SENSOR SOLUTIONS /// FDT Series Rev 1 07/2017
Page 1
FEATURES
Thin piezo film sensor
Flexible leads give flat profile to the sensor
Dynamic strain sensing with a high output
Typical interface to a 1 or 10 M Ω input
impedance
Output Voltage (dependent on force applied)
10 mV to 100V
APPLICATIONS
Sensing Direct Contact Force
Recording Time of an Event
Counting Number of Impact Events
Measuring Impact Related Events
Sensing Vibration using Cantilevered Beam
Wakeup Switch
Motion Detection
FDT SERIES ELEMENTS WITH
LEAD ATTACHMENT
SPECIFICATIONS
Piezo Film Technology
Flexible Leads
High Strain Output
Film Thickness Options
Lamination Options
Solderable Connection Pins
The “F” in FDT Series stands for “‘Flexible
Leads”. These are rectangle elements of Piezo film with
silver ink screen printed electrodes. Rather than making
the lead attachment near the sensor, the Piezo polymer
tail extends from the active sensor area as flex circuit
material with offset traces. This gives a very flat, flexible
lead with a connector at the end.
The FDT elements are available in a variety of
different sizes and thicknesses. They are available without
a laminate (FDT), with a laminated (0.005” mylar) on one
side (FLDT) or with tape release layer adhesive (FDT with
adh) in the sensor area.
FDT SERIES ELEMENTS WITH LEAD ATTACHMENT
SENSOR SOLUTIONS /// FDT Series Rev 1 07/2017
Page 2
DIMENSIONS and PART NUMBERS
DIMENSION in INCHES (mm)
Model Number
Part Number
Film
thickness
A
Film
Electrode
C
Film
D
Electrode
t
(μm)
Cap
(nF)
FDT1-028K
1-1002785-1
28 μm
.620 (16)
9.25 (235)
1.16 (30)
55
1.37
FDT1-052K
2-1002785-1
52 μm
.620 (16)
9.25 (235)
1.16 (30)
85
.740
FLDT1-028K
1-1002786-1
28 μm
.620 (16)
9.25 (235)
1.16 (30)
205
1.37
FLDT1-052K
2-1002786-1
52 μm
.620 (16)
9.25 (235)
1.16 (30)
230
.740
FDT1-028K
w/adh-F
1001777
28 μm
.650 (17)
5.51 (140)
1.18 (30)
125
1.37
The connector pins on the FDT sensors can be directly soldered to a PCB with a reasonable level of care. This
component cannot withstand high temperatures (>80°C) and therefore soldering of the pins to a PCB must be
done quickly. A heat sink clamped to the interface area between the film and the crimps will take the heat away
from the film. Pre-tin the pins and then quickly solder them to the board. Do not allow the soldering iron to touch
the film and do not use a dwell time of more than 5 seconds on the pins. Low temperature solder can also be
used.
TE.com/sensorsolutions
Measurement Specialties, Inc., a TE Connectivity company.
Measurement Specialties, TE Connectivity, TE Connectivity (logo) and EVERY CONNECTION COUNTS are trademarks. All other logos, products and/or company names referred to
herein might be trademarks of their respective owners.
The information given herein, including drawings, illustrations and schematics which are intended for illustration purposes only, is believed to be reliable. However, TE Connectivity makes
no warranties as to its accuracy or completeness and disclaims any liability in connection with its use. TE Connectivity‘s obligations shall only be as set forth in TE Connectivity‘s Standard
Terms and Conditions of Sale for this product and in no case will TE Connectivity be liable for any incidental, indirect or consequential damages arising out of the sale, resale, use or
misuse of the product. Users of TE Connectivity products should make their own evaluation to determine the suitability of each such product for the specific application.
© 2015 TE Connectivity Ltd. family of companies All Rights Reserved.
NORTH AMERICA
Measurement Specialties, Inc.,
a TE Connectivity Company
Tel: +1-800-522-6752
Email: customercare.dtmd@te.com
EUROPE
MEAS Deutschland GmbH
a TE Connectivity Company
Tel: +49-800-440-5100
Email: customercare.dtmd@te.com
ASIA
Measurement Specialties (China), Ltd.,
a TE Connectivity Company
Tel: +86 0400-820-6015
Email: customercare.chdu@te.com