FDT SERIES ELEMENTS WITH LEAD ATTACHMENT SPECIFICATIONS FEATURES Thin piezo film sensor Flexible leads give flat profile to the sensor Dynamic strain sensing with a high output Typical interface to a 1 or 10 M input impedance Output Voltage (dependent on force applied) 10 mV to 100V APPLICATIONS Piezo Film Technology Flexible Leads High Strain Output Film Thickness Options Lamination Options Solderable Connection Pins The "F" in FDT Series stands for "`Flexible Leads". These are rectangle elements of Piezo film with silver ink screen printed electrodes. Rather than making the lead attachment near the sensor, the Piezo polymer tail extends from the active sensor area as flex circuit material with offset traces. This gives a very flat, flexible lead with a connector at the end. The FDT elements are available in a variety of different sizes and thicknesses. They are available without a laminate (FDT), with a laminated (0.005" mylar) on one side (FLDT) or with tape release layer adhesive (FDT with adh) in the sensor area. Sensing Direct Contact Force Recording Time of an Event Counting Number of Impact Events Measuring Impact Related Events Sensing Vibration using Cantilevered Beam Wakeup Switch Motion Detection SENSOR SOLUTIONS /// FDT Series Rev 1 07/2017 Page 1 FDT SERIES ELEMENTS WITH LEAD ATTACHMENT DIMENSIONS and PART NUMBERS DIMENSION in INCHES (mm) Model Number Part Number FDT1-028K FDT1-052K FLDT1-028K FLDT1-052K FDT1-028K w/adh-F 1-1002785-1 2-1002785-1 1-1002786-1 2-1002786-1 1001777 Film thickness 28 m 52 m 28 m 52 m 28 m A Film .620 (16) .620 (16) .620 (16) .620 (16) .650 (17) B Electrode .485 (12) .485 (12) .485 (12) .485 (12) .485 (12) C Film 9.25 (235) 9.25 (235) 9.25 (235) 9.25 (235) 5.51 (140) D Electrode 1.16 (30) 1.16 (30) 1.16 (30) 1.16 (30) 1.18 (30) t (m) 55 85 205 230 125 Cap (nF) 1.37 .740 1.37 .740 1.37 The connector pins on the FDT sensors can be directly soldered to a PCB with a reasonable level of care. This component cannot withstand high temperatures (>80C) and therefore soldering of the pins to a PCB must be done quickly. A heat sink clamped to the interface area between the film and the crimps will take the heat away from the film. Pre-tin the pins and then quickly solder them to the board. Do not allow the soldering iron to touch the film and do not use a dwell time of more than 5 seconds on the pins. Low temperature solder can also be used. NORTH AMERICA EUROPE ASIA Measurement Specialties, Inc., a TE Connectivity Company Tel: +1-800-522-6752 Email: customercare.dtmd@te.com MEAS Deutschland GmbH a TE Connectivity Company Tel: +49-800-440-5100 Email: customercare.dtmd@te.com Measurement Specialties (China), Ltd., a TE Connectivity Company Tel: +86 0400-820-6015 Email: customercare.chdu@te.com TE.com/sensorsolutions Measurement Specialties, Inc., a TE Connectivity company. Measurement Specialties, TE Connectivity, TE Connectivity (logo) and EVERY CONNECTION COUNTS are trademarks. All other logos, products and/or company names referred to herein might be trademarks of their respective owners. The information given herein, including drawings, illustrations and schematics which are intended for illustration purposes only, is believed to be reliable. However, TE Connectivity makes no warranties as to its accuracy or completeness and disclaims any liability in connection with its use. TE Connectivity`s obligations shall only be as set forth in TE Connectivity`s Standard Terms and Conditions of Sale for this product and in no case will TE Connectivity be liable for any incidental, indirect or consequential damages arising out of the sale, resale, use or misuse of the product. Users of TE Connectivity products should make their own evaluation to determine the suitability of each such product for the specific application. (c) 2015 TE Connectivity Ltd. family of companies All Rights Reserved. SENSOR SOLUTIONS /// FDT Series Rev 1 07/2017 Page 2