75 V, 42 A, 7.2 mΩ Low RDS(ON)
N ch Trench Power MOSFET
FKI07117
FKI07117-DS Rev.1.2 SANKEN ELECTRIC CO.,LTD. 1
Jan. 20, 2014
Features
V(BR)DSS --------------------------------- 75 V (ID = 100 µA)
ID ---------------------------------------------------------- 42 A
RDS(ON) ---------- 9.7 mΩ max. (VGS = 10 V, ID = 31.2 A)
Qg ------ 25.0 nC (VGS = 4.5 V, VDS = 38 V, ID = 31.2 A)
Low Total Gate Charge
High Speed Switching
Low On-Resistance
Capable of 4.5 V Gate Drive
100 % UIL Tested
RoHS Compliant
Applications
DC-DC converters
Synchronous Rectification
Power Supplies
Package
TO-220F
Not to scale
Equivalent circuit
Absolute Maximum Ratings
Unless otherwise specified, TA = 25 °C
Parameter
Symbol
Test conditions
Rating
Unit
Drain to Source Voltage
VDS
75
V
Gate to Source Voltage
VGS
± 20
V
Continuous Drain Current
ID
TC = 25 °C
42
A
Pulsed Drain Current
IDM
PW ≤ 100µs
Duty cycle ≤ 1 %
83
A
Continuous Source Current
(Body Diode)
IS
42
A
Pulsed Source Current
(Body Diode)
ISM
PW ≤ 100µs
Duty cycle ≤ 1 %
83
A
Single Pulse Avalanche Energy
EAS
VDD = 38 V, L = 1 mH,
IAS = 11.2 A, unclamped,
RG = 4.7 Ω
Refer to Figure 1
126
mJ
Avalanche Current
IAS
23.3
A
Power Dissipation
PD
TC = 25 °C
40
W
Operating Junction Temperature
TJ
150
°C
Storage Temperature Range
TSTG
− 55 to 150
°C
(1) (2) (3)
G D S
D(2)
S(3)
G(1)
http://www.sanken-ele.co.jp
FKI07117
FKI07117-DS Rev.1.2 SANKEN ELECTRIC CO.,LTD. 2
Jan. 20, 2014
Thermal Characteristics
Unless otherwise specified, TA = 25 °C
Symbol
Test Conditions
Min.
Typ.
Max.
Unit
RθJC
−
−
3.1
°C/W
RθJA
−
−
62.5
°C/W
Electrical Characteristics
Unless otherwise specified, TA = 25 °C
Symbol
Test Conditions
Min.
Typ.
Max.
Unit
V(BR)DSS
ID = 100 μA, VGS = 0 V
75
−
−
V
IDSS
VDS = 75 V, VGS = 0 V
−
−
100
µA
IGSS
VGS = ± 20 V
−
−
± 100
nA
VGS(th)
VDS = VGS, ID = 1 mA
1.0
2.0
2.5
V
RDS(ON)
ID = 31.2 A, VGS = 10 V
−
7.2
9.7
mΩ
ID = 15.6 A, VGS = 4.5 V
−
8.2
11.2
mΩ
RG
f = 1 MHz
−
1.1
−
Ω
Ciss
VDS = 25 V
VGS = 0 V
f = 1 MHz
−
4040
−
pF
Coss
−
370
−
Crss
−
215
−
Qg1
VDS = 38 V
ID = 31.2 A
−
54.0
−
nC
Qg2
−
25.0
−
Qgs
−
9.8
−
Qgd
−
7.3
−
td(on)
VDS = 38 V
ID = 31.2 A
VGS = 10 V, RG = 4.7 Ω
Refer to Figure 2
−
6.8
−
ns
tr
−
6.4
−
td(off)
−
29.4
−
tf
−
13.3
−
VSD
IS = 31.2 A, VGS = 0 V
−
0.9
1.5
V
trr
IF = 31.2 A
di/dt = 100 A/µs
Refer to Figure 3
−
44.3
−
ns
Qrr
−
69.1
−
nC
FKI07117
FKI07117-DS Rev.1.2 SANKEN ELECTRIC CO.,LTD. 3
Jan. 20, 2014
Test Circuits and Waveforms
VDD
ID
VDS
RG
VGS
0 V
L
IAS
ID
V(BR)DSS
VDD
VDS
(a) Test Circuit (b) Waveform
Figure 1 Unclamped Inductive Switching
VDS
VDD
RG
RL
VGS
0 V
P.W. = 10 μs
Duty cycle ≤ 1 %
td(on) tr
ton
td(off) tf
toff
90%
10%
90%
10%
VGS
VDS
(a) Test Circuit (b) Waveform
Figure 2 Switching Time
VGS
0 V
IF
RG
L
D.U.T.
VDD
0 V
IF
trr
di/dt IRM × 90 %
IRM
(a) Test Circuit (b) Waveform
Figure 3 Diode Reverse Recovery Time
DD(BR)DSS
(BR)DSS
2
ASAS VV
V
IL
2
1
E
FKI07117
FKI07117-DS Rev.1.2 SANKEN ELECTRIC CO.,LTD. 4
Jan. 20, 2014
Package Outline
TO-220F
NOTES:
1) Dimension is in millimeters
2) Pb-free. Device composition compliant with the RoHS directive
Marking Diagram
Part Number
YMW BAA
FKI×××××
Lot Number
Y is the Last digit of the year (0 to 9)
M is the Month (1 to 9, O, N or D)
W is the Week (1st to 5th week of every month)
B expresses Pb free pins
A is the suffix No.
FKI07117
FKI07117-DS Rev.1.2 SANKEN ELECTRIC CO.,LTD. 5
Jan. 20, 2014
OPERATING PRECAUTIONS
In the case that you use Sanken products or design your products by using Sanken products, the reliability largely
depends on the degree of derating to be made to the rated values. Derating may be interpreted as a case that an operation
range is set by derating the load from each rated value or surge voltage or noise is considered for derating in order to
assure or improve the reliability. In general, derating factors include electric stresses such as electric voltage, electric
current, electric power etc., environmental stresses such as ambient temperature, humidity etc. and thermal stress caused
due to self-heating of semiconductor products. For these stresses, instantaneous values, maximum values and minimum
values must be taken into consideration. In addition, it should be noted that since power devices or IC’s including power
devices have large self-heating value, the degree of derating of junction temperature affects the reliability significantly.
Because reliability can be affected adversely by improper storage environments and handling methods, please
observe the following cautions.
Cautions for Storage
Ensure that storage conditions comply with the standard temperature (5 to 35°C) and the standard relative humidity
(around 40 to 75%); avoid storage locations that experience extreme changes in temperature or humidity.
Avoid locations where dust or harmful gases are present and avoid direct sunlight.
Reinspect for rust on leads and solderability of the products that have been stored for a long time.
Cautions for Testing and Handling
When tests are carried out during inspection testing and other standard test periods, protect the products from power
surges from the testing device, shorts between the product pins, and wrong connections. Ensure all test parameters are
within the ratings specified by Sanken for the products.
Remarks About Using Silicone Grease with a Heatsink
When silicone grease is used in mounting the products on a heatsink, it shall be applied evenly and thinly. If more
silicone grease than required is applied, it may produce excess stress.
Volatile-type silicone greases may crack after long periods of time, resulting in reduced heat radiation effect.
Silicone greases with low consistency (hard grease) may cause cracks in the mold resin when screwing the
products to a heatsink.
Our recommended silicone greases for heat radiation purposes, which will not cause any adverse effect on the
product life, are indicated below:
Type
Suppliers
G746
Shin-Etsu Chemical Co., Ltd.
YG6260
Momentive Performance Materials Inc.
SC102
Dow Corning Toray Co., Ltd.
Cautions for Mounting to a Heatsink
When the flatness around the screw hole is insufficient, such as when mounting the products to a heatsink that has
an extruded (burred) screw hole, the products can be damaged, even with a lower than recommended screw torque.
For mounting the products, the mounting surface flatness should be 0.05mm or less.
Please select suitable screws for the product shape. Do not use a flat-head machine screw because of the stress to
the products. Self-tapping screws are not recommended. When using self-tapping screws, the screw may enter the
hole diagonally, not vertically, depending on the conditions of hole before threading or the work situation. That
may stress the products and may cause failures.
Recommended screw torque:
Package
Recommended Screw Torque
TO-220, TO-220F
0.490 to 0.686 N・m (5 to 7 kgf・cm)
TO-3P, TO-3PF, TO-247
0.686 to 0.882 N・m (7 to 9 kgf・cm)
SLA
0.588 to 0.784 N・m (6 to 8 kgf・cm)
For tightening screws, if a tightening tool (such as a driver) hits the products, the package may crack, and internal
stress fractures may occur, which shorten the lifetime of the electrical elements and can cause catastrophic failure.
Tightening with an air driver makes a substantial impact. In addition, a screw torque higher than the set torque can
be applied and the package may be damaged. Therefore, an electric driver is recommended.
When the package is tightened at two or more places, first pre-tighten with a lower torque at all places, then tighten
with the specified torque. When using a power driver, torque control is mandatory.
Please pay special attention about the slack of the press mold. In case that the hole diameter of the heatsink is less
than 4 mm, it may cause the resin crack at tightening.
FKI07117
FKI07117-DS Rev.1.2 SANKEN ELECTRIC CO.,LTD. 6
Jan. 20, 2014
Soldering
When soldering the products, please be sure to minimize the working time, within the following limits:
• 260 ± 5 °C 10 ± 1 s (Flow, 2 times)
• 380 ± 10 °C 3.5 ± 0.5 s (Soldering iron, 1 time)
Soldering should be at a distance of at least 1.5 mm from the body of the products.
Electrostatic Discharge
When handling the products, the operator must be grounded. Grounded wrist straps worn should have at least 1MΩ
of resistance from the operator to ground to prevent shock hazard, and it should be placed near the operator.
Workbenches where the products are handled should be grounded and be provided with conductive table and floor
mats.
When using measuring equipment such as a curve tracer, the equipment should be grounded.
When soldering the products, the head of soldering irons or the solder bath must be grounded in order to prevent
leak voltages generated by them from being applied to the products.
The products should always be stored and transported in Sanken shipping containers or conductive containers, or
be wrapped in aluminum foil.
IMPORTANT NOTES
The contents in this document are subject to changes, for improvement and other purposes, without notice. Make
sure that this is the latest revision of the document before use.
Application and operation examples described in this document are quoted for the sole purpose of reference for the
use of the products herein and Sanken can assume no responsibility for any infringement of industrial property
rights, intellectual property rights or any other rights of Sanken or any third party which may result from its use.
Unless otherwise agreed in writing by Sanken, Sanken makes no warranties of any kind, whether express or
implied, as to the products, including product merchantability, and fitness for a particular purpose and special
environment, and the information, including its accuracy, usefulness, and reliability, included in this document.
Although Sanken undertakes to enhance the quality and reliability of its products, the occurrence of failure and
defect of semiconductor products at a certain rate is inevitable. Users of Sanken products are requested to take, at
their own risk, preventative measures including safety design of the equipment or systems against any possible
injury, death, fires or damages to the society due to device failure or malfunction.
Sanken products listed in this document are designed and intended for the use as components in general purpose
electronic equipment or apparatus (home appliances, office equipment, telecommunication equipment, measuring
equipment, etc.).
When considering the use of Sanken products in the applications where higher reliability is required (transportation
equipment and its control systems, traffic signal control systems or equipment, fire/crime alarm systems, various
safety devices, etc.), and whenever long life expectancy is required even in general purpose electronic equipment
or apparatus, please contact your nearest Sanken sales representative to discuss, prior to the use of the products
herein.
The use of Sanken products without the written consent of Sanken in the applications where extremely high
reliability is required (aerospace equipment, nuclear power control systems, life support systems, etc.) is strictly
prohibited.
When using the products specified herein by either (i) combining other products or materials therewith or (ii)
physically, chemically or otherwise processing or treating the products, please duly consider all possible risks that
may result from all such uses in advance and proceed therewith at your own responsibility.
Anti radioactive ray design is not considered for the products listed herein.
Sanken assumes no responsibility for any troubles, such as dropping products caused during transportation out of
Sanken’s distribution network.
The contents in this document must not be transcribed or copied without Sanken’s written consent.