Real-Time Ethernet
Multiprotocol (REM) Switch
Data Sheet
fido5100/fido5200
Rev. E Document Feedback
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700 ©20172020 Analog Devices, Inc. All rights reserved.
Technical Support www.analog.com
FEATURES
144-lead CSP_BGA RoHS compliant package
−40°C to +105°C industrial temperature range rating
3.3 V input/output buffers
IEEE 802.3, 10 Mbps/100 Mbps, half and full duplex, IPv6 and
IPv4 communication
2 independent Ethernet ports: 1 MII and 1 RMII interface per
port
Support for all industrial protocols
PROFINET Class B and Class C with fast startup (Version 2.3)
EtherNet/IP with QuickConnect, CIP Sync, and CIP Motion
Modbus TCP
EtherCAT
Ethernet POWERLINK
Host interface transfer rate: 32 bits per 28 ns
Supports EtherCAT cycle times down to 12.5 μs and
PROFINET cycle times down to 31.25 μs
PI Net Load Class III capable
DLR (supervisor and node, announce and beacon based),
MRPD, HSR, PRP, shared device, controller redundancy
IEEE 1588 Version 2 support: ordinary clock; both peer to peer
and end to end transparent clocks, raw frames, and UDP
8 independent timer signals synchronized with an internal
precision timer
4 independently programmable timer signals for timer
capture events or timer output events
4 timer signals create programmable periodic waveforms
synchronized to the internal precision timer
DCP, LLDP, DHCP, RSTP, VLAN, IGMP snooping support
Forwarding table with aging and learning
Drive LEDs for link activity
APPLICATIONS
Industrial automation
Process control
Managed Ethernet switch
FUNCTIONAL BLOCK DIAGRAM
TIMER
CONTROL
UNIT
INTERRUPT
CONTROL
HOST
INTERFACE BUFFER
MEMORY
REM SW ITCH
PORT 1 PORT 2
15833-001
Figure 1.
GENERAL DESCRIPTION
The fido5100 and fido5200 (REM switch) are programmable
IEEE 802.3 10 Mbps/100 Mbps Ethernet Internet Protocol
Version 6 (IPv6) and Internet Protocol Version 4 (IPv4) switches
that support virtually any Layer 2 or Layer 3 protocol. The
switches are personalized to support the desired protocol by
firmware that is downloaded from a host processor.
The firmware is contained in the real-time Ethernet multiprotocol
(REM) switch driver and is downloaded at power-up. The REM
switch can be ready for network data operation in less than 4 ms to
support fast startup and quick connect type network functionality.
The REM switch devices have the same signal assignments as
defined in this data sheet.
The fido5100 supports the following protocols: PROFINET real
time (RT) and isochronous real time (IRT), EtherNet/IP with
and without device level ring (DLR), Modbus TCP, and
POWERLINK.
The fido5200 supports the following protocols: EtherCAT and
all protocols defined for the fido5100.
The REM switch is intended for use with a host processor.
Network operation is handled using the functions and services
provided in the REM switch driver. The host processor can
implement any protocol stack by integrating it with the REM
switch driver. An example application is shown in Figure 11.
The REM switches are available in a 144-ball chip scale package
ball grid array (CSP_BGA) package.
Note that throughout this data sheet, multifunction pins, such
as A02/ALE, are referred to either by the entire pin name or by
a single function of the pin, for example, ALE, when only that
function is relevant.
fido5100/fido5200 Data Sheet
Rev. E | Page 2 of 19
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications ....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description ......................................................................... 1
Revision History ............................................................................... 2
Specifications ..................................................................................... 3
REM Switch Characteristics ........................................................ 3
Timing SpecificationsNonmultiplexed Address Data Bus .. 3
Timing SpecificationsMultiplexed Address Data Bus ......... 5
Absolute Maximum Ratings ............................................................ 7
ESD Caution .................................................................................. 7
Pin Configuration and Function Descriptions ............................. 8
Theory of Operation ...................................................................... 12
Device Interfaces ........................................................................ 12
Internal Precision Timer ........................................................... 12
Host Interface .............................................................................. 12
Ethernet Interface ....................................................................... 15
Applications Information .............................................................. 17
REM Switch Hardware .............................................................. 17
Board Layout ............................................................................... 17
Design Considerations .............................................................. 17
Outline Dimensions ....................................................................... 19
Ordering Guide .......................................................................... 19
REVISION HISTORY
3/2020—Rev. D to Rev. E
Deleted Table 13; Renumbered Sequentially .............................. 18
1/2020—Rev. C to Rev. D
Change to Features Section ............................................................. 1
8/2019—Rev. B to Rev. C
Change to Features Section, General Description Section, and
Figure 1 .............................................................................................. 1
Changes to Figure 6 .......................................................................... 8
Change to Crystal Section and Figure 8 ...................................... 12
Change to Figure 9 and Figure 10 ................................................ 16
Changes to Figure 11, REM Switch Hardware Section, and
Power Section .................................................................................. 17
Changes to Table 13 ........................................................................ 18
1/2019—Rev. A to Rev. B
Change to tAH Parameter, Table 2 .................................................... 3
Changes to Ordering Guide .......................................................... 19
8/2018—Rev. 0 to Rev. A
Added Core Current Parameter and I/O Current Parameter,
Table 1 ................................................................................................. 3
Changes to tAS Parameter and tAH Parameter, Table 2 ................... 3
Added Note 2 and Note 3, Table 2; Renumbered Sequentially ... 3
Change to Power Dissipation Parameter, Table 4 ......................... 7
10/2017—Revision 0: Initial Version
Data Sheet fido5100/fido5200
Rev. E | Page 3 of 19
SPECIFICATIONS
REM SWITCH CHARACTERISTICS
Table 1.
Parameter Min Typ Max Unit Test Conditions/Comments
OPERATING CONDITIONS
Core Voltage 1.08 1.2 1.32 V
Core Current 48 mA At TA = 85°C
Input/Output (I/O) Buffers 2.97 3.3 3.63 V 3.3 V power supply
I/O Current 0.035 mA At TA = 85°C
PLL Analog Voltage Regulator Power Supply 1.08 1.2 1.32 V
DC Input Voltage −0.5 +3.8 V
Output Voltage 0.5 +3.8 V
Operating Junction Temperature (Industrial) −40 +125 °C
DC CHARACTERISTICS (I/O STANDARD)
3.3 V LVCMOS
VCC+3V3 2.97 3.3 3.63 V Voltage level applied to the VCC+3V3 signal
Input Voltage
Low (VIL) −0.3 +0.8 V
High (VIH) 2.0 3.6 V
Output Voltage
Low (VOL) 0.4 V
High (VOH) 2.4 V
Output Current
Low (IOL) 8.2 13.0 16.1 mA
High (IOH) 9.2 19.2 30.7 mA
LEAKAGE CURRENT
Input Pin −10 +10 μA Input voltage (VIN) = 0 V to 3.3 V maximum
Tristated I/O Pin −10 +10 μA Output voltage (VOUT) = 0 V to 3.3 V maximum
HOST INTERFACE TRANSFER RATE1 32 Bits Per 28 ns
1 Supports EtherCAT cycle times down to 12.5 μs and PROFINET cycle times down to 31.25 μs.
TIMING SPECIFICATIONS—NONMULTIPLEXED ADDRESS DATA BUS
Table 2. Nonmultiplexed Address Data Bus—Read and Write Cycle Timing1, 2, 3
Parameter Min Typ Max Unit Description
tAS 2 ps Address setup time
tAH 370 ps Address hold time
tCDV 20 ns CS to data valid time
tODV 20 ns Output enable to data valid time
tOEL 20 ns Output enable low time
tCSH 8 ns CS high time
tCSL 20 ns CS low time
tEOE 0 ns CS to output enable time
tCOE 0 ns Output enable high to CS high
tDO 150 ps Output enable to data drive time
tDHZ 110 ps Output disable to high-Z time
tCHZ 110 ps CS high to high-Z time
tWES 0 ns CS to write enable
tWEWC 16 ns Write enable to write complete
tWECS 0 ns Write enable high to CS high
tDS 30 ps Data setup to WE high
tDH 30 ps Input data hold after WE high
1 The MBS pin determines whether the host interfaced has multiplexed or separate address and data lines. When MBS = 0, the interface is nonmultiplexed.
2 OE can be taken low before CS. Therefore, tEOE can be a negative value. In this case, a board designer must closely monitor tDO and tCDV to avoid bus contention and
ensure proper data transfer.
3 The read bus cycle terminates when either CS or OE is taken high. Therefore, a negative value for tCOE is acceptable in some circumstances.
fido5100/fido5200 Data Sheet
Rev. E | Page 4 of 19
Timing Diagrams, Nonmultiplexed REM Switch
ADDRESSADDRESS
DATA
OE
CS
DATA OUT
tAS tAH
tCDV
tDO tDHZ
tCHZ
tEOE
tODV
tOEL
tCSL
tCOE tCSH
15833-002
Figure 2. REM Switch Nonmultiplexed Address and Data Bus Read Timing, MBS = 0
DATA DATA IN
ADDRESSADDRESS
tAS tAH
tDS tDH
tWEWC
tWES
WE
CS
tWECS
tCSH
15833-003
Figure 3. REM Switch Nonmultiplexed Address and Data Bus Write Timing, MBS = 0
Data Sheet fido5100/fido5200
Rev. E | Page 5 of 19
TIMING SPECIFICATIONS—MULTIPLEXED ADDRESS DATA BUS
Table 3. Multiplexed Address Data Bus—Read and Write Cycle Timing1
Parameter Min Typ Max Unit Description
t
ALEH
ns
ALE high time
tALEL 16 ns ALE low time
tAS 170 ps Address setup time
tAH 170 ps Address hold time
tCDV 20 ns ALE to valid data
tALOE 2 ns ALE to output enable
tODV 20 ns Output enable to data valid
tDHZ 150 ps Output disable to high-Z time
tCHZ 150 ps CS high to high-Z time
tCLLL 0 ns CS low to ALE low
tCSH 8 ns CS high time
tEOE 2 ns CS to output enable
tDO 2 110 ps Output enable to output drive time
tCOE 0 ns Output disable to CS high
tWES 0 ns CS to write enable
tWEWC 16 ns Write enable to write complete
tWECS 0 ns Write enable high to CS high
t
WHLH
ns
WE high to next ALE high
tDS 60 ps Data setup to WE high
tDH 60 ps Input data hold after WE high
1 The MBS pin determines whether the host interfaced has multiplexed or separate address and data lines. When MBS = 1, the interface is multiplexed.
Timing Diagrams, Multiplexed REM Switch
ADDRESS
ADDRESS
BUS
ALE
DATA O UT
t
AS
t
AH
t
ALEH
t
ALOE
t
DO
t
DHZ
t
CHZ
t
COE
t
CLLL
t
CDV
t
ALEL
OE
CS
t
CSH
t
ODV
t
EOE
15833-004
Figure 4. REM Switch Multiplexed Address and Data Bus Read Timing, MBS = 1
fido5100/fido5200 Data Sheet
Rev. E | Page 6 of 19
ADDRESS
ADDRESS
BUS DATA IN
t
AS
t
AH
t
DS
t
DH
ALE
t
ALEH
t
CLLL
t
ALEL
t
WES
t
WECS
t
WHLH
t
WEWC
t
CSH
WE
CS
15833-005
Figure 5. REM Switch Multiplexed Address and Data Bus Write Timing, MBS = 1
Data Sheet fido5100/fido5200
Rev. E | Page 7 of 19
ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter Rating
Power Supply
Core Voltage and Periphery Circuitry
1.08 V to 1.32 V
I/O (VCC+3V3) 2.97 V to 3.63 V
PLL Analog 1.08 V to 1.32 V
DC Input Voltage −0.5 V to +3.8 V
Operating Temperature Range
Junction −40°C to +125°C
Ambient
−40°C to +85°C
Storage Temperature (No Bias) Range −65°C to +150°C
Electrostatic Discharge (ESD) Voltage,
Human Body Model
−2000 V to +2000 V
Lead Temperature (Soldering) J-STD-020C1
Power Dissipation 172.6 mW
1 Compliant with JEDEC Standard J-STD-020C and restriction of hazardous
substances (RoHS), Directive 2002/95/EU.
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
ESD CAUTION
fido5100/fido5200 Data Sheet
Rev. E | Page 8 of 19
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
A
M
L
K
J
H
G
F
E
D
C
B
1 2 345678 9 10 11 12
D02/AD02 D04/AD04 D07 D11 D15 D18 D19 D22 D25 D27 D30 D31
D01 D03/AD03 D06 D10 D14 D17 D20 D23 D26 D29 OE WE
A04/UNUSED D00 D05/A05 D09 D13 D16 D21 D24 D28 INT2 INT1 INT0
A02/ALE A03/UNUSED A05/UNUSED D08 D12 VCC+1V2 GND VCC+3V3 GND TIMER7 TIMER6 CS
RESET LE SIZE_32 GND VCC+1V2 GND VCC+1V2 GND VCC+3V3 TIMER5 TIMER4 TIMER3
GND MBS GND VCC+3V3 GND VCC+1V2 GND GND GND TIMER2 TIMER1 TIMER0
XTAL0 XTAL1 VCC+1V2A GND VCC+1V2 GND VCC+1V2 GND RMII_CLK CLKOUT P2_ACTIVITY
GND
GND VCC+3V3 GND VCC+3V3 GND VCC+1V2 GND GND VCC+3V3 P2_CRS P2_COL P2_LINK_
STATUS
P1_TXEN P1_TXCLK NC GND VCC+3V3 GND VCC+1V2 NC NC NC P2_RXDV P2_RXCLK
P1_TXD0 NC NC NC NC P1_RXDV P1_LINK_
STATUS P2_TXD1 NC P2_RXD0 NC NC
P1_TXD1 P1_TXD2 P1_RXD0 P1_RXD3 NC P1_CRS P1_ACTIVITY P2_TXD0 P2_TXD3 NC P2_RXD2 NC
P1_TXD3 NC P1_RXD1 P1_RXD2 NC P1_RXCLK P1_COL P2_TXEN P2_TXD2 P2_TXCLK P2_RXD1 P2_RXD3
VCC+1V2 VCC+3V3 VCC+1V2 GND I/O
REM SW ITCH
TOP VIEW
(No t t o Scal e)
15833-006
Figure 6. Pin Configuration
Data Sheet fido5100/fido5200
Rev. E | Page 9 of 19
Table 5. Pin Function Descriptions
Pin No. Mnemonic Direction1 Description
A1 D02/AD02 I/O Data Bus Bit 02 Nonmultiplexed/Data Bus Bit 02 Multiplexed. This is a
multifunction pin.
When MBS = 0, Pin A1 (D02) is Data Bus Bit 02 to and from the REM switch for
the nonmultiplexed address data bus.
When MBS = 1, Pin A1 (AD02) is for the multiplexed address data bus, Bit 02 of
the address (LSB), and Bit 02 of the data.
A2 D04/AD04 I/O Data Bus Bit 04 Nonmultiplexed/Data Bus Bit 04 Multiplexed. This is a
multifunction pin.
When MBS = 0, Pin A2 (D04) is Data Bus Bit 04 to and from the REM switch for
the nonmultiplexed address data bus.
When MBS = 1, Pin A2 (AD04) is for the multiplexed address data bus, Bit 04 of
the address, Bit 04 of the data.
A3 D07 I/O Data Bus Bit 07. Pin A3 is Data Bus Bit 07 to and from the REM switch.
A4 D11 I/O Data Bus Bit 11. Pin A4 is Data Bus Bit 11 to and from the REM switch.
A5 D15 I/O Data Bus Bit 15. Pin A5 is Data Bus Bit 15 to and from the REM switch.
A6
D18
I/O
Data Bus Bit 18. Pin A6 is Data Bus Bit 18 to and from the REM switch.
A7 D19 I/O Data Bus Bit 19. Pin A7 is Data Bus Bit 19 to and from the REM switch.
A8 D22 I/O Data Bus Bit 22. Pin A8 is Data Bus Bit 22 to and from the REM switch.
A9 D25 I/O Data Bus Bit 25. Pin A9 is Data Bus Bit 25 to and from the REM switch.
A10 D27 I/O Data Bus Bit 27. Pin A10 is Data Bus Bit 27 to and from the REM switch.
A11 D30 I/O Data Bus Bit 30. Pin A11 is Data Bus Bit 30 to and from the REM switch.
A12 D31 I/O Data Bus Bit 31. Pin A12 is Data Bus Bit 31 to and from the REM switch.
B1 D01 I/O Data Bus Bit 01. Pin B1 is Data Bus Bit 01 to and from the REM switch.
B2 D03/AD03 I/O Data Bus Bit 03 Nonmultiplexed/Data Bus Bit 03 Multiplexed. This is a
multifunction pin.
When MBS = 0, Pin B2 (D03) is Data Bus Bit 03 to and from the REM switch for
the nonmultiplexed address data bus.
When MBS = 1, Pin B2 (AD03) is for the multiplexed address data bus, Bit 03 of
the address, Bit 03 of the data.
B3 D06 I/O Data Bus Bit 06. Pin B3 is Data Bus Bit 06 to and from the REM switch.
B4 D10 I/O Data Bus Bit 10. Pin B4 is Data Bus Bit 10 to and from the REM switch.
B5 D14 I/O Data Bus Bit 14. Pin B5 is Data Bus Bit 14 to and from the REM switch.
B6
D17
I/O
Data Bus Bit 17. Pin B6 is Data Bus Bit 17 to and from the REM switch.
B7 D20 I/O Data Bus Bit 20. Pin B7 is Data Bus Bit 20 to and from the REM switch.
B8 D23 I/O Data Bus Bit 23. Pin B8 is Data Bus Bit 23 to and from the REM switch.
B9 D26 I/O Data Bus Bit 26. Pin B9 is Data Bus Bit 26 to and from the REM switch.
B10 D29 I/O Data Bus Bit 29. Pin B10 is Data Bus Bit 29 to and from the REM switch.
B11
OE
I
Output Enable. Setting Pin B11 low allows the REM switch to drive data lines.
B12 WE I Write Enable. Setting Pin B12 low enables a write; setting Pin B12 high enables
a read.
C1 A04/UNUSED I Address Line 04/Multiplexed Address Bus (UNUSED). This is a multifunction pin.
Pin C1 is Address Line 04 when MBS = 0 for the nonmultiplexed address data
bus. When MBS = 1, Pin C1 is Bit 04 of the address bus. Line A04 is sampled on
the falling edge of CS (Pin D12).
Pin C1 is unused when MBS = 1 for the multiplexed address data bus.
C2 D00 I/O Data Bus Bit 00. C2 is Data Bus Bit 00 to and from the REM switch.
C3 D05/A05 I/O Data Bus Bit 05 Nonmultiplexed/Data Bus Bit 05 Multiplexed. This is a
multifunction pin.
When MBS = 0, Pin C3 (D05) is Data Bus Bit 05 to and from the REM switch for
the nonmultiplexed address data bus.
When MBS = 1, Pin C3 (A05) is for the multiplexed address data bus, Bit 05 of
the address, Bit 05 of the data.
C4 D09 I/O Data Bus Bit 09. Pin C4 is Data Bus Bit 09 to and from the REM switch.
C5 D13 I/O Data Bus Bit 13. Pin C5 is Data Bus Bit 13 to and from the REM switch.
C6
D16
I/O
Data Bus Bit 16. Pin C6 is Data Bus Bit 16 to and from the REM switch.
fido5100/fido5200 Data Sheet
Rev. E | Page 10 of 19
Pin No. Mnemonic Direction1 Description
C7 D21 I/O Data Bus Bit 21. Pin C7 is Data Bus Bit 21 to and from the REM switch.
C8 D24 I/O Data Bus Bit 24. Pin C8 is Data Bus Bit 24 to and from the REM switch.
C9 D28 I/O Data Bus Bit 28. Pin C9 is Data Bus Bit 28 to and from the REM switch.
C10 INT2 O Interrupt 2 Output to Host Processor. Pin C10 can be configured to respond to
one or more internal events.
C11 INT1 O Interrupt 1 Output to Host Processor. Pin C11 can be configured to respond to
one or more internal events.
C12 INT0 O Interrupt 0 Output to Host Processor. Pin C12 can be configured to respond to
one or more internal events.
D1 A02/ALE I Address Line 02/Address Latch Enable. This is a multifunction pin.
N/A
Pin D1 is Address Line 02 when MBS = 0 for the nonmultiplexed address data
bus. When MBS = 0, Pin D1 is Bit 02 of the address bus. Line A02 is sampled on
the falling edge of CS (Pin D12). The addresses are 32-bit aligned/addressable.
When MBS = 1, this pin is the address latch enable pin.
D2 A03/UNUSED I Address Line 03/Multiplexed Address Bus. This is a multifunction pin.
Pin D2 is Address Line 03 when MBS = 0 for the nonmultiplexed address data
bus. When MBS = 0, Pin D2 is Bit 03 of the address bus. Line A03 is sampled on
the falling edge of CS (Pin D12). The addresses are 32-bit aligned/addressable.
Pin D2 is unused when MBS = 1 for the multiplexed address data bus.
D3 A05/UNUSED I Address Line 05/Multiplexed Address Bus. This is a multifunction pin.
Pin D3 is Address Line 05 when MBS = 0 for the nonmultiplexed address data
bus. When MBS = 0, Pin D3 is Bit 05 of the address bus. Line A05 is sampled on
the falling edge of CS (Pin D12). The addresses are 32-bit aligned/addressable.
Pin D3 is unused when MBS = 1 for the multiplexed address data bus.
D4 D08 I/O Data Bus Bit 08. Pin D4 is Data Bus Bit 08 to and from the REM switch.
D5 D12 I/O Data Bus Bit 12. Pin D5 is Data Bus Bit 12 to and from the REM switch.
D6, E5, E7, F6, G5, G8,
H6, J7
VCC+1V2 N/A 1.2 V Power Supply.
D7, D9, E4, E6, E8, F1,
F3, F5, F7, F8, F9, G4,
G6, G7, G9, H1, H3,
H5, H7, H8, J4, J6
GND N/A Ground.
D8, E9, F4, H2, H4,
H9, J5
VCC+3V3
N/A
3.3 V Power Supply.
D10 TIMER7 O Internal Precision Timer Clock 7 Synchronized. Pin D10 is a programmable output.
D11 TIMER6 O Internal Precision Timer Clock 6 Synchronized. Pin D11 is a programmable output.
D12 CS I Address Bus Chip Select. The address bus is sampled on the falling edge of CS.
A rising edge on CS terminates the current read or write cycle.
E1
RESET
I
Reset. When Pin E1 is asserted low, all internal registers initialize and bus
configuration pins enable for sampling.
E2 LE I System Endianness. When Pin E2 is set high, the data format is little endian.
When Pin E2 is set low, the data format is big endian. The value is captured on
the rising edge of RESET.
E3 SIZE_32 I Data Bus Size. The data bus size is 32 bits when Pin E3 is set high and 16 bits
when Pin E3 is set low. The value is captured on the rising edge of RESET.
E10 TIMER5 O Internal Precision Timer Clock 5 Synchronized. Pin E10 is a programmable
output.
E11 TIMER4 O Internal Precision Timer Clock 4 Synchronized. Pin E11 is a programmable
output.
E12
TIMER3
I/O
Internal Precision Timer 3 Clock Synchronized. Pin E12 is a programmable
output or input.
F2 MBS I Multiplex Bus Select. When Pin F2 is set high, the host interface bus operates as
a multiplexed bus. The host interface operates as a nonmultiplexed bus when
Pin F2 is set low. The value is captured on the rising edge of Pin E1, RESET.
F10 TIMER2 I/O Internal Precision Timer Clock 2 Synchronized. Pin F10 is a programmable
output or input.
Data Sheet fido5100/fido5200
Rev. E | Page 11 of 19
Pin No. Mnemonic Direction1 Description
F11 TIMER1 I/O Internal Precision Timer Clock 1 Synchronized. Pin F11 is a programmable
output or input.
F12 TIMER0 I/O Internal Precision Timer Clock 0 Synchronized. Pin F12 is a programmable
output or input.
G1 XTAL0 Clock Input. This pin has a frequency of 25 MHz.
G2 XTAL1 Output Pair for XTAL0. Pin G2 is required for use with a crystal clock source.
G3 VCC+1V2A Analog 1.2 V Power Supply. This pin must be isolated from VCC+1V2.
G10 RMII_CLK O 50 MHz Reduced Media Independent Interface (RMII) Transmit and Receive
Clock Reference for Port 1 and Port 2.
G11 CLKOUT O Output Clock. Pin G11 has the same frequency as XTAL0 (25 MHz).
G12
P2_ACTIVITY
O
Port 2 Activity LED Output Driver. The LED turns on when G12 is asserted low.
H10 P2_CRS I Port 2 Carrier Sense. When H10 is asserted high, a carrier has been sensed on
Port 2.
H11 P2_COL I Port 2 Media Independent Interface (MII) Collision. Pin H11 asserting high
indicates a collision on Port 2.
H12 P2_LINK_STATUS I Port 2 Link Status from Physical Layer (PHY). When H12 is asserted low, the link
on Port is active.
J1 P1_TXEN O Port 1 MII Transmit Enable. Setting Pin J1 high enables transmission on Port 1.
J2 P1_TXCLK I Port 1 MII Transmit Clock from PHY.
J3, J8, J9, J10, K2, K3, K4,
K5, K9, K11, K12, L5,
L10, L12, M2, M5
NC N/A No Connection.
J11 P2_RXDV I Port 2 Received Data Valid. Data from the Port 2 PHY is valid when J11 is
asserted high (used as CRS/RXDV in RMII mode).
J12 P2_RXCLK I Port 2 MII Receive Clock from PHY.
K1 P1_TXD0 O Transmit Data Output Bit 0 for Port 1 MII and RMII.
K6 P1_RXDV I Port I MII Received Data Valid. Asserting Pin K6 high indicates that data from
the Port 1 PHY is valid (used as CRS/RXDV in RMII mode).
K7 P1_LINK_STATUS I Port 1 Link Status from PHY. Asserting Pin K7 low activates the Port 1 link.
K8 P2_TXD1 O Transmit Data Output Bit 1 for Port 2 MII and RMII.
K10 P2_RXD0 I Receive Data Input Bit 0 for Port 2 MII and RMII.
L1 P1_TXD1 I Transmit Data Output Bit 1 for Port 1 MII and RMII.
L2 P1_TXD2 O Transmit Data Output Bit 2 for Port 1 MII.
L3 P1_RXD0 I Receive Data Input Bit 0 for Port 1 MII and RMII.
L4 P1_RXD3 I Receive Data Input Bit 3 for Port 1 MII.
L6 P1_CRS I Port 1 Carrier Sense. When L6 is asserted high, a carrier has been sensed on
Port 1.
L7 P1_ACTIVITY O Port 1 Activity LED Output Driver. The LED turns on when Pin L7 is asserted low.
L8
P2_TXD0
O
Transmit Data Output Bit 0 for Port 2 MII and RMII.
L9 P2_TXD3 O Transmit Data Output Bit 3 for Port 2 MII.
L11 P2_RXD2 I Receive Data Input Bit 2 for Port 2 MII.
M1 P1_TXD3 O Transmit Data Output Bit 3 for Port 1 MII.
M3 P1_RXD1 I Receive Data Input Bit 1 for Port 1 MII AND RMII.
M4 P1_RXD2 I Receive Data Input Bit 2 for Port 1 MII.
M6 P1_RXCLK I Port I MII Receive Clock from PHY.
M7 P1_COL I Port 1 MII Collision. Asserting Pin M7 high indicates a collision on Port 1.
M8 P2_TXEN O Port 2 MII Transmit Enable. Setting Pin M8 to high enables the Port 2 transmit.
M9 P2_TXD2 O Transmit Data Output Bit 2 for Port 2 MII.
M10 P2_TXCLK I Port 2 MII Transmit Clock from PHY.
M11
P2_RXD1
I
Receive Data Input Bit 1 for Port 2 MII and RMII.
M12 P2_RXD3 I Receive Data Input Bit 3 for Port 2 MII.
1 I is input, I/O is input/output, O is output, and N/A is not applicable.
fido5100/fido5200 Data Sheet
Rev. E | Page 12 of 19
THEORY OF OPERATION
DEVICE INTERFACES
Oscillator
The oscillator clock source is routed to an internal phase-locked
loop (PLL) to create the following clock sources:
25 MHz for the CLKOUT reference clock
50 MHz for the RMII reference clock
An oscillator used as a clock source requires a tighter tolerance.
TIMER0
TIMER1
TIMER2
TIMER3
TIMER4
TIMER5
TIMER6
TIMER7
INT0
INT1
XTAL0
XTAL1
INT2
F12 TIM E R0
F11 TIM E R1
F10 TIM E R2
E12 TIME R3
E11 TIME R4
E10 TIME R5
D11 TI MER6
D10 TI MER7
C12 INT 0
C11 INT 1
C10 INT 2
ASEMPC–
25.000MHZ–LR–T
LE
MBS
SIZE_32
E2
F2
G1 XTAL0 4 1
36
R28
22Ω C25
0.01µF
25MHz
OUT
U5
OE
GND VDD
GND
G2
E3
_BGA GND
+3V3
GND
15833-007
Figure 7. Oscillator Clock Source Circuit
Crystal
When using the REM switch with a crystal, use an oscillator
pad configuration, as shown Figure 8.
XTAL1
XTAL0
R
F
25MHz
C
L
C
L
REM
SWITCH
15833-008
Figure 8. Crystal Clock Source Circuit
The values presented in the following list are typical for
operation when using a 25 MHz crystal:
ESR = 40 Ω
CL = 8 pF
RF = 1 MΩ
Reset Timing
The timing requirement for RESET is a minimum active low
time of 16 ns.
INTERNAL PRECISION TIMER
The REM switch includes an internal precision timer (IPT). The
IPT maintains a system time that has a resolution of 1 ns. Use
the IPT to trigger timer output events or capture input event
times on the TIMER0, TIMER1, TIMER2, and TIMER3 pins, or
to create a complex pulse pattern on the TIMER4, TIMER5,
TIMER6, and TIMER7 pins.
TIMER0 to TIMER3 Inputs/Outputs
TIMER0 to TIMER3 inputs/outputs can be configured to either
time stamp an input event or time trigger an output event.
When configured to time stamp an input event, the value of the
IPT is captured in a 64-bit register when the associated timer
signal transitions from low to high. User software reads this
register and uses the value to time stamp an associated event.
For example, when the TIMER0 signal transitions from low to
high, the value of the IPT is stored in the Timer 0, 64-bit
register (consult the REM Switch Software Driver User Guide,
available at www.analog.com/en/products/industrial-ethernet.html
for more details). The same is true when configuring TIMER1,
TIMER2, or TIMER3 to time stamp input events. User software
uses the generated time stamp to associate the time stored in the
64-bit register with a particular event.
When configured to time trigger an output event, the timer
signal toggles when the IPT reaches the value stored in the
Timer x, 64-bit register. The process of time triggering an
output event is as follows using the Timer 0 register in the
example:
1. The host processor software stores a value in the Timer 0,
64-bit register.
2. The IPT reaches that value stored in the Timer 0, 64-bit
register.
3. The TIMER0 pin toggles from high to low or low to high
(depending on its state when the 64-bit register was
loaded).
The same process is followed when the TIMER1, TIMER2, and
TIMER3 pins are configured to time trigger output events.
TIMER4 to TIMER7 Outputs
TIMER4 to TIMER7 outputs are configured to output independ-
ent, IPT clock synchronized, programmable, pulse-width
modulated signals. Each of these timers has a resolution of
16 ns. Each timer can have its own pulse-width modulation
program that allows an arbitrary number of rising and falling
edges, depending on the protocols that repeat on a programmable
interval. The software drivers for the REM switch provide the
capability to define the rising and falling edges for each
TIMERx output.
HOST INTERFACE
Multiplex Bus Select
The host interface supports a separate address bus and data bus
or a multiplexed address and data bus. The selection between
the two types of busses is provided by the MBS signal (Pin F2),
which is sampled on the rising edge of RESET. See Table 5 for
pin function descriptions for the MBS and RESET signals.
Data Sheet fido5100/fido5200
Rev. E | Page 13 of 19
Data Bus Width
The host interface supports either a 16-bit or 32-bit wide data
bus. The data bus width is determined by the SIZE_32 (Pin E3)
signal that is sampled on the rising edge of RESET. See Table 5
for pin function descriptions for the SIZE_32 and RESET signals.
Endianness
The host interface presents data on the data bus in either big
endian or little endian format. The endianness of the data is
determined by the LE signal (Pin E2), which is sampled on the
rising edge of the RESET signal. See Table 5 for pin function
descriptions for the LE and RESET signals.
The REM switch data bus is defined as follows:
D0 = LSB
D15 = MSB for 16-bit bus
D31 = MSB for 32-bit bus
For all control/status register accesses, there is no difference in
operation based on the setting of the LE pin. The data represen-
tation in a host processor register must match the data that is
transferred over the bus.
All control/status registers are 16-bits wide. If using a 32-bit
bus, transfer the data in the following order: D15 to D0 (D31 to
D16 are ignored when using a 32-bit bus). For example, the
REM switch driver reads the device number register early in the
initialization process. In the case of the number, 0x00003300, the
value read from this register must be transferred across the bus,
as shown in Table 6. When evaluated in the software on the host
processor, the value of these 32 bits results in 0x00003300.
For queue accesses, the REM switch treats all data as byte
arrays. Consider the following example of a stream of bytes
received over an Ethernet cable into a REM switch port and
then transferred to the host. The packet data in network order is
as follows: 0x00, 0x01, 0x02, 0x03, 0x04, 0x05, 0x06, 0x07, 0x08,
0x09, 0x0A, 0x0B, 0x0C, 0x0D, 0x0E, 0x0F.
The data is read differently depending on the setting, as follows:
Big endian 16-bit host interface: 0x0001, 0x0203, 0x0405,
0x0607, 0x0809, 0x0A0B, 0x0C0D, 0x0E0F.
Big endian 32-bit host interface: 0x00010203, 0x04050607,
0x08090A0B, 0x0C0D0E0F.
Little endian 16-bit host interface: 0x0100, 0x0302, 0x0504,
0x0706, 0x0908, 0x0B0A, 0x0D0C, 0x0F0E.
Little endian 32-bit host interface: 0x03020100,
0x07060504, 0x0B0A0908, 0x0F0E0D0C.
Consult the REM Switch Software Driver User Guide, available
at www.analog.com/en/products/industrial-ethernet.html for
more details on how to handle endianness in an application of
a device.
Table 6. Control/Status Registers Bit Map
D31 D30 D29 D28 D27 D26 D25 D24 D23 D22 D21 D20 D19 D18 D17 D16
0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0
D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0
0 0 1 1 0 0 1 1 0 0 0 0 0 0 0 0
Table 7. Big Endian 16-Bit Data Bus Bit Map, 0x0E0F Hexadecimal
D31 D30 D29 D28 D27 D26 D25 D24 D23 D22 D21 D20 D19 D18 D17 D16
0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0
D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0
0 0 0 0 1 1 1 0 0 0 0 0 1 1 1 1
Table 8. Big Endian 32-Bit Data Bus Bit Map, 0x0C0D0E0F Hexadecimal
D31 D30 D29 D28 D27 D26 D25 D24 D23 D22 D21 D20 D19 D18 D17 D16
0 0 0 0 1 1 0 0 0 0 0 0 1 1 0 1
D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0
0 0 0 0 1 1 1 0 0 0 0 0 1 1 1 1
Table 9. Little Endian 16-Bit Data Bus Bit Map, 0x0E0F Hexadecimal
D31 D30 D29 D28 D27 D26 D25 D24 D23 D22 D21 D20 D19 D18 D17 D16
0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0
D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0
0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 0
Table 10. Little Endian 32-Bit Data Bus Bit Map, 0x0F0E0D0C Hexadecimal
D31 D30 D29 D28 D27 D26 D25 D24 D23 D22 D21 D20 D19 D18 D17 D16
0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 0
D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0
0 0 0 0 1 1 0 1 0 0 0 0 1 1 0 0
fido5100/fido5200 Data Sheet
Rev. E | Page 14 of 19
Address/Data Bus Operation
The host interface address/data bus connects to the address/
data bus of the CPU. There are four bits of data for the address
bus and either 16 bits or 32 bits of data for the data bus. Each
REM switch address is 32-bit aligned, meaning that the addresses
increment by four bytes (A05 to A02). Regardless of whether the
data bus is 16 bits wide or 32 bits wide, the least significant
address bit supplied to the REM switch is always the same.
In addition, all accesses to indirect registers return the register
data in the lower 16 bits only (even if the interface is 32 bits
wide). For wider registers, such as a 64-bit timer, use a repeated
set of reads or writes to access the full content of the register.
Nonmultiplexed Address Data Bus
MBS = 0 selects the nonmultiplexed address data bus config-
uration. The read and write cycle timings are defined in Figure 2
and Figure 3. See Table 2 for the read and write cycle timing
parameters.
Multiplexed Address Data Bus
MBS = 1 selects the multiplexed address data bus configuration.
The read and write cycle timings are defined in Figure 4 and
Figure 5. See Table 3 for the read and write cycle timing
parameters.
Register and Data Access
Four bits of address provide direct access to 16 registers. A read
cycle or a write cycle obtains or sets the data in these registers.
To access additional registers, use the host indirect address
register. The direct address register definitions are provided in
Table 11.
The REM switch software driver provides the necessary application
programming interface (API) functions to access these registers
and manage all aspects of the switch for a specific protocol. Ether-
net packets are received and transmitted directly through the
Queue 0, Queue 1, Queue 2, and Queue 3 read and write registers,
depending on the protocol.
Ethernet protocol control and switch management are performed
by the software driver API through the host read/write queue
data registers and the host direct/indirect registers (refer to the
REM Switch Driver User Guide, available at
www.analog.com/en/products/industrial-ethernet.html, for more
information about these registers). Interrupt management is
performed by the software driver API using the three interrupt
lines in conjunction with the queue status register, timer status
register, universal input/output controller (UIC) interrupt status
register, and the composite interrupt status register.
Table 11. Direct Address Register Definitions
Register Name Width Address[5:0] Read/Write1 Reset Value2
Queue 0 Read 16/32 0x00 R 0x00000000
Queue 0 Write 16/32 0x00 W N/A
Queue 1 Read 16/32 0x04 R 0x00000000
Queue 1 Write 16/32 0x04 W N/A
Queue 2 Read 16/32 0x08 R 0x00000000
Queue 2 Write 16/32 0x08 W N/A
Queue 3 Read 16/32 0x0C R 0x00000000
Queue 3 Write 16/32 0x0C W N/A
Reserved N/A 0x10 to 0x14 N/A
Host Read Queue 0 Data 16/32 0x18 R 0x00000000
Host Read Queue 0 Data Head
16/32
0x18
W
0x00000000
Host Read Queue 1 Data 16/32 0x1C R 0x00000000
Host Read Queue 1 Data Head 16/32 0x1C W N/A
Queue Status Register 16 0x20 R/W 0x00000F00
Timer Status Register 16 0x24 R/W 0x00000000
UIC Interrupt Status 16 0x28 R/W 0x0000
Composite Interrupt Status 16 0x2C R 0x0000
Host Indirect Address 16 0x30 R/W 0x0000
Host Indirect Read Data 16 0x34 R N/A
Host Indirect Write Data 16 0x34 W N/A
Host Write Queue 0 Completion 16 0x38 R 0x0000
Host Write Queue 1 Completion
16
0x3C
R
0x0000
1 R means read only, W means write only, and R/W means read/write.
2 N/A means not applicable.
Data Sheet fido5100/fido5200
Rev. E | Page 15 of 19
Interrupts
Three interrupt lines are outputs from the REM switch; these
three lines are labeled INT0, INT1, and INT2. Each of these
interrupt lines must be mapped according to the interrupt
inputs of the host processor. To ensure the best protocol
performance, give INT2 the highest priority in the processor
priority scheme, and do not disable it.
The interrupt lines are mapped to the events defined by the
queue status register, timer status register, UIC interrupt status
register, and composite interrupt status register for each protocol.
It is the responsibility of the software driver API to provide the
appropriate interrupt service routine for the mapped event.
Refer to the REM Switch Driver User Guide, available at
www.analog.com/en/products/industrial-ethernet.html, for
technical details on handling REM switch interrupts for a
specific industrial Ethernet protocol.
When an interrupt event defined in the appropriate status
registers occurs, the associated REM switch interrupt output
line becomes active (Logic 1) and remains active until the
register is cleared. If multiple events are mapped to the same
REM switch interrupt output, and more than one becomes
active, the associated interrupt line remains in the active (Logic 1)
state until all active interrupt source registers are cleared.
Note that although the interrupts, INT0, INT1, and INT2, are
labeled as priorities of low, medium, and high, there is not any
inherent priority on the lines themselves, and they can be mapped
accordingly.
ETHERNET INTERFACE
There are two Ethernet ports on the REM switch. Each port is
capable of configuration to support RMII or MII. Each port also
has an input for link status from the PHY and an output for a
link activity LED.
Connections
The pins associated specifically with the RMII and MII interfaces
are listed in Table 12; their full descriptions are defined in
Table 5.
The RMII interface is a seven-signal interface for each port (see
Figure 9). This interface uses a 50 MHz reference clock (RMII_
CLK) provided by the REM switch to the PHY.
The MII interface is a 14-signal interface for each port (see
Figure 10). The REM switch provides the base clock to the
PHYs using the synchronized 25 MHz CLKOUT signal. The
PHYs then provide a receive and transmit clock (RX_CLK and
TX_CLK) for each port.
Link Status and Activity
The Px_LINK_STATUS signal is an input to the REM switch
from the selected PHY, configured so that the Px_LINK_STATUS
signal is asserted continuously (not blinking) and determines
the link up or link down state.
The Px_ACTIVITY signal is an output from the REM switch
and is typically used to drive an LED to indicate a link is valid.
fido5100/fido5200 Data Sheet
Rev. E | Page 16 of 19
XTAL0 HOS T I NTERFACE
REM
SWITCH
P1_CRS/
P1_RXDV
2
2
2
2
P2_CRS/
P2_RXDV
P1_TXEN
P2_TXEN
P1_TXD0/
P1_TXD1
P2_TXD0/
P2_TXD1
P1_RXD0/
P1_RXD1
P2_RXD0/
P2_RXD1
RMII_CLK
MBS
D00 TO D31
LE
OE
SIZE_32
A02 TO A05
WE
CS
INT0 TO INT2
PORT 1 PORT 2
CLKOUT
RESET
P1_LINK_STATUS
P1_ACTIVITY
TIMER0 TO TIMER3
4 4
P2_LINK_STATUS
P2_ACTIVITY
TIMER4 TO TIMER7
3
4
32
15833-009
Figure 9. REM Switch Configured for RMII Interface
4
4P2_RXD0 T O
P2_RXD3
P2_T XD0 TO
P2_TXD3
P2_RXDV
P2_CRS
P2_COL
P2_TXEN
P1_TXCLK
P1_RXCLK
P2_TXCLK
P2_RXCLK
P1_COL
P1_CRS
P1_RXDV
P1_TXEN
4P1_T XD0 TO
P1_TXD3
4P1_RXD0 T O
P1_RXD3
XTAL0 HOS T I NTERFACE
MBS
D00 TO D31
LE
OE
SIZE_32
A02 TO A05
WE
CS
INT0 TO INT2
PORT 1 PORT 2
CLKOUT
RESET
P1_LINK_STATUS
P1_ACTIVITY
TIMER0 TO TIMER3
4 4
P2_LINK_STATUS
P2_ACTIVITY
TIMER4 TO TIMER7
3
4
32
15833-010
REM
SWITCH
Figure 10. REM Switch Configured for MII Interface
Table 12. Brief Descriptions for MII and RMII Pins
Pin No. Mnemonic Brief Description
G10 RMII_CLK 50 MHz RMII Transmit and Receive Clock for Port 1 and Port 2.
G11 CLKOUT Output Clock.
G12 P2_ACTIVITY Port 2 Activity LED Output Driver.
H10 P2_CRS Port 2 Carrier Sense.
H11 P2_COL Port 2 MII Collision.
H12 P2_LINK_STATUS Port 2 Link Status from PHY.
J1 P1_TXEN Port 1 MII Transmit Enable.
J2 P1_TXCLK Port 1 MII Transmit Clock from PHY.
J11
P2_RXDV
Port 2 Received Data Valid.
J12 P2_RXCLK Port 2 MII Receive Clock from PHY.
K1 P1_TXD0 Transmit Data Output Bit 0 for Port 1 MII, RMII.
K6 P1_RXDV Port I MII Received Data Valid.
K7 P1_LINK_STATUS Port 1 Link Status from PHY.
K8 P2_TXD1 Transmit Data Output Bit 1 for Port 2 MII, RMII.
K10
P2_RXD0
Receive Data Input Bit 0 for Port 2 MII, RMII.
L1 P1_TXD1 Transmit Data Output Bit 1 for Port 1 MII, RMII.
L2 P1_TXD2 Transmit Data Output Bit 2 for Port 1 MII.
L3 P1_RXD0 Receive Data Input Bit 0 for Port 1 MII, RMII.
L4 P1_RXD3 Receive Data Input Bit 3 for Port 1 MII.
L6
P1_CRS
Port 1 MII Carrier Sense.
L7
P1_ACTIVITY
Port 1 Activity LED Output Driver.
L8 P2_TXD0 Transmit Data Output Bit 0 for Port 2 MII, RMII.
L9 P2_TXD3 Transmit Data Output Bit 3 for Port 2 MII.
L11 P2_RXD2 Receive Data Input Bit 2 for Port 2 MII.
M1 P1_TXD3 Transmit Data Output Bit 3 for Port 1 MII.
M3
P1_RXD1
Receive Data Input Bit 1 for Port 1 MII, RMII.
M4
P1_RXD2
Receive Data Input Bit 2 for Port 1 MII.
M6 P1_RXCLK Port 1 Receive Clock from PHY.
M7 P1_COL Port 1 MII Collision.
M8 P2_TXEN Port 2 MII Transmit Enable.
M9 P2_TXD2 Transmit Data Output Bit 2 for Port 2 MII.
M10 P2_TXCLK Port 2 MII Transmit Clock from PHY.
M11 P2_RXD1 Receive Data Input Bit 1 for Port 2 MII, RMII.
M12 P2_RXD3 Receive Data Input Bit 3 for Port 2 MII.
Data Sheet fido5100/fido5200
Rev. E | Page 17 of 19
APPLICATIONS INFORMATION
REAL-TIME ETHERNET
MULTIPROTOCOL (REM)
SWITCH
CONFIGURABL E TO
SUPPORT TOPOLOGY
MANAGEMENT
PRP
DLR
MRPD
RSTP
MRP
HSR
INDUSTRI AL F IELD DEV ICE
OR CONTROLLER APPLICATION
CONFIGURABL E TO
SUPPORT NE TW ORK
MANAGEMENT
DCP
LLDP
AGING
VLAN
DHCP
IGMP
LEARNING
CONFIGURABL E TO
SUPPORT INDUSTRI AL
ETHERNET PROTOCOLS
PROFINET, EtherNet/IP,
Modbus TCP, EtherCAT,
ET HERNE T POW E RLI NK
FAST CYCLE TIME,
FAS T ST ARTUP, AND
LOW JITTER
PriorityChannel
TECHNOLOGY
CPU OR
SoC RAM
APPLICATION
I/O
FLASH
PHY
INDUSTRI AL ETHERNE T
NETWORK
PHY
15833-011
Figure 11. Application for the REM Switch
REM SWITCH HARDWARE
The basic REM switch hardware is identified as the fido5100 or
fido5200. For example, the fido5100 supports the following
protocols:
PROFINET RT and IRT, Class B and Class C with fast
startup (Version 2.3)
EtherNet/IP with and without DLR (supervisor and node,
announce based and beacon based), QuickConnect, CIP
Sync, and CIP Motion
Modbus TCP
POWERLINK
The fido5200 supports the following protocols:
EtherCAT
All protocols defined for the fido5100
The REM switches are PI Net Load Class III capable, and
support media redundancy for planned duplication (MRPD),
high availability seamless redundancy (HSR), and parallel
redundancy protocol (PRP). They also support IEEE 1588
Version 2 for ordinary clock (both peer to peer and end to end
transparent clocks), raw frames, and user datagram protocol
(UDP), as well as discovery configuration protocol (DCP), link
layer discovery protocol (LLDP), dynamic host configuration
protocol (DHCP), rapid spanning tree protocol (RSTP), virtual
local area network (VLAN), and Internet group management
protocol (IGMP) snooping support.
REM Switch Drivers
The REM switch driver for each protocol is provided as
portable C code. The REM Switch Software Driver User Guide
describes the driver for each protocol and its integration into a
host processor. Visit www.analog.com/en/products/industrial-
ethernet.html to download the user guide.
BOARD LAYOUT
The following guidelines provide best practice for board layout
with the REM switch:
Use individual polygons for the power planes for each of
the three supplies. Allow at least 0.2 mm of isolation
between the power planes.
Isolate clock signals from the other traces and make them
as short as possible.
A minimum clearance around the REM switch of 3 mm is
required to facilitate heat dissipation.
DESIGN CONSIDERATIONS
Power
The REM switch require 1.2 V and 3.3 V power supplies. Each
power level requires its own power plane on the PCB.
The REM switch uses 3.3 V LVCMOS logic levels for its I/O.
This I/O requires a 3.3 V (±10%) power supply circuit. Ideally,
this circuit uses a low noise switching power supply. The REM
switch use a 1.2 V10%) supply for the core of the chip. The
core power supply requires its own power plane on the PCB.
Additional best practices include
Use one 0.1 µF bypass capacitor for every 1.2 V power pin.
Use a power supply IC rated to supply at least 100 mA.
Supply 3.3 V power from its own layer on the PCB to the
3.3 V power input pins on the REM switch.
Use one 0.1 µF bypass capacitor for every 3.3 V power pin.
For the 1.2 V analog supply, the signal must be isolated
using a 120 Ω, 500 mA ferrite bead and 10 µF, 1 µF, and
0.1 µF filtering capacitors.
fido5100/fido5200 Data Sheet
Rev. E | Page 18 of 19
Reset
The RESET signal is typically driven by the host microprocessor
that is paired with the REM switch. RESET is an active low signal;
therefore, pull RESET high as power becomes valid.
Physical Layer (PHY)
The REM switch is designed intentionally without PHYs
because of the different requirements on PHY performance.
EtherCAT and PROFINET IRT have much tighter latency and
jitter requirements than standard Ethernet.
Clocking
Most PHYs allow the user to clock the PHY with a crystal
oscillator or a separate clock source when using an MII
interface. It is a requirement for EtherCAT designs (and
recommended for other designs) to use the CLKOUT signal
from the REM switch as the clock source for the PHYs. This
approach minimizes jitter as much as possible.
CLKOUT from the REM switch is a 25 MHz clock signal
generated from the 25 MHz input clock to the REM switch
using the internal PLL of the REM switch. The PHY uses the
25 MHz CLKOUT signal to generate the MII receive (Rx) and
transmit (Tx) clock inputs (P1_RXCLK, P1_TXCLK,
P2_RXCLK, and P2_TXCLK pins) to the REM switch.
For RMII, the REM switch generates the required 50 MHz clock
for the RMII interface. The clock is generated from the 25 MHz
input clock to the REM switch using the internal PLL of the
REM switch.
As with all clock signals, take care when routing these signals to
minimize noise and loading effects.
Management Data Input/Output (MDIO)
All PHYs require configuration and can provide some type of
status information in return. Each PHY is different, but most
PHYs use a management data input/output (MDIO) interface to
communicate this configuration and status. The REM switch does
not provide separate communication to the PHYs. The host
processor paired with the REM switch is required to provide
this PHY communication.
Contact Analog Devices, Inc., technical support regarding
questions about PHY settings or the MDIO interface.
Data Sheet fido5100/fido5200
Rev. E | Page 19 of 19
OUTLINE DIMENSIONS
0.80
BSC
PKG-000000
08-17-2017-A
BOTTOM VIEW
TOP VIEW
SIDE VIEW
DETAIL A
10.10
10.00 SQ
9.90
1.24 M AX
8.80 SQ
REF
A1 BALL
CORNER
A1 BALL
PAD CORNE R
A
B
C
D
E
F
G
910 81112 7 56 4 23 1
H
J
K
L
M
0.91
0.86
0.81
0.45
0.40
0.35
COPLANARITY
0.12
BALL DIAM E TER
DETAIL A
0.35
0.30
0.25
COM P LIANT W IT H JE DE C STANDARDS MO- 275- E E AB- 1
SEATING
PLANE
Figure 12. 144-Ball Chip Scale Package Ball Grid Array [CSP_BGA]
(BC-144-12)
Dimensions shown in millimeters
ORDERING GUIDE
Model1 Temperature Range Package Description Package Option
FIDO5100BBCZ −40°C to +85°C 144-Ball Chip Scale Package Ball Grid Array [CSP_BGA] BC-144-12
FIDO5100CBCZ
−40°C to +105°C
144-Ball Chip Scale Package Ball Grid Array [CSP_BGA]
BC-144-12
FIDO5110BBCZ −40°C to +85°C 144-Ball Chip Scale Package Ball Grid Array [CSP_BGA] BC-144-12
FIDO5110CBCZ −40°C to +105°C 144-Ball Chip Scale Package Ball Grid Array [CSP_BGA] BC-144-12
FIDO5200BBCZ −40°C to +85°C 144-Ball Chip Scale Package Ball Grid Array [CSP_BGA] BC-144-12
FIDO5200CBCZ −40°C to +105°C 144-Ball Chip Scale Package Ball Grid Array [CSP_BGA] BC-144-12
FIDO5210BBCZ −40°C to +85°C 144-Ball Chip Scale Package Ball Grid Array [CSP_BGA] BC-144-12
FIDO5210CBCZ −40°C to +105°C 144-Ball Chip Scale Package Ball Grid Array [CSP_BGA] BC-144-12
RAPID-NIEK-V0004 Evaluation Kit
1 Z = RoHS Compliant Part.
©2017–2020 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D15833-3/20(E)