TMDS442 www.ti.com SLLS757A - AUGUST 2006 - REVISED MARCH 2007 4-TO-2 DVI/HDMI SWITCH * FEATURES 1 * A 4-to-2 Single-Link or 2-to-1 Dual-Link DVI/HDMI Physical Layer Switch * Compatible with HDMI 1.3a * Supports 2.25 Gbps Signaling Rate for 480i/p, 720i/p, and 1080i/p Resolutions up to 12-Bit Color Depth * Integrated Receiver Terminations * 8-dB Receiver Equalizer Compensates for Losses From Standard HDMI Cables * Selectable Output De-Emphasis Compensates for Losses From Flat Cables * High-Impedance Outputs When Disabled 2 * * * * I2C Repeater Isolates Bus Capacitance at Both Ends TMDS Inputs HBM ESD Protection Exceeds 6 kV 3.3-V Supply Operation 128-Pin TQFP Package ROHS Compatible and 260C Reflow Rated APPLICATIONS * * * * Digital TV Digital Projector Audio Video Receiver DVI or HDMI Switch DESCRIPTION The TMDS442, 4-to-2 port DVI/HDMI switch, allows up to 4 digital video interface (DVI) or high-definition multimedia interface (HDMI) ports to be switched to two independent display blocks. The essential requirement of picture-in-picture display from two digital audiovisual sources is having two individual DVI or HDMI receivers in a digital display system. TMDS442 supports two DVI or HDMI receivers to enable multiple-source selection (picture-in-picture), as well as supports acting as a 4-input 1-output video switch. Each input or output port contains one 5-V power indicator (5V_PWR), one hot plug detector (HPD), a pair of I2C interface signals (SCL/SDA), and four TMDS channels supporting data rates up to 2.25 Gbps. The 5-V power indicator and the hot plug detector are pulled down with internal resistors, forcing a low state on these pins until receiving a valid high signal. The I2C interface is constructed by an I2C repeater circuit to isolate the capacitance form both ends of the buses. TMDS receivers integrate 50- termination resistors pulled up to VCC, which eliminates the need for external terminations. An 8-dB input equalization cooperates to each TMDS receiver inputs to optimize system performance through 5-meter or longer DVI or HDMI compliant cables. TYPICAL APPLICATION Game Machine Digital TV STB DVD Player or DVR TMDS 442 High Definition DVD Player 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PowerPAD is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright (c) 2006-2007, Texas Instruments Incorporated TMDS442 www.ti.com SLLS757A - AUGUST 2006 - REVISED MARCH 2007 A precision resistor is connected externally from the VSADJ pin to ground, for setting the differential output voltage to be compliant with the TMDS standard for all TMDS driver outputs. The PRE pin controls the TMDS output to be operated under either a standard TMDS mode or an AC de-emphasis mode. When PRE = high, a 3-dB AC de-emphasis TMDS output swing is selected to pre-condition the output signals to overcome signal impairments that may exist between the output of the TMDS442 and the HDMI receiver placed at a remote location. Each sink output port can be configured with the SA, SB, OE, I2CEN, and PRE pins. SA1, SB1, OE1, I2CEN1, and PRE1 regulate the behaviour of sink port 1; SA2, SB2, OE2, I2CEN2, and PRE2 regulate the behaviour of sink port 2. These control signals are hard-wire controlled by GPIO interface, or through a local I2C interface. When GE = low, the configurations are done through a local I2C interface, LC_SCL, LC_SDA, LC_A0, and LC_A1 pins, and the 5V_EN can be programmed through the local I2C interface. It is default high after device powered on. When GE = high, the configurations are done through GPIO pins regardless the value of the 5V_EN in the internal I2C registers. The two bit source selector pins, SA and SB, determine the source transferred to the sink port. The internal multiplexer interconnects the TMDS channels and I2C interface from the selected source port to the sink port. The HPD output of the selected source port follows the status of the HPD_SINK. Since two of the source ports will always be unconnected to any output, the I2C interfaces of unselected ports are isolated and the HPD outputs of an unselected port are pulled low. The TMDS outputs of each of the sink ports are enabled based on the OE signal and 5V_PWR signal (from the selected source port). When OE is low, for an output port, and the 5V_PWR signal from the selected source port is high, the TMDS output signals are enabled; otherwise they are disabled, and high impedance. The I2C driver at sink side, SCL_SINK and SDA_SINK, are enabled by setting I2CEN high. When I2CEN is low, the I2C driver can not forward a low state to the I2C bus connected at the sink port. A hard wire output voltage select pin, OVS, allows adjustable output voltage level to SCL_SINK and SDA_SINK to optimise noise margins while interfacing to different HDMI receivers. The I2C driver of each source port, SCL and SDA, is controlled by its 5V_PWR signal. A valid 5-V signal appearing at the input of 5V_PWR enables the I2C driver of the source port. The device is packaged in a 128-pin PowerPAD TQFP package and characterized for operation from 0C to 70C. 2 Submit Documentation Feedback Copyright (c) 2006-2007, Texas Instruments Incorporated Product Folder Link(s): TMDS442 TMDS442 www.ti.com SLLS757A - AUGUST 2006 - REVISED MARCH 2007 These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. FUNCTIONAL BLOCK DIAGRAM A14 B14 A13 B13 A12 B12 A11 B11 A24 B24 A23 B23 A22 B22 A21 B21 A34 B34 A33 B33 A32 B32 A31 B31 Quad Terminated TMDS Rx with EQ Quad Terminated TMDS Rx with EQ Quad TMDS Tx 4-to-2 Dual MUX 4-to-1 MUX Y14 Z14 Y13 Z13 Y12 Z12 Y11 Z11 PRE1 OE1 VSADJ Quad Terminated TMDS Rx with EQ Quad TMDS Tx Y24 Z24 Y23 Z23 Y22 Z22 Y21 Z21 PRE2 OE2 A44 B44 A43 B43 A42 B42 A41 B41 SA1 SB1 Quad Terminated TMDS Rx with EQ LC_SCL LC_SDA SA2 SB2 LC_A0 LC_A1 GE HPD1 HPD2 HPD3 HPD4 5V_PWR1 5V_PWR2 5V_PWR3 5V_PWR4 x x x PRE1 I CEN1 OE1 2 SB1 SA1 x x x PRE2 I CEN2 OE2 2 SB2 SA2 x x SP 5V_ PWR4 5V_ PWR2 5V_ PWR1 5V_EN 5V_ PWR3 HPD_SINK1 HPD_SINK2 5V_SINK1 5V_SINK2 Control Logic SCL1 SDA1 SCL2 SDA2 SCL_SINK1 SDA_SINK1 SCL3 SDA3 SCL_SINK2 SDA_SINK2 OVS GPIO0 (SA1) GPIO1 (SB1) GPIO2 (/OE1) GPIO3 (I2CEN1) GPIO4 (PRE1) GPIO5 (SA2) GPIO6 (SB2) GPIO7 (/OE2) GPIO8 (I2CEN2) GPIO9 (PRE2) GPIO10 (SP) SCL4 SDA4 Submit Documentation Feedback Copyright (c) 2006-2007, Texas Instruments Incorporated Product Folder Link(s): TMDS442 3 TMDS442 www.ti.com SLLS757A - AUGUST 2006 - REVISED MARCH 2007 B44 Vcc A43 B43 GND A42 B42 Vcc A41 B41 GND SCL4 SDA4 5V_PWR4 HPD4 Vcc LC_SCL LC_SDA LC_A0 LC_A1 GND Vcc HPD_SINK1 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 75 74 73 72 71 70 69 68 67 SCL_SINK1 A44 91 65 Vcc GND 5V_SINK1 SDA_SINK1 HPD3 93 92 66 5V_PWR3 94 SDA3 96 95 PNP PACKAGE (TOP VIEW) SCL3 97 98 64 63 GND GND B31 99 62 Y11 A31 Vcc 100 101 61 60 Vcc Z12 B32 102 59 Y12 A32 GND 103 104 58 57 GND Z13 B33 105 56 Y13 A33 106 55 Vcc Vcc 107 54 Z14 B34 108 Y14 A34 109 53 52 GND 110 51 VSADJ Vcc HPD2 111 112 50 Vcc HPD_SINK2 5V_PWR2 SDA2 113 114 48 SCL2 115 47 46 GND 116 45 GND B21 117 44 Z21 A21 118 Y21 Vcc 119 43 42 B22 120 41 Z22 A22 GND 121 122 40 39 Y22 GND B23 123 38 Z23 A23 124 37 Y23 Vcc 125 36 Vcc B24 126 Z24 A24 127 35 34 GND 128 33 GND 5V_SINK2 SDA_SINK2 SCL_SINK2 Vcc Y24 32 31 GE GND OVS 30 GPIO9 (PRE2) GPIO (SP) 28 29 27 26 GPIO6 (SB2) GPIO7 (/OE2) GPIO8 (I2CEN2) GPIO5 (SA2) 23 24 25 GPIO4 (PRE1) GPIO3 (I2CEN1) 22 GPIO2 (/OE1) 21 GPIO1 (SB1) 19 20 GPIO0 (SA1) 18 17 A14 GND Vcc 16 15 Vcc B14 14 A13 13 12 GND B13 A12 10 11 9 Vcc B12 A11 6 7 8 B11 GND 5 SCL1 4 SDA1 3 5V_PWR1 2 Vcc HPD1 1 49 Z11 TERMINAL FUNCTIONS TERMINAL NAME NO. I/O DESCRIPTION A11, A12, A21, A22, A31, A32, A41, A42, A13, A14 A23, A24 A33, A34 A43, A44 8, 11, 14, 17 118, 121, 124, 127 100, 103, 106, 109 82, 85, 88, 91 I Source Source Source Source port port port port 1 2 3 4 TMDS TMDS TMDS TMDS positive positive positive positive B11, B12, B21, B22, B31, B32, B41, B42, B13, B14 B23, B24 B33, B34 B43, B44 7, 10, 13, 16 117, 120, 123, 126 99, 102, 105, 108 81, 84, 87, 90 I Source Source Source Source port port port port 1 2 3 4 TMDS TMDS TMDS TMDS negative negative negative negative 4 inputs inputs inputs inputs Submit Documentation Feedback inputs inputs inputs inputs Copyright (c) 2006-2007, Texas Instruments Incorporated Product Folder Link(s): TMDS442 TMDS442 www.ti.com SLLS757A - AUGUST 2006 - REVISED MARCH 2007 TERMINAL FUNCTIONS (continued) TERMINAL NAME NO. I/O DESCRIPTION Y11, Y12, Y13, Y14 Y21, Y22, Y23, Y24 62, 59, 56, 53 43, 40, 37, 34 O Sink port 1 TMDS positive outputs Sink port 2 TMDS positive outputs Z11, Z12, Z13, Z14 Z21, Z22, Z23, Z24 63, 60, 57, 54 44, 41, 38, 35 O Sink port 1 TMDS negative outputs Sink port 2 TMDS negative outputs SCL1 SDA1 54 IO Source Port 1 DDC I2C clock line Source Port 1 DDC I2C data line SCL2 SDA2 115 114 IO Source Port 2 DDC I2C clock line Source Port 2 DDC I2C data line SCL3 SDA3 97 96 IO Source Port 3 DDC I2C clock line Source Port 3 DDC I2C data line SCL4 SDA4 79 78 IO Source Port 4 DDC I2C clock line Source Port 4 DDC I2C data line SCL_SINK1 SDA_SINK1 65 66 IO Sink port 1 DDC I2C clock line Sink port 1 DDC I2C data line SCL_SINK2 SDA_SINK2 46 47 IO Sink port 2 DDC I2C clock line Sink port 2 DDC I2C data line HPD1 HPD2 HPD3 HPD4 2 112 94 76 O Source Source Source Source HPD_SINK1 HPD_SINK2 68 49 I Sink port 1 hot plug detector input Sink port 2 hot plug detector input 5V_PWR1 5V_PWR 2 5V_PWR 3 5V_PWR 4 3 113 95 77 I Source Source Source Source 5V_SINK1 5V_SINK 2 67 48 O Sink Port 1 5-V power indicator output Sink Port 2 5-V power indicator output LC_SCL LC_SDA 74 73 IO Local I2C clock line Local I2C data line LC_A0 LC_A1 72 71 I Local I2C address bit 0 Local I2C address bit 1 GE 31 I GPIO Enable L: Local I2C pins are active, GPIO pins are high impedance H: GPIO pins are active, local I2C pins are high impedance GPIO0 GPIO1 GPIO2 GPIO3 GPIO4 20 21 22 23 24 I SA1 - Sink port 1 source selector SB1 - Sink port 1 source selector OE1 - Sink port 1 TMDS output enable I2CEN1 - Sink port 1 DDC I2C output enable PRE1 - Sink port 1 TMDS AC de-emphasis mode selector GPIO5 GPIO6 GPIO7 GPIO8 GPIO9 GPIO10 GPIO11 25 26 27 28 29 30 32 I SA2 - Sink port 2 source selector SB2 - Sink port 2 source selector OE2 - Sink port 2 TMDS output enable I2CEN2 - Sink port 2 DDC I2C output enable PRE2 - Sink port 2 TMDS AC de-emphasis mode selector SP - Sink priority selector OVS - SCL_SINK/SDA_SINK output voltage select 51 I TMDS compliant voltage swing control VSADJ Port 1 Port 2 Port 3 Port 4 Port 1 Port 2 Port 3 Port 4 Vcc 1, 9, 15, 19 36, 42, 50, 55, 61 69, 75, 83, 89, 93 101, 107, 111, 119, 125 Power supply GND 6, 12, 18, 33, 39, 45, 52, 58, 64 70, 80, 86, 92 98, 104, 110, 116, 122, 128 Ground hot hot hot hot 5-V 5-V 5-V 5-V plug plug plug plug detector output detector output detector output detector output power power power power signal input signal input signal input signal input Submit Documentation Feedback Copyright (c) 2006-2007, Texas Instruments Incorporated Product Folder Link(s): TMDS442 5 TMDS442 www.ti.com SLLS757A - AUGUST 2006 - REVISED MARCH 2007 EQUIVALENT INPUT AND OUTPUT SCHEMATIC DIAGRAMS TMDS Output Stage TMDS Input Stage Y Vcc 25 W Z 25 W 50 W 50 W A B 10mA Source-Side I2C Input/Output Stage Sink-Side I2C Input/Output Stage Status Input Stage Vcc Vcc Vcc 400 W SCL SDA LC_SDA Vcc SINK_SCL SINK_SDA 400 W 400 W HPD_SINK 5V_PWR 60 kW V OL Control Input Stage Control Input Stage Vcc GE GPIO LC_SCL Vcc 400 W Status Output Stage Vcc HPD 5V_SINK 400 W OVS ORDERING INFORMATION (1) (1) 6 PART NUMBER PART MARKING PACKAGE TMDS442PNP TMDS442 128-PIN TQPF TMDS442PNPR TMDS442 128-PIN TQPF Tape/Reel For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Submit Documentation Feedback Copyright (c) 2006-2007, Texas Instruments Incorporated Product Folder Link(s): TMDS442 TMDS442 www.ti.com SLLS757A - AUGUST 2006 - REVISED MARCH 2007 ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range (unless otherwise noted) (1) UNIT VCC Supply voltage range (2) -0.5 V to 4 V Aim*, Bim Voltage range 2.5 V to 4 V Yjm, Zjm, , Vsadjj, HPDi, 5V_SINKj, LC_SCL, LC_SDA, LC_A0, LC_A1, GE, GPIO -0.5V to 4 V SCLi, SCL_SINKj, SDAi, SDA_SINKj, HPD_SINKj, 5V_PWRi -0.5 V to 6 V Aim, Bim Human body model (3) Electrostatic discharge 6 kV All pins 5 kV Charged-device model (4) (all pins) 1500 V (5) 200 V Machine model (all pins) See Dissipation Rating Table Continuous power dissipation (1) (2) (3) (4) (5) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values, except differential I/O bus voltages, are with respect to network ground terminal. Tested in accordance with JEDEC Standard 22, Test Method A114-B Tested in accordance with JEDEC Standard 22, Test Method C101-A Tested in accordance with JEDEC Standard 22, Test Method A115-A DISSIPATION RATINGS (1) (2) (3) DERATING FACTOR ABOVE TA = 25C (1) TA = 70C POWER RATING PACKAGE PCB JEDEC STANDARD TA 25C 128-TQFP PNP Low-K (2) 2129.47 mW 21.2947 mW/C 1171.20 mW 128-TQFP PNP High-K (3) 4308.48 mW 43.0848 mW/C 2369.66 mW This is the inverse of the junction-to-ambient thermal resistance when board-mounted and with no air flow. In accordance with the Low-K thermal metric definitions of EIA/JESD51-3 In accordance with the High-K thermal metric definitions of EIA/JESD51-7 THERMAL CHARACTERISTICS over operating free-air temperature range (unless otherwise noted) PARAMETER RJB Junction-to-board thermal resistance RJC Junction- to-case thermal resistance PD Device power dissipation TEST CONDITIONS MIN VIH = VCC, VIL = VCC - 0.6 V, RT = 50 , AVCC = 3.3 V, VCC = 3.6 V, RVSADJ = 4.6 k, PRE = Low or high Ai/Bi(2:4)= 1.65 Gbps HDMI data pattern, Ai/Bi(1) = 165 MHz clock TYP MAX UNIT 7.86 C/W 19.5 C/W 1431 mW RECOMMENDED OPERATING CONDITIONS MIN NOM MAX VCC Supply voltage 3 3.3 3.6 UNIT V TA Operating free-air temperature 0 70 C TMDS DIFFERENTIAL PINS (A/B) VIC Input common mode voltage VCC-400 VCC+10 VID Receiver peak-to-peak differential input voltage 150 1560 mVp-p RVSADJ Resistor for TMDS compliant voltage swing range 4.6 4.64 4.68 k AVCC TMDS Output termination voltage, see Figure 3 3 3.3 3.6 V RT Termination resistance, see Figure 3 45 50 55 Signaling rate mV 0 2.25 Gbps 2 VCC V CONTROL PINS (LC_A0, LC_A1, GE, GPIO) VIH LVTTL High-level input voltage Submit Documentation Feedback Copyright (c) 2006-2007, Texas Instruments Incorporated Product Folder Link(s): TMDS442 7 TMDS442 www.ti.com SLLS757A - AUGUST 2006 - REVISED MARCH 2007 RECOMMENDED OPERATING CONDITIONS (continued) MIN VIL LVTTL Low-level input voltage NOM MAX UNIT GND 0.8 V CONTROL PINS (OVS) VIH LVTTL High-level input voltage 3 3.6 V VIL LVTTL Low-level input voltage -0.5 0.5 V STATUS PINS (HPD_SINK, 5V_PWR) VIH High-level input voltage 2 5.3 V VIL Low-level input voltage GND 0.8 V DDC I/O PINS (SCL_SINK, SDA_SINK) VIH High-level input voltage 0.7VCC 5.5 V VIL Low-level input voltage -0.5 0.3VCC V VILC Low-level input voltage contention (1) -0.5 0.4 V DDC I/O PINS (SCL, SDA) VIH High-level input voltage 2.1 5.5 V VIL Low-level input voltage -0.5 1.5 V LOCAL I2C PINS (LC_SCL, LC_SDA) VIH High-level input voltage 0.7VCC VCC V VIL Low-level input voltage -0.5 0.3VCC V (1) VIL specification is for the first low level seen by the SCL_SINK/SDA_SINK lines. VILC is for the second and subsequent low levels seen by the SCL_SINK/SDA_SINK lines. ELECTRICAL CHARACTERISTICS over recommended operating conditions (unless otherwise noted) PARAMETER TEST CONDITIONS ICC Supply current VIH = VCC, VIL = VCC - 0.4 V, RT = 50 , AVCC = 3.3 V, Ai/Bi(2:4) = 1.65-Gbps HDMI data pattern, Ai/Bi(1) = 165-MHz Pixel clock PD Power dissipation VIH = VCC, VIL = VCC - 0.4 V, RT = 50 , AVCC = 3.3 V, Ai/Bi(2:4) = 1.65-Gbps HDMI data pattern, Ai/Bi(1) = 165-MHz Pixel clock MIN TYP (1) MAX UNIT 250 412 (2) mA 640 1344 (2) mW TMDS DIFFERENTIAL PINS (A/B, Y/Z) VOH Single-ended high-level output voltage AVCC-10 AVCC+10 mV VOL Single-ended low-level output voltage AVCC-600 AVCC-400 mV Vswing Single-ended output swing voltage 400 600 mV VOD(O) Overshoot of output differential voltage 15% 2x Vswing VOD(U) Undershoot of output differential voltage 25% 2x Vswing VOC(SS) Change in steady-state common-mode output voltage between logic states I(O)OFF Single-ended standby output current VOD(pp) Peak-to-peak output differential voltage VODE(SS) Steady state output differential voltage with de-emphasis I(OS) Short circuit output current See Figure 6 VI(open) Single-ended input voltage under high impedance input or open input II = 10 A RINT Input termination resistance VIN = 2.9 V See Figure 4, AVCC = 3.3 V, RT = 50 5 mV -10 10 A 800 1200 560 840 PRE = Low -12 12 PRE = High -15 15 VCC-10 VCC+10 0 V VCC 1.5 V, AVCC = 3.3 V, RT = 50 See Figure 5, PRE = High, AVCC = 3.3 V, RT = 50 45 50 55 mVp-p mA mV STATUS PINS (HPD_SINK, 5V_PWR) (1) (2) 8 All typical values are at 25C and with a 3.3-V supply. The maximum rating is characterized under 3.6 V VCC. Submit Documentation Feedback Copyright (c) 2006-2007, Texas Instruments Incorporated Product Folder Link(s): TMDS442 TMDS442 www.ti.com SLLS757A - AUGUST 2006 - REVISED MARCH 2007 ELECTRICAL CHARACTERISTICS (continued) over recommended operating conditions (unless otherwise noted) PARAMETER IIH High-level digital input current IIL Low-level digital input current TEST CONDITIONS VIH = 5.3 V MIN TYP (1) MAX UNIT -150 150 VIH = 2 V or VCC -85 85 VIL = GND or 0.8 V -20 20 A A STATUS PINS (HPD, 5V_SINK) VOH High-level output voltage IOH = -4 mA VOL Low-level output voltage IOL = 4 mA 2.4 VCC V GND 0.4 V CONTROL PINS (LC_A0, LC_A1, GE, GPIO) IIH High-level digital input current VIH = 2 V or VCC -10 10 A IIL Low-level digital input current VIL = GND or 0.8 V -10 10 A CI Input capacitance VI = GND or VCC 10 pF DDC I/O PINS (SCL_SINK, SDA_SINK) VI = 5.5 V -50 50 VI = VCC -10 10 High-level output current VO = 3.6 V -10 10 A Low-level input current VIL = GND -40 40 A OVS = NC 470 620 OVS = GND 620 775 OVS = VCC 775 950 Ilkg Input leakage current IOH IIL VOL Low-level output voltage IOL = 400 A or 4 mA OVS = NC VOL-VILC CIO Low-level input voltage below output low-level voltage level Input/output capacitance Ensured by design A V 70 OVS = GND 240 OVS = VCC 420 mV VI = 5.0 V or 0 V, Freq = 100 kHz 25 VI = 3.0 V or 0 V, Freq = 100 kHz 10 pF DDC I/O PINS (SCL, SDA) AND LOCAL I2C PINS (LC_SCL, LC_SDA) VI = 5.5 V -50 50 VI = VCC -10 10 High-level output current VO = 3.6 V -10 10 A Low-level input current VIL = GND -10 10 A Low-level output voltage IOL = 4 mA 0.2 V VI = 5.0 V or 0 V, Freq = 100 kHz 25 VI = 3.0 V or 0 V, Freq = 100 kHz 10 Ilkg Input leakage current IOH IIL VOL CI Input capacitance Submit Documentation Feedback Copyright (c) 2006-2007, Texas Instruments Incorporated Product Folder Link(s): TMDS442 A pF 9 TMDS442 www.ti.com SLLS757A - AUGUST 2006 - REVISED MARCH 2007 SWITCHING CHARACTERISTICS over recommended operating conditions (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP (1) MAX UNIT TMDS DIFFERENTIAL PINS (Y/Z) tPLH Propagation delay time, low-to-high-level output 250 800 ps tPHL Propagation delay time, high-to-low-level output 250 800 ps tr Differential output signal rise time (20% - 80%) 80 240 ps tf Differential output signal fall time (20% - 80%) 80 240 ps tsk(p) Pulse skew (|tPHL - tPLH|) (2) 50 ps tsk(D) Intra-pair differential skew, see Figure 7 75 ps tsk(o) Inter-pair channel-to-channel output skew (3) 150 ps tsk(bb) Bank-to-bank skew 300 ps tsk(pp) Part-to-part skew 1 ns ten Enable time 20 ns tdis Disable time 20 ns tsx TMDS Switch time 20 ns tjit(pp) Peak-to-peak output jitter from Y/Z(1), residual jitter tjit(pp) Peak-to-peak output jitter from Y/Z(2:4), residual jitter tjit(pp) Peak-to-peak output jitter from Y/Z(1), residual jitter tjit(pp) Peak-to-peak output jitter from Y/Z(2:4), residual jitter See Figure 4, AVCC = 3.3 V, RT = 50 (4) See Figure 8 See Figure 9, Ai/Bi(1) = 165-MHz clock, Ai/Bi(2:4) = 1.65-Gbps HDMI pattern, PRE = low Input: 5m 28AWG HDMI cable, Output: 3-Inch 8-mil trace width 10 30 ps 48 74 ps See Figure 9, Ai/Bi(1) = 225-MHz clock, Ai/Bi(2:4) = 2.25-Gbps HDMI pattern, PRE = low Input: 5m 28AWG HDMI cable, Output: 3-Inch 8-mil trace width 18 33 ps 56 71 ps CONTROL AND STATUS PINS (HPD_SINK, HPD, 5V_PWR, 5V_SINK) tpd(HPD) Propagation delay time 15 ns tpd(5V) Propagation delay time 15 ns 15 ns tsx(HPD) HPD Switch time tsx(5V) 5-V Power switch time tsx DDC Switch time See Figure 8 CL= 10 pF, CL(DDC) = 100 pF 15 ns 1 s 204 459 ns 35 140 ns 194 351 ns 35 140 ns DDC I/O PINS (SCL, SCL_SINK, SDA, SDA_SINK) tPLH Propagation delay time, low-to-high-level output SCL_SINK/SDA_SINK to SCL/SDA tPHL Propagation delay time, high-to-low-level outputSCL_SINK/SDA_SINK to SCL/SDA tPLH Propagation delay time, low-to-high-level output SCL/SDA to SCL_SINK/SDA_SINK See Figure 11, OVS = NC tPHL Propagation delay time, high-to-low-level output SCL/SDA to SCL_SINK/SDA_SINK tr Output signal rise time, SCL_SINK/SDA_SINK 500 800 ns tf Output signal fall time, SCL_SINK/SDA_SINK 20 72 ns tr Output signal rise time, SCL/SDA 796 999 ns tf Output signal fall time, SCL/SDA 20 72 ns tset Enable to start condition thold Enable after stop condition (1) (2) (3) (4) 10 See Figure 12 100 ns 100 ns All typical values are at 25C and with a 3.3-V supply. tsk(p) is the magnitude of the time difference between tPLH and tPHL of a specified terminal. tsk(o) is the magnitude of the difference in propagation delay times between any specified terminals of channel 2 to 4 of a device when inputs are tied together. tsk(pp) is the magnitude of the difference in propagation delay times between any specified terminals of channel 2 to 4 of two devices, or between channel 1 of two devices, when both devices operate with the same source, the same supply voltages, at the same temperature, and have identical packages and test circuits. Submit Documentation Feedback Copyright (c) 2006-2007, Texas Instruments Incorporated Product Folder Link(s): TMDS442 TMDS442 www.ti.com SLLS757A - AUGUST 2006 - REVISED MARCH 2007 TIMING CHARACTERISTICS FOR LOCAL I2C INTERFACE (LC_SCL, LC_SDA, LC_AO, LC_A1) STANDARD MODE PARAMETER MIN MAX FAST MODE MIN 100 MAX fSCL Clock frequency, SCL tw(L) Clock low period, SCL low tw(H) Clock high period, SCL high tr Rise time, SCL and SDA 1000 300 s tf Fall time, SCL and SDA 300 300 s tsu(1) Setup time, SDA to SCL th(1) Hold time, SCL to SDA t(buf) 4.7 400 UNIT 4 kHz s 1.3 s 0.6 250 100 s 0 0 s BUS Free time between a STOP and START condition 4.7 1.3 s tsu(2) Setup time, SCL to start condition 4.7 0.6 s th(2) Hold time, start condition to SCL 4 0.6 s tsu(3) Setup time, SCL to stop condition 4 0.6 Cb (1) Capacitive load for each bus line (1) 400 s 400 pF Cb is the total capacitance of one bus line in pF. Submit Documentation Feedback Copyright (c) 2006-2007, Texas Instruments Incorporated Product Folder Link(s): TMDS442 11 TMDS442 www.ti.com SLLS757A - AUGUST 2006 - REVISED MARCH 2007 PARAMETER MEASUREMENT INFORMATION t w(H) t w(L) tr tf SCL t su(1) t h(1) SDA A. tr and tf are measured at 20% - 80% refered to VIHmin and VILmax levels. Figure 1. SCL and SDA Timing SCL t su(2) t h(2) t su(3) t (buf) SDA Start Condition Stop Condition Figure 2. Start and Stop Conditions AVcc RT RT ZO = RT TMDS Driver ZO = RT TMDS Receiver Figure 3. Typical Termination for TMDS Output Driver 12 Submit Documentation Feedback Copyright (c) 2006-2007, Texas Instruments Incorporated Product Folder Link(s): TMDS442 TMDS442 www.ti.com SLLS757A - AUGUST 2006 - REVISED MARCH 2007 PARAMETER MEASUREMENT INFORMATION (continued) Vcc RINT RINT RT Y A TMDS Receiver VID VA TMDS Driver CL 0.5 pF VY AVcc RT Z B VZ VB VID = VA - VB Vswing = VY - VZ VA DC Coupled Vcc AC Coupled Vcc+0.2 V VB Vcc-0.4 V Vcc-0.2 V VID 0.4 V VID VID(pp) 0V -0.4 V t PHL t PLH 100% 80% Vswing VOD(O) 0V Differential VOD(pp) 20% 0% tf tr VOD(U) VOC nVOC(SS) NOTE: PRE = low. All input pulses are supplied by a generator having the following characteristics: tr or tf < 100 ps, 100 MHz from Agilent 81250. CL includes instrumentation and fixture capacitance within 0.06 m of the D.U.T. Measurement equipment provides a bandwidth of 20 GHz minimum. Figure 4. TMDS Timing Test Circuit and Definitions Submit Documentation Feedback Copyright (c) 2006-2007, Texas Instruments Incorporated Product Folder Link(s): TMDS442 13 TMDS442 www.ti.com SLLS757A - AUGUST 2006 - REVISED MARCH 2007 PARAMETER MEASUREMENT INFORMATION (continued) 1 bit VOD(PP) 1 to N bit VODE(SS) Figure 5. De-Emphasis Output Voltage Waveforms and Duration Measurement Definitions 50 W IOS TMDS Driver 50 W + _ 0 V or 3.6 V Figure 6. Short Circuit Output Current Test Circuit VOH VY 50% VZ VOL tsk(D) Figure 7. Definition of Intra-Pair Differential Skew 14 Submit Documentation Feedback Copyright (c) 2006-2007, Texas Instruments Incorporated Product Folder Link(s): TMDS442 TMDS442 www.ti.com SLLS757A - AUGUST 2006 - REVISED MARCH 2007 PARAMETER MEASUREMENT INFORMATION (continued) Input-1 kept HIGH A Input-2 kept LOW A B B 3.3V Vcc 2 0V SA Clocking SB 0V kept LOW tSX Y Output tSX 75mV -75mV Z 75mV -75mV Hi-Z 3.3V Vcc 2 0V /OE tdis ten Figure 8. TMDS Outputs Control Timing Definitions AVcc RT Data + Video Data Patterm Generator 800mVpp or 1200mVpp Differential Clk+ Clk- Coax Coax SMA SMA RX +EQ SMA 28AWG HDMI Cable Coax Coax SMA Coax Jitter Test Instrument AVcc RT RT Transmission media HDMI cable or FR4 PCB trace SMA SMA SMA Coax OUT TMDS442 RX +EQ RT Coax OUT SMA Coax Jitter Test Instrument TTP1 TTP2 TTP3 TTP4 -12 A. All jitters are measured in BER of 10 B. The residual jitter reflects the total jitter measured at the TMDS442 output, TP3, subtract the total jitter from the signal generator, TP1 C. The input cable length and the output transmission media are specified in the test conditions. Figure 9. Jitter Test Circuit Submit Documentation Feedback Copyright (c) 2006-2007, Texas Instruments Incorporated Product Folder Link(s): TMDS442 15 TMDS442 www.ti.com SLLS757A - AUGUST 2006 - REVISED MARCH 2007 PARAMETER MEASUREMENT INFORMATION (continued) Port 1 is the Source Port 2 is the Source SA Vcc 2 SB 0V 5V_PWR1 1.5V 5V 5V_PWR2 5V_PWR3 5V or 0V 5V_PWR4 5V or 0V 5V_SINK Vcc/2 tpd (5V) tsx (5V) tpd (5V) HPD_SINK 1.5V tsx (HPD) HPD1 Vcc/2 tpd (HPD) HPD2 tpd (HPD) Vcc Vcc/2 0V tpd (HPD) HPD3 0V HPD4 0V SDA1 SDA2 2.0V SDA_SINK 0.6V tsx (DDC) Figure 10. Post Switch Timing Definitions 16 Submit Documentation Feedback Copyright (c) 2006-2007, Texas Instruments Incorporated Product Folder Link(s): TMDS442 TMDS442 www.ti.com SLLS757A - AUGUST 2006 - REVISED MARCH 2007 PARAMETER MEASUREMENT INFORMATION (continued) Vcc VCC 3.3V + 10% SCL/SDA Input Vcc/2 RL=4.7kW PULSE GENERATOR 0.1V D.U.T. RT tPHL C L=100pF VIN tPLH 80% VOUT SCL_SINK/ SDA_SINK Output 80% 20% 1.5V 20% tf 3.3V + 10% tr VOL Vcc VCC 5V + 10% SCL_SINK/ SDA_SINK Input 1.5V RL=1.67kW PULSE GENERATOR 0.1V D.U.T. RT tPHL C L=400pF VIN 80% VOUT SCL/SDA Output 80% 20% Vcc/2 20% tf 5V + 10% tr VOL Vcc SCL_SINK/ SDA_SINK Input 0.5V tPLH 5V + 10% SCL/SDA Output Vcc/2 Figure 11. I2C Timing Test Circuit and Definition START STOP 5V SCL 0V 5V VCC/2 SDA 0V V CC 1.5V 5V_PWR 0V t SET t HOLD V CC I2CEN 0V 2 Figure 12. I C Setup and Hold Definition Submit Documentation Feedback Copyright (c) 2006-2007, Texas Instruments Incorporated Product Folder Link(s): TMDS442 17 TMDS442 www.ti.com SLLS757A - AUGUST 2006 - REVISED MARCH 2007 TYPICAL CHARACTERISTICS SUPPLY CURRENT vs FREQUENCY SUPPLY CURRENT vs FREE-AIR TEMPERATURE 320 325 319 317 ICC - Supply Current - mA ICC - Supply Current - mA 318 VID(PP) = 1000 mV, PRE = High 316 315 VID(PP) = 1000 mV, PRE = Low 314 313 312 311 VCC = AVCC = 3.3 V, RT = 50 W, RVSADJ = 4.64 kW, TA = 25C, SA1 = SB1 = Low, 5V_PWR1 = High, SA2 = SB2 = High, 5V_PWR4 = High, OE1 = OE2 = Low I2CEN1 = I2CEN2 = High, HDMI Data Pattern 320 PRE = HIGH 315 PRE = LOW 310 VCC = AVCC = 3.3 V, RT = 50 W, 305 300 RVSADJ = 4.64 kW, TA = 25C, SA1 = SB1 = Low, 5V_PWR1 = High, SA2 = SB2 = High, 5V_PWR4 = High, OE1 = OE2 = Low I2CEN1 = I2CEN2 = High, HDMI Data Pattern, 165-Mhz Pixel Clock, VID(PP) = 1000 mV 310 0 20 30 40 50 60 70 Figure 13. Figure 14. RESIDUAL PEAK-TO-PEAK JITTER vs DATA RATE (DC Coupled Input: 5m Cable, Output: 1m Cable) RESIDUAL PEAK-TO-PEAK JITTER vs DATA RATE (DC Coupled Input: 5m Cable, Output: 0m Cable) 20 20 18 18 16 PRE = High, TTP1 1200 mVPP 14 PRE = High, TTP1 800 mVPP 12 10 See Figure 9 Jitter Test Circuit, VCC = AVCC = 3.3 V, RT = 50 W, 8 RVSADJ = 4.64 kW, TA = 25C SA1 = SB1 = Low , 5V_PWR1 = High, SA2 = SB2 = High, 5V_PWR4 = High, OE1 = OE2 = Low, I2CEN1 = I2CEN2 = High, HDMI Data Pattern 6 4 2 0 16 See Figure 9 Jitter Test Circuit, VCC = AVCC = 3.3 V, RT = 50 W, RVSADJ = 4.64 kW, TA = 25C PRE = Low, 1200 mVPP 14 PRE = Low, 800 mVPP 12 PRE = High, 1200 mVPP 10 8 PRE = High, 800 mVPP 6 SA1 = SB1 = Low, 5V_PWR1 = High, SA2 = SB2 = High, 5V_PWR4 = High, OE1 = OE2 = Low, I2CEN1 = I2CEN2 = High, HDMI Data Pattern 4 2 0 750 1450 1650 1850 2250 750 Data Rate - Mbps Figure 15. 18 10 TA - Free-Air Temperature - C Residual Peak-Peak Jitter - % of Tbit Residual Peak-Peak Jitter - % of Tbit 200 250 450 650 750 850 1050 1250 1450 1650 Signaling Rates - Mbps 1450 1650 1850 Data Rate - Mbps 2250 Figure 16. Submit Documentation Feedback Copyright (c) 2006-2007, Texas Instruments Incorporated Product Folder Link(s): TMDS442 TMDS442 www.ti.com SLLS757A - AUGUST 2006 - REVISED MARCH 2007 TYPICAL CHARACTERISTICS (continued) RESIDUAL PEAK-TO-PEAK JITTER vs DATA RATE (AC Coupled Input: 3m Cable, Output: 1m Cable) 20 20 PRE = High, 800 mVPP 18 16 14 PRE = High, 1200 mVPP 12 10 8 6 2 See Figure 9 Jitter Test Circuit, VCC = AVCC = 3.3 V, RT = 50 W, RVSADJ = 4.64 kW, TA = 25C, SA1 = SB1 = Low, 5V_PWR1 = High, SA2 = SB2 = High, 5V_PWR4 = High, OE1 = OE2 = Low, I2CEN1 = I2CEN2 = High, HDMI Data Pattern Residual Peak-Peak Jitter - % of Tbit Residual Peak-Peak Jitter - % of Tbit 18 4 RESIDUAL PEAK-TO-PEAK JITTER vs DATA RATE (AC Coupled Input: 3m Cable, Output: 0m Cable) 16 See Figure 9 Jitter Test Circuit, VCC = AVCC = 3.3 V, RT = 50 W, RVSADJ = 4.64 kW, TA = 25C, SA1 = SB1 = Low, 5V_PWR1 = High, SA2 = SB2 = High, 5V_PWR4 = High, OE1 = OE2 = Low, I2CEN1 = I2CEN2 = High, HDMI Data Pattern 14 PRE = High, 1200 mVPP 12 10 PRE = Low, 1200 mVPP 8 6 4 PRE = Low, 800 mVPP PRE = High, 800 mVPP 2 0 0 750 1450 1650 1850 2250 750 Data Rate - Mbps Figure 17. RESIDUAL PEAK-TO-PEAK JITTER vs PEAK-TO-PEAK DIFFERENTIAL INPUT VOLTAGE (at TTP1, DC Coupled: 5m Cable) 30 24 30 See Figure 9 Jitter Test Circuit, VCC = AVCC = 3.3 V, RT = 50 W, RVSADJ = 4.64 kW, TA = 25C, SA1 = SB1 = Low, 5V_PWR1 = High, SA2 = SB2 = High, 5V_WPR4 = High OE1 = OE2 = Low, I2CEN1 = I2CEN2 = High, 1.65-Gbps HDMI Data Pattern, 165-MHz pixel Clock,VID(PP) at TTP1, PRE = Low, TTP1 1200 mVPP Source Jitter < 0.3UI 22 20 18 PRE = High, TTP1 1200 mVPP 16 PRE = Low, TTP1 800 mVPP 14 12 PRE = High, TTP1 800 mVPP 10 See Figure 9 Jitter Test Circuit, VCC = AVCC = 3.3 V, RT = 50 W, RVSADJ = 4.64 kW, TA = 25C, SA1 = SB1 = Low , 5V_PWR1 = High, SA2 = SB2 = High, 5V_PWR4 = High, OE1 = OE2 = Low, I2CEN1 = I2CEN2 = High 165-Mhz Pixel Clock HDMI Data Pattern, VID(PP) at TTP1, Source Jitter < 0.3 UI 28 Residual Peak-Peak Jitter - % of Tbit Residual Peak-Peak Jitter - % of Tbit 26 26 24 22 Output:1m HDMI Cable, PRE = High 20 18 16 14 12 10 8 Output:0m HDMI Cable, PRE = Low 6 8 4 2250 Figure 18. RESIDUAL PEAK-TO-PEAK JITTER vs 8-MIL FR4 TRACE OUTPUT (DC Coupled Input: 5m Cable) 28 1450 1650 1850 Data Rate - Mbps 8 12 16 8-mil FR4 Trace Length - inch Figure 19. 100 300 500 700 900 1100 1300 1500 1700 Peak-to-Peak Differential Input Voltage - mVp-p Figure 20. Submit Documentation Feedback Copyright (c) 2006-2007, Texas Instruments Incorporated Product Folder Link(s): TMDS442 19 TMDS442 www.ti.com SLLS757A - AUGUST 2006 - REVISED MARCH 2007 TYPICAL CHARACTERISTICS (continued) OUTPUT INTRA-PAIR SKEW vs INPUT INTRA-PAIR SKEW (DC Coupled Input: 0m, Output: 0m) 30 Output Intra-Pair Skew - ps 25 VCC = AVCC = 3.3 V, RT = 50 W, RVSADJ = 4.64 kW, TA = 25C, tr/tf > 0.3Tbit From the Source 1080p (1.485Gbps), PRE = High 20 1080i (742.5Mbps), PRE = High 15 1080i (742.5Mbps), PRE = Low 10 1080p (1.485Gbps), PRE = Low 5 SA1 = SB1 = Low, 5V_PWR1 = High, SA2 = SB2 = High, 5V_PWR4 = High, OE1 = OE2 = Low, I2CEN1 = I2CEN2 = High, HDMI Data Pattern, TTP2 VID(PP) = 800 mVPP 0 0.08 20 0.16 0.24 0.32 0.4 0.48 0.56 Input Intra-Pair Skew - Tbit Figure 21. Submit Documentation Feedback 0.64 Copyright (c) 2006-2007, Texas Instruments Incorporated Product Folder Link(s): TMDS442 TMDS442 www.ti.com SLLS757A - AUGUST 2006 - REVISED MARCH 2007 TYPICAL CHARACTERISTICS (continued) TP1 TP2 TP3 TP4 TMDS442 Test Board Video Format Generator HDMI Cable A TMDS 442 HDMI Cable B Eye Pattern @ TP1 @ TP2 @TP3 PRE=LOW @TP4 PRE=HIGH Cable A 1m Data Cable B 1m Clock 5m 1m Data Clock Figure 22. Eye Patterns at 148.5-MHz Pixel Clock Submit Documentation Feedback Copyright (c) 2006-2007, Texas Instruments Incorporated Product Folder Link(s): TMDS442 21 TMDS442 www.ti.com SLLS757A - AUGUST 2006 - REVISED MARCH 2007 DESCRIPTION SOURCE SELECTION LOOKUP CONTROL REGISTER BITS I/O SELECTED HOT PLUG DETECT STATUS SB SA OE I2CEN Y/Z SCL_SINK SDA_SINK HPD1 HPD2 HPD3 HPD4 L L L H A1/B1 SCL1 SDA1 HPD_SINK L L L L H L H A2/B2 SCL2 SDA2 L HPD_SINK L L H L L H A3/B3 SCL3 SDA3 L L HPD_SINK L H H L H A4/B4 SCL4 SDA4 L L L HPD_SINK X X L L A/B Z HPD_SINK is transmitted to corresponding source port X X H H Z SCL SDA HPD_SINK is transmitted to corresponding source port X X H L Z Z HPD_SINK is transmitted to corresponding source port SINK PRIORITY CONTROL (SA1 = SA2 = Low, SB1 = SB2 = Low, OE1 = OE2 = Low, I2CEN1 = I2CEN2 = High) SINK PRIORITY SINK PORT 1 SINK PORT 2 SP Y1/Z1 SCL_SINK1/SDA_SINK1 Y2/Z2 SCL_SINK2/SDA_SINK2 HPD1 L A1/B1 SCL1/SDA1 A1/B1 Z HPD_SINK1 H A1/B1 Z A1/B1 SCL1/SDA1 HPD_SINK2 5V_PWR STATUS (SA = Low, SB = Low, OE = Low, I2CEN = High) CONTROL STATUS SOURCE PLUG IN STATUS I/O SELECTED HOT PLUG DETECT STATUS GE 5V_EN 5V_PWR1 Y/Z SCL_SINK/SDA_SINK HPD1 HPD2 HPD3 HPD4 L H H A1/B1 SCL1/SDA1 HPD_SINK L L L L H L Z Z L L L L L L X A1/B1 SCL1/SDA1 HPD_SINK L L L H X H A1/B1 SCL1/SDA1 HPD_SINK L L L H X L Z Z L L L L I2C POINTER REGISTER P7 P6 P5 P4 P3 P2 P1 P0 0 0 0 0 0 0 X X 01, Sink port 1 configuration register 10, Sink port 2 configuration register 11, Source plug-in status register Power up default is 0000 0011 22 Submit Documentation Feedback Copyright (c) 2006-2007, Texas Instruments Incorporated Product Folder Link(s): TMDS442 TMDS442 www.ti.com SLLS757A - AUGUST 2006 - REVISED MARCH 2007 SINK PORT 1 CONFIGURATION REGISTER C7 C6 C5 C4 C3 C2 C1 C0 0 0 0 PRE1 I2CEN1 OE1 SB1 SA1 Power up default is 0000 1000 SINK PORT 2 CONFIGURATION REGISTER C7 C6 C5 C4 C3 C2 C1 C0 0 0 0 PRE2 I2CEN2 OE2 SB2 SA2 Power up default is 0000 1001 SOURCE PLUG-IN STATUS REGISTER S7 S6 S5 S4 S3 S2 S1 S0 0 0 SP 5V_EN 5V_PWR4 5V_PWR3 5V_PWR2 5V_PWR1 Power up default is 0001 0000 Submit Documentation Feedback Copyright (c) 2006-2007, Texas Instruments Incorporated Product Folder Link(s): TMDS442 23 TMDS442 www.ti.com SLLS757A - AUGUST 2006 - REVISED MARCH 2007 APPLICATION INFORMATION I2C Interface Notes The I2C interface is used to access the internal registers of the TMDS442. I2C is a two-wire serial interface developed by Philips Semiconductor (see I2C-Bus Specification, Version 2.1, January 2000). The bus consists of a data line (SDA) and a clock line (SCL) with pull-up structures. When the bus is idle, both SDA and SCL lines are pulled high. All the I2C compatible devices connect to the I2C bus through open drain I/O pins, SDA and SCL. A master device, usually a microcontroller or a digital signal processor, controls the bus. The master is responsible for generating the SCL signal and device addresses. The master also generates specific conditions that indicate the START and STOP of data transfer. A slave device receives and/or transmits data on the bus under control of the master device. The TMDS442 works as a slave and supports the standard mode transfer (100 kbps) and fast mode transfer (400 kbps) as defined in the I2C-Bus Specification. The TMDS442 has been tested to be fully functional with the high-speed mode (3.4 Mbps) but is not ensured at this time. The basic I2C start and stop access cycles are shown in Figure 23. The basic access cycle consists of the following: * A start condition * A slave address cycle * Any number of data cycles * A stop condition SDA SCL S P Start Condition Stop Condition Figure 23. I2C Start and Stop Conditions General I2C Protocol * * * * 24 The master initiates data transfer by generating a start condition. The start condition is when a high-to-low transition occurs on the SDA line while SCL is high, as shown in Figure 23. All I2C-compatible devices should recognize a start condition. The master then generates the SCL pulses and transmits the 7-bit address and the read/write direction bit R/W on the SDA line. During all transmissions, the master ensures that data is valid. A valid data condition requires the SDA line to be stable during the entire high period of the clock pulse (see Figure 23). All devices recognize the address sent by the master and compare it to their internal fixed addresses. Only the slave device with a matching address generates an acknowledge (see Figure 25) by pulling the SDA line low during the entire high period of the ninth SCL cycle. On detecting this acknowledge, the master knows that a communication link with a slave has been established. The master generates further SCL cycles to either transmit data to the slave (R/W bit 1) or receive data from the slave (R/W bit 0). In either case, the receiver needs to acknowledge the data sent by the transmitter. So an acknowledge signal can either be generated by the master or by the slave, depending on which one is the receiver. The 9-bit valid data sequences consisting of 8-bit data and 1-bit acknowledge can continue as long as necessary (see Figure 26). To signal the end of the data transfer, the master generates a stop condition by pulling the SDA line from low to high while the SCL line is high (see Figure 23). This releases the bus and stops the communication link with the addressed slave. All I2C compatible devices must recognize the stop condition. Upon the receipt of a stop condition, all devices know that the bus is released, and they wait for a start condition followed by a matching address. Submit Documentation Feedback Copyright (c) 2006-2007, Texas Instruments Incorporated Product Folder Link(s): TMDS442 TMDS442 www.ti.com SLLS757A - AUGUST 2006 - REVISED MARCH 2007 SDA SCL Data Line Stable; Data Valid Change of Data Allowed Figure 24. I2C Bit Transfer Data Output by Transmitter Not Acknowledge Data Output by Receiver Acknowledge SCL From Master 1 8 2 9 S Clock Pulse for Acknowledgement Start Condition Figure 25. I2C Acknowledge 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 SCL SDA Stop MSB Acknowledge Slave Address Acknowledge Data Figure 26. I2C Address and Data Cycles During a write cycle, the transmitting device must not drive the SDA signal line during the acknowledge cycle so that the receiving device may drive the SDA signal low. After each byte transfer following the address byte, the receiving device will pull the SDA line low for one SCL clock cycle. A stop condition will be initiated by the transmitting device after the last byte is transferred. An example of a write cycle can be found in Figure 27 and Figure 28. Note that the TMDS442 does not allow multiple write transfers to occur. See Example - Writing to the TMDS442 section for more information. During a read cycle, the slave receiver will acknowledge the initial address byte if it decodes the address as its address. Following this initial acknowledge by the slave, the master device becomes a receiver and Submit Documentation Feedback Copyright (c) 2006-2007, Texas Instruments Incorporated Product Folder Link(s): TMDS442 25 TMDS442 www.ti.com SLLS757A - AUGUST 2006 - REVISED MARCH 2007 acknowledges data bytes sent by the slave. When the master has received all of the requested data bytes from the slave, the not acknowledge (A) condition is initiated by the master by keeping the SDA signal high just before it asserts the stop (P) condition. This sequence terminates a read cycle as shown in Figure 29 and Figure 30. Note that the TMDS442 does not allow multiple read transfers to occur. See Example - Reading from the TMDS442 section for more information. From Receiver S Slave Address W A DATA A DATA A = No Acknowledge (SDA High) A = Acknowledge S = Start Condition P = Stop Condition W = Write R = Read P A From Transmitter Figure 27. I2C Write Cycle Acknowledge (From Receiver) Start Condition A6 A5 A1 A0 R/W ACK D7 Acknowledge (Transmitter) Acknowledge (Receiver) D6 D0 D1 ACK D7 D6 D1 D0 ACK SDA 2 First Data Byte I C Device Address and Read/Write Bit Other Data Bytes Stop Condition Last Data Byte Figure 28. Multiple Byte Write Transfer S Slave Address R A DATA A DATA A A = No Acknowledge (SDA High) A = Acknowledge S = Start Condition P = Stop Condition W = Write R = Read P Transmitter Receiver Figure 29. I2C Read Cycle Start Condition SDA Acknowledge (From Receiver) A6 A0 R/W ACK I 2 C Device Address and Read/Write Bit D7 Acknowledge (From Transmitter) D0 First Data Byte ACK Not Acknowledge (Transmitter) D7 Other Data Bytes D6 D1 D0 Last Data Byte ACK Stop Condition Figure 30. Multiple Byte Read Transfer Slave Address Both SDA and SCL must be connected to a positive supply voltage via a pull-up resistor. These resistors should comply with the I2C specification that ranges from 2 k to 19 k. When the bus is free, both lines are high. The address byte is the first byte received following the START condition from the master device. The first 5 Bits (MSBs) of the address are factory preset to 01011. The next two bits of the TMDS442 address are controlled by 26 Submit Documentation Feedback Copyright (c) 2006-2007, Texas Instruments Incorporated Product Folder Link(s): TMDS442 TMDS442 www.ti.com SLLS757A - AUGUST 2006 - REVISED MARCH 2007 the logic levels appearing on the I2C-A1 and I2C-A0 pins. The I2C-A1 and I2C-A0 address inputs can be connected to VCC for logic 1, GND for logic 0, or can be actively driven by TTL/CMOS logic levels. The device addresses are set by the state of these pins and are not latched. Thus a dynamic address control system could be utilized to incorporate several devices on the same system. Up to four TMDS442 devices can be connected to the same I2C-Bus without requiring additional glue logic. Table 1 lists the possible addresses for the TMDS442. Table 1. TMDS442 Slave Addresses FIXED ADDRESSES SELECTABLE WITH ADDRESS PINS READ/WRITE BIT BIT 7 (MSB) BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 (A1) BIT 1 (A0) BIT 0 (R/W) 0 1 0 1 1 0 0 0 0 1 0 1 1 0 0 1 0 1 0 1 1 0 1 0 0 1 0 1 1 0 1 1 0 1 0 1 1 1 0 0 0 1 0 1 1 1 0 1 0 1 0 1 1 1 1 0 0 1 0 1 1 1 1 1 Sink Port Selection Register and Source Plug-In Status Register Description (Sub-Address) The TMDS442 operates using only a single byte transfer protocol similar to Figure 27 and Figure 29. The internal sub-address registers and the functionality of each can be found in Table 2. When writing to the device, it is required to send one byte of data to the corresponding internal sub-address. If control of two sink ports and source plug-in status is desired, then the master will have to cycle through the sub-addresses (sink ports) one at a time as illustrated in the Example - Writing to the TMDS442 section for the proper procedure of writing to the TMDS442. During a read cycle, the TMDS442 sends the data in its selected sub-address in a single transfer to the master device requesting the information. See the Example - Reading from the TMDS442 section of this document for the proper procedure on reading from the TMDS442. Upon power up, the TMDS442 registers are in a default value, 0000 0011. Table 2. TMDS442 Sink Port and Source Plug-In Status Registers Selection REGISTER NAME BIT ADDRESS (b7b6b5...b0) Sink port 1 0000 0001 Sink port 2 0000 0010 Source plug-in status 0000 0011 Sink Port Register Bit Descriptions Each bit of the first two sub-addresses, sink port 1 and port 2 control registers, allows the user to individually control the functionality of the TMDS442. The benefit of this process allows the user to control the functionality of each sink port independent of the other sink port. The bit description is decoded in Table 3. Table 3. TMDS442 Sink Port Register Bit Decoder BIT FUNCTION BIT VALUES RESULT 7, 6, 5 Reserved 000 Default value 4 PRE 0 3dB De-emphasis off 3 I2CEN 2 OE 1 3dB De-emphasis on 0 Sink side I2C buffer is disabled (Hi-Z) 1 Sink side I2C buffer is enabled 0 Sink side TMDS on 1 Sink side TMDS off (Hi-Z) Submit Documentation Feedback Copyright (c) 2006-2007, Texas Instruments Incorporated Product Folder Link(s): TMDS442 27 TMDS442 www.ti.com SLLS757A - AUGUST 2006 - REVISED MARCH 2007 Table 3. TMDS442 Sink Port Register Bit Decoder (continued) BIT FUNCTION 1, 0 BIT VALUES RESULT 00 Source port 1 select 01 Source port 2 select 10 Source port 3 select 11 Source port 4 select SB SA Bits 7 (MSB), 6 and 5 - Reserved bits without function. Bit 4 - Controls the TMDS output differential voltage. Bit 3 - Controls the status of DDC interface, SCL_SINK and SDA_SINK. Bit 2 - Controls the status of TMDS interface, Y/Z. Bits 1, and 0 (LSB) - Selects the source input of the TMDS442. The 5-V plug in status can be read through each bit of the sub-address (source plug-in status) status register. Each bit of the third sub-address, source plug-in status registers, allows the user to read the cable plug-in status based on the appearance of a valid +5-V power signal from each source input port. The bit description is decoded in Table 4. Table 4. TMDS442 Source Plug-In Status Register Bit Decoder BIT FUNCTION BIT VALUES 7, 6 Reserved 00 5 SP 4 5V_EN 3 5V_PWR4 2 5V_PWR3 1 0 5V_PWR2 5V_PWR1 RESULT Default value 0 Sink port1 is the main display when the same source is selected by both sinks 1 Sink port2 is the main display when the same source is selected by both sinks 0 TMDS output status is not controlled by the corresponding +5-V power signal 1 TMDS output status is controlled by the corresponding +5-V power signal 0 Source side I2C buffer is disabled (Hi-Z) When source port 4 is selected by sink, TMDS is Hi-Z 1 Source side I2C buffer is enabled When source port 4 is selected by sink, TMDS is under the control of OE 0 Source side I2C buffer is disabled (Hi-Z) 1 When source port 3 is selected by sink, TMDS is Hi-Z 0 Source side I2C buffer is disabled (Hi-Z) When source port 2 is selected by sink, TMDS is Hi-Z 1 Source side I2C buffer is enabled When source port 2 is selected by sink, TMDS is under the control of OE 0 Source side I2C buffer is disabled (Hi-Z) When source port 1 is selected by sink, TMDS is Hi-Z 1 Source side I2C buffer is enabled When source port 1 is selected by sink, TMDS is under the control of OE Example - Writing to the TMDS442 The proper way to write to the TMDS442 is illustrated as follows: An I2C master initiates a write operation to the TMDS442 by generating a start condition (S) followed by the TMDS442 I2C address (as shown below), in MSB first bit order, followed by a 0 to indicate a write cycle. After receiving an acknowledge from the TMDS442, the master presents the sub-address (sink port) it wants to write consisting of one byte of data, MSB first. The TMDS442 acknowledges the byte after completion of the transfer. Finally the master presents the data it wants to write to the register (sink port) and the TMDS442 acknowledges the byte. The I2C master then terminates the write operation by generating a stop condition (P). Note that the TMDS442 does not support multi-byte transfers. To write to both sink ports - or registers - this procedure must be repeated for each register one series at a time (i.e. repeat steps 1 through 8 for each sink port). 28 Submit Documentation Feedback Copyright (c) 2006-2007, Texas Instruments Incorporated Product Folder Link(s): TMDS442 TMDS442 www.ti.com SLLS757A - AUGUST 2006 - REVISED MARCH 2007 STEP 1 0 2 I C Start (Master) STEP 2 2 I C General Address (Master) S 7 6 5 4 3 2 1 0 0 1 0 1 1 X X 0 Where each X logic state is defined by I2C-A1 and I2C-A0 pins being tied to either Vs+ or GND. STEP 3 9 2 I C Acknowledge (Slave) A STEP 4 7 6 5 4 3 2 1 0 I2C Write Sink Port Address (Master) 0 0 0 0 0 0 Addr Addr Where Addr is determined by the values shown in Table 2. STEP 5 9 I2C Acknowledge (Slave) A STEP 6 I2C Write Data (Master) 7 6 5 4 3 2 1 0 Data Data Data Data Data Data Data Data Where Data is determined by the values shown in Table 3. STEP 7 9 I2C Acknowledge (Slave) A STEP 8 0 I2C Stop (Master) P For step 4, an example of the proper bit control for selecting sink port 2 is 0000 0010. For step 6, an example of the proper bit control for selecting source port B, enabling TMDS outputs and DDC link of the sink port 2 without 3.5dB de-emphasis is 0000 1001. Example - Reading From the TMDS442 The read operation consists of two phases. The first phase is the address phase. In this phase, an I2C master initiates a write operation to the TMDS442 by generating a start condition (S) followed by the TMDS442 I2C address, in MSB first bit order, followed by a 0 to indicate a write cycle. After receiving acknowledges from the TMDS442, the master presents the sub-address (sink port) of the register it wants to read. After the cycle is acknowledged (A), the master terminates the cycle immediately by generating a stop condition (P). The second phase is the data phase. In this phase, an I2C master initiates a read operation to the TMDS442 by generating a start condition followed by the TMDS442 I2C address (as shown below for a read operation), in MSB first bit order, followed by a 1 to indicate a read cycle. After an acknowledge from the TMDS442, the I2C master receives one byte of data from the TMDS442. After the data byte has been transferred from the TMDS442 to the master, the master generates a NOT-acknowledge followed by a stop. Similar to the write function, to read both sink ports steps 1 through 11 must be repeated for each and every sink port desired. TMDS Read Phase 1: STEP 1 0 I2C Start (Master) S STEP 2 7 6 5 4 3 2 1 0 I2C General Address (Master) 0 1 0 1 1 X X 0 Submit Documentation Feedback Copyright (c) 2006-2007, Texas Instruments Incorporated Product Folder Link(s): TMDS442 29 TMDS442 www.ti.com SLLS757A - AUGUST 2006 - REVISED MARCH 2007 Where each X logic state is defined by I2C-A1 and I2C-A0 pins being tied to either Vs+ or GND. STEP 3 9 I2C Acknowledge (Slave) A STEP 4 7 6 5 4 3 2 1 0 I2C Read Sink Port Address (Master) 0 0 0 0 0 0 Addr Addr Where Addr is determined by the values shown in Table 2. STEP 5 9 I2C Acknowledge (Slave) A STEP 6 0 I2C Stop (Master) P TMDS442 Read Phase 2: STEP 7 0 I2C Start (Master) S STEP 8 7 6 5 4 3 2 1 0 I2C General Address (Master) 0 1 0 1 1 X X 1 Where X logic state is defined by I2C-A1 and I2C-A0 pins being tied to either Vs+ or GND. STEP 9 9 2 I C Acknowledge (Slave) A STEP 10 2 I C Read Data (Slave) 7 6 5 4 3 2 1 0 Data Data Data Data Data Data Data Data Where Data is determined by the logic values contained in the Sink Port Register. STEP 11 9 I2C Not-Acknowledge (Master) A STEP 12 0 I2C Stop (Master) P Supply Voltage All VCC pins can be tied to a single 3.3-V power source. A 0.01-F capacitor is connected from each VCC pin directly to ground to filter supply noise. TMDS Inputs Standard TMDS terminations are integrated on all TMDS inputs. External terminations are not required. Each input channel contains an 8-dB equalization circuit to compensate for cable losses. The voltage at the TMDS input pins must be limited per the absolute maximum ratings. An unused input should not be connected to ground as this would result in excessive current flow damaging the device. TMDS input pins do not incorporate failsafe circuits. An unused input channel can be externally biased to prevent output oscillation. The complementary input pin is recommended to be grounded through a 1-k resistor and the other pin left open. 30 Submit Documentation Feedback Copyright (c) 2006-2007, Texas Instruments Incorporated Product Folder Link(s): TMDS442 TMDS442 www.ti.com SLLS757A - AUGUST 2006 - REVISED MARCH 2007 TMDS Outputs A 1% precision resister, 4.64-k, connected from VSADJ to ground is recommended to allow the differential output swing to provide TMDS signal levels. The differential output driver provides a typical 10-mA current sink capability, which provides a typical 500-mV voltage drop across a 50- termination resistor. A 10% accuracy resistor is allowed to be connected when the output swing is not strictly required to meet the TMDS signal levels. A 10% resistor provides differential output voltages in the range of 438 mV and 532 mV. AVCC VCC TMDS442 ZO = RT TMDS Driver RT RT TMDS Receiver ZO = RT GND Figure 31. TMDS Driver and Termination Circuit Referring to Figure 31, if both VCC (TMDS442 supply) and AVCC (sink termination supply) are both powered, the TMDS output signals are high impedance when OE = high. Both supplies being active is the normal operating condition. Again refer to Figure 31, if VCC is on and AVCC is off, the TMDS outputs source a typical 5-mA current through each termination resistor to ground. A total of 10-mW of power is consumed by the terminations independent of the OE logical selection. When AVCC is powered on, normal operation (OE controls output impedance) is resumed. When the power source of the device is off and the power source to termination is on, the IO(off), output leakage current, specification ensures the leakage current is limited 10-A or less. The PRE pin provides 3dB de-emphasis, allowing output signal pre-conditioning to offset interconnect losses from the TMDS442 outputs to a TMDS receiver. PRE is recommended to be set low while connecting to a receiver throw short PCB route. HPD Pins The HPD signals (HPD1, HPD2, HPD3) have an output impedance of 47- typically. In certain applications, a 931- resistor from the HPD output to the connector pin is recommended, to increase the output resistance to 1-K +/- 20%. DDC Channels The DDC channels are designed using I2C drivers with 5-V signal tolerance, allowing direct connection to standard I2C buses. Dual-Link 2-to-1 Switch Configurations TMDS442 can be simply configured to operate as a dual-link DVI/HDMI, 2-to-1 switch, by configuring the device as follows, see Figure 32: 1. Set SA1 = low and SA2 = high 2. Set SB1 = SB2 3. When the 5V_SINK1, HPD_SINK1, SCL_SINK1, and SDA_SINK1 are selected as the control channels from/to the SINK, connect the 5V_PWR1, HPD1, SCL1, and SDA1 to the dual-link source 1, and connect the 5V_PWR3, HPD3, SCL3, and SDA3 to the dual-link source 2. 4. When the 5V_SINK2, HPD_SINK2, SCL_SINK2, and SDA_SINK2 are selected as the control channels from/to the SINK, connect the 5V_PWR2, HPD2, SCL2, and SDA2 to the dual-link source 1, and connect the 5V_PWR4, HPD4, SCL4, and SDA4 to the dual-link source 2. Submit Documentation Feedback Copyright (c) 2006-2007, Texas Instruments Incorporated Product Folder Link(s): TMDS442 31 TMDS442 www.ti.com SLLS757A - AUGUST 2006 - REVISED MARCH 2007 TMDS DATA 5 TMDS DATA 4 TMDS DATA 3 Quad Terminated TMDS Rx with EQ TMDS DATA 2 From source 1 TMDS DATA 1 TMDS DATA 0 TMDS CLOCK TMDS DATA 5 Quad Terminated TMDS Rx with EQ TMDS DATA 4 Quad TMDS Tx TMDS DATA 3 Unused Input TMDS DATA 2 MUX TMDS DATA 5 TMDS DATA 4 TMDS DATA 3 To SINK TMDS DATA 1 Quad Terminated TMDS Rx with EQ TMDS DATA 0 Quad TMDS Tx TMDS DATA 2 TMDS CLOCK Unused Output From source 2 TMDS DATA 1 TMDS DATA 0 TMDS CLOCK Quad Terminated TMDS Rx with EQ Unused Input To source 1 HPD1 To source 2 HPD3 HPD_SINK1 HPD2 From SINK HPD_SINK2 HPD4 From source 1 5V_PWR1 From source 2 5V_PWR3 5V_PWR4 5V_SINK1 To SINK 5V_SINK2 SCL3 SDA3 SCL4 SDA4 GPIO5 (SA2) GPIO6 (SB2) SCL1 SDA1 SCL2 SDA2 From/To source 2 Control Logic GPIO0 (SA1) GPIO1 (SB1) From/To source 1 5V_PWR2 SCL_SINK1 SDA_SINK1 From/To SINK SCL_SINK2 SDA_SINK2 HIGH = source 1 LOW = source 2 Figure 32. Dual-Link 2-to-1 DVI/HDMI Switch Configuration In a dual link application, the unused TMDS input should be configured as follows: the complementary input pin is grounded through a 1-k resistor, and the other pin left open. Layout Considerations The high-speed TMDS inputs are the most critical paths for the TMDS442. There are several considerations to minimize discontinuities on these transmission lines between the connectors and the device: * The TMDS differential inputs should be layout in the shortest stubs from connectors directly * Maintain 100- differential impedance into and out of the TMDS442 * Keep an uninterrupted ground plane beneath the high-speed I/Os * Keep the ground-path vias to the device as close as possible to allow the shortest return current path I2C Function Description The SCL/SDA and SCL_SINK/SDA_SINK pins are 5-V tolerant when the device is powered off and high impedance under low supply voltage, 1.5 V or below. If the device is powered up and the I2C circuits are enabled, and EN = high, the driver T (see Figure 33) is turned on or off depending up on the corresponding R side voltage level. When the R side is pulled low below 1.5 V, the corresponding T side driver turns on and pulls the T side down to a low level output voltage, VOL. The value of VOL depends on the input to the OVS pin. When OVS is left floating 32 Submit Documentation Feedback Copyright (c) 2006-2007, Texas Instruments Incorporated Product Folder Link(s): TMDS442 TMDS442 www.ti.com SLLS757A - AUGUST 2006 - REVISED MARCH 2007 or not connected, VOL is typically 0.5 V. When OVS is connected to GND, VOL is typically 0.65 V. When OVS is connected to VCC, VOL is typically 0.8 V. VOL is always higher than the driver R input threshold, VIL, which is typically 0.4 V, preventing lockup of the repeater loop. The VOL value can be selected to improve or optimize noise margins between VOL and the VIL of the repeater itself or the VIL of some external device connected on the T side. When the R side is pulled up, above 1.5 V, the T side driver turns off and the T side pin is high impedance. OVS T SCL SDA SCL_SINK SDA_SINK EN R Figure 33. I2C Drivers in TMDS442 When the T side is pulled below 0.4 V by an external I2C driver, both drivers R and T are turned on. Driver R pulls the R side to near 0 V, and driver T is on, but is overridden by the external I2C driver. If driver T is already on, due to a low on the R side, driver R just turns on. When the T side is released by the external I2C driver, driver T is still on, so the T side is only able to rise to the VOL of driver T. Driver R turns off, since VOL is above its 0.4-V VIL threshold, releasing the R side. If no external I2C driver is keeping the R side low, the R side rises, and driver T turns off once the R side rises above 1.5 V, see Figure 34. Vcc SCL_SINK/ SDA_SINK 0.5V tPLH 5V + 10% SCL/SDA Vcc/2 Figure 34. Waveform of Turning Driver T Off It is important that any external I2C driver on the T side is able to pull the bus below 0.4 V to ensure full operation. If the T side cannot be pulled below 0.4 V, driver R may not recognize and transmit the low value to the R side. I2C Enable The I2C drivers are enabled with an internal EN signal. This EN signal is the AND gate result of the 5V_PWR signal from the selected input port and the I2CEN signal for the output. This AND gate is turned on based on an OR gate result of the GE and the 5V_EN settings. GE 5V_EN EN 5V_PWR I2CEN Figure 35. I2C Enable Equivalent Logic Submit Documentation Feedback Copyright (c) 2006-2007, Texas Instruments Incorporated Product Folder Link(s): TMDS442 33 TMDS442 www.ti.com SLLS757A - AUGUST 2006 - REVISED MARCH 2007 When GE sets high, or GE sets low and 5V_EN sets high, the EN signal is the AND result of the 5V_PWR and the I2CEN. When GE sets low and 5V_EN sets low, the EN signals follows the status of I2CEN. See Table 5. Table 5. Truth Table for the EN Signal of the I2C Driver (1) GE 5V_EN (1) 5V_PWR I2CEN EN 1 X 1 1 1 1 X 1 0 0 1 X 0 1 0 1 X 0 0 0 0 1 1 1 1 0 1 1 0 0 0 1 0 1 0 0 1 0 0 0 0 0 1 1 1 0 0 1 0 0 0 0 0 1 1 0 0 0 0 0 X is 1 or 0 The I2CEN pin is active-high with an internal pull-up to VCC. It can be used to isolate a badly behaved slave during powering up. It should never change state during an I2C operation because disabling during a bus operation may hang the bus and enabling part way through a bus cycle could confuse the I2C parts being enabled. I2C Behavior The typical application of the TMDS442 is as a repeater in a TV connecting the HDMI input connector and an internal HDMI Rx through flat cables. The I2C repeater is 5-V tolerant, and no additional circuitry is required to translate between 3.3-V to 5-V bus voltages. In the following example, the system master is running on an R-side I2C-bus while the slave is connected to a T-side bus. Both buses run at 100 kHz supporting standard-mode I2C operation. Master devices can be placed on either bus. VRdd V Tdd Driver T RRup RTup Master Slave CSOURCE CI CO Cslave Driver R Cmedium CCABLE Figure 36. Typical Application Figure 37 illustrates the waveforms seen on the R-side I2C-bus when the master writes to the slave through the I2C repeater circuit of the TMDS442. This looks like a normal I2C transmission, and the turn on and turn off of the acknowledge signals are slightly delayed. 34 Submit Documentation Feedback Copyright (c) 2006-2007, Texas Instruments Incorporated Product Folder Link(s): TMDS442 TMDS442 www.ti.com SLLS757A - AUGUST 2006 - REVISED MARCH 2007 9th Clock Pulse - Acknowledge From Slave RSCL RSDA Figure 37. Bus R Waveform Figure 38 illustrates the waveforms seen on the T-side I2C-bus under the same operation in Figure 37. On the T-side of the I2C repeater, the clock and data lines would have a positive offset from ground equal to the VOL of the driver T. After the 8th clock pulse, the data line is pulled to the VOL of the slave device which is very close to ground in this example. At the end of the acknowledge, the slave device releases and the bus level rises back to the VOL set by the driver until the R-side rises above VCC/2, after which it continues to high. It is important to note that any arbitration or clock stretching events require that the low level on the T-side bus at the input of the TMDS442 I2C repeater is below 0.4 V to be recognized by the device and then transmitted to the R-side I2C bus. 9th Clock Pulse - Acknowledge From Slave TSCL TSDA VOL Of Driver T V OL Of Slave Figure 38. Bus T Waveform The I2C circuitry inside the TMDS442 allows multiple stage operation as shown in Figure 39. I2C-Bus slave devices can be connected to any of the bus segments. The number of devices that can be connected in series is limited by repeater delay/time of flight considerations for the maximum bus speed requirements. Source 3.3V 5V 5V 5V Rup 5V 3.3V Rup SOURCE SOURCE Rup 1 BUS MASTER Sink Repeater 3.3V Rup Rup 2 Rup SINK SINK SDA RSDA TSDA SDA SDA_SINK RSDA TSDA SDA SCL RSCL TSCL SCL SCL_SINK RSCL TSCL SCL C1 TMDS141 C2 C3 C2 C2 TMDS442 C3 EN EN C2 TMDS141 C1 BUS SLAVE EN Figure 39. Typical Series Application I2C Pull-up Resistors The pull-up resistor value is determined by two requirements: 1. The maximum sink current of the I2C buffer: The maximum sink current is 3 mA or slightly higher for an I2C driver supporting standard-mode I2C operation,. R up(min) + VDDlsink (1) 2. The maximum transition time on the bus: The maximum transition time, T, of an I2C bus is set by an RC time constant, where R is the pull-up resistor Submit Documentation Feedback Copyright (c) 2006-2007, Texas Instruments Incorporated Product Folder Link(s): TMDS442 35 TMDS442 www.ti.com SLLS757A - AUGUST 2006 - REVISED MARCH 2007 value, and C is the total load capacitance. The parameter, k, can be calculated from equation 3 by solving for t, the times at which certain voltage thresholds are reached. Different input threshold combinations introduce different values of t. Table 6 summarizes the possible values of k under different threshold combinations. T + k RC (2) V(t) + V (1 * e *tRC) DD (3) Table 6. Value K Upon Different Input Threshold Voltages Vth-\Vth+ 0.7VDD 0.65VDD 0.6VDD 0.55VDD 0.5VDD 0.45VDD 0.4VDD 0.35VDD 0.3VDD 0.1VDD 1.0986 0.9445 0.8109 0.6931 0.5878 0.4925 0.4055 0.3254 0.2513 0.15VDD 1.0415 0.8873 0.7538 0.6360 0.5306 0.4353 0.3483 0.2683 0.1942 0.2VDD 0.9808 0.8267 0.6931 0.5754 0.4700 0.3747 0.2877 0.2076 0.1335 0.25VDD 0.9163 0.7621 0.6286 0.5108 0.4055 0.3102 0.2231 0.1431 0.0690 0.3VDD 0.8473 0.6931 0.5596 0.4418 0.3365 0.2412 0.1542 0.0741 - From equation 1, Rup(min) = 5.5V/3mA = 1.83 k to operate the bus under a 5-V pull-up voltage and provide less than 3 mA when the I2C device is driving the bus to a low state. If a higher sink current, for example 4 mA, is allowed, Rup(min) can be as low as 1.375 k. Given a 5-V I2C device with input low and high threshold voltages at 0.3 Vdd and 0.7 Vdd, the valued of k is 0.8473 from Table 6. Taking into account the 1.83-k pull-up resistor, the maximum total load capacitance is C(total-5V) = 645 pF. Ccable(max) should be restricted to be less than 545 pF if Csource and Ci can be as heavy as 50 pF. Here the Ci is treated as Csink, the load capacitance of a sink device. Fixing the maximum transition time from Table 6, T = 1 s, and using the k values from Table 6, the recommended maximum total resistance of the pull-up resistors on an I2C bus can be calculated for different system setups. To support the maximum load capacitance specified in the HDMI spec, Ccable(max) = 700pF/Csource = 50pF/Ci = 50pF, R(max) can be calculated as shown in Table 7. Table 7. Pull-Up Resistor Upon Different Threshold Voltages and 800-pF Loads Vth-\Vth+ 0.7VDD 0.65VDD 0.6VDD 0.55VDD 0.5VDD 0.45VDD 0.4VDD 0.35VDD 0.3VDD UNIT 0.1VDD 1.14 1.32 1.54 1.80 2.13 2.54 3.08 3.84 4.97 k 0.15VDD 1.20 1.41 1.66 1.97 2.36 2.87 3.59 4.66 6.44 k 0.2VDD 1.27 1.51 1.80 2.17 2.66 3.34 4.35 6.02 9.36 k 0.25VDD 1.36 1.64 1.99 2.45 3.08 4.03 5.60 8.74 18.12 k 0.3VDD 1.48 1.80 2.23 2.83 3.72 5.18 8.11 16.87 - k Or, limiting the maximum load capacitance of each cable to be 400 pF to accommodate with I2C spec version 2.1. Ccable(max) = 400pF/Csource=50pF/Ci = 50pF, the maximum values of R are calculated as shown in Table 8. Table 8. Pull-Up Resistor Upon Different Threshold Voltages and 500-pF Loads Vth-\Vth+ 0.7VDD 0.65VDD 0.6VDD 0.55VDD 0.5VDD 0.45VDD 0.4VDD 0.35VDD 0.3VDD UNIT 0.1VDD 1.82 2.12 2.47 2.89 3.40 4.06 4.93 6.15 7.96 k 0.15VDD 1.92 2.25 2.65 3.14 3.77 4.59 5.74 7.46 10.30 k 0.2VDD 2.04 2.42 2.89 3.48 4.26 5.34 6.95 9.63 14.98 k 0.25VDD 2.18 2.62 3.18 3.92 4.93 6.45 8.96 13.98 28.99 k 0.3VDD 2.36 2.89 3.57 4.53 5.94 8.29 12.97 26.99 - k Obviously, to accommodate the 3-mA drive current specification, a narrower threshold voltage range is required to support a maximum 800-pF load capacitance for a standard-mode I2C bus. When the input low and high level threshold voltages, Vth- and Vth+, are 0.7 V and 1.9 V, which is 0.15 VDD and 0.4 VDD approximately with VDD = 5 V, from Table 7, the maximum pull-up resistor is 3.59 k. The allowable pull-up resistor is in the range of 1.83 k and 3.59 k. 36 Submit Documentation Feedback Copyright (c) 2006-2007, Texas Instruments Incorporated Product Folder Link(s): TMDS442 TMDS442 www.ti.com SLLS757A - AUGUST 2006 - REVISED MARCH 2007 Thermal Dissipation High-K board - It is always recommended to solder the PowerPADTM onto the thermal land. A thermal land is the area of solder-tinned-copper underneath the PowerPAD package. Thermal simulation shows the JA of the TMDS442 is 23.2C/W on a high-K board with a 4 x 4 thermal via array, or is 29.4C/W under the same condition without a via array. The maximum junction temperature is 103C with via arrays and 112C without via arrays when the maximum power dissipation from the device is 1.43W. The maximum recommended junction temperature is 125C, allowing the TMDS442 to operate over the full temperature range (0C - 70C) when the PowerPAD is soldered onto the thermal land. Low-K board - Simulation also shows the JA of the TMDS442 is 46.9C/W on a low-K board with the PowerPAD soldered and no thermal vias. To ensure the maximum junction temperature does not exceed 125C with a worst case power dissipation from the device of 1.43W, the ambient temperature needs to be lower than 58C, when the device is placed on a low-K board. A general PCB design guide to PowerPAD package is provided in slma002 - PowerPAD Thermally Enhanced Package. Submit Documentation Feedback Copyright (c) 2006-2007, Texas Instruments Incorporated Product Folder Link(s): TMDS442 37 TMDS442 www.ti.com SLLS757A - AUGUST 2006 - REVISED MARCH 2007 PACKAGE OPTION ADDENDUM PACKAGING INFORMATION 30-August-2006 Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3) TMDS442PNP ACTIVE HTQFP PNP 128 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR TMDS442PNPG4 ACTIVE HTQFP PNP 128 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR 1. The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. 2. Eco Plan -The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) -please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) 3. MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer: The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. 38 Submit Documentation Feedback Copyright (c) 2006-2007, Texas Instruments Incorporated Product Folder Link(s): TMDS442 TMDS442 www.ti.com SLLS757A - AUGUST 2006 - REVISED MARCH 2007 Revision History Changes from Original (August 2006) to Revision A ..................................................................................................... Page * * * * * * * * * * Changed HDMI 1.3 to HDMI 1.3a.......................................................................................................................................... 1 Changed 1.65 Gbps to 2.25 Gbps and 8-Bit to 12-Bit........................................................................................................... 1 Changed 1.65 Gbps to 2.25 Gbps ......................................................................................................................................... 1 Changed 1.65 Gbps to 2.25 Gbps ......................................................................................................................................... 7 Added 2.25 Gbps Peak-to-peak output jitter from Y/Z(1), residual jitter.............................................................................. 10 Added 2.25 Gbps Peak-to-peak output jitter from Y/Z(2:4), residual jitter........................................................................... 10 Changed RESIDUAL PEAK-TO-PEAK JITTER vs DATA RATE curves............................................................................. 18 Changed RESIDUAL PEAK-TO-PEAK JITTER vs DATA RATE curves............................................................................. 18 Changed RESIDUAL PEAK-TO-PEAK JITTER vs DATA RATE curves............................................................................. 19 Added RESIDUAL PEAK-TO-PEAK JITTER vs DATA RATE curves ................................................................................. 19 Submit Documentation Feedback Copyright (c) 2006-2007, Texas Instruments Incorporated Product Folder Link(s): TMDS442 39 PACKAGE OPTION ADDENDUM www.ti.com 10-Feb-2010 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty TMDS442PNP ACTIVE HTQFP PNP 128 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR TMDS442PNPG4 ACTIVE HTQFP PNP 128 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR TMDS442PNPR ACTIVE HTQFP PNP 128 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR TMDS442PNPRG4 ACTIVE HTQFP PNP 128 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device TMDS442PNPR Package Package Pins Type Drawing HTQFP PNP 128 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 1000 330.0 24.4 Pack Materials-Page 1 17.0 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 17.0 1.5 20.0 24.0 Q2 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TMDS442PNPR HTQFP PNP 128 1000 367.0 367.0 45.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. 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