Application Specification .050 Series Standard Edge 114-13148 Peripheral Computer Interconnect (PCI) Surface Mount Connector Assemblies NOTE i 07 NOV 07 Rev A All numerical values are in metric units [with U.S. customary units in brackets]. Dimensions are in millimeters [and inches]. Unless otherwise specified, dimensions have a tolerance of +0.13 [+.005] and angles have a tolerance of +2 . Figures and illustrations are for identification only and are not drawn to scale. _ 1. INTRODUCTION This specification covers the requirements for application of .050 Series Standard Edge PCI Surface Mount Connector Assemblies for printed circuit (pc) board applications. These connectors are available with a double row of 60 to 92 positions with contact spacing on 1.27 mm [.050 in.] centerlines. The connector consists of a housing, surface mount contacts, and hold-downs. The housing features standoffs that allow easy pc board cleaning after soldering, polarizing alignment webs, and a daughter board entry slot. The polarization alignment webs are molded into the housing to ensure polarization with a compatible daughter board when inserted into the daughter board entry slot. The connectors are supplied in tray form for manual or robotic equipment placement. When corresponding with Tyco Electronics Personnel, use the terminology provided in this specification to facilitate your inquiries for information. Basic terms and features of this product are provided in Figure 1. Polarizing Alignment Web (61st and 62nd Contact Positions) Daughter Board Entry Slot Polarizing Alignment Web (11th and 12th Contact Positions) Housing Surface Mount Contact Standoff Hold-Down (4 Places) (3 Places) Figure 1 2. REFERENCE MATERIAL 2.1. Revision Summary S Updated document to corporate requirements S Changed hole dimensions in Figure 2 S Deleted Figure 9 and renumbered E 2007 Tyco Electronics Corporation, Harrisburg, PA All International Rights Reserved TOOLING ASSISTANCE CENTER 1-800-722-1111 This controlled document is subject to change. PRODUCT INFORMATION 1-800-522-6752 For latest revision and Regional Customer Service, TE logo and Tyco Electronics are trademarks. *Trademark. Other products, logos, and company names used are the property of their respective owners. visit our website at www.tycoelectronics.com 1 of 8 LOC B .050 Series Standard Edge PCI Connector Assemblies 114-13148 2.2. Customer Assistance Reference Product Base Part Number 145246 and Product Code 2282 are representative of .050 Series Standard Edge PCI Surface Mount Connector Assemblies. Use of these numbers will identify the product line and expedite your inquiries through a service network established to help you obtain product and tooling information. Such information can be obtained through a local Tyco Electronics Representative or, after purchase, by calling PRODUCT INFORMATION at the number at the bottom of page 1. 2.3. Drawings Customer Drawings for product part numbers are available from the service network. If there is a conflict between the information contained in the Customer Drawings and this specification or with any other technical documentation supplied, call PRODUCT INFORMATION at the number at the bottom of page 1. 2.4. Specifications Product Specification 108-14034 provides product performance and test information. 2.5. Instructional Material Instruction Sheets (408-series) provide product assembly instructions or tooling setup and operation procedures and Customer Manuals (409-series) provide machine setup and operation procedures. There are no documents available which pertain to this product. 2.6. Manuals Manual 402-40 can be used as a guide to soldering. This manual provides information on various flux types and characteristics with the commercial designation and flux removal procedures. A checklist is included in the manual as a guide for information on soldering problems. 2.7. Standards and Publications Standards and publications developed by the International Electrotechnical Commission (IEC), Institute of Electrical and Electronics Engineers (IEEE), and Electronic Industries Alliance (EIA) provide industry test and performance requirements. Documents available which pertain to this product are: IEC 60512-6, "Electromechanical Components for Electronic Equipment; Basic Testing Procedures and Measuring Methods Part 6: Climatic Test and Soldering Tests" IEEE 1386, "Common Mezzanine Card (CMC) Family" EIA-364-52, "Solderability of Contact Terminations Test Procedure for Electrical Connectors and Sockets" EIA-700AAAB, "Detail Specification for 1.0 Millimeter, Two-Part Connectors for Use with Parallel Printed Boards" 3. REQUIREMENTS 3.1. Safety Do not stack product shipping containers so high that the containers buckle or deform. 3.2. Material The housings are made of high-temperature thermoplastic polycyclohexyl dimethylene terephthalate (PCT), UL 94V-0. The contacts are made of phosphor bronze; the mating interface is underplated with nickel and plated with gold and the solder tine is plated with matte tin-lead. The hold-downs are made of brass plated with matte tin-lead. 3.3. Storage A. Ultraviolet Light Prolonged exposure to ultraviolet light may deteriorate the chemical composition used in the connector material. B. Shelf Life The connectors should remain in the shipping containers until ready for use to prevent deformation to the contacts. The connectors should be used on a first in, first out basis to avoid storage contamination that could adversely affect performance. 2 of 8 Tyco Electronics Corporation Rev A .050 Series Standard Edge PCI Connector Assemblies 114-13148 C. Chemical Exposure Do not store connectors near any chemical listed below as they may cause stress corrosion cracking in the contacts. Alkalies Amines Ammonia Carbonates Citrates Nitrites Phosphates Citrates Sulfur Nitrites Sulfur Compounds Tartrates 3.4. PC Board (Mother Board and Daughter Board) A. Material and Thickness The pc board material shall be glass epoxy (FR-4 or G-10). There is no required thickness for the mother board. The mother board will accept a daughter board with a maximum thickness of 1.78 mm [.070 in.] (including circuit pads). NOTE Contact PRODUCT INFORMATION at the number listed at the bottom of page 1 for suitability of other board materials. i B. Tolerance Maximum allowable bow of the mother board shall be 0.10 mm [.004 in.] over the length of the connector. C. Holes The holes in the mother board for the connector hold-downs must be drilled through to the dimensions given in Figure 2. D. Layout The mother board layout must be designed using the dimensions provided on the customer drawing for the specific connector. Reference sample of the recommended pc board layout is shown in Figure 2. The daughter board configuration must be in accordance with the dimensions and tolerances provided on the customer drawing for the specific connector. A slot must be cut at the 11th and 12th and 61st and 62nd contact positions to align with the polarizing alignment webs of the connector. A typical recommended daughter board configuration is shown in Figure 2. Sample Recommended Mother Board Layout (Connector Side) 0.2.67+0.076 [.105+.003] 0.203 [.008] G 0.762+.051 [.030+.002] F 0.203 [.008] 0.051 [.002] Typ 4.318 [.170] Typ 2.44+0.051 [.096+.002] -G- F G 2.44+0.051 [.096+.002] 0.152 [.006] 1.905 [.075] F G 2.44+0.051 [.096+.002] -G- 3.81 [.150] 2 Places 10 Spaces at 1.27 [.050] 48 Spaces at 1.27 [.050] 31 Spaces at 1.27 [.050] 64.77+0.076 [2.550+.003] 107.95 +0.076 [4.250+.003] Figure 2 (cont'd) Rev A Tyco Electronics Corporation 3 of 8 .050 Series Standard Edge PCI Connector Assemblies 114-13148 Typical Recommended Daughter Board Configuration 15.49 [.610] 106.93 [4.210] 1.905 [.075] 64.77 [2.550] 7.87 [.310] Min 4 Places 1.905 [.075] A -H- 1.905 [.075] 6.223 [.245] Min R 2 Places A 10 Spaces at 1.27 [.050] 48 Spaces at 1.27 [.050] 31 Spaces at 1.27 [.050] 1.905+0.05 [.075+.002] -J- 1.905+0.05 [.075+.002] 0.254 [.010] 20_ 2 Places H J 0.914+.051 [.036+.002] Section A-A 1.575+0.178 [.062+.007] -K- 0.254 [.010] 0.051 [.002] H J H 0.381 [.015] 0.102 [.004] K Figure 2 (end) 3.5. Connector Placement These connectors can be placed onto the pc board manually or by robotic equipment. Connectors should be taken from the tray and placed directly on the pc board. It is NOT recommended emptying connectors from the tray into piles or in bowl feeders prior to placement. CAUTION Connectors should be handled only by the housing to avoid deformation, contamination, or damage to the contact solder tines. ! 3.6. Connector Seating All hold-downs must align with their intended pc board holes, then inserted into the holes simultaneously. The hold-downs will assist in alignment of the contact solder tines with their matching pads. It is imperative that the solder tines are sufficiently pressed into the solder paste. Optimally, the contact solder tines should be centered on the pads; however, slight misalignment is permissible as long as the entire solder tine is on the pad as shown in Figure 3. PC Board Contact Solder Tine Centered on Circuit Pad is Optimal Contact Solder Tine Hanging Off of Pad is Not Permissible Slight Misalignment of Contact Solder Tine is Permissible Figure 3 4 of 8 Tyco Electronics Corporation Rev A .050 Series Standard Edge PCI Connector Assemblies 114-13148 3.7. Functional Tolerances The seated connector must not exceed the tolerances given in Figure 4. 0.13 [.005] (Max) Standoff _ _ 90 +3 (4 Places) to PC Board _ _ 90 +3 Figure 4 3.8. Connector Spacing Care must be used to avoid interference between adjacent connectors and other components. The minimum allowable distance between connectors to ensure proper insertion of the daughter board is shown in Figure 5. 3.3 [.130] Min Allowable Distance Figure 5 3.9. Soldering A. Pads The pc board circuit pads must be solderable in accordance with Test 12a of IEC 60512-6. B. Solder Paste Characteristics 1. Alloy type shall be 63 Sn/37 Pb or 60 Sn/40 Pb. 2. Flux incorporated in the paste shall be rosin, mildly active (RMA) type. C. Solder Mask Solder mask is recommended to minimize solder bridging between circuit pads. If a trace is run between adjacent pads on the solder side of the pc board, a solder mask MUST be applied over the trace to prevent bridging and wicking of solder away from the contact solder tines. Additionally, there should be solder mask covering any traces in the area of the hold-down solder deposit. Liquid photo imageable or dry film solder masks in step with modern processing techniques are recommended. The solder mask must not exceed the height of the circuit pad by more than 0.05 mm [.002 in.]. CAUTION Since the connector may rest on top of the solder mask, an excessively high mask would allow too much space between the lead and the pad for a good solder joint. A solder joint under these conditions would be weak, and would ! not provide long-term performance for the connector. D. Stencil (or Screen) Recommended stencil thickness is 0.15 mm [.006 in.]. The stencil aperture is determined by the circuit pad size and stencil thickness. It may be any shape as long as it prevents solder bridging from one pad to another. Generally, the thinner stencil will need a larger aperture to maintain the given volume of solder paste. Rev A Tyco Electronics Corporation 5 of 8 .050 Series Standard Edge PCI Connector Assemblies 114-13148 E. Solder Volume Minimum solder volume (V) (before curing) for each circuit pad must be calculated by multiplying the pad length (L) by the pad width (W) by the stencil thickness (T): 2.67 CAUTION 0.76 0.15 = 0.304 mm3 [.105 .030 .006 = .0000189 in.3] volume per circuit pad Using solder volume over that which is recommended could cause excess wicking on the contact solder tine, resulting in a reduction of solder tine compliance or solder joint failure. ! F. Process The connectors should be soldered using wave, non-focused infrared reflow (IR), or equivalent soldering technique. Manual 402-40 contains soldering guidelines. The reflow temperature and time is specified in Figure 6. SOLDERING PROCESS TEMPERATURE (Max) TIME IR 220_C [428_F] 3 Minutes Figure 6 G. Cleaning After soldering, removal of fluxes, residues, and activators is necessary. Consult with the supplier of the solder and flux for recommended cleaning solvents. Cleaners must be free of dissolved flux and other contaminants. It is recommended cleaning with the pc board on its edge. Common cleaning solvents with times and temperatures that will not affect these connectors is specified in Figure 7. CAUTION Even when using no clean" solder paste, it is imperative that the contact interface be kept clean of flux and residue, since it acts as an insulator. Flux may migrate under certain conditions with elevated temperatures and, therefore, ! cleaning is necessary. CLEANER TIME TEMPERATURE TYPE (Minutes) (Maximum) Aqueous 1 132_C [270_F] Isopropyl Alcohol Solvent 5 100_C [212_F] KESTER 5778 Aqueous 5 100_C [212_F] KESTER 5779 Aqueous 5 100_C [212_F] LONCOTERGE 520 Aqueous 5 100_C [212_F] LONCOTERGE 530 Aqueous 5 100_C [212_F] NAME ALPHA 2110 Figure 7 DANGER Consideration must be given to toxicity and other safety requirements recommended by the solvent manufacturer. Refer to the manufacturer's Material Safety Data Sheet (MSDS) for characteristics and handling of cleaners. Trichloroethylene and Methylene Chloride is not recommended because of harmful occupational and environmental effects. Both are carcinogenic (cancer-causing). NOTE If you have a particular cleaning solvent that is not listed, contact PRODUCT INFORMATION at the number at the bottom of page 1. i H. Drying When drying cleaned assemblies and pc boards, temperature limitations must not be exceeded: -55_ to 105_C [-68_ to 221_F]. Excessive temperatures may cause housing degradation. 3.10. Checking Installed Connector The installed connector must have solder fillets evenly formed around each contact solder tine. All solder joints should conform to those specified in Workmanship Specification 101-21 and all other requirements specified in this document. 6 of 8 Tyco Electronics Corporation Rev A .050 Series Standard Edge PCI Connector Assemblies 114-13148 3.11. Polarization A polarizing pattern for placing the connector on the pc board is provided by the number of solder tines in each cluster of solder tines and the hold-downs. Polarization for the mating daughter board is provided by the polarization alignment webs of the connector which match the slots of the daughter board. 3.12. Installing Daughter Board (Figure 8) The daughter board must be oriented with the slots aligned with the polarizing alignment webs of the connector. The side-to-side and front-to-back angles must be visually aligned with the connector, then the daughter board must be pushed straight into the daughter board entry slot of the connector until bottomed. This method requires less insertion force and there will be less chance of damage to components. 3.13. Removing Daughter Board The daughter board must be gripped firmly and pulled straight out of the connector. The daughter board must not be shifted side-to-side or front-to-back as excessive angles could damage the contacts, housing, or pc boards. This method protects the connector from damage and will ease extraction of the daughter board. 3.14. Connector Removal The connectors can be removed from the pc board by standard de-soldering methods. Connectors MUST NOT be re-used after removal from the pc board. Installing Daughter Board Slot (2 Places) Daughter Board Polarizing Alignment Web (2 Places) Connector PC Board Top View of Connector Daughter Board Entry Slot PC Board Figure 8 3.15. Repair These connectors are not repairable. Damaged or defective connectors MUST NOT be used. 4. QUALIFICATION The .050 Series Standard Edge PCI Surface Mount Connector Assemblies are Listed by Underwriters Laboratories Inc. (UL) in File E 28476 and Certified by CSA International in File LR 7189. 5. TOOLING No tooling is required for manual placement of the connectors. For robotic equipment placement, a pc board support must be used to prevent bowing of the pc board during the placement of connectors on the board. It should have flat surfaces with holes or a channel large enough and deep enough to receive the connector hold-downs. The robotic equipment must have a true position accuracy tolerance of 0.05 mm [.002 in.]. This includes gripper and fixture tolerances as well as equipment repeatability. It must use the socket datum surfaces detailed on the customer drawing to ensure reliable placement. Rev A Tyco Electronics Corporation 7 of 8 .050 Series Standard Edge PCI Connector Assemblies 114-13148 6. VISUAL AID Figure 9 shows a typical application of .050 Series Standard Edge PCI Surface Mount Connector Assemblies. This illustration should be used by production personnel to ensure a correctly applied product. Applications which DO NOT appear correct should be inspected using the information in the preceding pages of this specification and in the instructional material shipped with the product or tooling. DAUGHTER BOARD MUST BE BOTTOMED IN DAUGHTER BOARD ENTRY SLOT OF CONNECTOR THERE MUST BE NO DAMAGE TO DAUGHTER BOARD THERE MUST BE NO DAMAGE TO HOUSING III III III III III III SOLDER FILLETS MUST BE EVENLY FORMED AROUND EACH CONTACT SOLDER TINE STANDOFFS MUST BE SEATED ON PC BOARD CONTACT SOLDER TINES MUST BE CENTERED OR SLIGHTLY MISALIGNED ON CIRCUIT PAD FIGURE 9. VISUAL AID 8 of 8 Tyco Electronics Corporation Rev A