Semiconductor Components Industries, LLC, 2000
March, 2000 – Rev. 7 1Publication Order Number:
MC10H164/D
MC10H164
8-Line Multiplexer
The MC10H164 is a MECL 10H part which is a functional/pinout
duplication of the standard MECL 10K family part, with 100%
improvement in propagation delay, and no increase in power supply
current.
The MC10H164 is designed to be used in data multiplexing and
parallel to serial conversion applications. Full parallel gating provides
equal delays through any data path. The MC10H164 incorporates an
output buffer, eight inputs and an enable. A high on the enable forces
the output low. The open emitter output allows the MC10H164 to be
connected directly to a data bus. The enable line allows an easy means
of expanding to more than 8 lines using additional MC10H164’s.
•Propagation Delay, 1.0 ns Typical
•Power Dissipation, 310 mW Typical (same as MECL 10K)
•Improved Noise Margin 150 mV (Over Operating Voltage and
Temperature Range)
•Voltage Compensated
•MECL 10K–Compatible
LOGIC DIAGRAM
VCC1 = PIN 1
VCC2 = PIN 16
VEE = PIN 8
A 7
B 9
C 10
Enable 2
X0 6
X1 5
X2 4
X3 3
X4 11
X5 12
X6 13
X7 14
Z
15
DIP PIN ASSIGNMENT
VCC1
ENABLE
X3
X2
X1
X0
A
VEE
VCC2
Z
X7
X6
X5
X4
C
B
16
15
14
13
12
11
10
9
1
2
3
4
5
6
7
8
Pin assignment is for Dual–in–Line Package.
For PLCC pin assignment, see the Pin Conversion Tables on page 18
of the ON Semiconductor MECL Data Book (DL122/D).
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Device Package Shipping
ORDERING INFORMATION
MC10H164L CDIP–16 25 Units/Rail
MC10H164P PDIP–16 25 Units/Rail
MC10H164FN PLCC–20 46 Units/Rail
MARKING
DIAGRAMS
1
16
A = Assembly Location
WL = W afer Lot
YY = Year
WW = Work Week
CDIP–16
L SUFFIX
CASE 620
MC10H164L
AWLYYWW
PDIP–16
P SUFFIX
CASE 648
PLCC–20
FN SUFFIX
CASE 775
10H164
AWLYYWW
1
1
16
MC10H164P
AWLYYWW
TRUTH TABLE
ADDRESS INPUTS
ENABLE CBAZ
L
L
L
L
L
L
L
L
L
L
H
H
L
H
L
H
X0
X1
X2
X3
HXLXX
L
L
L
L
H
H
H
H
L
L
H
H
L
H
L
H
X4
X5
X6
X7
MC10H164
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2
MAXIMUM RATINGS
Symbol Characteristic Rating Unit
VEE Power Supply (VCC = 0) –8.0 to 0 Vdc
VIInput Voltage (VCC = 0) 0 to VEE Vdc
Iout Output Current– Continuous
– Surge 50
100 mA
TAOperating Temperature Range 0 to +75 °C
Tstg Storage Temperature Range– Plastic
– Ceramic –55 to +150
–55 to +165 °C
°C
ELECTRICAL CHARACTERISTICS (VEE = –5.2 V ±5%) (See Note 1.)
0°25°75°
Symbol Characteristic Min Max Min Max Min Max Unit
IEPower Supply Current – 83 – 75 – 83 mA
IinH Input Current High – 512 – 320 – 320 µA
IinL Input Current Low 0.7 – 0.7 – 0.7 – µA
VOH High Output Voltage –1.02 –0.84 –0.98 –0.81 –0.92 –0.735 Vdc
VOL Low Output Voltage –1.95 –1.63 –1.95 –1.63 –1.95 –1.60 Vdc
VIH High Input Voltage –1.17 –0.84 –1.13 –0.81 –1.07 –0.735 Vdc
VIL Low Input Voltage –1.95 –1.48 –1.95 –1.48 –1.95 –1.45 Vdc
AC PARAMETERS
tpd Propagation Delay
Enable
Data
Address
0.4
0.7
1.0
1.45
2.4
2.8
0.4
0.8
1.1
1.5
2.5
2.9
0.5
0.9
1.2
1.7
2.6
3.2
ns
trRise Time 0.5 1.5 0.5 1.6 0.5 1.7 ns
tfFall T ime 0.5 1.5 0.5 1.6 0.5 1.7 ns
1. Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been
established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 Iinear fpm is
maintained. Outputs are terminated through a 50–ohm resistor to –2.0 volts.
MC10H164
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3
FIGURE 2 – 1–OF–64 LINE MULTIPLEXER
FIGURE 1 – HIGH SPEED 16–BIT MULTIPLEXER/DEMULTIPLEXER
TYPICAL APPLICATIONS
The Bit chosen is dependent on six–bit
code present on inputs 7, 9, 14 of the
MC10H161 and the A, B, C inputs of the
MC10H164.
MC10H161
MC10H164
E1
C
B
A
MC10H136
MC10H161
MC10H162
S0
S1
CR
ABCD
E1
C
B
A
E0
MC10H164
76543210
E1
C
B
AD0
Control Selection
MC10H136
MC10H164
S0
S1
CR
ABCD
15 14 13 12 11 10 9 8
76543210
E1
C
B
AD0
Start/Stop
S0
15 141312 1110 9 8
E0
S1
CR
Dout
Dout
Dout
Dout
Dout
Dout
ABC
E
MC10H164
ABC
E
MC10H164
Dout
ABC
E
MC10H164
ABC
E
MC10H164
ABC
E
MC10H164
ABC
E
MC10H164
ABC
E
MC10H164
MC10H161
Dout
ABC
MSB
LSB
Q7
Q6
Q5
Q4
Q3
Q2
Q1
Q0
14
9
7
E
MC10H164
MC10H164
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4
PACKAGE DIMENSIONS
PLCC–20
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 775–02
ISSUE C
NOTES:
1. DATUMS –L–, –M–, AND –N– DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS PLASTIC
BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED A T DATUM –T–, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE TOP
AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037 (0.940).
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE
THE H DIMENSION TO BE SMALLER THAN 0.025
(0.635).
–M–
–N–
–L–
Y BRK
W
V
D
D
S
L–M
M
0.007 (0.180) N S
T
S
L–M
M
0.007 (0.180) N S
T
S
L–M
S
0.010 (0.250) N S
T
XG1
B
U
Z
VIEW D–D
20 1
S
L–M
M
0.007 (0.180) N S
T
S
L–M
M
0.007 (0.180) N S
T
S
L–M
S
0.010 (0.250) N S
T
C
G
VIEW S
E
J
R
Z
A
0.004 (0.100)
–T– SEATING
PLANE
S
L–M
M
0.007 (0.180) N S
T
S
L–M
M
0.007 (0.180) N S
T
H
VIEW S
K
K1
F
G1 DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.385 0.395 9.78 10.03
B0.385 0.395 9.78 10.03
C0.165 0.180 4.20 4.57
E0.090 0.110 2.29 2.79
F0.013 0.019 0.33 0.48
G0.050 BSC 1.27 BSC
H0.026 0.032 0.66 0.81
J0.020 ––– 0.51 –––
K0.025 ––– 0.64 –––
R0.350 0.356 8.89 9.04
U0.350 0.356 8.89 9.04
V0.042 0.048 1.07 1.21
W0.042 0.048 1.07 1.21
X0.042 0.056 1.07 1.42
Y––– 0.020 ––– 0.50
Z2 10 2 10
G1 0.310 0.330 7.88 8.38
K1 0.040 ––– 1.02 –––
____
MC10H164
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5
PACKAGE DIMENSIONS
CDIP–16
L SUFFIX
CERAMIC DIP PACKAGE
CASE 620–10
ISSUE T
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
–A–
–B–
–T–
FE
G
NK
C
SEATING
PLANE
16 PL
D
S
A
M
0.25 (0.010) T
16 PLJS
B
M
0.25 (0.010) T
M
L
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.750 0.785 19.05 19.93
B0.240 0.295 6.10 7.49
C––– 0.200 ––– 5.08
D0.015 0.020 0.39 0.50
E0.050 BSC 1.27 BSC
F0.055 0.065 1.40 1.65
G0.100 BSC 2.54 BSC
H0.008 0.015 0.21 0.38
K0.125 0.170 3.18 4.31
L0.300 BSC 7.62 BSC
M0 15 0 15
N0.020 0.040 0.51 1.01
____
16 9
18
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
–A–
B
FC
S
HGD
J
L
M
16 PL
SEATING
18
916
K
PLANE
–T–
M
A
M
0.25 (0.010) T
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.740 0.770 18.80 19.55
B0.250 0.270 6.35 6.85
C0.145 0.175 3.69 4.44
D0.015 0.021 0.39 0.53
F0.040 0.70 1.02 1.77
G0.100 BSC 2.54 BSC
H0.050 BSC 1.27 BSC
J0.008 0.015 0.21 0.38
K0.110 0.130 2.80 3.30
L0.295 0.305 7.50 7.74
M0 10 0 10
S0.020 0.040 0.51 1.01
____
PDIP–16
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648–08
ISSUE R
MC10H164
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6
Notes
MC10H164
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7
Notes
MC10H164
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8
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without further notice to any products herein. SCILLC makes no warranty , representation or guarantee regarding the suitability of its products for any particular
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including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or
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MC10H164/D
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