© 2008 Microchip Technology Inc. DS80336D-page 1
PIC18F2458/2553/4458/4553
The PIC18F2458/2553/4458/4553 Rev. B6 parts you
have received conform functionally to the Device Data
Sheet (DS39887B), except for the anomalies
described below. Any Data Sheet Clarification issues
related to the PIC18F2458/2553/4458/4553 will be
reported in a separate D ata Sheet errat a. Please chec k
the Microchip web site for any existing issues.
The following silicon errata apply only to
PIC18F2458/2553/4458/4553 devices with these
Device/Revision IDs:
All of the issues listed here will be addressed in future
revisions of the PIC18F2458/2553/4458/4553 silicon.
1. Module: MSSP
In SPI Slave mode with slave select enabled
(SSPM<3:0> = 0100), the minimum time between
the falling edge of the SS pin and first SCK edge
is greater than specified in parameter 70
in Table 28-17 and Table 28-18 of the
PIC18F2455/2550/4455/4550 Data Sheet”
(DS39632). The updated specification is shown in
bold in Table 1.
The minimum time between SS pin low and an
SSPBUF write is also 3 TCY. If the falling edge of
the SS pin occurs greater than 3 TCY, before the
first SCK edge or loading SSPBUF, the peripheral
will function correctly. Also, if SSPBUF is written
prior to the SS pin going low, the peripheral will
function correctly.
Work around
None.
Date Codes that pertain to this issue:
All engineering and production devices.
TABLE 1: EXAMPLE SPI MODE REQUIREMENTS (SLAVE MODE TIMING)
Note: The “PIC18F2458/2553/4458/4553 Data
Sheet” is supplemented by the
“PIC18 F2 45 5/2 55 0/ 44 55 /45 50 D ata Shee t”
(DS39632). PIC18F2458/2553/4458/4553
features and specifications that are
shared with the PIC18F2455/2550/4455/
4550 devices are documented in
the “PIC18F2455/2550/4455/4550 Data
Sheet”.
Part Number Device ID Revision ID
PIC18F2458 0010 1010 011 0 0110
PIC18F2553 0010 1010 010 0 0110
PIC18F4458 0010 1010 001 0 0110
PIC18F4553 0010 1010 000 0 0110
The Devic e IDs (DEVID1 an d DEVID2 ) are located at
addresses 3FFFFEh:3FFFFFh in the device’s
configuration space. They are shown in binary in the
format “DEVID2 DEVID1”.
Param
No. Symbol Characteristic Min Max Units Conditions
70 TSSL2SCH,
TSSL2SCLSS to SCK or SCK Input 3TCY —ns
PIC18F2458/2553/4458/4553 Rev. B6 Silicon Errata
PIC18F2458/2553/4458/4553
DS80336D-page 2 © 2008 Microchip Technology Inc.
2. Module: MSSP
With MSSP in SPI Master mode, FOSC/64 or
Timer2/2 clock rate and CKE = 0, a write collis ion
may occur if SSPBUF is loaded immediately after
the transfer is complete. A delay may be required
after the MSSP Interrupt Flag bit, SSPIF, is set or
the Buffer Full bit, BF, is set and before writing
SSPBUF. If the delay is insuf fi cie ntl y short, a write
collision may occur as indicated by the WCOL bit
being set .
Work around
Add a software delay of one SCK period after
detecting the completed transfer and prior to
updating the SSPBUF contents. Verify the WCOL
bit is clear after writing SSPBUF. If the WCOL is
set, clear the bit in software and rewrite the
SSPBUF register.
Date Codes that pertain to this issue:
All engineering and production devices.
3. Module: ECCP (PWM Mode)
When configured for half-bridge operation with
dead band (CCPxCON<7:6> = 10), the PWM
output may be corrupted for certain values of the
PWM duty cycle. This can occur when these
additional criteria are also met:
A non-zero dead-band delay is specified
(PDC6:PDC0 > 0)
The duty cycle has a value of 0 through 3, or
4n + 3 (n 1)
Work around
None.
Date Codes that pertain to this issue:
All engineering and production devices.
4. Module: Electrical Characteristics (BOR)
Certain operating conditions can move the effec-
tive Brown-out Reset (BOR) threshold outside of
the range specifie d in th e ele ctri ca l ch arac teri st ic s
of the device data sheet (parameter D005).
The BOR t hreshold has been observed to increase
with high device op erating frequencies, some t able
read operations and heavy loading on the USB
volt age regul ato r. When all o f these co nd itions a re
present, BOR has been observed with VDD
20 percent higher than the VBOR value specified
for a given <BORV1:BORV0> setting.
The BOR threshold may decrease under other
conditi ons, such as during Sleep , where it may not
occur until VDD is 120 mV below the specified
minimums.
Work around
None.
Date Codes that pertain to this issue:
All engineering and production devices.
5. Module: MSSP (SPI Slave)
If configured in SPI Slave mode, the MSSP may not
successfully recognize data packets generated by an
external master processor. This applies to all SPI
Slave modes (CKE/CKP = 1 or 0), whether or not
slave select is enabled (SSPM3:SSPM0 = 010x).
Work around
Insert a series resistor between the SPI master
Serial Data Out (SDO) and the corresponding SPI
slave Serial Data In (SDI) input line of the
microc ont roll er. The required val ue for the res ist or
varies wit h the applicatio n system’ s characteri stics
and the process variations between the
microcontrollers.
Experimentation and thorough testing are
encouraged.
Date Codes that pertain to this issue:
All engineering and production devices.
© 2008 Microchip Technology Inc. DS80336D-page 3
PIC18F2458/2553/4458/4553
6. Module: MSSP
If the application firmware is expecting to receive
valid data – in either SPI slave or Master mode –
the firmware must read from the SSPBUF regis ter
before writing the next byte to transmit to SSPBUF.
If the firmware does not read from SSPBUF, the
BF bit (SSP STAT<0>) can s till be se t fr om the p re-
vious transaction. If the BF bit is set, the incoming
data byte is blocked from transferring from the
SSPSR shif t register to the SSPBUF regis ter . If the
firmware then reads from SSPBUF, the data read
will not matc h the data mo st recen tly recei ved on
the SDI pin.
In the earlier silicon revision (B5), incoming data
bytes received on the SDI pin are always trans-
ferred from SSPSR to SSPBUF, regardless of the
state of the BF bit.
Work around
If the firmware expects to receive valid data,
always clear the BF bit by reading from SSPBUF
prior to writing to SSPBUF, even when the current
data in SSPBUF is not important. Sample work-
around code, suitable for all silicon revisions, is
given in Example 1 (Assembly language) and
Example 2 (C language).
Date Codes that pertain to this issue:
All engineering and production devices.
EXAMPLE 1: SAMPLE ASSEMBLY CODE FOR TR ANSFERRING SPI DAT A
EXAMPLE 2: SAMPLE C CODE FOR T R ANSFERRING SPI DAT A
WriteSPI:
BCF PIR1, SSPIF
MOVF SSPBUF, w ;Perform read, even if the data in SSPBUF is not important
MOVLW 0xA5 ;In this example, let’s send “0xA5” to the other SPI device.
MOVWF SSPBUF
WaitXmitComplete:
BTFSS PIR1, SSPIF
BRA WaitXmitComplete
MOVF SSPBUF, w ;The data received should be valid.
unsigned char WriteSPI(unsigned char ByteToSend)
{unsigned char TempVariable;
PIR1bits.SSPIF = 0;
TempVariable = SSPBUF; // Reads from SSPBUF, ensures BF bit is clear before
SSPBUF = ByteToSend; // sending the next byte.
while(!PIR1bits.SSPIF); // Wait until the transmission is complete.
return SSPBUF; // The data received should be valid.
}
PIC18F2458/2553/4458/4553
DS80336D-page 4 © 2008 Microchip Technology Inc.
REVISION HISTORY
Rev A Document (8/2007)
Initial relea se of this do cument. Silicon i ssues 1-2 (MSSP)
and 3 (ECCP – PWM Mode).
Rev B Document (3/2008)
Added silicon issue 4 Electrical Characteristics (BOR).
Rev C Document (4/2008)
Added si licon iss ue 5 ( MSSP – SPI S lave) .
Rev D Document (5/2008)
Added sili con i ss ue 6 ( MSSP) .
© 2008 Microchip Technology Inc. DS80336D-page 5
Information contained in this publication regarding device
applications and t he lik e is provid ed only f or yo ur con ve nience
and may be supe rseded by u pdates. I t is y o u r r es ponsibility to
ensure that your application meets with your specifications.
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Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,
PICST ART, PRO MA TE, rfPIC and SmartShunt are registered
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FilterLab, Linear Active Thermistor, MXDEV, MXLAB,
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Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard,
dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, In-Circuit Serial
Prog ra m ming , IC SP, IC EPI C, M i n d i, MiWi , M PA S M, MP L AB
Certified logo, MPLIB, MPLINK, mTouch, PICkit, PICDEM,
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All other trademarks mentioned herein are property of their
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© 2008, Microchip Technology Incorporat ed, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Note the following details of the code protection feature on Microchip devices:
Microchip products meet the specification contained in their particular Microchip Data Sheet.
Microchip believes that it s family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.
Code protection is c onstantly evolving. We a t Microc hip are co m mitted to continuously improving the code prot ect ion featur es of our
products. Attempts to break Microchip’ s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Microchip received ISO/TS-16949:2002 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperiph erals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
DS80336D-page 6 © 2008 Microchip Technology Inc.
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