIN CURRENT (A)
Fig. 5 Static Drain-Source On-Resistance vs. Drain Current
D
R , STATIC DRAIN-SOURCE
ON-RESISTANCE ( )
DS(on)
6
DMN2004WKQ
Document number: DS39166 Rev. 1 - 2
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© Diodes Incorporated
DMN2004WKQ
I , DRAIN CURRENT (A)
Fig. 7 D
On-Resistance vs. Drain Current and Gate Voltage
T, JUNCTION TEMPERATURE ( C)
Fig. 8 j°
Static Drain-Source, On-Resistance vs. Temperature
R , STATIC DRAIN-SOURCE
ON-RESISTANCE ( )
DS(on)
I , DRAIN-SOURCE LEAKAGE CURRENT (nA)
DSS
I , REVERSE DRAIN CURRENT (A)
DR
1000
I , DRAIN CURRENT (mA)
D
Fig. 11 Forward Transfer Admittance vs. Drain Current
|Y |, FORWARD TRANSFER ADMITTANCE (S)
fs
V , DRAIN SOURCE VOLTAGE (V)
DSFig. 12 Capacitance Variation
DMN2004WKQ
Document number: DS39166 Rev. 1 - 2
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DMN2004WKQ
Package Outline Dimensions
Please see http://www.diodes.com/package-outlines.html for the latest version.
Suggested Pad Layout
Please see http://www.diodes.com/package-outlines.html for the latest version.
a
E1E
Fe1
b
L
c
e
A2
A1
D
SOT323
Dim
Min
Max
Typ
A1
0.00
0.10
0.05
A2
0.90
1.00
0.95
b
0.25
0.40
0.30
c
0.10
0.18
0.11
D
1.80
2.20
2.15
E
2.00
2.20
2.10
E1
1.15
1.35
1.30
e
0.650 BSC
e1
1.20
1.40
1.30
F
0.375
0.475
0.425
L
0.25
0.40
0.30
a
0°
8°
--
All Dimensions in mm
Dimensions
Value
(in mm)
C
0.650
G
1.300
X
0.470
Y
0.600
Y1
2.500
Y1 G
Y
X
C
DMN2004WKQ
Document number: DS39166 Rev. 1 - 2
6 of 6
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August 2016
© Diodes Incorporated
DMN2004WKQ
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(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
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