Application Specification
.050 Series Standard Edge
Peripheral Computer Interconnect (PCI) 114-13148
LOC B
1
of 8
E
2007 Tyco Electronics Corporation, Harrisburg, PA
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*Trademark. Other products, logos, and company names used are the property of their respective owners.
TOOLING ASSISTANCE CENTER 1-800-722-1111
PRODUCT INFORMATION 1-800-522-6752 This controlled document is subject to change.
For latest revision and Regional Customer Service,
visit our website at
www.tycoelectronics.com
Surface Mount Connector Assemblies
07 NOV 07 Rev A
All numerical values are in metric units [with U.S. customary units in brackets]. Dimensions are in millimeters [and
inches]. Unless otherwise specified, dimensions have a tolerance of +0.13 [+.005] and angles have a tolerance of +2
_
.
Figures and illustrations are for identification only and are not drawn to scale.
1. INTRODUCTION
This specification covers the requirements for application of .050 Series Standard Edge PCI Surface Mount
Connector Assemblies for printed circuit (pc) board applications. These connectors are available with a double
row of 60 to 92 positions with contact spacing on 1.27 mm [.050 in.] centerlines.
The connector consists of a housing, surface mount contacts, and hold–downs. The housing features standoffs
that allow easy pc board cleaning after soldering, polarizing alignment webs, and a daughter board entry slot.
The polarization alignment webs are molded into the housing to ensure polarization with a compatible daughter
board when inserted into the daughter board entry slot.
The connectors are supplied in tray form for manual or robotic equipment placement.
When corresponding with Tyco Electronics Personnel, use the terminology provided in this specification to
facilitate your inquiries for information. Basic terms and features of this product are provided in Figure 1.
Figure 1
Polarizing Alignment Web
(11th and 12th Contact Positions)
Daughter Board
Entry Slot
Standoff
(4 Places)
Housing
Hold-Down
(3 Places)
Surface Mount
Contact
Polarizing Alignment Web
(61st and 62nd Contact Positions)
2. REFERENCE MATERIAL
2.1. Revision Summary
S
Updated document to corporate requirements
S
Changed hole dimensions in Figure 2
S
Deleted Figure 9 and renumbered
NOTE
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.050 Series Standard Edge PCI Connector Assemblies 114-13148
Rev
A2
of 8 Tyco Electronics Corporation
2.2. Customer Assistance
Reference Product Base Part Number 145246 and Product Code 2282 are representative of .050 Series
Standard Edge PCI Surface Mount Connector Assemblies. Use of these numbers will identify the product line
and expedite your inquiries through a service network established to help you obtain product and tooling
information. Such information can be obtained through a local Tyco Electronics Representative or, after
purchase, by calling PRODUCT INFORMATION at the number at the bottom of page 1.
2.3. Drawings
Customer Drawings for product part numbers are available from the service network. If there is a conflict
between the information contained in the Customer Drawings and this specification or with any other technical
documentation supplied, call PRODUCT INFORMATION at the number at the bottom of page 1.
2.4. Specifications
Product Specification 108–14034 provides product performance and test information.
2.5. Instructional Material
Instruction Sheets (408–series) provide product assembly instructions or tooling setup and operation
procedures and Customer Manuals (409–series) provide machine setup and operation procedures. There are
no documents available which pertain to this product.
2.6. Manuals
Manual 402–40 can be used as a guide to soldering. This manual provides information on various flux types
and characteristics with the commercial designation and flux removal procedures. A checklist is included in the
manual as a guide for information on soldering problems.
2.7. Standards and Publications
Standards and publications developed by the International Electrotechnical Commission (IEC), Institute of
Electrical and Electronics Engineers (IEEE), and Electronic Industries Alliance (EIA) provide industry test and
performance requirements. Documents available which pertain to this product are:
IEC 60512–6, “Electromechanical Components for Electronic Equipment; Basic Testing Procedures and
Measuring Methods Part 6: Climatic Test and Soldering Tests”
IEEE 1386, “Common Mezzanine Card (CMC) Family”
EIA–364–52, “Solderability of Contact Terminations Test Procedure for Electrical Connectors and Sockets”
EIA–700AAAB, “Detail Specification for 1.0 Millimeter, Two–Part Connectors for Use with Parallel Printed
Boards”
3. REQUIREMENTS
3.1. Safety
Do not stack product shipping containers so high that the containers buckle or deform.
3.2. Material
The housings are made of high–temperature thermoplastic polycyclohexyl dimethylene terephthalate (PCT),
UL 94V–0. The contacts are made of phosphor bronze; the mating interface is underplated with nickel and
plated with gold and the solder tine is plated with matte tin–lead. The hold–downs are made of brass plated
with matte tin–lead.
3.3. Storage
A. Ultraviolet Light
Prolonged exposure to ultraviolet light may deteriorate the chemical composition used in the connector
material.
B. Shelf Life
The connectors should remain in the shipping containers until ready for use to prevent deformation to the
contacts. The connectors should be used on a first in, first out basis to avoid storage contamination that
could adversely affect performance.
.050 Series Standard Edge PCI Connector Assemblies 114-13148
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Tyco Electronics Corporation
C. Chemical Exposure
Do not store connectors near any chemical listed below as they may cause stress corrosion cracking in
the contacts.
Alkalies Ammonia Citrates Phosphates Citrates Sulfur Compounds
Amines Carbonates Nitrites Sulfur Nitrites Tartrates
3.4. PC Board (Mother Board and Daughter Board)
A. Material and Thickness
The pc board material shall be glass epoxy (FR–4 or G–10). There is no required thickness for the mother
board. The mother board will accept a daughter board with a maximum thickness of 1.78 mm [.070 in.]
(including circuit pads).
Contact PRODUCT INFORMATION at the number listed at the bottom of page 1 for suitability of other board
materials.
B. Tolerance
Maximum allowable bow of the mother board shall be 0.10 mm [.004 in.] over the length of the connector.
C. Holes
The holes in the mother board for the connector hold–downs must be drilled through to the dimensions
given in Figure 2.
D. Layout
The mother board layout must be designed using the dimensions provided on the customer drawing for
the specific connector. Reference
sample
of the recommended pc board layout is shown in Figure 2.
The daughter board configuration must be in accordance with the dimensions and tolerances provided on
the customer drawing for the specific connector. A slot must be cut at the 11th and 12th and 61st and
62nd contact positions to align with the polarizing alignment webs of the connector. A
typical
recommended daughter board configuration is shown in Figure 2.
Figure 2 (cont’d)
Sample Recommended Mother Board Layout
(Connector Side)
107.95 +0.076 [4.250+.003]
64.77+0.076 [2.550+.003]
3.81 [.150]
2 Places
1.905 [.075]
48 Spaces at 31 Spaces at
10 Spaces at
1.27 [.050]
4.318
[.170]
Typ
1.27 [.050] 1.27 [.050]
2.44+0.051
[.096+.002]
-G-
2.44+0.051 [.096+.002]
0.152 [.006]
0.203 [.008]
0.762+.051 [.030+.002]
0.051 [.002]
0.2.67+0.076 [.105+.003]
0.203 [.008]
Typ
2.44+0.051
[.096+.002]
-G-
FG
FG
FG
NOTE
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.050 Series Standard Edge PCI Connector Assemblies 114-13148
Rev
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of 8 Tyco Electronics Corporation
Typical Recommended Daughter Board Configuration
7.87 [.310] Min
4 Places
-H-
6.223
[.245]
Min
1.905 [.075]
R 2 Places
106.93 [4.210]
64.77 [2.550]
15.49
[.610]
1.905 [.075]
1.905 [.075]
10 Spaces at
1.27 [.050] 1.905+0.05 [.075+.002] -J-
48 Spaces at 1.27 [.050]
1.905+0.05 [.075+.002]
0.254 [.010]
31 Spaces at 1.27 [.050]
0.254 [.010]
0.914+.051 [.036+.002]
0.051 [.002]
Section A-A
20
_
2 Places
0.381 [.015]
0.102 [.004]
1.575+0.178 [.062+.007] -K-
A
A
K
HJ
H
HJ
Figure 2 (end)
3.5. Connector Placement
These connectors can be placed onto the pc board manually or by robotic equipment. Connectors should be
taken from the tray and placed directly on the pc board. It is NOT recommended emptying connectors from the
tray into piles or in bowl feeders prior to placement.
Connectors should be handled only by the housing to avoid deformation, contamination, or damage to the contact
solder tines.
3.6. Connector Seating
All hold–downs must align with their intended pc board holes, then inserted into the holes simultaneously. The
hold–downs will assist in alignment of the contact solder tines with their matching pads. It is imperative that the
solder tines are sufficiently pressed into the solder paste. Optimally, the contact solder tines should be
centered on the pads; however, slight misalignment is permissible as long as the entire solder tine is on the
pad as shown in Figure 3.
Figure 3
PC Board
Contact Solder Tine Centered
on Circuit Pad is Optimal
Contact Solder Tine Hanging
Off of Pad is Not Permissible
Slight Misalignment of Contact
Solder Tine is Permissible
CAUTION
!
.050 Series Standard Edge PCI Connector Assemblies 114-13148
Rev
A 5
of 8
Tyco Electronics Corporation
3.7. Functional Tolerances
The seated connector must not exceed the tolerances given in Figure 4.
Figure 4
0.13 [.005] (Max) Standoff
(4 Places) to PC Board 90
_
+3
_
90
_
+3
_
3.8. Connector Spacing
Care must be used to avoid interference between adjacent connectors and other components. The minimum
allowable distance between connectors to ensure proper insertion of the daughter board is shown in Figure 5.
Figure 5
3.3 [.130] Min Allowable Distance
3.9. Soldering
A. Pads
The pc board circuit pads must be solderable in accordance with Test 12a of IEC 60512–6.
B. Solder Paste Characteristics
1. Alloy type shall be 63 Sn/37 Pb or 60 Sn/40 Pb.
2. Flux incorporated in the paste shall be rosin, mildly active (RMA) type.
C. Solder Mask
Solder mask is recommended to minimize solder bridging between circuit pads. If a trace is run between
adjacent pads on the solder side of the pc board, a solder mask MUST be applied over the trace to
prevent bridging and wicking of solder away from the contact solder tines. Additionally, there should be
solder mask covering any traces in the area of the hold–down solder deposit. Liquid photo imageable or
dry film solder masks in step with modern processing techniques are recommended.
The solder mask must not exceed the height of the circuit pad by more than 0.05 mm [.002 in.].
Since the connector may rest on top of the solder mask, an excessively high mask would allow too much space
between the lead and the pad for a good solder joint. A solder joint under these conditions would be weak, and would
not provide long-term performance for the connector.
D. Stencil (or Screen)
Recommended stencil thickness is 0.15 mm [.006 in.].
The stencil aperture is determined by the circuit pad size and stencil thickness. It may be any shape as
long as it prevents solder bridging from one pad to another. Generally, the thinner stencil will need a larger
aperture to maintain the given volume of solder paste.
CAUTION
!
.050 Series Standard Edge PCI Connector Assemblies 114-13148
Rev
A6
of 8 Tyco Electronics Corporation
E. Solder Volume
Minimum solder volume (V) (before curing) for each circuit pad must be calculated by multiplying the pad
length (L) by the pad width (W) by the stencil thickness (T):
2.67
0.76
0.15 = 0.304 mm3 [.105
.030
.006 = .0000189 in.3] volume per circuit pad
Using solder volume over that which is recommended could cause excess wicking on the contact solder tine, resulting
in a reduction of solder tine compliance or solder joint failure.
F. Process
The connectors should be soldered using wave, non–focused infrared reflow (IR), or equivalent soldering
technique. Manual 402–40 contains soldering guidelines. The reflow temperature and time is specified in
Figure 6.
SOLDERING PROCESS TEMPERATURE (Max) TIME
IR 220
_
C [428
_
F] 3 Minutes
Figure 6
G. Cleaning
After soldering, removal of fluxes, residues, and activators is necessary. Consult with the supplier of the
solder and flux for recommended cleaning solvents. Cleaners must be free of dissolved flux and other
contaminants. It is recommended cleaning with the pc board on its edge. Common cleaning solvents with
times and temperatures that will not affect these connectors is specified in Figure 7.
Even when using no clean" solder paste, it is imperative that the contact interface be kept clean of flux and residue,
since it acts as an insulator. Flux may migrate under certain conditions with elevated temperatures and, therefore,
cleaning is necessary.
CLEANER TIME TEMPERATURE
NAME TYPE (Minutes) (Maximum)
ALPHA 2110 Aqueous 1 132
_
C [270
_
F]
Isopropyl Alcohol Solvent 5 100
_
C [212
_
F]
KESTER 5778 Aqueous 5 100
_
C [212
_
F]
KESTER 5779 Aqueous 5 100
_
C [212
_
F]
LONCOTERGE 520 Aqueous 5 100
_
C [212
_
F]
LONCOTERGE 530 Aqueous 5 100
_
C [212
_
F]
Figure 7
Consideration must be given to toxicity and other safety requirements recommended by the solvent manufacturer.
Refer to the manufacturer's Material Safety Data Sheet (MSDS) for characteristics and handling of cleaners.
Trichloroethylene and Methylene Chloride is not recommended because of harmful occupational and environmental
effects. Both are carcinogenic (cancer-causing).
If you have a particular cleaning solvent that is not listed, contact PRODUCT INFORMATION at the number at the
bottom of page 1.
H. Drying
When drying cleaned assemblies and pc boards, temperature limitations must not be exceeded: –55
_
to
105
_
C [–68
_
to 221
_
F]. Excessive temperatures may cause housing degradation.
3.10. Checking Installed Connector
The installed connector must have solder fillets evenly formed around each contact solder tine. All solder joints
should conform to those specified in Workmanship Specification 101–21 and all other requirements specified in
this document.
CAUTION
!
CAUTION
!
DANGER
NOTE
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.050 Series Standard Edge PCI Connector Assemblies 114-13148
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Tyco Electronics Corporation
3.11. Polarization
A polarizing pattern for placing the connector on the pc board is provided by the number of solder tines in each
cluster of solder tines and the hold–downs.
Polarization for the mating daughter board is provided by the polarization alignment webs of the connector
which match the slots of the daughter board.
3.12. Installing Daughter Board
(Figure 8)
The daughter board must be oriented with the slots aligned with the polarizing alignment webs of the
connector. The side–to–side and front–to–back angles must be visually aligned with the connector, then the
daughter board must be pushed straight into the daughter board entry slot of the connector until bottomed.
This method requires less insertion force and there will be less chance of damage to components.
3.13. Removing Daughter Board
The daughter board must be gripped firmly and pulled straight out of the connector. The daughter board must
not be shifted side–to–side or front–to–back as excessive angles could damage the contacts, housing, or pc
boards. This method protects the connector from damage and will ease extraction of the daughter board.
3.14. Connector Removal
The connectors can be removed from the pc board by standard de–soldering methods. Connectors MUST
NOT be re–used after removal from the pc board.
Figure 8
Polarizing Alignment
Web (2 Places)
Slot (2 Places) Daughter Board
Connector
Installing Daughter Board
Top View of Connector
Daughter Board
Entry Slot
PC Board
PC Board
3.15. Repair
These connectors are not repairable. Damaged or defective connectors MUST NOT be used.
4. QUALIFICATION
The .050 Series Standard Edge PCI Surface Mount Connector Assemblies are Listed by Underwriters
Laboratories Inc. (UL) in File E 28476 and Certified by CSA International in File LR 7189.
5. TOOLING
No tooling is required for manual placement of the connectors. For robotic equipment placement, a pc board
support must be used to prevent bowing of the pc board during the placement of connectors on the board. It
should have flat surfaces with holes or a channel large enough and deep enough to receive the connector
hold–downs. The robotic equipment must have a true position accuracy tolerance of 0.05 mm [.002 in.]. This
includes gripper and fixture tolerances as well as equipment repeatability. It must use the socket datum
surfaces detailed on the customer drawing to ensure reliable placement.
.050 Series Standard Edge PCI Connector Assemblies 114-13148
Rev
A8
of 8 Tyco Electronics Corporation
6. VISUAL AID
Figure 9 shows a typical application of .050 Series Standard Edge PCI Surface Mount Connector Assemblies.
This illustration should be used by production personnel to ensure a correctly applied product. Applications
which DO NOT appear correct should be inspected using the information in the preceding pages of this
specification and in the instructional material shipped with the product or tooling.
FIGURE 9. VISUAL AID
DAUGHTER BOARD MUST BE
BOTTOMED IN DAUGHTER BOARD
ENTRY SLOT OF CONNECTOR
SOLDER FILLETS MUST BE
EVENLY FORMED AROUND
EACH CONTACT SOLDER TINE
STANDOFFS MUST BE
SEATED ON PC BOARD
CONTACT SOLDER TINES MUST
BE CENTERED OR SLIGHTLY
MISALIGNED ON CIRCUIT PAD
THERE MUST BE NO
DAMAGE TO HOUSING
THERE MUST BE NO DAMAGE
TO DAUGHTER BOARD
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