2011-07-25
1
BC856S/U_BC857S
PNP Silicon AF Transistor Arrays
• For AF input stages and driver applications
• High current gain
• Low collector-emitter saturation voltage
• Two (galvanic) internal isolated transistor
with good matching in one package
• BC856S / U, BC857S: For orientation in reel see
package information below
• Pb-free (RoHS compliant) package
• Qualified according AEC Q101
BC856S/U
BC857S
EHA07175
654
321
C1 B2 E2
C2B1E1
TR1 TR2
Type Marking Pin Configuration Package
BC856S
BC856U
BC857S
3Ds
3Ds
3Cs
1=E1
1=E1
1=E1
2=B1
2=B1
2=B1
3=C2
3=C2
3=C2
4=E2
4=E2
4=E2
5=B2
5=B2
5=B2
6=C1
6=C1
6=C1
SOT363
SC74
SOT363
2011-07-25
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BC856S/U_BC857S
Maximum Ratings
Parameter Symbol Value Unit
Collector-emitter voltage
BC856S/U
BC857S
VCEO
65
45
-
Collector-base voltage
BC856S, BC856U
BC857S
VCBO
80
50
V
Emitter-base voltage VEBO 5
Collector current IC100 mA
Peak collector current, tp ≤ 10 ms ICM 200
Total power dissipation-
TS ≤ 115 °C, BC856S
TS ≤ 118 °C, BC856U, BC857U
Ptot
250
250
-
Junction temperature Tj150 °C
Storage temperature Tst
g
-65 ... 150
Thermal Resistance
Parameter Symbol Value Unit
Junction - soldering point1)
BC856S, BC857S
BC856U
RthJS
≤ 140
≤ 130
K/W
1For calculation of RthJA please refer to Application Note AN077 (Thermal Resistance Calculation)
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BC856S/U_BC857S
Electrical Characteristics at T
A
= 25°C, unless otherwise specified
Parameter Symbol Values Unit
min. typ. max.
DC Characteristics
Collector-emitter breakdown voltage
IC = 10 mA, IB = 0 , BC856S/U
IC = 10 mA, IB = 0 , BC857S
V(BR)CEO
65
45
-
-
-
-
-
Collector-base breakdown voltage
IC = 10 µA, IE = 0 , BC856S/U
IC = 10 µA, IE = 0 , BC857S
V(BR)CBO
80
50
-
-
-
-
Emitter-base breakdown voltage
IE = 10 µA, IC = 0
V(BR)EBO 5 - - V
Collector-base cutoff current
VCB = 45 V, IE = 0
VCB = 45 V, IE = 0 , TA = 150 °C
ICBO
-
-
-
-
0.015
5
µA
DC current gain1)
IC = 10 µA, VCE = 5 V
IC = 2 mA, VCE = 5 V
hFE
-
200
250
290
-
630
-
Collector-emitter saturation voltage1)
IC = 10 mA, IB = 0.5 mA
IC = 100 mA, IB = 5 mA
VCEsat
-
-
75
250
300
650
mV
Base emitter saturation voltage1)
IC = 10 mA, IB = 0.5 mA
IC = 100 mA, IB = 5 mA
VBEsat
-
-
700
850
-
-
-
Base-emitter voltage1)
IC = 2 mA, VCE = 5 V
IC = 10 mA, VCE = 5 V
VBE(ON)
600
-
650
-
750
820
mV
1Pulse test: t < 300µs; D < 2%
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BC856S/U_BC857S
Electrical Characteristics at TA = 25°C, unless otherwise specified
Parameter Symbol Values Unit
min. typ. max.
AC Characteristics
Transition frequency
IC = 20 mA, VCE = 5 V, f = 100 MHz
fT- 250 - MHz
Collector-base capacitance
VCB = 10 V, f = 1 MHz
Ccb - 1.5 - pF
Emitter-base capacitance
VEB = 0.5 V, f = 1 MHz
Ceb - 8 -
Short-circuit input impedance
IC = 2 mA, VCE = 5 V, f = 1 kHz
h11e - 4.5 - kΩ
Open-circuit reverse voltage transf. ratio
IC = 2 mA, VCE = 5 V, f = 1 kHz
h12e - 2 - 10-4
Short-circuit forward current transf. ratio
IC = 2 mA, VCE = 5 V, f = 1 kHz
h21e - 330 - -
Open-circuit output admittance
IC = 2 mA, VCE = 5 V, f = 1 kHz
h22e - 30 - µS
Noise figure
IC = 200 µA, VCE = 5 V, f = 1 kHz,
∆ f = 200 Hz, RS = 2 kΩ
F- - 10 dB
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BC856S/U_BC857S
DC current gain hFE = ƒ(IC)
VCE = 5 V
10 10 10 10
EHP00382
h
mA
-2 -1 12
FE
3
10
10
2
0
10
5
5
10
1
0
10
5
555
100
25
-50
C
Ι
C
C
C
Collector-emitter saturation voltage
IC = ƒ(VCEsat), hFE = 20
10 0
EHP00380
VCEsat
10
mA
10
10
2
1
0
-1
5
5
V
0.3 0.5
100
25
-50
0.1 0.2 0.4
C
Ι
C
C
C
Base-emitter saturation voltage
IC = ƒ(VBEsat), hFE = 20
0
10
EHP00379
BEsat
V
0.6 V 1.2
-1
10
0
10
1
2
10
5
5
Ι
C
mA
0.2 0.4 0.8
C
25
C
100
C
-50
C
Collector cutoff current ICBO = ƒ(TA)
VCBO = 30 V
10 0 50 100 150
EHP00381
TA
5
10
10
nA
10
Ι
CB0
5
5
5
10
10
4
3
2
1
0
-1
max
typ
C
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BC856S/U_BC857S
Transition frequency fT = ƒ(IC)
VCE = 5 V
10 10 10 10
EHP00378
f
mA
MHz
-1 0 1 2
5
T
3
10
10
2
1
10
5
5
5
C
Ι
Collector-base capacitance Ccb = ƒ(VCB)
Emitter-base capacitance Ceb = ƒ(VEB)
0 4 8 12 16 V22
VCB(VEB
0
1
2
3
4
5
6
7
8
9
10
pF
12
CCB(CEB)
CCB
CEB
Total power dissipation Ptot = ƒ(TS)
BC856S, BC857S
0 15 30 45 60 75 90 105 120 °C 150
TS
0
25
50
75
100
125
150
175
200
225
250
mW
300
Ptot
Total power dissipation Ptot = ƒ(TS)
BC856U
0 15 30 45 60 75 90 105 120 °C 150
TS
0
25
50
75
100
125
150
175
200
225
250
mW
300
Ptot
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BC856S/U_BC857S
Permissible Pulse Load
Ptotmax/PtotDC = ƒ(tp)
BC856S, BC857S
10 -6 10 -5 10 -4 10 -3 10 -2 10 0
s
tp
0
10
1
10
2
10
3
10
-
Ptotmax/PtotDC
D = 0
0.005
0.01
0.02
0.05
0.1
0.2
0.5
Permissible Pulse Load RthJS = ƒ(tp)
BC856S; BC857S
10 -6 10 -5 10 -4 10 -3 10 -2 10 0
s
tp
-1
10
0
10
1
10
2
10
3
10
K/W
RthJS
0.5
0.2
0.1
0.05
0.02
0.01
0.005
D = 0
Permissible Puls Load RthJS = ƒ (tp)
BC856U
10 -6 10 -5 10 -4 10 -3 10 -2 10 0
s
tp
-1
10
0
10
1
10
2
10
3
10
K/W
RthJS
D=0.5
0.2
0.1
0.05
0.02
0.01
0.005
0
Permissible Pulse Load
Ptotmax/PtotDC = ƒ(tp)
BC856U
10 -6 10 -5 10 -4 10 -3 10 -2 10 0
s
tp
0
10
1
10
2
10
3
10
Ptotmax / PtotDC
D=0
0.005
0.01
0.02
0.05
0.1
0.2
0.5
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BC856S/U_BC857S
Package SC74
Package Outline
Foot Print
Standard Packing
0.5
0.95
1.9
2.9
546
321
1.1 MAX.
(0.35)
(2.25)
±0.2
2.9 B
0.2
+0.1
-0.05
0.35
Pin 1
marking
MB6x
0.95
1.9
0.15 -0.06
+0.1
1.6
10˚ MAX.
A
±0.1
2.5
0.25
10˚ MAX.
±0.1
±0.1
A0.2 M
0.1 MAX.
2.7
4
3.15
Pin 1
marking
8
0.2
1.15
Reel ø180 mm = 3.000 Pieces/Reel
Reel ø330 mm = 10.000 Pieces/Reel
For symmetric types no defined Pin 1 orientation in reel.
Manufacturer
2005, June
Date code (Year/Month)
BCW66H
Type code
Pin 1 marking
Laser marking
Marking Layout (Example)
Small variations in positioning of
Date code, Type code and Manufacture are possible.
2011-07-25
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BC856S/U_BC857S
Package SOT363
Package Outline
Foot Print
Marking Layout (Example)
Standard Packing
Reel ø180 mm = 3.000 Pieces/Reel
Reel ø330 mm = 10.000 Pieces/Reel
For symmetric types no defined Pin 1 orientation in reel.
Small variations in positioning of
Date code, Type code and Manufacture are possible.
Manufacturer
2005, June
Date code (Year/Month)
BCR108S
Type code
Pin 1 marking
Laser marking
0.3
0.70.9
0.65
0.65
1.6
0.2
4
2.15 1.1
8
2.3
Pin 1
marking
+0.1
0.2
1
6
23
5 4
±0.2
2
+0.1
-0.05
0.15
±0.1
1.25
0.1 MAX.
0.9 ±0.1
A
-0.05 6x
0.1 M
0.650.65
2.1
±0.1
0.1
0.1 MIN.
M
0.2 A
Pin 1
marking
2011-07-25
10
BC856S/U_BC857S
Edition 2009-11-16
Published by
Infineon Technologies AG
81726 Munich, Germany
2009 Infineon Technologies AG
All Rights Reserved.
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee
of conditions or characteristics. With respect to any examples or hints given herein,
any typical values stated herein and/or any information regarding the application of
the device, Infineon Technologies hereby disclaims any and all warranties and
liabilities of any kind, including without limitation, warranties of non-infringement of
intellectual property rights of any third party.
Information
For further information on technology, delivery terms and conditions and prices,
please contact the nearest Infineon Technologies Office (<www.infineon.com>).
Warnings
Due to technical requirements, components may contain dangerous substances.
For information on the types in question, please contact the nearest Infineon
Technologies Office.
Infineon Technologies components may be used in life-support devices or systems
only with the express written approval of Infineon Technologies, if a failure of such
components can reasonably be expected to cause the failure of that life-support
device or system or to affect the safety or effectiveness of that device or system.
Life support devices or systems are intended to be implanted in the human body or
to support and/or maintain and sustain and/or protect human life. If they fail, it is
reasonable to assume that the health of the user or other persons may be
endangered.
1.
2.
3.
Material Content Data Sheet
Sales Product Name BC 857S H6327 Issued 7. March 2012
MA# MA000849564
Package PG-SOT363-6-1 Weight* 6.29 mg
Construction Element Material Group Substances CAS#
if applicable Weight
[mg]
Average
Mass
[%]
Sum
[%]
Average
Mass
[ppm]
Sum
[ppm]
chip non noble metal arsenic 7440-38-2 0.000 0.00 22
noble metal gold 7440-57-5 0.014 0.22 2188
inorganic material silicon 7440-21-3 0.078 1.25 1.47 12456 14666
leadframe inorganic material silicon 7440-21-3 0.001 0.01 92
non noble metal titanium 7440-32-6 0.003 0.05 458
non noble metal chromium 7440-47-3 0.009 0.14 1375
non noble metal copper 7440-50-8 2.869 45.64 45.84 456480 458405
wire non noble metal copper 7440-50-8 0.010 0.17 0.17 1660 1660
encapsulation organic material carbon black 1333-86-4 0.030 0.48 4824
plastics epoxy resin - 0.652 10.37 103716
inorganic material silicondioxide 60676-86-0 2.350 37.39 48.24 373861 482401
leadfinish non noble metal tin 7440-31-5 0.213 3.39 3.39 33925 33925
plating noble metal silver 7440-22-4 0.056 0.89 0.89 8943 8943
*deviation < 10% Sum in total: 100,00 1000000
Important Remarks:
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company Infineon Technologies AG
Address 81726 München
Internet www.infineon.com
