SFH 3710-3/4-Z - OSRAM OPTO SEMICONDUCTORS

2016-02-29 1

2016-0 2-29

Silicon NPN Phototransistor with Vλ Characteristics

Version 1.3

SFH 3710

Ordering Information

Features:

•Spectral range of sensitivity: (typ) 350 ... 950 nm

•Package: Chipled (EIA 0805)

•Special: Adapted to human eye sensitivity (Vλ)

•Very small SMT package

Applications

•For control and drive circuits

•Ambient light detector

•Exposure meter for daylight and artificial light

•Sensor for backlight-dimming

Type: Photocurrent Ordering Code

IPCE [µA]

λ = 560 nm, Ee = 10 µW/cm2, VCE

= 5 V

SFH 3710 2.5 ... 12.5 Q65110A3107

SFH 3710-2/3 2.5 ... 8 Q65110A3512

SFH 3710-3/4 4 ... 12.5 Q65110A3511

Note: Single bins on request

2016-02-29 2

Version 1.3 SFH 3710

Maximum Ratings (TA = 25 °C)

Characteristics (TA = 25 °C)

Parameter Symbol Values Unit

Operating and storage temperature range Top; Tstg -40 ... 85 °C

Collector-emitter voltage VCE 5.5 V

Collector current IC20 mA

Emitter-collector voltage VEC 0.5 V

ESD withstand voltage

(acc. to ANSI/ ESDA/ JEDEC JS-001 - HBM)

VESD 2000 V

Parameter Symbol Values Unit

Wavelength of max. sensitivity (typ) λS max 570 nm

Spectral range of sensitivity (typ) λ10% (typ) 350

... 950

Radiant sensitive area (typ) A 0.29 mm2

Dimensions of chip area (typ) L x W (typ) 0.75 x

0.75

mm x

Half angle (typ) ϕ ± 60 °

Capacitance

(VCE = 0 V, f = 1 MHz, E = 0)

(typ) CCE 4 pF

Dark current

(VCE = 5 V, E = 0)

(typ (max)) ICE0 3 (≤ 50) nA

Temperature coefficient

(Std. Light A)

(typ) TC 0.9 % / K

Temperature coefficient

(λ = 550 nm)

(typ) TC 0.78 % / K

Version 1.3 SFH 3710

2016-02-29 3

Grouping (TA = 25 °C, λ = 560 nm)

Group Min Photocurrent Max Photocurrent Typ Photocurrent Collector-emitter

saturation

voltage

Ee = 10 µW/cm2,

VCE = 5 V

Ee = 10 µW/cm2,

VCE = 5 V

EV = 1000 lx, Std.

Light A, VCE = 5 V

IC = IPCEmin x 0.3, Ee

= 10 µW/cm2

IPCE, min [µA] IPCE, max [µA] IPCE [µA] VCEsat [mV]

SFH 3710-2 2.5 5 220 100

SFH 3710-3 4 8 350 100

SFH 3710-4 6.3 12.5 570 100

Note.: IPCEmin is the min. photocurrent of the specified group

Relative Spectral Sensitivity 1) page 11

Srel = f(λ)

Photocurrent 1) page 11

IPCE = f(EV)

400

0nm

OHF04047

100

rel

500 600 700 800 900 1100

OHF04055

PCE

100101102103104105

-4

-3

10-2

-1

100

102

2016-02-29 4

Version 1.3 SFH 3710

Photocurrent 1) page 11

IPCE = f(EV)

Collector-Emitter Capacitance 1) page 11

CCE = f(VCE), f = 1 MHz, E = 0

Directional Characteristics 1) page 11

Srel = f(ϕ)

OHF04056

100

100101102103104105

PCE rel

OHF04052

10-3 10-2 10-1 100101102

0.5

1.0

1.5

2.0

2.5

3.0

4.0

OHF01402

40 30 20 10

20 40 60 80 100 1200.40.60.81.0

0.2

0.4

0.6

0.8

1.0

100 0

Version 1.3 SFH 3710

2016-02-29 5

Package Outline

Dimensions in mm (inch).

Package

Chipled (EIA 0805)

Approximate Weight:

3.76 mg

GEOY7009

0.5 (0.020)

0.3 (0.012)

0.4 (0.016)

0.2 (0.008)

0.65 (0.026)

0.95 (0.037)

1.5 (0.059)

1.3 (0.051)

1.35 (0.053)

1.15 (0.045)

1.0 (0.039)

0.8 (0.031)

1.9 (0.075)

2.1 (0.083)

Collector mark

2016-02-29 6

Version 1.3 SFH 3710

Recommended Solder Pad

Dimensions in mm.

Reflow Soldering Profile

Product complies to MSL Level 2 acc. to JEDEC J-STD-020D.01

OHFP2578

3.2

1.25

Component location on pad

Bauteil positioniert

OHA04525

100

150

200

250

300

50 100 150 200 250 300

˚C

240 ˚C

217 ˚C

245 ˚C

25 ˚C

Version 1.3 SFH 3710

2016-02-29 7

Taping

Dimensions in mm (inch).

OHA04612

Profile Feature

Profil-Charakteristik

Ramp-up rate to preheat*)

25 °C to 150 °C

2 3 K/s

Time tS

TSmin to TSmax

100 12060

10 20 30

80 100

217

2 3

245 260

3 6

Time

25 °C to TP

Time within 5 °C of the specified peak

temperature TP - 5 K

Ramp-down rate*

TP to 100 °C

All temperatures refer to the center of the package, measured on the top of the component

* slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range

Ramp-up rate to peak*)

TSmax to TP

Liquidus temperature

Peak temperature

Time above liquidus temperature

Symbol

Unit

Einheit

Pb-Free (SnAgCu) Assembly

Minimum MaximumRecommendation

K/s

°C

480

2016-02-29 8

Version 1.3 SFH 3710

Tape dimensions [mm]

Tape dim ensions in m m

Reel dimensions [mm]

Reel dim ensions in m m

Barcode-Product-Label (BPL)

Tape and Reel

8 mm tape with 3000 pcs. on ∅ 180 mm reel

WP0P1P2D0E F

8 + 0.3 / -0.1 4 ± 0.1 2 ± 0.05

4 ± 0.1

2 ± 0.05 1.5 ± 0.1 1.75 ± 0.1 3.5 ± 0.05

A W Nmin W1W2max

180 8 60 8.4 + 2 14.4

F E

Direction of unreeling

OHAY0324

Label

Leader:

Trailer:

13.0

Direction of unreeling

±0.25

min. 160 mm *

min. 400 mm *

*) Dimensions acc. to IEC 60286-3; EIA 481-D

OHA04563

(G) GROUP:

1234567890(1T) LOT NO: (9D) D/C: 1234

(X) PROD NO: 123456789

(6P) BATCH NO: 1234567890

LX XXXX

RoHS Compliant

BIN1: XX-XX-X-XXX-X

XTemp ST

XXX °C X

Pack: RXX

DEMY XXX

X_X123_1234.1234 X

9999(Q)QTY:

Semiconductors

OSRAM Opto

XX-XX-X-X

EXAMPLE

X_X123_1234.1234 XX_X123_1234.1234 X

EXAMPLE

XXXXXX

X_X123_1234.1234 XX_X123_1234.1234 X

XX-XX-X-XXX-XX-X-X

EXAMPLE

XXXXXX

X_X123_1234.1234 XX_X123_1234.1234 X

XX-XX-X-XXX-XX-X-X

EXAMPLE

Pack: RXX

XXX

X_X123_1234.1234 XX_X123_1234.1234 X

XX-XX-X-X

EXAMPLE

Pack: RXXPack: RXX

DEMY DEMY

EXAMPLE

12341234

EXAMPLE

(9D) D/C:(9D) D/C:

12341234

EXAMPLE

1234

EXAMPLE

Pack: RXXPack: RXX

DEMY

EXAMPLE

(9D) D/C:(9D) D/C:

EXAMPLE

(9D) D/C:

1234

EXAMPLE

(9D) D/C:

EXAMPLE

12345678901234567890

EXAMPLE

(6P) BATCH NO:(6P) BATCH NO:

12345678901234567890

SemiconductorsSemiconductors

EXAMPLE

(6P) BATCH NO:(6P) BATCH NO:

12345678901234567890

EXAMPLE

SemiconductorsSemiconductors

OSRAM OptoOSRAM Opto

EXAMPLE

1234567890

X_X123_1234.1234 X

Pack: RXX

DEMY

X_X123_1234.1234 X

(9D) D/C:

1234

(9D) D/C:

1234567890

(6P) BATCH NO:

1234567890

OSRAM Opto

XXX

X_X123_1234.1234 X

XX-XX-X-X

Pack: RXX

DEMY

Semiconductors

Version 1.3 SFH 3710

2016-02-29 9

Dry Packing Process and Materials

Note:

Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card.

Regarding dry pack you will find further information in the internet. Here you will also find the normative

references like JEDEC.

Transportation Packing and Materials

Dimensions of transportation box in mm

Width Length Height

200 ± 5 195 ± 5 30 ± 5

OHA00539

OSRAM

Moisture-sensitive label or print

Barcode label

Desiccant

Humidity indicator

Barcode label

OSRAM

Please check the HIC immidiately after

bag opening.

Discard if circles overrun.

Avoid metal contact.

WET

Do not eat.

Comparator

check dot

parts still adequately dry.

examine units, if necessary

15%

10% bake units

bake units

If wet,

change desiccant

If wet,

Humidity Indicator

MIL-I-8835

If wet,

Moisture Level 3 Floor time 168 Hours Moisture Level 6 Floor time 6 Hours

a) Humidity Indicator Card is > 10% when read at 23 ˚C ± 5 ˚C, or

reflow, vapor-phase reflow, or equivalent processing (peak package

2. After this bag is opened, devices that will be subjected to infrared

1. Shelf life in sealed bag: 24 months at < 40 ˚C and < 90% relative humidity (RH).

Moisture Level 5a

at factory conditions of

(if blank, seal date is identical with date code).

a) Mounted within

b) Stored at

body temp.

3. Devices require baking, before mounting, if:

Bag seal date

Moisture Level 1

Moisture Level 2

Moisture Level 2a

4. If baking is required,

b) 2a or 2b is not met.

Date and time opened:

reference IPC/JEDEC J-STD-033 for bake procedure.

Floor time see below

If blank, see bar code label

Floor time > 1 Year

Floor time 1 Year

Floor time 4 Weeks

10% RH.

Moisture Level 4

Moisture Level 5

˚C).

OPTO SEMICONDUCTORS

MOISTURE SENSITIVE

This bag contains

CAUTION

Floor time 72 Hours

Floor time 48 Hours

Floor time 24 Hours

30 ˚C/60% RH.

LEVEL

If blank, see

bar code label

OHA02044

PACKVAR:

R077

Additional TEXT

P-1+Q-1

Multi TOPLED

Muster

OSRAM Opto

Semiconductors

(6P) BATCH NO:

(X) PROD NO:

(9D) D/C:

(1T) LOT NO:

210021998

123GH1234

024 5

(Q)QTY:2000

0144

(G) GROUP:

260 C RT

240 C R

220 C R

Bin3:

Bin2: Q-1-20

Bin1: P-1-20

LSY T676

Temp ST

R18DEMY

PACKVAR:

R077

Additional TEXT

P-1+Q-1

Multi TOPLED

Muster

OSRAM Opto

Semiconductors

(6P) BATCH NO:

(X) PROD NO:

(9D) D/C:

(1T) LOT NO:

210021998

123GH1234

4 5

(Q)QTY:2000

0144

(G) GROUP:

260 C RT

240 C R

220 C R

Bin3:

Bin2: Q-1-20

Bin1: P-1-20

LSY T676

Temp ST

R18DEMY

OSRAM

Packing

Sealing label

Barcode label

Moisture Level 3 Floor time 168 Hours Moisture Level 6 Floor time 6 Hours

a) Humidity Indicator Card is > 10% when read at 23 ˚C ± 5 ˚C, or

reflow, vapor-phase reflow, or equivalent processing (peak package

2. After this bag is opened, devices that will be subjected to infrared

1. Shelf life in sealed bag: 24 months at < 40 ˚C and < 90% relative humidity (RH).

Moisture Level 5a

at factory conditions of

(if blank, seal date is identical with date code).

a) Mounted within

b) Stored at

body temp.

3. Devices require baking, before mounting, if:

Bag seal date

Moisture Level 1

Moisture Level 2

Moisture Level 2a

4. If baking is required,

b) 2a or 2b is not met.

Date and time opened:

reference IPC/JEDEC J-STD-033 for bake procedure.

Floor time see below

If blank, see bar code label

Floor time > 1 Year

Floor time 1 Year

Floor time 4 Weeks

10% RH.

Moisture Level 4

Moisture Level 5

˚C).

OPTO SEMICONDUCTORS

MOISTURE SENSITIVE

This bag contains

CAUTION

Floor time 72 Hours

Floor time 48 Hours

Floor time 24 Hours

30 ˚C/60% RH.

LEVEL

If blank, see

bar code label

Barcode label

2016-02-29 10

Version 1.3 SFH 3710

Disclaimer

Language english will prevail in case of any discrepancies or deviations between the two language wordings.

Attention please!

The information describes the type of component and shall not be considered as assured characteristics.

Terms of delivery and rights to change design reserved. Due to technical requirements components may contain

dangerous substances.

For information on the types in question please contact our Sales Organization.

If printed or downloaded, please find the latest version in the Internet.

Packing

Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office.

By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing

material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any

costs incurred.

Components used in life-support devices or systems must be expressly authorized for such purpose!

Critical components* may only be used in life-support devices** or systems with the express written approval of

OSRAM OS.

*) A critical component is a component used in a life-support device or system whose failure can reasonably be

expected to cause the failure of that life-support device or system, or to affect its safety or the effectiveness of that

device or system.

**) Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or

maintain and sustain human life. If they fail, it is reasonable to assume that the health and the life of the user may be

endangered.

Version 1.3 SFH 3710

2016-02-29 11

Glossary

1) Typical Values: Due to the special conditions of the manufacturing processes of LED, the typical data or

calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily

correspond to the actual parameters of each single product, which could differ from the typical data and calculated

correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data

will be changed without any further notice.

2016-02-29 12

Version 1.3 SFH 3710

Published by OSRAM Opto Semiconductors GmbH

Leibnizstraße 4, D-93055 Regensburg