ATZB-X0-256-3-0-C - MICROCHIP TECHNOLOGY

ZIGBIT 2.4GHZ WIRELESS MODULES

ATZB-X0-256-3-0-C

DATASHEET

Features

• Compact size (33.0 x 20.0mm)

• High RX sensitivity (- 96dBm)

• Outperforming link budget (up to 99.6dB)

• Up to +3.6dBm output power

• Very low power consumption:

• 6.3mA in RX mode(1)

• 20.5mA in TX mode(1)

• 0.3µA in sleep mode(2)

• Ample memory resources:

• 256KBytes in-system self-programm abl e Flash me mory , 4KBytes EEPROM,

16KBytes SRAM

• Wide range of interfaces (both analog and digital):

• 4- wire SPI, TWI

• ISP, JTAG

• Two analog comparator input

• UART, USART

• Timer, PWM

• Four ADC lines

• External clock input, internal clock output

• Up to 32 lines configurable as GPIO

• Preassigned Atmel® MAC address that can be used on end product

• Capability to use MAC address into the internal EEPROM

• IEEE® 802.15.4 compliant transceiver

• 2.4GHz ISM band

• Serial bootloader

• High performance, low power Atmel® AVR® XMEGA® 8/16-bit Microcontroller

• Rapid design-in with built-in chip antenna

• RF test point using MS-147 RF connector

• Small physical footprint and low profile for optimum fit in very small application

boards

• Mesh networking capability

• Easy-to-use low cost development kit

• Single source of support for HW and SW

• Worldwide license-free operation

Notes: 1. MCU is in active stat e with 3V Supply, CPU clock @ 16MHz, RX RPC enabled (for RX current),

PHY_TX_PWR=0x0 (for TX current), All digit al outputs pull ed hi gh.

2. Controller Sleep Mode: SLEEP_MODE_PWR_DOWN.

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Table of Contents

1. Introduction ........................................................................................ 3

1.1 Summary ........................................................................................................... 3

1.2 Applications ....................................................................................................... 3

1.3 Abbreviations and Acronyms ............................................................................ 3

1.4 Related Documents ........................................................................................... 5

2. ZigBit Module Overview ..................................................................... 6

2.1 Overview ........................................................................................................... 6

3. Specification....................................................................................... 8

3.1 Electrical Characteristics ................................................................................... 8

3.1.1 Absolute Maximum Ratings ................................................................ 8

3.1.2 Power Supply ...................................................................................... 8

3.1.3 RF Characteristics .............................................................................. 9

3.1.4 ATXMEGA256A3U Microcontroller Characteristics .......................... 10

3.1.5 Module Interfaces Characteristics ..................................................... 10

3.2 Physical/Environmental Characteristics and Outline ....................................... 10

3.3 Pin Configuration ............................................................................................. 11

3.4 Antenna orientation recommendation ............................................................. 12

3.5 Mounting Information ...................................................................................... 12

3.6 Soldering Profile .............................................................................................. 15

3.7 Antenna Reference Designs ........................................................................... 16

4. Schematics ...................................................................................... 16

4.1 Handling Instructions ....................................................................................... 17

4.2 General Recommendations ............................................................................ 17

5. Persistence Memory ........................................................................ 17

6. Ordering Information ........................................................................ 19

7. Agency Certifications ....................................................................... 20

7.1 United States (FCC) ........................................................................................ 20

7.2 European Union (ETSI) ................................................................................... 21

7.3 Industry Canada (IC) Compliance statements ................................................ 21

8. Revision History ............................................................................... 23

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1. Introduction

1.1 Summary

ATZB-X0-256-3-0-C ZigBit® is an ultra-compact and low-power 2.4GHz IEEE 802.15.4/ZigBee® OEM module from

Atmel. Based on the innovative mixed-signal hardware platform from Atmel, this module uses the ATxmega256A3U [1]

Microcontroller and AT86RF233 [5] 2.4GHz ISM band transceiver. The radio transceiver provides high data rates from

250kb/s up to 2Mb/s, frame handling, outstanding receiver sensitivity and high transmit output power enabling a very

robust wireless communication. The module is designed for wireless sensing, monitoring, control, data acquisition

applications, to name a few. This ZigBit module eliminates the need for costly and time-consuming RF development,

and shortens time-to-market for wireless applications.

The module has an MS-147 RF connector that can be used as an RF test port. The built-in chip antenna is designed

and tuned for the ZigBit design to enable quick integration of the ZigBit into any application.

1.2 Applications

The ZigBit module is compatible with robust IEEE 802.15.4/ZigBee stack that supports a self-healing, self-organizing

mesh network, while optimizing network traffic and minimizing power consumption.

For detailed software support information, please visit http://www.atmel.com/products/wireless.

The application areas include, but are not limited to:

• Building automation and monitoring

o Lighting controls

o Wireless sm o ke- and CO-detectors

o Structural integrity monitoring

• HVAC monitoring & control

• Inventory management

• Environmental monitoring

• Security

• Water metering

• Industrial monitoring

o Machinery condition and performance monitoring

o Monitoring of plant system parameters such as temperature, pressure, flow, tank level, humidity, vibration, etc.

• Automated meter reading (AMR)

1.3 Abbreviations and Acronyms

ADC Analog-to-Digital Converter

API Application Programming Interface

DC Direct Current

DTR Data Terminal Ready

EEPROM Electrically Erasable Programmable Read-Onl y Memory

ESD Electrostatic Discharge

GPIO General Purpose Input/Output

HAF High Frequency

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HVAC Heating, Ventilating, and Air Conditioning

HW Hardware

I2C Inter-Integrated Circuit

IEEE Institute of Electrical and Electronics Engineers

IRQ Interrupt Request

ISM Industrial, Scientific and Medical radio band

JTAG Digital interface for debugging of embedded device, also known as IEEE 1149.1 standard

interface

MAC Medium Access Control layer

MCU Microcontroller Unit. In this document it also means the processor, which is the core of a ZigBit

module

NRE Network layer

OEM Original Equipment Manufacturer

OTA Over-The-Air upgrade

PA Power Amplifier

PCB Printed Circuit Board

PER Package Error Ratio

RAM Random Access Memory

RF Radio Frequency

RPC Reduced Power Consumption

RTS/CTS Request to Send/ Clear to Send

RX Receiver

SMA Surface Mount Assembly

SoC System on Chip

SPI Serial Peripheral Interface

SW Software

TTM Time-To-Market

TX Transmitter

UART Universal Asynchronous Receiver/Transmitter

USART Universal Synchronous/Asynchronous Receiver/Transmitter

USB Universal Serial Bus

ZigBee, ZigBee PRO Wireless networking standards targeted at low-power applications

802.15.4 The IEEE 802.15.4-2003 standard applicable to low-rate wireless Personal Area Network

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1.4 Related Documents

[1] ATXMEGA256A3U Datasheet in http://www.atmel.com/Images/Atmel-8386-8-and-16-bit-AVR-Microcontroller-

ATxmega64A3U-128A3U-192A3U-256A3U_datasheet.pdf

[2] MS-147 Series Interface RF Connector with Switch, 3.9mm High, DC to 6GHz

http://www.hirose.co.jp/cataloge_hp/e35801505.pdf

[3] IEEE Std 802.15.4-2003 IEEE Standard for Information technology - Part 15.4 Wireless Medium Access Control

(MAC) and Physical Layer (PHY) Specifications for Low-Rate Wireless Personal Area Networks (LR-WPANs)

[4] ZigBee Specification. ZigBee Document 053474r17, October 19, 2007

[5] AT86RF233 Datasheet in http://www.atmel.com/Images/Atmel-8351-MCU_Wireless-AT86RF233_Datasheet.pdf

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2. ZigBit Module Overview

2.1 Overview

The ATZB-X0-256-3-0-C ZigBit is a compact, low-power, high sensitivity IEEE 802.15.4/ZigBee OEM module. Based on

a solid combination of the latest Atmel MCU Wireless hardware platform, 2.4GHz ISM band transceiver and Atmel

Studio Wireless Composer - the ZigBit offers an unmatched combination of superior radio performance, ultra-low power

consumption and exceptional ease of integration.

Figure 2-1. ATZB-X0-256-3-0-C Block diagram

This ZigBit module contains Atmel’s ATxmega256A3U Microcontroller and AT86RF233 2.4GHz ISM band Transceiver

for ZigBee and IEEE 802.15.4 [1]. The module features 256KB in-system self-programmable Flash memory, 16KB

SRAM and 4KB EEPROM.

The compact all-in-one board design of MCU and radio transceiver with very minimal components on the RF path to

Antenna dramatically improves the ZigBit’s compact size, range performance on signal transmission and increases its

sensitivity. This ensures stable connectivity within a larger coverage area, and helps develop applications on smaller

footprint. The MS-147 connector [2] can be used as an RF Test port.

ZigBit Module contains a complete RF/MCU design with all the necessary passive components included. The module

can be easily mounted on a simple 2-layer PCB with a minimum of required external connection. The ZigBit Module

evaluation kit containing the ZigBit extension board for the Atmel Xplained PRO HW evaluation platform can be used to

develop FW using the Atmel Studio and evaluate using the Wireless Composer. Compared to a custom RF/MCU

solution, a module-based solution offers considerable savings in development time and NRE cost per unit during the

HW/FW design, prototyping, and mass production phases of product development.

All ZigBits are preloaded with a bootloader when they are sold as modules, either in single units or T&R.

Depending on end-user design requirements, the ZigBit can operate as a self-contained sensor node, where it would

function as a single MCU, or it can be paired with a host processor driving the module over a serial interface.

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The MAC stack running on the host processor can then control data transmission and manages module peripherals.

Thus very minimal firmware customization is required for successful module design-in. Third-party sensors can then be

connected directly to the module, thus expanding the existing set of peripheral interfaces.

Every ZigBit Module come pre loaded with Atmel assigned 64-bit MAC address stored in the signature bytes of the

device. This unique IEEE MAC address can be used as the MAC address of the end product, so there is no need to buy

a MAC address separately for the product using the ZigBit.

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3. Specification

3.1 Electrical Characteristics

3.1.1 Absolute Maximum Ratings

Table 3-1. Absolute Ma ximum R atings (1)(2)

Parameter Minimum Maximum

Voltage on any pin, except RESET with respect to ground -0.3V 3.6V (VDD max)

Input RF level +10dBm

Current into Vcc pins 200mA

Notes: 1. Absolute Maximum Ratings are the values beyond which damage to the device may occur. Under no

circumstances must the absolute maximum ratings given in this table be violated. Stresses beyond those listed

under "Absolute Maximum Ratings" may cause permanent damage to the device.

This is a stress rating only. Functional operation of the device at these or other conditions, beyond those indicated

in the operational sections of this specification, is not implied. Exposure to absolute maximum rating conditions for

extended periods may affect device reliability.

2. Attention! ZigBit is an ESD-sensitive device. Precaution should be taken when handling the device in order to

prevent permanent damage.

3.1.2 Power Supply

Table 3-2. Test Con di tions ( unle ss otherwise stated), Vcc = 3V, Tamb = 25°C.

Parameter Range Unit

Supply voltage, VDD 1.8 to 3.6 V

Active Current consumption: RX mode – BUSY_RX - Receive state 16.5 mA

Active Current consumption: RX mode - RX_ON with RPC, MCU Active 11.8 mA

Active Current consumption: RX mode - RX_ON, MCU Active 17.0 mA

Active Current consumption: RX mode - RX_ON with RPC, MCU Power_down 6.1 mA

Active Current consumption: RX mode - RX_ON, MCU Power_down 11.3 mA

Active Current consumption: TX mode

(1)

– BUSY_TX – Transmit state 20.5 mA

Active Current consumption: TX mode

– PLL_ON 5.6 mA

Current consumption: TRX_OFF, MCU Active 5.5 mA

Current consumption: TRX_OFF, MCU Power_down 443 µA

Sleep Current consumption: TRX Sleep, MCU Power_down

(2)

0.3 µA

Sleep Current consumption: TRX Sleep, MCU Power_save

(2)

0.3 µA

Sleep Current consumption: TRX Sleep, MCU Standby

(2)

380 µA

Sleep Current consumption: TRX Sleep, MCU Extended_Standby

(2)

380 µA

Sleep Current consumption: TRX Deep_Sleep, MCU Power_down (2) 8.5 µA

Sleep Current consumption: TRX Deep_Sleep, MCU Power_save (2) 8.5 µA

Sleep Current consumption: TRX Deep_Sleep, MCU Standby (2) 388 µA

Sleep Current consumption: TRX Deep_Sleep, MCU Extended_Standby (2) 388 µA

Note 1: Output TX power (when measuring consumption in TX mode) is +3 dBm.

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Note 2:

a) All interfaces are set to the default state (see Pin Assignment Table).

b) JTAG is not connected.

c) CPU Clock configured when doing this measurement – 16MHz for all modes except Power save and Power down modes

Current consumption depends on multiple factors, including but not limited to, the board design and materials, Protocol settings,

network activity, EEPROM read/write operations. It also depends on MCU load and/or peripherals used by an application.

3.1.3 RF Characteristics

Table 3-3. RF Characteristics (1).

Parameter Condition Typical Values Unit

Frequency band 2.4000 to 2.4835 GHz

Numbers of channe ls 16

Channel spacing 5 MHz

Transmitter output power Adjusted in 16 steps -17 to +4 dBm

Receiver sensit iv ity PER = 1% -96 dBm

On-air data rate 250, upto 2000 Kbps

TX output/ RX input nominal impedance For balanced 50 Ω

Range Open field, LoS, Elev ated 48 – 178

Note # Range measured is Line of Sight and at 10ft elevation from Ground at different combinat i ons of orientations of transm itt er and

receiver, with speci al conditi ons were there is minimal or no RF interference from other sources. For best case orientation of the ZigBi ts

to achieve maximum range, refer to section 3.4

Table 3-4. TX power settings

PHY_TX_PWR 3:0 Regist er v alue Power register setting

[dBm] Typical Output power [dBm]

(values at RF connector)

0 +4 +3

1 +3.7 +2.9

2 +3.4 +2.7

3 +3 +2.6

4 +2.5 +2.5

5 +2 +0.4

6 +1 -0.3

7 0 -1

8 -1 -2

9 -2 -3.0

10 -3 -4.

11 -4 -5.7

12 -6 -7.5

13 -8 -9.8

14 -12 -13.0

15 -17 -17.9

Note 1: For detailed characteristics , ref er to [2].

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3.1.4 ATXMEGA256A3U Microcontroller Characteristics

Table 3-5. ATXMEGA256A3U Characteristics.

Parameter Range Unit

On-chip flash memory size 256K Bytes

On-chip RAM size 16K Bytes

On-chip EEPROM size 4K Bytes

Operation frequency 16 MHz

3.1.5 Module Interfaces Characteristics

Table 3-6. Module Interfaces Characteristics (1).

Parameters Condition Range Unit

UART maximum baud rate 115.2 Kbps

ADC conversion time (latency)

(RES+2)/2+(GAIN !=0)

RES (Resolution) = 8 or 12 5-8 ClkADC cycles

ADC input resistance Static load resistor of input signal 4.0 kΩ

ADC reference voltage (VREF) 1.0 to AVcc – 0.6 V

ADC input voltage 0 - AVDD V

TWI maximum clock 400 kHz

GPIO High level input voltage Vcc = 2.7-3.6V 2 to Vcc+0.3 V

GPIO Low level input voltage Vcc = 2.7-3.6V -0.3 to 0.3 VDD V

GPIO High level output voltage VOH Vcc = 3.0-3.6V 2.4 to 0.94Vcc V

GPIO Low level output voltage VOL Vcc = 3.0-3.6V 0.05Vcc typ

Max 0.4 V

Real-time os cillator frequency 32.768 kHz

Note 1: For detailed characteristics, refer to [1].

3.2 Physical/Environmental Characteristics and Outline

Table 3-7. Physical characteristics.

Parameters Value Comments

Size 33.0 x 20.0 mm

Operating temperature range -40°C to +85°C -40°C to +85°C operational

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3.3 Pin Configuration

Table 3-8. ATZB-X0-256-3-0-C P inout description

Pin Out

Pin descript ions

Function

AVSS

Analog Ground

AVSS

Analog Ground

DEVDD

Digital Power input pin

4 DEVDD Digital Power input pin

RSET/PDI_CLOCK

RESET

PD4/SS

SPI

7 PD5/MOSI/XCK1 SPI

PD6/MISO/RXD1/D-

SPI

9 PD7/SCK/TXD1/D+ SPI

PA5

GPIO / ADC / Analog COMP+

PA4

GPIO/ADC/Analog Comp-

DVSS

Digital Ground

PD2/SYNC/ASYNC/OC0C/

UART

14 PD3/SYNC/TXD0/OC0D UART

PD1/SCL/INT/OC0B

USART

PDI_DATA

PWM/TC

PA6

GPIO/ADC

PA7

GPIO/ADC

PB3

GPIO/ADC/DAC1

20 PB2 GPIO/ADC/DAC/intwkup

PF1/OC0B/INT/XCK0

INT/PWM/GPIO

22 PF2/OC0C/INT/RXD0 INT/PWM/GPIO

PF3/OC0D/INT/TXD0

INT/PWM/GPIO

PB0/IAREF/INT

Adc ref

25 PA0/ADC0/INT ADC/ GPIO

PA1/ADC1/INT

ADC/ GPIO

PA2/ADC2/INT

ADC/ GPIO

PA3/ADC3/INT

ADC/ GPIO

DVSS

Digital Ground

PB6/TCK/INT

JTAG

PB4/TMS/INT

JTAG

PB7/TDO/INT

JTAG

33 PB5/TDI/INT JTAG

PE3/TXD

GPIO/output counter

PE2/RXD

Wakeup INT

36 PE1/XCK TWI/INT/GPIO

PE0

TWI/INT/GPIO

PE5/OC1B/INT

GPIO/TC

PE4/SYNC/OC1A

Master Clock out put

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Pin Out

Pin descript ions

Function

PF0

GPIO/Timer

DVSS

Digital Ground

DVSS

Digital Ground

3.4 Antenna or ientation recommendation

The Antenna in this module is designed to provide the best possible LoS range in the direction indicated in this

illustration.

3.5 Mounting Information

The Figures below shows the PCB layout recommended for a ZigBit module. Neither via-holes nor wires are allowed on

the PCB upper layer in the area occupied by the module. As a critical requirement, RF_GND pins should be grounded

via several via-holes to be located right next to the pins thus minimizing inductance and preventing both mismatch and

losses.

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Figure 3-1. ATZB-X0-256-3-0-C Dimensions

Figure 3-2. ATZB-X0-256-3-0-C Pinout

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Figure 3-3. ATZB-X0-256-3-0-C Foot Print Dimensions

Figure 3-4. ATZB-X0-256-3-0-C Mounting Information (Preferred Placement)

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Figure 3-5. Figure 3-4. ATZB-X0-256-3-0-C Mounting Information (Alternative Placement)

The ZigBit’s location and orientation on the carrier board is illustrated in the above Mounting information drawing. The

Recommended placement of ZigBit on Carrier Board needs to be accurately followed to ensure performance on the end

application

Please note the areas in the Mounting information drawing for copper and component keep out to ensure superior

performance of the ZigBits on your End application. Copper keep out recommended in the drawing applies for all layers

of the carrier board

The dimension A of the carrier board should be equal to or greater than 20mm. Similarly, the dimension B should be

equal to or greater than 33mm

3.6 Soldering Profile

The J-STD-020C-compliant soldering profile is recommended acc ording to Tabl e 3-9.

Table 3-9. Soldering profile(1)

Profile feature Green package

Average ramp-up rate (217°C to peak) 3°C/s max

Preheat temperature 175°C ±25°C 180s max

Temperature maintained above 217°C 60s to 150s

Time within 5°C of actual peak temperature 20s to 40s

Peak temperature range 260°C

Ramp-down rate 6°C/s max

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Profile feature Green package

Time within 25°C to peak temperature 8 minutes

Note: 1. The package is backward compatible with P B/Sn soldering prof i l e.

3.7 Antenna Reference Designs

Multiple factors affect proper antenna match, hence, affecting the antenna pattern. The particular factors are the board

material and thickness, shields, the material used for enclosure, the board neighborhood, and other components

adjacent to antenna. Following guidelines need to be followed when designing the base board for the ZigBit.

General Recommendations:

• Metal enclosure should not be used. Using low profile enclosure might also affect antenna tuning.

• Placing high profile components next to antenna should be avoided.

• Having holes/vias punched around the periphery of the board eliminates parasitic radiation from the board

edges also distorting antenna pattern.

• ZigBit module should not be placed next to consumer electronics which might interfere with ZigBit’s RF band

frequency.

The board design should prevent propagation of microwave field inside the board material. Electromagnetic waves of

high frequency may penetrate the board thus making the edges of the board radiate, which may distort the antenna

pattern. To eliminate this effect, metalized and grounded holes/vias must be placed around the board's edges.

4. Schematics

The following schematic drawings for the ATZB-X0-256-3-0-C are in the following order:

• Top level schematics

• Connector schematics

• ATxmega256A3BU schematics

• AT86RF233 schematics

D D

C C

B B

A A

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SPI INTERFACE

GPIO/ADC

GPIO/ADC/ANALOGCOMP

GPIO/ADC/DAC

INT/PWM/GPIO

JTAG

UART/USART

PDI/GPIO

TWI

CONNECTOR

Xmega_233_Connector.SchDoc

TRX_I/F

SPI INTERFACE

GPIO/ADC

GPIO/ADC/ANALOGCOMP

GPIO/ADC/DAC

INT/PWM/GPIO

JTAG

UART/USART

PDI/GPIO

TWI

XMEGA233

Xmega_233_MCU.SchDoc

TRX_I/F

Xmega_233_RF.SchDoc

ZigBit Xmega 2.4GHz board PCB

PCB200

Product number/revision

Serial number

Label ZigBit Shield

LABEL1

COLABEL1

COPCB200

D D

C C

B B

A A

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MSK

PA3_ADC3_INT

PB6_TCK_INT

PB7_TDO_INT

PB5_TDI_INT

PB4_TMS_INT

PB3

PB2

PA6

PA0_ADC0_INT

PA1_ADC1_INT

PA2_ADC2_INT

PF1_OC0B_INT_XCK0

PA5

PA4

PA7

VCC_3V3

GND GND

PD4_SS

PD5_MOSI_XCK1

USBD_P

USBD_N

GND

VCC_3V3

GND

VDD

RSET/PDI_CLOCK

PD4/SS

PD5/MOSI/XCK1

PD6/MISO/RXD1/D-

PD7/SCK/TXD1/D+

PA5

PA4

GND

PD2/RXD0

PD3/TXD0

PD1/XCK0

PDI_DATA

PA6

PA7

PB3

PB2

PF1/OC0B/INT/XCK0

21 PF2/OC0C/INT/RXD0 22

PF3/OC0D/INT/TXD0 23

PB0/IAREF/INT 24

PA0/ADC0/INT 25

PA1/ADC1/INT 26

PA2/ADC2/INT 27

PA3/ADC3/INT 28

PB6/TCK/INT 30

PB4/TMS/INT 31

PB7/TDO/INT 32

PB5/TDI/INT 33

PE3 34

PE2/ASYNC 35

PE1/SCL 36

PE0/SDA 37

PE5/OC1B/INT 38

GND 41

GND 29

PE4/SYNC/OC1A 39

GND 42

PF0 40

ATZB-X-0-256-3-0-C

Z200

PF2_OC0C_INT_RXD0

PF3_OC0D_INT_TXD0

PD4

PD5

PD6

PD7

SPI INTERFACE

PA0

PA1

PA2

PA3

PA6

PA7

AREF

GPIO/ADC

PB2

PB3

GPIO/ADC/DAC

PF1

PF2

PF3

INT/PWM/GPIO

PA4

PA5

GPIO/ADC/ANALOG COMP

PB5

PB4

PB6

PB7

nRST

JTAG

PD4_SS

PD5_MOSI_XCK1

USBD_N

USBD_P

PA0_ADC0_INT

PA1_ADC1_INT

PA2_ADC2_INT

PA3_ADC3_INT

PA6

PA7

PB2

PB3

PA4

PA5

PB4_TMS_INT

PB5_TDI_INT

PB6_TCK_INT

PB7_TDO_INT

PF1_OC0B_INT_XCK0

PF2_OC0C_INT_RXD0

PF3_OC0D_INT_TXD0

GPIO/ADC/ANALOGCOMP

GPIO/ADC/DAC

GPIO/ADC

SPI INTERFACE

JTAG

INT/PWM/GPIO

nRST

PB0_AREF_INT

PE4_SYNC_OC1A

PE5_OC1B_INT

PDI_DATA

PF0

EMI ShieldZ201 Ba

PE4_SYNC_OC1A

PE5_OC1B_INT

PF0

PDI_DATA

PF0

PDI

PE4

PE5

PDI/GPIO PDI/GPIO

PE2

PE1

PE3

PE0

TWI

PE1_SCL

PE2_ASYNC

PE3_GPIO

TWI

PE0_SDA

PE2_ASYNC

PE3_GPIO

PD1_XCK0

PD2_RXD0

PD3_TXD0

PE1_SCL

PE0_SDA

PD2

PD1

PD3

UART/USART

PD1_XCK0

PD2_RXD0

PD3_TXD0

UART/USART

PIZ20001

PIZ20002

PIZ20003

PIZ20004

PIZ20005

PIZ20006

PIZ20007

PIZ20008

PIZ20009

PIZ200010

PIZ200011

PIZ200012

PIZ200013

PIZ200014

PIZ200015

PIZ200016

PIZ200017

PIZ200018

PIZ200019

PIZ200020

PIZ200021 PIZ200022

PIZ200023

PIZ200024

PIZ200025

PIZ200026

PIZ200027

PIZ200028

PIZ200029

PIZ200030

PIZ200031

PIZ200032

PIZ200033

PIZ200034

PIZ200035

PIZ200036

PIZ200037

PIZ200038

PIZ200039

PIZ200040

PIZ200041

PIZ200042

COZ200

PIZ20101 PIZ20102 PIZ20103 PIZ20104

COZ201

POGPIO0ADC

POGPIO0ADC0AREF

POGPIO0ADC0PA0POGPIO0ADC0PA1POGPIO0ADC0PA2POGPIO0ADC0PA3POGPIO0ADC0PA6POGPIO0ADC0PA7

POGPIO0ADC0ANALOGCOMP

POGPIO0ADC0ANALOGCOMP0PA4POGPIO0ADC0ANALOGCOMP0PA5

POGPIO0ADC0DAC

POGPIO0ADC0DAC0PB2POGPIO0ADC0DAC0PB3

POINT0PWM0GPIO

POINT0PWM0GPIO0PF1POINT0PWM0GPIO0PF2POINT0PWM0GPIO0PF3

POJTAG

POJTAG0NRST

POJTAG0PB4POJTAG0PB5POJTAG0PB6POJTAG0PB7

POPDI0GPIO

POPDI0GPIO0PDIPOPDI0GPIO0PE4POPDI0GPIO0PE5POPDI0GPIO0PF0

POSPI INTERFACE

POSPI INTERFACE0PD4POSPI INTERFACE0PD5POSPI INTERFACE0PD6POSPI INTERFACE0PD7

POTWI

POTWI0PE0POTWI0PE1POTWI0PE2POTWI0PE3

POUART0USART

POUART0USART0PD1POUART0USART0PD2POUART0USART0PD3

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ATZB-X0-256-3-0-C

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MGR Road

Chennai

PAGE: of

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Date:

OJS

MSK

VCC_3V3

GND

GND GND

VCC_3V3

nRST

PC0_TRX_nRST

VCC_3V3

nRST

GND

VCC_3V3

iPCB Rule

PCB Rule

PD3_TXD0

PD1_XCK0

PE4_SYNC_OC1A

PA5

PA4

PB3

PB2

PA6

PA7

PA3_ADC3_INT

PA0_ADC0_INT

PA1_ADC1_INT

PA2_ADC2_INT

PB6_TCK_INT

PB7_TDO_INT

PB5_TDI_INT

PB4_TMS_INT

PD4_SS

PD5_MOSI_XCK1

PE5_OC1B_INT

PF1_OC0B_INT_XCK0

PF2_OC0C_INT_RXD0

PF3_OC0D_INT_TXD0

PC1_TRX_DIG2

PC2_TRX_IRQ

PC3_TRX_SLP_TR

PC4_TRX_SPI_SS

PC7_TRX_SPI_SCK

PC5_TRX_SPI_MOSI

PC6_TRX_SPI_MISO

TOSC1

TOSC2

TRX_nSEL

TRX_SCK

TRX_MOSI

TRX_MISO

TRX_nRST

TRX_IRQ

TRX_DIG2

SLP_TR

CLKM

TRX_I/F

PC4_TRX_SPI_SS

PC7_TRX_SPI_SCK

TRX_I/F

PC5_TRX_SPI_MOSI

PC6_TRX_SPI_MISO

PC1_TRX_DIG2

PC2_TRX_IRQ

PC3_TRX_SLP_TR

PC0_TRX_nRST

TOSC1

TOSC2 10 pFC200

10 pFC207

100K

R200

USBD_P

USBD_N

FC-135 32.768 kHz

XC200

AN_VCC_3V3 VCC_3V3

BLM15BB221SN1

L200

GND GND GND GND

VCC_3V3

GNDGND_RF

BLM15BB221SN1

L201

GND

100nC202

100nC203

100nC204

100nC205

4.7uF/10VC201

GND

100n

C208

GND

100nC206

GND

VCC_3V3

PA7(ADCA7/ACA7)

PB0(ADCB0/ACB0/AREFB)

PB1(ADCB1/ACB1)

PB2(ADCB2/ACB2/DACB0)

PB3(ADCB3/ACB3/DACB1)

PB4(ADCB4/ACB4/TMS)

PC4(SS/OC1A/OC0CLS)

PC5(XCK1/MOSI/OC1B/OC0CHS)

PC6(RXD1/MISO/OC0DLS)

PC7(TXD1/SCK/OC0DHS)

PD1(XCK0/OC0B)

27 PD0(OC0A)

PD3(TXD0/OC0D)

PD4(SS/OC1A)

PD5(MOSI/XCK1/OC1B)

PD6(MISO/RXD1/D-)

(D+/TXD1/SCK)PD7 33

GND

VCC

(OC0A)PF0 46

(OC0B/XCK0)PF1 47

(OC0C/RXD0)PF2 48

(OC0D/TXD0)PF3 49

(OC0A)PF4 50

PF5 51

PF6 54

PF7 55

VCC 45

GND 44

(ACA2/ADCA2)PA2 64

(ACA1/ADCA1)PA1 63

(AREFA/ACA0/ADCA0)PA0 62

AVCC 61

GND 60

(XTAL1)PR1 59

(XTAL2)PR0 58

PDI_CLK/RESET 57

PA3(ADCA3/ACA3)

PA4(ADCA4/ACA4)

PA5(ADCA5/ACA5)

PA6(ADCA6/ACA6)

PB5(ADCB5/ACB5/TDI)

PB6(ADCB6/ACB6/TCK)

PB7(ADCB7/ACB7/TDO)

GND

VCC

PC0(SDA/OC0A/OC0ALS)

PC1(SCL/XCK0/OC0B/OC0AHS)

PC2(RXD0/OC0C/OC0BLS)

PC3(TXD0/OC0D/OC0BHS)

GND 34

VCC 35

PD2(RXD0/OC0C)

(OC0A/SDA)PE0 36

(OC0B/XCK0/SCL)PE1 37

(OC0C/RXD0)PE2 38

(OC0D/TXD0)PE3 39

(OC1A)PE4 40

(OC1B)PE5 41

PE6 42

PE7 43

VCC 53

GND 52

PDI_DATA 56

PAD_GND 65

ATxmega256A3U-MH

U200

GND

PF1

PF2

PF3

INT/PWM/GPIO

PE2

PE1

PE3

PE0

TWI

PB5

PB4

PB6

PB7

nRST

JTAG

PD2

PD1

PD3

UART/USART

PE1_SCL

PE2_ASYNC

PE3_GPIO

PB4_TMS_INT

PB5_TDI_INT

PB6_TCK_INT

PB7_TDO_INT

PD1_XCK0

PF1_OC0B_INT_XCK0

PF2_OC0C_INT_RXD0

PF3_OC0D_INT_TXD0

JTAG

INT/PWM/GPIO

PD4

PD5

PD6

PD7

SPI INTERFACE

PA0

PA1

PA2

PA3

PA6

PA7

AREF

GPIO/ADC

PB2

PB3

GPIO/ADC/DAC

PA4

PA5

GPIO/ADC/ANALOG COMP

PD4_SS

PD5_MOSI_XCK1

USBD_N

USBD_P

PA0_ADC0_INT

PA1_ADC1_INT

PA2_ADC2_INT

PA3_ADC3_INT

PA6

PA7

PB2

PB3

PA4

PA5

GPIO/ADC/ANALOGCOMP

GPIO/ADC/DAC

GPIO/ADC

SPI INTERFACE

nRST

PD2_RXD0

PE4_SYNC_OC1A

PE5_OC1B_INT

PB0_AREF_INT

PF0

PDI_DATA

PF0

PDI_DATA

TWI

PF0

PDI

PE4

PE5

PDI/GPIO PDI/GPIO

PE1_SCL

PE2_ASYNC

PE3_GPIO

CLKM

PE0_SDA

PD2_RXD0

PD3_TXD0

UART/USART

PE0_SDA

Place xtal circuit closer

to MCU. Isolate from

digital signals.

Place de-coupling closer

to MCU Place 4.7uF closer to

Vcc input for module

PIC20001 PIC20002

COC200

PIC20101

PIC20102

COC201

PIC20201

PIC20202 COC202 PIC20301

PIC20302

COC203

PIC20401

PIC20402

COC204

PIC20501

PIC20502

COC205

PIC20601

PIC20602

COC206

PIC20701 PIC20702

COC207

PIC20801

PIC20802

COC208

PIL20001 PIL20002

COL200

PIL20101PIL20102

COL201

PIR20001 PIR20002

COR200

PIU20001

PIU20002

PIU20003

PIU20004

PIU20005

PIU20006

PIU20007

PIU20008

PIU20009

PIU200010

PIU200011

PIU200012

PIU200013

PIU200014

PIU200015

PIU200016

PIU200017 PIU200018 PIU200019 PIU200020 PIU200021 PIU200022 PIU200023 PIU200024 PIU200025 PIU200026 PIU200027 PIU200028 PIU200029 PIU200030 PIU200031 PIU200032

PIU200033

PIU200034

PIU200035

PIU200036

PIU200037

PIU200038

PIU200039

PIU200040

PIU200041

PIU200042

PIU200043

PIU200044

PIU200045

PIU200046

PIU200047

PIU200048

PIU200049PIU200050PIU200051PIU200052PIU200053PIU200054PIU200055PIU200056PIU200057PIU200058PIU200059PIU200060PIU200061PIU200062PIU200063PIU200064PIU200065

COU200

PIXC20001

PIXC20002

COXC200

POGPIO0ADC

POGPIO0ADC0AREF

POGPIO0ADC0PA0POGPIO0ADC0PA1POGPIO0ADC0PA2POGPIO0ADC0PA3POGPIO0ADC0PA6POGPIO0ADC0PA7

POGPIO0ADC0ANALOGCOMP

POGPIO0ADC0ANALOGCOMP0PA4POGPIO0ADC0ANALOGCOMP0PA5

POGPIO0ADC0DAC

POGPIO0ADC0DAC0PB2POGPIO0ADC0DAC0PB3

POINT0PWM0GPIO

POINT0PWM0GPIO0PF1POINT0PWM0GPIO0PF2POINT0PWM0GPIO0PF3

POJTAG

POJTAG0NRST

POJTAG0PB4POJTAG0PB5POJTAG0PB6POJTAG0PB7

POPDI0GPIO

POPDI0GPIO0PDIPOPDI0GPIO0PE4POPDI0GPIO0PE5POPDI0GPIO0PF0

POSPI INTERFACE

POSPI INTERFACE0PD4POSPI INTERFACE0PD5POSPI INTERFACE0PD6POSPI INTERFACE0PD7

POTRX0I0F

POTRX0I0F0CLKM

POTRX0I0F0SLP0TR

POTRX0I0F0TRX0DIG2

POTRX0I0F0TRX0IRQ

POTRX0I0F0TRX0MISOPOTRX0I0F0TRX0MOSIPOTRX0I0F0TRX0NRSTPOTRX0I0F0TRX0NSEL

POTRX0I0F0TRX0SCK

POTWI

POTWI0PE0POTWI0PE1POTWI0PE2POTWI0PE3

POUART0USART

POUART0USART0PD1POUART0USART0PD2POUART0USART0PD3

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ATZB-X0-256-3-0-C

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MGR Road

Chennai

PAGE: of

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Date:

OJS

MSK

IRQ

nSEL

MOSI

SCLK

MISO

SLP_TR

RESET_N

DIG2

TRX_I/F

TRX_nSEL

TRX_SCK

TRX_MOSI

TRX_MISO

TRX_nRST

TRX_IRQ

TRX_DIG2

SLP_TR

CLKM

TRX_I/F

CLKM

PCB Rule

GND_RF

GND

RESET_N

SLP_TR

DIG3

DIG4

IRQ

nSEL

MOSI

SCLK

MISO

DIG2

DIG1

GNDGND

DIG4 2

AVSS 3

RFP 4

RFN 5

AVSS 6

DVSS 7

RSTN 8

DIG1 9

DIG2 10

SLP_TR 11

DVSS 12

DVDD 13

DVDD 14

DEVDD 15

DVSS 16

CLKM

DVSS

SCLK

MISO

DVSS

MOSI

SEL

IRQ

XTAL2

XTAL1

AVSS

EVDD

AVDD

AVSS

AT86RF233

MLF32

DIG3 1

DIE

AT86RF233-ZUU1

GND

GND_RF

GND_RF GND_RF

GND

GND_RF

VCC_3V3

AN_VCC_3V3

GND_RF GND_RF

GND

2.2 pFC3

100nC9

100n C1

1uFC10

1uF C2

10 pFC8

10 pFC11

GND_RF GND_RF

GND_RF

50Ohm 1

GND 2

Bal

GND

2450BM15A0015EB100

RF_P

RF_N

GND_RF

680RR1

CLKM

RF_IN

1RF_OUT 2

GND 3

GND

MS147J1

FEED POINT

1NC 2

2450AT42B100A1

1 3

16.0MHz

3.3nH

3 pFC4

Place de-coupling closer

to TRX

Place de-coupling closer

to TRX

Place xtal circuit closer

to TRX . Isolate from

digital signals.

tune the values for

Antenna matching

PIA101

PIA102

PIA103

PIA104

COA1

PIB10001

PIB10002

PIB10003

PIB10004

PIB10005 PIB10006

COB100

PIC101

PIC102

COC1

PIC201

PIC202

COC2

PIC301 PIC302

COC3

PIC401

PIC402

COC4

PIC801

PIC802

COC8

PIC901

PIC902

COC9

PIC1001

PIC1002

COC10

PIC1101

PIC1102

COC11

PIJ101

PIJ102

PIJ103

PIJ104

COJ1

PIL101

PIL102

COL1

PIL201

PIL202

COL2

PIQ101

PIQ102

PIQ103

PIQ104

COQ1

PIR101

PIR102

COR1

PIU101

PIU102

PIU103

PIU104

PIU105

PIU106

PIU107

PIU108

PIU109

PIU1010PIU1011PIU1012PIU1013PIU1014PIU1015PIU1016

PIU1017

PIU1018

PIU1019

PIU1020

PIU1021

PIU1022

PIU1023

PIU1024

PIU1025 PIU1026 PIU1027 PIU1028 PIU1029 PIU1030 PIU1031 PIU1032

PIU1033

COU1

POTRX0I0F

POTRX0I0F0CLKM

POTRX0I0F0SLP0TR

POTRX0I0F0TRX0DIG2

POTRX0I0F0TRX0IRQ

POTRX0I0F0TRX0MISOPOTRX0I0F0TRX0MOSIPOTRX0I0F0TRX0NRSTPOTRX0I0F0TRX0NSEL

POTRX0I0F0TRX0SCK

ATZB-X0-256-3-0-C ZigBit 2.4GH z Wireless Modules [DATASHEET]

42172B−WIRELESS−03/2014

4.1 Handling Instructions

The ZigBit Modules are fixed with an EMI Shield to ensure compliance to Emission and Immunity rules. This shield is

galvanic and NOT air tight. So cleaning of the module with IPA / other similar agents is not advised. Humidity protection

coating (conformal) will cause deviated RF behavior and coating material being trapped inside EMI Shield. So this

should be avoided. For products requiring conformal coating, it is advised to suitably mask the ZigBit before applying

the coating to rest of the ZigBit carrier board. To protect ZigBi t from humidity, the housing of the product should ensure

suitable Ingress Protection standards are complied with.

The MS-147 connector should never be exposed to varnish / similar conformal coating material which will affect

electrical connection on the surfaces of connector.

The in-built chip antenna has been tuned for the particular design

4.2 General Recommendations

• Metal enclosure should not be used. Using low profile enclosure might also affect antenna tuning

• Placing high profile components next to antenna should be avoided

• Having holes/vias punched around the periphery of the board eliminates parasitic radiation from the board edges

also distorting antenna pattern

• ZigBit module should not be placed next to consumer electronics which might interfere with ZigBit RF frequency

band

5. Persistence Memory

A dedicated memory space is allocated to store product specific information and called the Persistence Memory. The

organization of the persistence memory is as follows:

Table 5-1. Persist en ce Memory

Data Size

Structure Revision 2 bytes

MAC address(1) 8 bytes

Board information overall 49 bytes

Board information – PCBA Name 30 bytes

Board information – PCBA Serial number 10 bytes

Board information – PCBA Atmel Part Number 8 bytes

Board information – PCBA Revision 1 byte

Reserved 3 bytes

XTAL Calibration Value 1 byte

Reserved 7 bytes

Reserved 4 bytes

CRC 2 bytes

In ATZB-X0-256-3-0-C, the persistence memory is stored in User signature Row of Atxmega256A3U microcontroller

starting from address 0x0000. This section is not erased by chip erase and requires a dedicated erase command.

ATZB-X0-256-3-0-C ZigBit 2.4GH z Wireless Modules [DATASHEET]

42172B−WIRELESS−03/2014

The user signature row is a separate memory section that is fully accessi ble (read and write) from application software

and external programmers. See section “Read User Signature Row / Production Signature Row” under section “NVM

Flash Commands” in Xmega AU manual [1] for details in reading the user signature data from application software

Note: 1. The MAC address stored inside the MCU is a uniquely ass igned ID for each ZigBit and owned by Atmel.

User of the ZigBit application can use this unique MAC ID to address the ZigBit in end-applications. The

MAC ID can be read from the ZigBit using the Performance Analyzer Application that is supplied through

Atmel Studio Gallery Extension.

ATZB-X0-256-3-0-C ZigBit 2.4GH z Wireless Modules [DATASHEET]

42172B−WIRELESS−03/2014

6. Ordering Information

Part number Description

ATZB-X0-256-3-0-C 2.4GHz IEEE802.15.4/ZigBee OEM module based on ATXMEGA256A3U MCU and AT86RF233

Transceiver with MS-147 test connector and chip antenna, Single unit

ATZB-X0-256-3-0-CR

(1)

2.4GHz IEEE802.15.4/ZigBee OEM module based on ATXMEGA256A3U MCU and AT86RF233

Transceiver with MS-147 test connector and chip antenna, Tape & Reel

Note: 1. Tape and reel quantity: 200.

ATZB-X0-256-3-0-C ZigBit 2.4GH z Wireless Modules [DATASHEET]

42172B−WIRELESS−03/2014

7. Agency Certi f ications

7.1 United States (FCC)

This equipment complies with Part 15 of the FCC rules and regulations. To fulfill FCC Certification requirements, an

OEM ma n ufacturer must comply with the following regulations:

1. The ATZB-X0-256-3-0-C modular transmitter must be labeled with its own FCC ID number, and, if the FCC ID

is not visible when the module is installed inside another device, then the outside of the device int o w hi c h t h e

module is installed must also display a label referring to the enclosed module. This exterior label can use

wording such as the following:

Contains FCC ID: VW4A091731 The enclosed device complies with Part 15 of the FCC Rules. Operation is

subject to the following two conditions: (i.) this device may not cause harmful interference and (ii.) this device

must accept any interference received, including interference that may cause undesired operation.

Any similar wording that expresses the same meaning may be used.

IMPORTANT: This equipment complies with Part 15 of the FCC Rules. Operation is subject to the following two

conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference

received, including interference that may cause undesired operation (FCC 15.19).

The internal antenna used for this mobile transmitter must provide a separation distance of at least 20 cm from all

persons and must not be colocated or operating in conjunction with any other antenna or transmitter.

Installers must be provided with antenna installation instructions and transmitter operating conditions for satisfying RF

exposure compliance. This device is approved as a mobile device with respect to RF exposure compliance, and may

only be marketed to OEM installers. Use in portable exposure conditions (FCC 2.1093) requires separate equipment

authorization.

IMPORTANT: Modif icati ons not expressly approved by this company could void the user's authority to operate this

equipment (FCC section 15.21).

IMPORTANT: This equipment has been tested and found to comply with the limits for a Class A digital device,

pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful

interference when the equipment is operated in a commercial environment. This equipment generates, uses, and

can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may

cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to

cause harmful interference in which case the user will be required to correct the interference at his own expense

(FCC section 15.105).

ATZB-X0-256-3-0-C ZigBit 2.4GH z Wireless Modules [DATASHEET]

42172B−WIRELESS−03/2014

7.2 European Union (ETSI)

The ATZB-X0-256-3-0-C Mo d u le has been certified for use in European Union countries. If these modules are

incorporated into a product, the manufacturer must ensure compliance of the final product to the European harmonized

EMC and lowvoltage/safety standards. A Declaration of Conformity must be issued for each of these standards and

kept on file as described in Annex II of the R&TTE Directive.

Furthermore, the manufacturer must maintain a copy of the modules' documentation and ensure the final product does

not exceed the specified power ratings, antenna specifications, and/or installation requirements as specified in the user

manual. If any of these specifications are exceeded in the final product, a submission must be made to a notified body

for compliance testing to all required standards.

IMPORTANT: The 'CE' marking must be affixed to a visible location on the OEM product. The CE mark shall

consist of the initials "CE" taking the following form:

The CE marking must have a height of at least 5mm except where this is not possible on account of the nature of the

apparatus.

The CE marking must be affixed visibly, legibly, and indelibly.

More detailed information about CE marking requirements you can find at "DIRECTIVE 1999/5/EC OF THE

EUROPEAN PARL I AMENT AND OF THE COUNCIL" on 9 March 1999 at section 12.

7.3 Industry Canada (IC) Compliance statements

This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two

conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including

interference that may cause undesired operation of the device.

Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence.

L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2)

l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en

compromettre le fonctionnement.

This equipment complies with radio frequency exposure limits set forth by Industry Canada for an uncontrolled

environment. This equipment should be installed and operated with minimum distance 20 cm between the device and

the user or bystanders.

Cet équipement est conforme aux limites d'exposition aux radiofréquences définies par Industrie Canada pour un

environnement non contrôlé. Cet équipement doit être installé et utilisé avec un minimum de 20 cm de distance entre le

dispositif et l'utilisateur ou des tiers

CAUTION: Any changes or modifications not expressly approved by the party responsible for compliance could void the

user’s authority to operate the equipment.

The OEM integrator is still responsible for testing their end-product for any additional compliance requirements required

with this module installed (for example, digital device emissions, PC peripheral requirements, etc.).

This Module is labelled with its own IC ID. If the IC ID Certification Number is not visible while installed inside another

device, then the device should display the label on it referring the enclosed module. In that case, the final end product

must be labelled in a visible area with the following:

“Contains Transmitter Module IC:11019A-091731”

“Contains IC: 11019A-091731”

ATZB-X0-256-3-0-C ZigBit 2.4GH z Wireless Modules [DATASHEET]

42172B−WIRELESS−03/2014

Ce module est étiqueté avec son propre ID IC. Si le numéro de certification IC ID n'est pas visible lorsqu'il est installé à

l'intérieur d'un autre appareil, l'appareil doit afficher l'étiquette sur le module de référence ci-joint. Dans ce cas, le

produit final doit être étiqueté dans un endroit visible par le texte suivant:

“Contains Transmitter Module IC: 11019A-091731”

“Contains IC: 11019A-091731”

ATZB-X0-256-3-0-C ZigBit 2.4GH z Wireless Modules [DATASHEET]

42172B−WIRELESS−03/2014

8. Revision History

Doc. Rev. Date Comments

42172B 04/2014 Removed a table note below Table 3-8

42172A 11/2013 Initial revision.

Atmel Cor pora ti on

1600 Technology Drive

San Jose, CA 95110

USA

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