HCC/HCF4013B
DUAL ’D’ – TYPE FLIP–FLOP
DESCRIPTION
.SET-RESET CAPABILITY
.STATIC FLIP-FLOP OPERATION - RETAINS
STATE INDEFINITELY WITH CLOCK LEVEL
EITHER”HIGH” OR ”LOW”
.MEDIUM-SPEED OPERATION - 16MHz (typ.)
CLOCKTOGGLE RATE AT 10V
.QUIESCENT CURRENT SPECIFIED TO 20V
FOR HCC DEVICE
.STANDARDIZED SYMMETRICAL OUTPUT
CHARACTERISTICS
.5V, 10V, AND 15VPARAMETRIC RATINGS
.INPUT CURRENTOF 100nA AT 18V AND 25°C
FOR HCC DEVICE
.100% TESTEDFOR QUIESCENTCURRENT
.MEETSALLREQUIREMENTSOFJEDECTEN-
TATIVE STANDARD No. 13A, ”STANDARD
SPECIFICATIONS FOR DESCRIPTION OF ”B”
SERIESCMOS DEVICES”
June1989
TheHCC4013B (extended temperature range) and
HCF4013B (intermediate temperature range) are
monolithic integrated circuits, available in 14-lead
dual in-line plastic or ceramic package and plastic
micropackage.
TheHCC/HCF4013B consistsoftwoidentical, inde-
pendent data-type flip-flops.Each flip-flophasinde-
pendent data, set,reset,andclockinputs and Qand
Qoutputs. These devices can beused for shift reg-
isterapplications, and,byconnecting Qoutputtothe
data input, for counter and toggle applications. The
logic level present at the Dinputis transferred tothe
Q output during the positive-going transition of the
clock pulse. Setting or resetting is independent of
the clock and isaccomplished by ahighlevel on the
set or reset line, respectively.
EY
(Plastic Package) F
(Ceramic Frit Seal Package)
C1
(Plastic Chip Carrier)
ORDERCODES :
HCC4013BF HCF4013BM1
HCF4013BEY HCF4013BC1
PIN CONNECTIONS
M1
(Micro Package)
1/11
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Value Unit
VDD* Supply Voltage : HCC Types
HCF Types – 0.5 to + 20
– 0.5 to + 18 V
V
ViInput Voltage – 0.5 to VDD + 0.5 V
IIDC Input Current (any one input) ±10 mA
Ptot Total Power Dissipation (per package)
Dissipation per Output Transistor
for Top = Full Package-temperature Range
200
100
mW
mW
Top Operating Temperature : HCC Types
HCF Types – 55 to + 125
–40to+85 °C
°C
T
stg Storasge Temperature – 65 to + 150 °C
RECOMMENDED OPERATING CONDITIONS
Symbol Parameter Value Unit
VDD Supply Voltage : HCC Types
HCF Types 3to18
3to15 V
V
V
IInput Voltage 0 to VDD V
Top Operating Temperature : HCC Types
HCF Types – 55 to + 125
–40to+85 °C
°C
Stresses above those listed under ”Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating
only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this
specification is not implied. Exposure to absolute maximum rating conditions for external periods may affect device reliability.
* All voltages are with respect to VSS (GND).
LOGIC DIAGRAM AND TRUTH TABLE (one of two identical flip–flops)
NO CHANGE
LOGIC 0 = LOW ∆= LOW LEVEL
LOGIC 1 = HIGH X = DON’T CARE
N(N) = FF1/FF2 TERMINAL
ASSIGNEMENT
CL∆DRSQQ
–
/
–00001
–
/
–10010
–
\
–
X00QQ
XX1001
XX0110
XX1111
HCC/HFC4013B
2/11
STATIC ELECTRICAL CHARACTERISTICS(over recommended operating conditions)
Test Conditions Value
VIVO|IO|V
DD TLow
*25°CT
High*
Symbol Parameter (V) (V) (µA) (V) Min. Max. Min. Typ. Max. Min. Max.
Unit
ILQuiescent
Current HCC
Types
0/5 5 1 0.02 1 30
µA
0/10 10 2 0.02 2 60
0/15 15 4 0.02 4 120
0/20 20 20 0.04 20 600
HCF
Types
0/5 5 4 0.02 4 30
0/10 10 8 0.02 8 60
0/15 15 16 0.02 16 120
VOH Output High
Voltage 0/5 < 1 5 4.95 4.95 4.95 V
0/10 < 1 10 9.95 9.95 9.95
0/15 < 1 15 14.95 14.95 14.95
VOL Output Low
Voltage 5/0 < 1 5 0.05 0.05 0.05 V
10/0 < 1 10 0.05 0.05 0.05
15/0 < 1 15 0.05 0.05 0.05
VIH Input High
Voltage 0.5/4.5 < 1 5 3.5 3.5 3.5
V
1/9 < 1 10 7 7 7
1.5/13.5 < 1 15 11 11 11
VIL Input Low
Voltage 4.5/0.5 < 1 5 1.5 1.5 1.5 V
9/1 < 1 10 3 3 3
13.5/1.5 < 1 15 4 4 4
IOH Output
Drive
Current HCC
Types
0/5 2.5 5 – 2 – 1.6 – 3.2 – 1.15
mA
0/5 4.6 5 – 0.64 – 0.51 – 1 – 0.36
0/10 9.5 10 – 1.6 – 1.3 – 2.6 – 0.9
0/15 13.5 15 – 4.2 – 3.4 – 6.8 – 2.4
HCF
Types
0/ 5 2.5 5 – 1.53 – 1.36 – 3.2 – 1.1
0/ 5 4.6 5 – 0.52 – 0.44 – 1 – 0.36
0/10 9.5 10 – 1.3 – 1.1 – 2.6 – 0.9
0/15 13.5 15 – 3.6 – 3.0 – 6.8 – 2.4
IOL Output
Sink
Current HCC
Types
0/5 0.4 5 0.64 0.51 1 0.36
mA
0/10 0.5 10 1.6 1.3 2.6 0.9
0/15 1.5 15 4.2 3.4 6.8 2.4
HCF
Types
0/5 0.4 5 0.52 0.44 1 0.36
0/10 0.5 10 1.3 1.1 2.6 0.9
0/15 1.5 15 3.6 3.0 6.8 2.4
IIH,I
IL Input
Leakage
Current
HCC
Types 0/18
Any Input
18 ±0.1 ±10–5 ±0.1 ±1
µA
HCF
Types 0/15 15 ±0.3 ±10–5 ±0.3 ±1
CIInput Capacitance Any Input 5 7.5 pF
*T
Low=–55°C for HCC device : – 40°C for HCF device.
*T
High=+125°C for HCC device : + 85°C for HCF device.
TheNoiseMargin forboth”1” and ”0” level is: 1Vmin. withVDD = 5V, 2V min.with VDD = 10V,2.5 V min.with VDD =15V.
HCC/HCF4013B
3/11
DYNAMIC ELECTRICAL CHARACTERISTICS (Tamb =25°C, CL= 50pF, RL= 200kΩ,
typical temperature coefficient for all VDD = 0.3%/°C values, all input rise and fall time = 20ns)
Value
Symbol Parameter Test Conditions
VDD (V) Min. Typ. Max. Unit
tPLH,t
PHL Propagation Delay Time
(clock to Q or Q outputs) 5150300
ns
10 65 130
15 45 90
tPLH Propagation Delay Time
(set to Q or reset to Q) 5150300
ns
10 65 130
15 45 90
tPHL Propagation Delay Time
(set to Q or reset to Q) 5200400
ns
10 85 170
15 60 120
tTHL,t
TLH Transition Time 5 100 200 ns
10 50 100
15 40 80
fCL* Maximum Clock Input Frequency 5 3.5 7 MHz
10 8 16
15 12 24
tWCock Pulse Width 5 140 70 ns
10 60 30
15 40 20
tr,t
f
** Clock Input Rise or Fall Time 5 15 µs
10 4
15 1
tWSet or Reset Pulse Width 5 180 90 ns
10 80 40
15 50 25
tsetup Data Setup Time 5 40 20 ns
10 20 10
15 15 7
*Inputtr,t
f=5ns.
** If more than unit is cascaded in a parallel clocked application, trshould be made less than or equal to the sum of the fixed
propagation delay time at 15pF and the transition time of the carry output driving stage for the estimated capacitive load.
HCC/HFC4013B
4/11
Typical Output Low (sink) Current Characteristics. Minimum Output Low(sink) Current Charac-
teristics.
Typical Output High (source) Current Charac-
teristics. Minimum Output High (source) Current Charac-
teristics.
Typical Propagation Delay Time vs. Load Capacit-
ance (SETto Q orRESET to Q).
Typical Propagation Delay Time vs. Load Capacit-
ance(CLOCK or SETto Q,CLOCK or RESET to
Q).
HCC/HCF4013B
5/11
Typical Maximum Clock Frequency vs. Supply
Voltage. Typical Power Dissipation Devicevs. Frequency.
Input Leakage Current.
Noise Immunity.
TEST CIRCUITS
Quiescent Device Current.
HCC/HFC4013B
6/11
Plastic DIP14 MECHANICAL DATA
DIM. mm inch
MIN. TYP. MAX. MIN. TYP. MAX.
a1 0.51 0.020
B 1.39 1.65 0.055 0.065
b 0.5 0.020
b1 0.25 0.010
D 20 0.787
E 8.5 0.335
e 2.54 0.100
e3 15.24 0.600
F 7.1 0.280
I 5.1 0.201
L 3.3 0.130
Z 1.27 2.54 0.050 0.100
P001A
HCC/HCF4013B
7/11
Ceramic DIP14/1 MECHANICAL DATA
DIM. mm inch
MIN. TYP. MAX. MIN. TYP. MAX.
A 20 0.787
B 7.0 0.276
D 3.3 0.130
E 0.38 0.015
e3 15.24 0.600
F 2.29 2.79 0.090 0.110
G 0.4 0.55 0.016 0.022
H 1.17 1.52 0.046 0.060
L 0.22 0.31 0.009 0.012
M 1.52 2.54 0.060 0.100
N 10.3 0.406
P 7.8 8.05 0.307 0.317
Q 5.08 0.200
P053C
HCC/HFC4013B
8/11
SO14 MECHANICAL DATA
DIM. mm inch
MIN. TYP. MAX. MIN. TYP. MAX.
A 1.75 0.068
a1 0.1 0.2 0.003 0.007
a2 1.65 0.064
b 0.35 0.46 0.013 0.018
b1 0.19 0.25 0.007 0.010
C 0.5 0.019
c1 45°(typ.)
D 8.55 8.75 0.336 0.344
E 5.8 6.2 0.228 0.244
e 1.27 0.050
e3 7.62 0.300
F 3.8 4.0 0.149 0.157
G 4.6 5.3 0.181 0.208
L 0.5 1.27 0.019 0.050
M 0.68 0.026
S8°(max.)
P013G
HCC/HCF4013B
9/11
PLCC20 MECHANICAL DATA
DIM. mm inch
MIN. TYP. MAX. MIN. TYP. MAX.
A 9.78 10.03 0.385 0.395
B 8.89 9.04 0.350 0.356
D 4.2 4.57 0.165 0.180
d1 2.54 0.100
d2 0.56 0.022
E 7.37 8.38 0.290 0.330
e 1.27 0.050
e3 5.08 0.200
F 0.38 0.015
G 0.101 0.004
M 1.27 0.050
M1 1.14 0.045
P027A
HCC/HFC4013B
10/11
Information furnished is believed tobe accurate and reliable.However, SGS-THOMSON Microelectronics assumes no responsability for the
consequences of use of such information nor forany infringementofpatents orother rights of third parties which may results from its use. No
license is granted by implication or otherwiseunder any patent or patent rights of SGS-THOMSON Microelectronics. Specificationsmentioned
in this publication are subject to changewithout notice. This publication supersedes and replaces all information previously supplied.
SGS-THOMSON Microelectronicsproductsare notauthorizedforuse ascritical componentsin life supportdevices orsystems withoutexpress
written approval of SGS-THOMSON Microelectonics.
1994 SGS-THOMSON Microelectronics- All Rights Reserved
SGS-THOMSON Microelectronics GROUP OF COMPANIES
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HCC/HCF4013B
11/11
