ATC Q-BRIDGE THERMAL CONDUCTOR
ATC # 001-1143
Rev B, 3/15
ATC Q-Bridge
Thermal Conductor
ATC’s new Q-Bridge Thermal Conductor is manufac-
tured with the highest quality materials for reliable and
repeatable performance providing a cost effective
thermal management solution. These devices are
constructed with Aluminum Nitride (AlN) or Beryllium
Oxide (BeO) and are available in standard EIA form factors.
Q-Bridge provides the designer with the ability to manage
thermal conditions by directing heat to a thermal
ground plane, heat sink or any other specific ther-
mal point of interest. The inherently low capacitance
makes this device virtually transparent at RF / microwave
frequencies. This device has the added benefit of offer-
ing additional layers of protection to adjacent compo-
nents from hot spot thermal loads.
Q-Bridge provides the benefit of increased overall cir-
cuit reliability. ATC’s Q-Bridge is manufactured using
one-piece construction, providing a RoHS compliant SMT
package that is fully compatible with high speed auto-
mated pick-and-place processing. It is available in 0402,
0603 and 0805 EIA case sizes. Custom configurations are
also available.
Features:
• High Thermal Conductivity
• Low Thermal Resistance
• Low Capacitance
• Increases Circuit Reliability
• RoHS Compliant
• More efficient thermal management
Applications:
• GaN Power Amplifiers
• High RF Power Amplifiers
• Filters
• Synthesizers
• Industrial Computers
• Switch Mode Power Supplies
• Pin & Laser Diodes
Functional Applications:
• Between active device and adjacent ground planes
• Specific contact pad to case
• Contact pad to contact pad
• Direct component contact to via pad or trace
• Edges fully metalized
ATC Termination Code Non-Magnetic Termination Materials
TN Tin over Non-Magnetic Barrier Termination
CA Gold over Non-Magnetic Barrier Termination
WN Tin/Lead, Solder over Non-Magnetic Nickel Barrier Termination
Termination Materials