ATC Q-BRIDGE THERMAL CONDUCTOR
ATC # 001-1143
Rev B, 3/15
ATC Q-Bridge
Thermal Conductor
ATC’s new Q-Bridge Thermal Conductor is manufac-
tured with the highest quality materials for reliable and
repeatable performance providing a cost effective
thermal management solution. These devices are
constructed with Aluminum Nitride (AlN) or Beryllium
Oxide (BeO) and are available in standard EIA form factors.
Q-Bridge provides the designer with the ability to manage
thermal conditions by directing heat to a thermal
ground plane, heat sink or any other specific ther-
mal point of interest. The inherently low capacitance
makes this device virtually transparent at RF / microwave
frequencies. This device has the added benefit of offer-
ing additional layers of protection to adjacent compo-
nents from hot spot thermal loads.
Q-Bridge provides the benefit of increased overall cir-
cuit reliability. ATC’s Q-Bridge is manufactured using
one-piece construction, providing a RoHS compliant SMT
package that is fully compatible with high speed auto-
mated pick-and-place processing. It is available in 0402,
0603 and 0805 EIA case sizes. Custom configurations are
also available.
Features:
High Thermal Conductivity
Low Thermal Resistance
• Low Capacitance
Increases Circuit Reliability
• RoHS Compliant
More efficient thermal management
Applications:
• GaN Power Amplifiers
High RF Power Amplifiers
• Filters
• Synthesizers
• Industrial Computers
Switch Mode Power Supplies
• Pin & Laser Diodes
Functional Applications:
Between active device and adjacent ground planes
• Specific contact pad to case
• Contact pad to contact pad
• Direct component contact to via pad or trace
Edges fully metalized
ATC Termination Code Non-Magnetic Termination Materials
TN Tin over Non-Magnetic Barrier Termination
CA Gold over Non-Magnetic Barrier Termination
WN Tin/Lead, Solder over Non-Magnetic Nickel Barrier Termination
Termination Materials
ATC Q-BRIDGE THERMAL CONDUCTOR
For additional information and catalogs contact your ATC
representative or call direct at +1-631-622-4700.
Consult factory for additional performance data.
ATC accepts orders for our parts using designations
with
or
without
the “ATC” prefix. Both
methods of defining the part number are equivalent, i.e., part numbers referenced with the
“ATC” prefix are interchangeable to parts referenced without the “ATC” prefix. Customers are
free to use either in specifying or procuring parts from American Technical Ceramics.
Sales of ATC products are subject to the terms and conditions contained in American Technical Ceramics Corp. Terms and Conditions of Sale (ATC document #001-992 Rev. A 10/03). Copies of these
terms and conditions will be provided upon request. They may also be viewed on ATC’s website at www.atceramics.com/productfinder/default.asp. Click on the link for Terms and Conditions of Sale.
ATC has made every effort to have this information as accurate as possible. However, no responsibility is assumed by ATC for its use, nor for any infringements of rights of third parties which may
result from its use. ATC reserves the right to revise the content or modify its product line without prior notice.
© 2015 American Technical Ceramics Corp. All Rights Reserved. ATC # 001-1143, Rev B, 3/15
ATC Part Number Code
QB 0603 A 25 W TN T
Q-Bridge
Case Size
Substrate
A = AlN; B = BeO
Thickness (mils)
Packaging
T = Tape and Reel, std.
1000 pc., 7” Reel
5000 pc., 7” Reel
C = ATC Matrix Tray
Termination
TN, CA, WN
Style
W = Edge Wrap
E = No Wrap
The above part number refers to a Q-Bridge, Thickness 25 mils., (EIA case size 0603), Aluminum Nitride (AlN) substrate, Style W,
T Termination, with Tape and Reel Packaging.
Mechanical Configurations
W
t
L
T
Size (EIA) Length (L) Width (W)
Standard Thickness
(T, mils)
Termination (t)
0402 0.040 ±.002
(1.02 ±0.051)
0.020 ±.002
(0.51 ±0.051) 20 15 0.010 ±.002
(0.25 ±0.051)
0603 0.060 ±.002
(1.52 ±0.051)
0.030 ±.002
(0.76 ±0.051) 25 20 0.015 ±.002
(0.38 ±0.051)
0805 0.080 ±.002
(2.03 ±0.051)
0.050 ±.002
(1.27 ±0.051) 40 25 0.020 ±.002
(0.51 ±0.051)
inches (mm)
Dimensions
A B
Specifications
AlN
Case Size
Thermal Resistance (ºC/W) Thermal Conductivity (mW/ºC)* Capacitance Value (pF)
Thickness A Thickness B Thickness A Thickness B Thickness A Thickness B
0402 25 32 40 30 .06 .05
0603 20 25 50 40 .08 .06
0805 10 16 100 60 .13 .08
BeO
Case Size
Thermal Resistance (ºC/W) Thermal Conductivity (mW/ºC) Capacitance Value (pF)
Thickness A Thickness B Thickness A Thickness B Thickness A Thickness B
0402 16 21 61 46 .05 .04
0603 13 16 76 61 .06 .05
0805 7 11 153 92 .10 .07
*
Note: Thermal conductivity is normalized to chip size. All values are approximate. Consult factory for extended thermal
conductivity options.
Mouser Electronics
Authorized Distributor
Click to View Pricing, Inventory, Delivery & Lifecycle Information:
American Technical Ceramics (ATC):
QB0805A40WCATD QB0805B40WCATD QB0603A20WCATD QB0603B20WCATD QB0603B25WCATD
QB0603A25WCATD QB0402A20WCATD QB0402B20WCATD QB0805B25WCATD QB0805A25WCATD
QB0402B15WCATD QB0402A15WCATD