www.recom-international.com A-21
2009
DC-DC Converter Applications
Patterns for dispensing or printing adhesive are
given for automatic lines. If dispensing
manually after placement the patterns for UV
cure are easily repeated using a manual
syringe (even if using heat cure adhesive).If dis-
pensing manually, dot height and size are not
as important, and the ad-hesive should be
applied after the components have been
reflowed. When dispensing after reflow, a chip
underfill formulation adhesive would be the
preferred choice. These types 'wick' under the
component body and offer a good all round
adhesion from a single dispensed dot.
The patterns allow for the process spread of
the stand-off on the component, but do not
account for the thickness of the PCB tracks.
If thick PCB tracks are to be used, a grounded
copper strip should be laid beneath the centre
of the component (care should be exercised to
maintain isolation barrier limits). The adhesive
should not retard the pins reaching their solder
pads during placement of the part, hence low
viscosity adhesive is recommended.
The height of the adhesive dot, its viscosity and
slumping properties are critical. The dot must
be high enough to bridge the gap between
board surface and component, but low enough
not to slump and spread, or be squeezed by
the component, and so contaminate the solder
pads.
If wishing to use a greater number of dots of
smaller diameter (common for pin transfer
methods), the dot pattern can be changed, by
following a few simple guidelines. As the
number of dots is doubled their diameter
should be halved and centres should be at
least twice the printed diameter from each
other, but the dot height should remain at
0.4mm. The printed dot should always be
positioned by at least its diameter from the
nearest edge of the body to the edge of the
dot. The number of dots is not important,
provided good contact between adhesive and
body can be guaranteed, but a minimum of two
dots is recommended.
Cleaning
The thermoset plastic encapsulating material
used for the Recom range of surface mount
DC-DC converters is not fully hermetically
sealed. As with all plastic encapsulated active
devices, strongly reactive agents in hostile
environments can attack the material and the
internal parts, hence cleaning is recommended
in inert solutions (e.g. alcohol or water based
solvents) and at room temperature in an inert
atmospheres (e.g. air or nitrogen).
A batch or linear aqueous cleaning process
would be the preferred method of cleaning
using a deionised water solution.
Vapour Phase Reflow Soldering
Vapour phase soldering is a still upcoming
soldering practice; therefore there are no
standard temperature profiles available.
Principally, the Lead-free Soldering Profile
recommended by RECOM can be used for
vapour phase soldering. RECOM has tested
large quantities of 8-pin and 10-pin SMD
converters and recommends as an absolute
maximum condition 240°C for 90s dwell time.
In standard applications with small sized
components on a pcb, 230°C and shorter
dwell times will still deliver good results.
After discussions with various contract
manufacturers, we recommended that the
temperature gradients used during preheat and
cooling phases are between 0.5°K/s up to
3°K/s.
Other form factors than 8-pin or 10-pin SMD-
packages have not been fully tested under
vapour phase conditions. Please contact
RECOM in this case.
Custom DC-DC Converters
In addition to the standard ranges shown in this
data book, Recom have the capability to
produce custom DC-DC converters designed
to your specific requirements. In general, the
parts can be rapidly designed using computer
based CAD tools to meet any input or output
voltage requirements within the ranges of
Recom standard products (i.e. up to 48V at
either input or output). Prototype samples can
also be produced in short timescales.
Custom parts can be designed to your
specification, or where the part fits within a
standard series, the generic series specifica-
tion can be used. All custom parts receive the
same stringent testing, inspection and quality
procedures, as standard products. However
there is a minimum order quantity as the
additional documentation and administrative
tasks must be covered in terms of costs.
A general figure for this MOQ can be around
3000pcs of low wattage converters
(0,25W ~ 2W), 1000pcs medium sized
wattage (2W~15W) and 500pcs for higher
wattages (> 20W).
Recom custom parts are used in many
applications, which are very specific to the
individual customer, however, some typical
examples are:
●ECL Logic driver
●Multiple cell battery configurations
●Telecommunications line equipment
●Marine apparatus
●Automotive electronics
●LCD display power circuitry
●Board level instrumentation systems
To discuss your custom DC-DC converter
requirements, please contact Recom technical
support desk or your local distributor.
Tin Whisker Mitigation
The use of pure tin coating has caused
considerable customer concern about the pos-
sibility of tin whisker formation. Although it is
the opinion of Recom that the risks of con-
verter failure due to tin whisker formation are
vanishingly small (the only actual recorded fai-
lures due to tin whiskers were in exceptional
environments such as deep space or as a
contributary factor to corona discharge
flashover in a UHV transformer), we have
undertaken tin whisker mitigation procedures
as recommended by Jedec in their JP002
guidelines.
Through Hole Devices:
The pins used in all of our through-hole
converters are made of hard silver-copper
alloy. The pins are then nickel underplated to
0.5µm before being pure tin electroplated to
6µm thickness. This thickness of overplating is
a compromise between reasonable
manufacturing costs and having a thick
enough coating to impair tin whisker formation.
The surface is not ‘brightened’, also to
mitigate tin whisker formation.
Finally the pins are annealed according to JIS
C3101. This reduces any residual forming
stresses, which is one of the other potential
causes of tin whisker formation
Surface Mount Devices:
The carrier frames used in our SMD converters
are made from DF42N nickel alloy which is
pure tin plated. The pins are hot dipped in
Sn-Ag-Cu solder just before injection molding.
Hot dipping with SnAg4 or SnAgCu is generally
an effective mitigation practice and considered
whisker free.