2CCS050M12CM2,Rev. B
Electrical Characteristics (TC = 25˚C unless otherwise specied)
Symbol Parameter Min. Typ. Max. Unit Test Conditions Note
V(BR)DSS Drain-SourceBreakdownVoltage 1.2 kV VGS,=0V,ID=100µA
VGS(th) GateThresholdVoltage 2.3 VVDS=10V,ID=2.5mA
1.6 VDS=10V,ID=2.5mA,TJ=150˚C
IDSS ZeroGateVoltageDrainCurrent 2100 μA VDS=1.2kV,VGS=0V
IGSS Gate-SourceLeakageCurrent 0.5 μA VGS=20V,VDS=0V
RDS(on) OnStateResistance 25 34 mΩ VGS=20V,IDS=50A Fig.
4-7
43 63 VGS=20V,IDS=50A,TJ=150˚C
gfs Transconductance 22 SVDS=20V,IDS=50A Fig.8
21 VDS=20V,ID=50A,TJ=150˚C
Ciss InputCapacitance 2.810
nF VDS=800V,VGS=0V
f=1MHz,VAC=25mV
Fig.
16,17
Coss OutputCapacitance 0.393
Crss ReverseTransferCapacitance 0.014
Eon Turn-OnSwitchingEnergy
1.1 mJ VDD=600V,VGS=+20V/-5V
ID=50A,RG=20Ω
Load=200μHTJ=150˚C
Note:IEC60747-8-4Denitions
Fig.18
EOff Turn-OffSwitchingEnergy
0.6 mJ
RG(int) InternalGateResistance 1.5 Ω f=1MHz,VAC=25mV
QGS Gate-SourceCharge 32
nC VDD=800V,ID=50A Fig.15
QGD Gate-DrainCharge 30
QGTotalGateCharge 180
td(on) Turn-ondelaytime 21 ns VDD=800V,RLOAD=8Ω
VGS=+20/-2V,RG=3.8Ω
TJ=25˚C
Note:IEC60747-8-4Denitions
Fig.
20-25
tr(on) VSDfalltime90%to10% 30 ns
td(off) Turn-offdelaytime 50 ns
tf(off) VSDrisetime10%to90% 19 ns
Free-Wheeling SiC Schottky Diode Characteristics
Symbol Parameter Min. Typ. Max. Unit Test Conditions Note
VSD DiodeForwardVoltage 1.5 1.7 VIF=50A,VGS=0 Fig.9
2.0 2.3 IF=50A,TJ=150˚C
QCTotalCapacitiveCharge 0.28 μC
IFContinuousForwardCurrent 50 A VGS=-5V,Tc=90˚C
Thermal Characteristics
Symbol Parameter Min. Typ. Max. Unit Test Conditions Note
RthJCM ThermalResistanceJuction-to-CaseforMOSFET 0.37 0.40 ˚C/W Tc=90˚C,PD=150W
RthJCD ThermalResistanceJuction-to-CaseforDiode 0.42 0.43 Tc=90˚C,PD=130W
NTC Characteristics
Symbol Condition Typ. Max. Unit
R25 TC=25°C 5kΩ
DeltaR/R TC=100°C,R100=481Ω ±5 %
P25 TC=25°C mW
B25/50 R2=R25exp[B25/50(1/T2-1/(298.15K))] 3380 K
B25/80 R2=R25exp[B25/80(1/T2-1/(298.15K))] 3440 K