IS21/22ES04G
Integrated Silicon Solution, Inc. – www.issi.com – 1
Rev. A7
10/19/2020
IS21ES04G
IS22ES04G
4GB eMMC with eMMC 5.0 Interface
DATA SHEET
IS21/22ES04G
Integrated Silicon Solution, Inc. – www.issi.com – 2
Rev. A7
10/19/2020
FEATURES
• Packaged NAND flash memory with eMMC 5.0 interface
• IS21/22ES04G: 4Gigabyte
• Compliant with eMMC Specification Ver.4.4, 4.41,4.5,5.0
• Bus mode
- High-speed eMMC protocol
- Clock frequency: 0-200MHz.
- Ten-wire bus (clock, 1 bit command, 8 bit data bus) and a hardware reset.
• Supports three different data bus widths : 1 bit(default), 4 bits, 8 bits
- Data transfer rate: up to 52Mbyte/s (using 8 parallel data lines at 52 MHz)
- Single data rate : up to 200Mbyte/s @ 200MHz (HS200)
- Dual data rate : up to 400Mbyte/s @ 200MHz (HS400)
• Operating voltage range :
- VCCQ = 1.8 V/3.3 V
- VCC = 3.3 V
• Supports Enhanced Mode where the device can be configured as pseudo-SLC (pSLC) for higher read/write
performance, endurance, and reliability.
• Error free memory access
- Internal error correction code (ECC) to protect data communication
- Internal enhanced data management algorithm
- Solid protection from sudden power failure, safe-update operations for data content
• Security
- Support secure bad block erase and trim commands
- Enhanced write protection with permanent and partial protection options
• Field Firmware Update(FFU)
• Boot Partition and RPMB Partition
• Enhanced Device Life time
• Pre EOL information
• Production State Awareness
• Power Off Notification for Sleep
• Operating Temperature:
- Industrial Grade : -40 ℃ ~ 85 ℃
- Automotive Grade (A1): -40 ℃ ~ 85 ℃
• Storage Temperature: -40 ℃ ~ 85 ℃
• Quality
- RoHS compliant (for detailed RoHS declaration, please contact your representative.)
• Package
- 153 FBGA (11.5mm x 13mm x 1.0mm)
- 100 FBGA (14.0mm x 18.0mm x 1.4mm)
4GB eMMC with eMMC 5.0 Interface
IS21/22ES04G
Integrated Silicon Solution, Inc. – www.issi.com – 3
Rev. A7
10/19/2020
GENERAL DESCRIPTION
ISSI eMMC products follow the JEDEC eMMC 5.0 standard. It is ideal for embedded storage solutions for Industrial
application and automotive application, which require high performance across a wide range of operating
temperatures.
eMMC encloses the MLC NAND and eMMC controller inside as one JEDEC standard package, providing a
standard interface to the host. The eMMC controller directly manages NAND flash, including ECC, wear-leveling,
IOPS optimization and read sensing.
IS21/22ES04G
Integrated Silicon Solution, Inc. – www.issi.com – 4
Rev. A7
10/19/2020
TABLE OF CONTENTS
FEATURES ............................................................................................................................................................ 2
GENERAL DESCRIPTION .................................................................................................................................... 3
TABLE OF CONTENTS ......................................................................................................................................... 4
1. PERFORMANCE SUMMARY ........................................................................................................................ 6
1.1 SYSTEM PERFORMANCE ....................................................................................................................... 6
1.2 POWER CONSUMPTION ......................................................................................................................... 6
1.3 BOOT PARTITION AND RPMB (REPLAY PROTECTED MEMORY BLOCK) ....................................... 6
1.4 USER DENSITY ........................................................................................................................................ 6
2. PIN CONFIGURATION ................................................................................................................................... 7
3. PIN DESCRIPTIONS ...................................................................................................................................... 9
4. eMMC Device and System ........................................................................................................................... 10
5. REGISTER SETTINGS................................................................................................................................. 11
5.1 OCR Register ................................................................................................................................................ 11
5.2 CID Register ........................................................................................................................................... 11
5.3 CSD Register .......................................................................................................................................... 12
5.4 Extended CSD Register ......................................................................................................................... 14
5.5 RCA Register .......................................................................................................................................... 20
5.6 DSR Register .......................................................................................................................................... 20
6. The eMMC BUS ............................................................................................................................................ 21
7. POWER-UP .................................................................................................................................................. 22
7.1 eMMC POWER-UP ................................................................................................................................. 22
7.2 eMMC POWER-CYCLING ...................................................................................................................... 23
8. ELECTRICAL CHARACTERISTICS ............................................................................................................. 24
8.1 ABSOLUTE MAXIMUM RATINGS (1) POWER CONSUMPTION .......................................................... 24
8.2 Operating Conditions ............................................................................................................................ 24
8.2.1 POWER SUPPLY: eMMC ....................................................................................................................... 25
8.2.2 eMMC Power Supply Voltage ............................................................................................................... 25
8.2.3 BUS SIGNAL LINE LOAD ...................................................................................................................... 26
8.2.4 HS400 REFERENCE LOAD ................................................................................................................... 27
8.3 BUS SIGNAL LEVELS ............................................................................................................................ 28
8.3.1 BUS SIGNAL LINE LOAD ...................................................................................................................... 28
8.3.2 PUSH-PULL MODE BUS SIGNAL LEVEL-eMMC ................................................................................. 28
8.3.3 BUS OPERATING CONDITIONS for HS200 & HS400.......................................................................... 29
8.3.4 BUS DEVICE OUTPUT DRIVER REQUIREMENTS for HS200 & 400.................................................. 29
8.4 BUS TIMING ............................................................................................................................................ 29
8.5 DEVICE INTERFACE TIMIMG ................................................................................................................ 30
IS21/22ES04G
Integrated Silicon Solution, Inc. – www.issi.com – 5
Rev. A7
10/19/2020
8.6 BUS TIMING FOR DAT SIGNALS DURING DUAL DATA RATE OPERATION ................................... 32
8.6.1 DUAL DATA RATE INTERFACE TIMINGS ........................................................................................... 32
8.7 BUS TIMING SPECIFICATION IN HS400 MODE .................................................................................. 33
8.7.1 HS400 DEVICE OUTPUT TIMING .......................................................................................................... 34
9. PACKAGE TYPE INFORMATION ................................................................................................................ 36
10. ORDERING INFORMATION – Valid Part Numbers ................................................................................ 38
IS21/22ES04G
Integrated Silicon Solution, Inc. – www.issi.com – 6
Rev. A7
10/19/2020
1. PERFORMANCE SUMMARY
1.1 SYSTEM PERFORMANCE
Product
Typical value
Sequential Read
(MB/s)
Sequential Write
(MB/s)
Random Read
(IOPS)
Random Write
(IOPS)
IS21/22ES04G
272
14.6
4925
1205
Notes:
1. Values given for an 8-bit bus width, running HS400 mode, VCC=3.3V, VCCQ=1.8V.
2. Performance numbers might be subject to changes without notice.
3. eMMC Write Reliability ON
1.2 POWER CONSUMPTION
Product
Read (mA)
Write (mA)
Standby (mA)
VCCQ(1.8V)
VCC(3.3V)
VCCQ(1.8V)
VCC(3.3V)
IS21/22ES04G
186
47
80
46
0.090
Notes:
1. Values given for an 8-bit bus width, a clock frequency of 200MHz DDR mode, VCC= 3.6V±5%, VCCQ=1.95V±5%.
2. Standby current is measured at Vcc=3.3V±5 %, VCCQ=1.8V±5%, 8-bit bus width without clock frequency.
3. Current numbers might be subject to changes without notice.
1.3 BOOT PARTITION AND RPMB (REPLAY PROTECTED MEMORY BLOCK)
Option
Boot partition 1
Boot partition 2
RPMB
J
2048 KB
2048 KB
512 KB
B
16,384 KB
16,384 KB
128 KB
1.4 USER DENSITY
Total user density depends on device type.
Option
User Density
J
3,909,091,328 Bytes
B
3,825,205,248 Bytes
Note:
1. Current numbers might be subject to changes without notice.
IS21/22ES04G
Integrated Silicon Solution, Inc. – www.issi.com – 7
Rev. A7
10/19/2020
2. PIN CONFIGURATION
153 FBGA Top View (Ball Down)
NC NCNC NC NC
NC NC
DAT
4DAT
5
NC DAT
3NC
DAT
6DAT
7
NC NC
NC NC NCNC NC
DAT
0DAT
1
NC NC RFU
DAT
2VSS
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
1 2 345 6 78910 11 12 13 14
A
B
C
D
E
F
G
H
J
K
L
M
N
P
NC
eMMC SUPPLY GROUND
NC
NC NCNC NCNC
NC NC
NC NC NCNC NC
NC VSS
Q
VDD
INCNC VCC
Q
RFURFU RFU NCNC NC
NC
NC VSS
RFU VCC
RFU NCNC NC
NC
NC VCC
RFU NCNC NC
RFU
NC VSS
VSS NCNC NC
NC
NC DS
RFUVSS VCC NC
NC NCNCNC RFU
RST
_n RFU
VCC NCNC NC
NC
NC VSS
NCNC NC
NC
NC
NC NC
NC NC NCNC NC
NC VCC
Q
NC NCCMD CLK
NC NC
NC NC NCNC NC
NC VCC
Q
VSS
QNC
VSS
QNC
RFU NC
NC NC NCNC NC
VCC
QVSS
Q
NC RFU
VCC
QVSS
Q
1 2 345 6 78910 11 12 13 14
RFU
Note:
1. H5 (DS), A6 (VSS) and J5 (VSS) can be left floating if HS400 mode is not used.
IS21/22ES04G
Integrated Silicon Solution, Inc. – www.issi.com – 8
Rev. A7
10/19/2020
100 FBGA Top View (Ball Down)
1 2 345 6 78910
A
B
C
D
E
NC NC
NC
NC
RFU RFU RFU RFU RFU RFU RFU RFU
RFU RFU VDD
IRFU RFU RFU RFU RFU
F
G
H
J
VCC VCC VCC VCC VCC VCC VCC VCC
VSS VSS VSS VSS VSS VSS VSS VSS
VSS
QVCC
QRFU RFU RFU RFU VCC
QVSS
Q
RFU RFU RFU VSS RFU RFU RFU RFU
K
L
M
N
DAT
0DAT
2RFU DS RFU RFU DAT
5DAT
7
VCC
QVSS
QVCC
QRFU RFU VCC
QVSS
QVCC
Q
RFU RFU VSS
QRST
_n RFU VSS
QRFU RFU
DAT
1DAT
3RFU RFU RFU RFU DAT
4DAT
6
P
R
T
U
VSS
QVCC
QRFU CMD CLK RFU VCC
QVSS
Q
NC
NC NC NC
NC
NC
NC
NC
NC
eMMC SUPPLY GROUND
1 2 345 6 78910
RFU
Note:
1. K5 (DS) and J5 (VSS) can be left floating if HS400 mode is not used.
IS21/22ES04G
Integrated Silicon Solution, Inc. – www.issi.com – 9
Rev. A7
10/19/2020
3. PIN DESCRIPTIONS
Pin Name
Type(1)
Pin Function
CLK
I
DATA INPUT
Each cycle of this signal directs a one bit transfer on the command and either a
one bit (1x) or a two bits transfer (2x) on all the data lines. The frequency may
vary between zero and the maximum clock frequency
DAT0~DAT7
I/O/PP
DATA
These are bidirectional data channels. The DAT signals operate in push-pull
mode. Only the Device or the host is driving these signals at a time. By default,
after power up or reset, only DAT0 is used for data transfer. A wider data bus can
be configured for data transfer, using either DAT0-DAT3 or DAT0-DAT7, by the
eMMC host controller. The eMMC Device includes internal pull-ups for data lines
DAT1-DAT7. Immediately after entering the 4-bit mode, the Device disconnects
the internal pull ups of lines DAT1, DAT2, and DAT3. Correspondingly,
immediately after entering to the 8-bit mode the Device disconnects the internal
pull-ups of lines DAT1–DAT7.
CMD
I/O/PP/OD
COMMAND/RESPONSE
This signal is a bidirectional command channel used for Device initialization and
transfer of commands. The CMD signal has two operation modes: open-drain for
initialization mode, and push-pull for fast command transfer. Commands are sent
from the eMMC host controller to the eMMC Device and responses are sent from
the Device to the.host.
RST#
I
HARDWARE RESET
DS
O/PP
Data Strobe
This signal is generated by the device and used for output in HS400 mode. The
frequency of this signal follows the frequency of CLK. For data output each cycle
of this signal directs two bits transfer(2x) on the data - one bit for positive edge
and the other bit for negative edge. For CRC status response output and CMD
response output (enabled only HS400 enhanced strobe mode), the CRC status is
latched on the positive edge only, and don't care on the negative edge.
VDDI
INTERNAL VOLTAGE NODE
At least a 0.1uF capacitor is required to connect VDDI to ground. A 1uF capacitor
is recommended. Do not tie to supply voltage or ground.
VCC
-
POWER SUPPLY
VCC is the power supply for Core
VCCQ
-
POWER SUPPLY
VCC is the power supply for I/O
VSS
-
Ground
VSS is the ground for Core
VSSQ
-
GROUND
VSSQ is the ground for I/O
RFU
Reserved For Future Use
N.C.
NO CONNECTION
Lead is not internally connected.
Note:
1. I: input; O: output; PP: push-pull; OD: open-drain; NC: Not connected (or logical high); S: power supply
IS21/22ES04G
Integrated Silicon Solution, Inc. – www.issi.com – 10
Rev. A7
10/19/2020
4. eMMC Device and System
eMMC consists of a single chip MMC controller and NAND flash memory module. The micro-controller interfaces with a
host system allowing data to be written to and read from the NAND flash memory module. The controller allows the host
to be independent from details of erasing and programming the flash memory.
Figure 4.1 eMMC System Overview
SI (IO0)
WP# (IO2)
(IO3)
SO (IO1)
IS21/22ES04G
Integrated Silicon Solution, Inc. – www.issi.com – 11
Rev. A7
10/19/2020
5. REGISTER SETTINGS
5.1 OCR Register
The 32-bit operation conditions register (OCR) stores the VDD voltage profile of the Device and the access mode
indication. In addition, this register includes a status information bit. This status bit is set if the Device power up
procedure has been finished. The OCR register shall be implemented by all Devices.
Table 5.1 OCR Register
VCCQ Voltage Window
Width (Bits)
OCR Bit
OCR Value
Device power up status bit (busy)
(1)
1
[31]
Note 1
Access Mode
2
[30:29]
10b(sector mode)
Reserved
5
[28:24]
0 0000b
VCCQ: 2.7 – 3.6V
9
[23:15]
1 1111 1111b
VCCQ: 2.0 – 2.6V
7
[14:8]
000 0000b
VCCQ: 1.7 – 1.95V
1
[7]
1b
Reserved
7
[6:0]
000 0000b
Note:
1. This bit is set to LOW if the device has not finished the power up routine.
5.2 CID Register
The Card Identification (CID) register is 128 bits wide. It contains the Device identification information used
during the Device identification phase (eMMC protocol).
Table 5.2 CID Register
Name
Field
Width
(Bits)
CID Bits
CID Value
Manufacturer ID
MID
8
[127:120]
9Dh
Reserved
-
6
[119:114]
-
Device/BGA
CBX
2
[113:112]
1h
OEM/application ID
OID
8
[111:104]
1h
Product Name
PNM
48
[103:56]
IS004G
Product Revision
PRV
8
[55:48]
50h
Product Serial Number
PSN
32
[47:16]
Random by Production
Manufacturing Date
MDT
8
[15:8]
Month, Year
CRC7 Checksum
CRC
7
[7:1]
- (1)
Not used, always “1”
-
1
[0]
1h
Note:
1. The description is same as e.MMC ™ JEDEC standard.
IS21/22ES04G
Integrated Silicon Solution, Inc. – www.issi.com – 12
Rev. A7
10/19/2020
5.3 CSD Register
The Card-Specific Data (CSD) register provides information on how to access the contents stored in eMMC.
The CSD registers are used to define the error correction type, maximum data access time, data transfer
speed, data format…etc. For details, refer to section 7.3 of the JEDEC Standard Specification No.JESD84-
B50.
Table 5.3 CSD Register
Name
Field
Width
(Bits)
CSD Bits
CSD Value(1)
CSD Structure
CSD_STRUCTURE
2
[127:126]
3h
System Specification Version
SPEC_VERS
4
[125:122]
4h
Reserved (2)
-
2
[121:120]
-
Data Read Access Time 1
TAAC
8
[119:112]
4Fh
Data Read Access Time 2 in CLK
Cycles (NSAC x 100)
NSAC
8
[111:104]
1h
Maximum Bus Clock Frequency
TRAN_SPEED
8
[103:96]
32h
Card Command Classes
CCC
12
[95:84]
F5h
Maximum Read Data Block Length
READ_BL_LEN
4
[83:80]
9h
Partial Blocks for Reads supported
READ_BL_PARTIAL
1
[79]
0h
Write Block Misalignment
WRITE_BLK_MISALIGN
1
[78]
0h
Read Block Misalignment
READ_BLK_MISALIGN
1
[77]
0h
DS Register Implemented
DSR_IMP
1
[76]
0h
Reserved (2)
-
2
[75:74]
-
Device Size
C-SIZE
12
[73:62]
FFFh
Maximum Read Current at VDD
min
VDD_R_CURR_MIN
3
[61:59]
7h
Maximum Read Current at VDD
max
VDD_R_CURR_MAX
3
[58:56]
7h
Maximum Write Current at VDD
min
VDD_W_CURR_MIN
3
[55:53]
7h
Maximum Write Current at VDD
max
VDD_W_CURR_MAX
3
[52:50]
7h
Device Size Multiplier
C_SIZE_MULT
3
[49:47]
7h
Erase Group Size
ERASE_GRP_SIZE
5
[42:46]
1Fh
Erase Group Size Multiplier
ERASE_GRP_SIZE_MULT
5
[41:37]
1Fh
Write Protect Group Size
WR_GRP_SIZE
5
[36:32]
0Fh
Write Protect Group Enable
WR_GRP_ENABLE
1
[31]
1h
Manufacturer Default ECC
DEFAULT_ECC
2
[30:29]
0h
Write-Speed Factor
R2W_FACTOR
3
[28:26]
2h
IS21/22ES04G
Integrated Silicon Solution, Inc. – www.issi.com – 13
Rev. A7
10/19/2020
Name
Field
Width
(Bits)
CSD Bits
CSD Value(1)
Maximum Write Data Block Length
WRITE_BL_LEN
4
[25:22]
9h
Partial Blocks for Writes supported
WRITE_BL_PARTIAL
1
[21]
0h
Reserved (2)
-
4
[20:17]
-
Content Protection Application
CONTENT_PROT_APP
1
[16]
0h
File-Format Group
FILE_FORMAT_GRP
1
[15]
0h
Copy Flag (OTP)
COPY
1
[14]
0h
Permanent Write Protection
PERM_WRITE_PROTECT
1
[13]
0h
Temporary Write Protection
TEMP_WRITE_PROTECT
1
[12]
0h
File Format
FILE_FORMAT
2
[11:10]
0h
ECC
ECC
2
[9:8]
0h
CRC
CRC
7
[7:1]
30h
Not Used, always “1”
-
1
[0]
1h
Note:
1. CSD value might be subject to change without notice.
IS21/22ES04G
Integrated Silicon Solution, Inc. – www.issi.com – 14
Rev. A7
10/19/2020
5.4 Extended CSD Register
The Extended CSD register defines the Device properties and selected modes. It is 512 bytes long. The most
significant 320 bytes are the Properties segment, which defines the Device capabilities and cannot be modified
by the host. The lower 192 bytes are the Modes segment, which defines the configuration the Device is working
in. These modes can be changed by the host by means of the SWITCH command. For details, refer to section
7.4 of the JEDEC Standard Specification No.JESD84-B50.
Table 5.4 ECSD Register
Name
Field
Size
(Bytes)
ECSD Bits
ECSD Value
Reserved
-
6
[511:506]
-
Extended Security Commands
Error
EXT_SECURITY_ERR
1
[505]
0h
Supported Command Sets
S_CMD_SET
1
[504]
1h
HPI Features
HPI_FEATURES
1
[503]
1h
Background Operations Support
BKOPS_SUPPORT
1
[502]
1h
Max Packed Read Commands
MAX_PACKED_READS
1
[501]
3Ch
Max Packed Write Commands
MAX_PACKED_WRITES
1
[500]
3Ch
Data Tag Support
DATA_TAG_SUPPORT
1
[499]
1h
Tag Unit Size
TAG_UNIT_SIZE
1
[498]
3h
Tag Resources Size
TAG_RES_SIZE
1
[497]
0h
Context Management Capabilities
CONTEXT_CAPABILITIES
1
[496]
5h
Large Unit Size
LARGE_UNIT_SIZE_M1
1
[495]
03h
Extended Partitions Attribute
Support
EXT_SUPPORT
1
[494]
3h
Supported Modes
SUPPORT_MODES
1
[493]
1h
FFU Features
FFU_FEATURES
1
[492]
0h
Operations Code Timeout
OPERATION_CODE_TIEMOUT
1
[491]
0h
FFU Argument
FFU_ARG
4
[490:487]
65535
Reserved
-
181
[486:306]
-
Number of FW Sectors Correctly
Programmed
NUMBER_OF_FW_SECTORS_
CORRECTLY_PROGRAMMED
4
[305:302]
0h
Vendor Proprietary Health Report
VENDOR_PROPRIETARY_HE
ALTH_REPORT
32
[301:270]
0h
Device Life Time Estimation Type
B
DEVICE_LIFE_TIME_EST_TYP
_B
1
[269]
1h
Device Life Time Estimation Type
A
DEVICE_LIFE_TIME_EST_TYP
_A
1
[268]
1h
Pre EOL Information
PRE_EOL_INFO
1
[267]
1h
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Rev. A7
10/19/2020
Name
Field
Size
(Bytes)
ECSD Bits
ECSD
Value(1)
Optimal Read Size
OPTIMAL_READ_SIZE
1
[266]
1h
Optimal Write Size
OPTIMAL_WRITE_SIZE
1
[265]
4h
Optimal Trim Unit Size
OPTIMAL_TRIM_UNIT_SIZE
1
[264]
1h
Device Version
DEVICE_VERSION
2
[263:262]
0h
Firmware Version
FIRMWARE_VERSION
8
[261:254]
-
Power Class for 200MHz, DDR at
VCC=3.6V
PWR_CL_DDR_200_360
1
[253]
0h
Cache Size
CACHE_SIZE
4
[252:249]
1024
Generic CMD6 Timeout
GENERIC_CMD6_TIME
1
[248]
19h
Power Off Notification (Long)
Timeout
POWER_OFF_LONG_TIME
1
[247]
FFh
Background Operations Status
BKOPS_STATUS
1
[246]
0h
Number of Correctly Programmed
Sectors
CORRECTLY_PRG_SECTOR
S_NUM
4
[245:242]
0h
First Initialization Time After
Partitioning (First CMD1 to Device
ready)
INI_TIMEOUT_PA
1
[241]
64h
Reserved
-
1
[240]
-
-
Power Class for 52MHz, DDR at
3.6V
PWR_CL_DDR_52_360
1
[239]
0h
Power Class for 52MHz, DDR at
1.95V
PWR_CL_DDR_52_195
1
[238]
0h
Power Class for 200MHz at 3.6V
PWR_CL_200_360
1
[237]
0h
Power Class for 200MHz at 1.95V
PWR_CL_200_195
[236]
0h
Minimum Write Performance for 8-
bit at 52MHz in DDR Mode
MIN_PERF_DDR_W_8_52
1
[235]
0h
Minimum Read Performance for 8-
bit at 52MHz in DDR Mode
MIN_PERF_DDR_R_8_52
1
[234]
0h
Reserved
-
1
[233]
-
TRIM Multiplier
TRIM_MULT
1
[232]
11h
Secure Feature Support
SEC_FEATURE_SUPPORT
1
[231]
55h
SECURE ERASE Multiplier
SEC_ERASE_MULT
1
[230]
1Bh
SECURE TRIM Multiplier
SEC_TRIM_MULT
1
[229]
1Bh
Boot Information
BOOT_INFO
1
[228]
7h
Reserved
-
1
[227]
-
Boot Partition Size
BOOT_SIZE_MUL
T
J-Option
1
[226]
10h
B-Option
80h
IS21/22ES04G
Integrated Silicon Solution, Inc. – www.issi.com – 16
Rev. A7
10/19/2020
Name
Field
Size
(Bytes)
ECSD Bits
ECSD
Value(1)
Access Size
ACC_SIZE
1
[225]
6h
High-Capacity Erase Unit Size
HC_ERASE_GRP_SIZE
1
[224]
1h
High-Capacity Erase Timeout
ERASE_TIMEOUT_MULT
1
[223]
11h
Reliable Write-Sector Count
REL_WR_SEC_C
1
[222]
1h
High-Capacity Write Protect Group
Size
HC_WP_GRP_SIZE
1
[221]
10h
Sleep Current (VCC)
S_C_VCC
1
[220]
0Ah
Sleep Current (VCCQ)
S_C_VCCQ
1
[219]
0Bh
Production State Awareness
Timeout
PRODUCTION_STATE_AWAR
ENESS_TIMEOUT
1
[218]
14h
Sleep/Awake Timeout
S_A_TIMEOUT
1
[217]
13h
Sleep Notification Timeout
SLEEP_NOTIFICATION_TIME
1
[216]
0Fh
Sector Count
SEC_COUNT
J-Option
4
[215:212]
7634944(5)
B-Option
7471104(5)
Reserved
-
1
[211]
-
Minimum Write Performance for 8-
bit at 52MHz
MIN_PERF_W_8_52
1
[210]
8h
Minimum Read Performance for 8-
bit at 52MHz
MIN_PERF_R_8_52
1
[209]
8h
Minimum Write Performance for 8-
bit at 26MHz and 4-bit at 52MHz
MIN_PERF_W_8_26_4_52
1
[208]
8h
Minimum Read Performance for 8-
bit at 26MHz and 4-bit at 52MHz
MIN_PERF_R_8_26_4_52
1
[207]
8h
Minimum Write Performance for 4-
bit at 26MHz
MIN_PERF_W_4_26
1
[206]
8h
Minimum Read Performance for 4-
bit at 26MHz
MIN_PERF_R_4_26
1
[205]
8h
Reserved
-
1
[204]
-
Power Class for 26MHz at 3.6V
PWR_CL_26_360
1
[203]
0h
Power Class for 52MHz at 3.6V
PWR_CL_52_360
1
[202]
0h
Power Class for 26MHz at 1.95V
PWR_CL_26_195
1
[201]
0h
Power Class for 52MHz at 1.95V
PWR_CL_52_195
1
[200]
0h
Partition Switching Timing
PARTITION_SWITCH_TIME
1
[199]
3h
Out-of-Interrupt Busy Timing
OUT_OF_INTERRUPT_TIME
1
[198]
4h
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Rev. A7
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Name
Field
Size
(Bytes)
ECSD
Bits
ECSD
Value(1)
I/O Driver Strength
DRIVER_STRENGTH
1
[197]
1Fh
Card Type
CARD_TYPE
1
[196]
57h
Reserved
-
1
[195]
-
CSD Structure Version
CSD_STRUCTURE
1
[194]
2h
Reserved
-
1
[193]
-
Extended CSD Structure Revision
EXT_CSD_REV
1
[192]
7h
Command Set
CMD_SET
1
[191]
0h
Reserved
-
1
[190]
-
Command Set Revision
CMD_SET_REV
1
[189]
0h
Reserved
-
1
[188]
-
Power Class
POWER_CLASS
1
[187]
0h
Reserved
-
1
[186]
-
High-Speed Interface Timing
HS_TIMING
1
[185]
1h(3)
Reserved
-
1
[184]
-
Bus Width Mode
BUS_WIDTH
1
[183]
2h(4)
Reserved
-
1
[182]
-
Erased memory Content
ERASED_MEM_CONT
1
[181]
0h
Reserved
-
1
[180]
-
Partition Configuration
PARTITION_CONFIG
1
[179]
0h
Boot Configuration Protection
BOOT_CONFIG_PROT
1
[178]
0h
Boot Bus Width
BOOT_BUS_CONDITIONS
1
[177]
0h
Reserved
-
1
[176]
-
High-Density Erase Group
Definition
ERASE_GROUP_DEF
1
[175]
0h
Boot Write Protection Status
Registers
BOOT_WP_STATUS
1
[174]
0h
Boot Area Write Protection Register
BOOT_WP
1
[173]
0h
Reserved
-
1
[172]
-
User Write Protection Register
USER_WP
1
[171]
0h
Reserved
-
1
[170]
-
Firmware Configuration
FW_CONFIG
1
[169]
0h
RPMB Size
RPMB_SIZE_MUL
T
J-Option
1
[168]
04h
B-Option
01h
Write Reliability Setting Register
WR_REL_SET
1
[167]
1Fh
Write Reliability Parameter Register
WR_REL_PARAM
1
[166]
04h
Start Sanitize Operation
SANITIZE_START
1
[165]
0h
Manually Start Background
Operations
BKOPS_START
1
[164]
0h
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Name
Field
Size
(Bytes)
ECSD
Bits
ECSD
Value(1)
Enable Background Operations
Handshake
BKOPS_EN
1
[163]
0h
Hardware Reset Function
RST_n_FUNCTION
1
[162]
0h
HPI Management
HPI_MGMT
1
[161]
0h
Partitioning Support
PARTITIONING_SUPPORT
1
[160]
7h
Maximum Enhanced Area Size
MAX_ENH_SIZE
_MULT
J-Option
3
[159:157]
233
B-Option
228
Partitions Attribute
PATTITIONS_ATTRIBUTE
1
[156]
0h
Partitioning Setting
PARTITIONING_SETTING_CO
MPLETED
1
[155]
0h
General-Purpose Partition Size
GP_SIZE_MULT4
12
[154:152]
0h
GP_SIZE_MULT3
[151:149]
0h
GP_SIZE_MULT2
[148:146]
0h
GP_SIZE_MULT1
[145:143]
0h
Enhanced User Data Area Size
ENH_SIZE_MULT
3
[142:140]
0h
Enhanced User Data Start Address
ENH_START_ADDR
4
[139:136]
0h
Reserved
-
1
[135]
-
Bad Block Management mode
SEC_BAD_BLK_MGMNT
1
[134]
0h
Production State Awareness
PRODUCTION_STATE_AWAR
ENESS
1
[133]
0h
Package Case Temperature is
controlled
TCASE_SUPPORT
1
[132]
0h
Periodic Wake-Up
PERIODIC_WAKEUP
1
[131]
0h
Program CID/CSD in DDR Mode
Support
PROGRAM_CID_CSD_DDR_S
UPPORT
1
[130]
1h
Reserved
-
2
[129:128]
-
Vendor Specific Fields
VENDOR_SPECIFIC_NFIELD
64
[127:64]
-
Native Sector Size
NATIVE_SECTOR_SIZE
1
[63]
0h
Sector Size Emulation
USE_NATIVE_SECTOR
1
[62]
0h
Sector Size
DATA_SECTOR_SIZE
1
[61]
0h
1st Initialization After Disabling
Sector Size Emulation
INI_TIMEOUT_EMU
1
[60]
0h
Class 6 Command Control
CLASS_6_CTRL
1
[59]
0h
Number of Addressed Groups To
Be Released
DYNCAP_NEEDED
1
[58]
0h
Exception Events Control
EXCEPTION_EVENTS_CTRL
2
[57:56]
0h
Exception Events Status
EXCEPTION_EVENTS_STAT
US
2
[55:54]
0h
Extended Partitions Attribute
EXT_PARTITIONS_ATTRIBUT
E
2
[53:52]
0h
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Name
Field
Size
(Bytes)
ECSD
Bits
ECSD
Value(1)
Context Configuration
CONTEXT_CONF
15
[51:37]
0h
Packed Command Status
PACKED_COMMAND_STATU
S
1
[36]
0h
Packed Command Failure Index
PACKED_FAILURE_INDEX
1
[35]
0h
Power Off Notification
POWER_OFF_NOTIFICATION
1
[34]
0h
Control To Turn The Cache
ON/OFF
CACHE_CTRL
1
[33]
0h
Flushing Of The Cache
FLUSH_CACHE
1
[32]
0h
Reserved
-
1
[31]
-
Mode Config
MODE_CONFIG
1
[30]
0h
Mode Operation Codes
MODE_OPERATION_STATUS
1
[29]
0h
Reserved
-
2
[28:27]
-
FFU Status
FFU_STATUS
1
[26]
0h
Pre Loading Data Size
PRE_LOADING_DATA_SIZE
4
[25:22]
0h
Max Pre Loading Data Size
MAX_PRE_LOADI
NG_DATA_SIZE
J-Option
4
[21:18]
3784704(5)
B-Option
3702784(5)
Product State Awareness
Enablement
PRODUCT_STATE_AWAREN
ESS_ENABLEMENT
1
[17]
1h
Secure Removal Type
SECURE_REMOVAL_TYPE
1
[16]
1h
Command Queue Mod Enable
CMQ_MODE_EN
1
[15]
0h
Reserved
-
15
[14:0]
-
Note:
1. Reserved bits should read as “0”.
2. Obsolete values should be don’t care.
3. This field is 0 after power-on, H/W reset or software reset, thus selecting the backwards compatible interface timing
for the Device. If the host sets 1 to this field, the Device changes the timing to high speed interface timing (see
Section 10.6.1 of JESD84-B50). If the host sets value 2, the Device changes its timing to HS200 interface timing (see
Section 10.8.1 of JESD854-B50). If the host sets HS_TIMING [3:0] to 0x3, the device changes it’s timing to HS400
interface timing (see 10.10).
4. It is set to “0” (1bit data bus) after power up and can be changed by a SWITCH command.
5. Could be changed by Formware update
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5.5 RCA Register
The writable 16-bit Relative Device Address (RCA) register carries the Device address assigned by the host
during the Device identification. This address is used for the addressed host-Device communication after the
Device identification procedure. The default value of the RCA register is 0x0001. The value 0x0000 is reserved
to set all Devices into the Stand-by State with CMD7. For detailed register setting value, please refer to FAE.
5.6 DSR Register
The 16-bit driver stage register (DSR) is described in detail in Section 7.6 of the JEDEC Standard Specification
No.JESD84-B50. It can be optionally used to improve the bus performance for extended operating conditions
(depending on parameters like bus length, transfer rate or number of Devices). The CSD register carries the
information about the DSR register usage. For detailed register setting value, please refer to FAE.
Table 5.1 eMMC Registers
Name
Width
(Bytes)
Description
Implementation
CID
16
Device Identification number, an individual number for identification.
Mandatory
RCA
2
Relative Device Address is the Device system address, dynamically
assigned by the host during initialization.
Mandatory
DSR
2
Driver Stage Register, to configure the Device’s output drivers.
Optional
CSD
16
Device Specific Data, information about the Device operation
conditions.
Mandatory
OCR
4
Operation Conditions Register. Used by a special broadcast command
to identify the voltage type of the Device.
Mandatory
EXT_CSD
512
Extended Device Specific Data. Contains information about the Device
capabilities and selected modes. Introduced in standard v4.0
Mandatory
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6. The eMMC BUS
The eMMC bus has ten communication lines and three supply lines:
• CMD： Command is a bidirectional signal. The host and Device drivers are operating in two
modes, open drain and push/pull.
• DAT0-7： Data lines are bidirectional signals. Host and Device drivers are operating in push-pull
mode
• CLK： Clock is a host to Device signal. CLK operates in push-pull mode
• Data Strobe: Data Strobe is a Device to host signal. Data Strobe operates in push-pull mode.
Figure 6.1 BUS Circuitry Diagram
The ROD is switched on and off by the host synchronously to the open-drain and push-pull mode transitions. The
host does not have to have open drain drivers, but must recognize this mode to switch on the ROD. RDAT and RCMD
are pull-up resistors protecting the CMD and the DAT lines against bus floating device when all device drivers are
in a high-impedance mode.
A constant current source can replace the ROD by achieving a better performance (constant slopes for the signal
rising and falling edges). If the host does not allow the switchable ROD implementation, a fixed RCMD can be
used).Consequently the maximum operating frequency in the open drain mode has to be reduced if the used
RCMD value is higher than the minimal one given in.
RData strobe is pull-down resistor used in HS400 device.
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7. POWER-UP
7.1 eMMC POWER-UP
An eMMC bus power-up is handled locally in each device and in the bus master. 7.1 shows the power-up
sequence and is followed by specific instructions regarding the power-up sequence. Refer to section 10.1 of the
JEDEC Standard Specification No.JESD84-B50 for specific instructions regarding the power-up sequence.
Figure 7.1 eMMC POWER-UP Diagram
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7.2 eMMC POWER-CYCLING
The master can execute any sequence of VCC and VCCQ power-up/power-down. However, the master must not
issue any commands until VCC and VCCQ are stable within each operating voltage range. After the slave enters
sleep mode, the master can power-down VCC to reduce power consumption. It is necessary for the slave to be
ramped up to VCC before the host issues CMD5 (SLEEP_AWAKE) to wake the slave unit. For more information
about power cycling see Section 10.1.3 of the JEDEC Standard Specification No.JESD84-B50.
Figure 7.2 eMMC POWER-CYCLE
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Rev. A7
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8. ELECTRICAL CHARACTERISTICS
8.1 ABSOLUTE MAXIMUM RATINGS (1) POWER CONSUMPTION
Input Voltage
-0.6V to +4.6V
VCC Supply
-0.6V to +4.6V
VCCQ Supply
-0.6V to +4.6V
Notes:
1. Applied conditions greater than those listed in “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at these or any other conditions above
those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect reliability.
8.2 Operating Conditions
Parameter
Symbol
Min
Max.
Unit
Remark
Peak voltage on all lines
-0.5
VCCQ
+ 0.5
V
All Inputs
Input Leakage Current (before initialization sequence and/or the
internal pull up resistors connected)
-100
100
μA
Input Leakage Current (after initialization sequence and the
internal pull up resistors disconnected)
-2
2
μA
All Outputs
Output Leakage Current (before initialization sequence)
-100
100
μA
Output Leakage Current (after initialization sequence)
-2
2
μA
Notes:
1. Initialization sequence is defined in Section 10.1 of the JEDEC Standard Specification No.JESD84-B50.
2. DS (Data Strobe) pin is excluded.
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8.2.1 POWER SUPPLY: eMMC
In the eMMC, VCC is used for the NAND flash device and its interface voltage; VCCQ is for the controller and the
MMC interface voltage as shown in Figure 8.1. The core regulator is optional and only required when internal
core logic voltage is regulated from VCCQ. A CReg capacitor must be connected to the VDDi terminal to stabilize
regulator output on the system.
Figure 8.1 eMMC Internal Power Diagram
8.2.2 eMMC Power Supply Voltage
The eMMC supports one or more combinations of VCC and VCCQ as shown in Table 8.1. The VCCQ must be
defined at equal to or less than VCC.
Table 8.1 – eMMC Operating Voltage
Parameter
Symbol
MIN
MAX
Unit
Remarks
Supply voltage (NAND)
VCC
2.7
3.6
V
Supply voltage (I/O)
VCCQ
2.7
3.6
V
1.7
1.95
V
Supply power-up for 3.3V
tPRUH
35
ms
Supply power-up for 1.8V
tPRUL
25
ms
The eMMC must support at least one of the valid voltage configurations, and can optionally support all
valid voltage configurations.
Table 8.2 – eMMC Voltage Combinations
VCCQ
1.7V–1.95V
2.7V–3.6V1
Vcc
2.7V-3.6V
Valid
Valid
Note:
1. VCCQ (I/O) 3.3 volt range is not supported in HS200 /HS400 devices.
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8.2.3 BUS SIGNAL LINE LOAD
The total capacitance CL of each line of the eMMC bus is the sum of the bus master capacitance CHOST, the bus
capacitance CBUS itself and the capacitance CDEVICE of eMMC connected to this line:
CL = CHOST + CBUS + CDEVICE
The sum of the host and bus capacitances must be under 20pF.
Table 8.3 – Signal Line Load
Parameter
Symbol
Min
Max
Unit
Remark
Pull-up resistance for
CMD
RCMD
4.7
50
Kohm
to prevent bus floating
Pull-up resistance for
DAT0–7
RDAT
10
50
Kohm
to prevent bus floating
Bus signal line
capacitance
CL
30
pF
Single Device
Single Device capacitance
CDEVICE
6
pF
Maximum signal line
inductance
16
nH
VCCQ decoupling capacitor
2.2+0.1
4.7+0.22
μF
It should be located as close as possible to the
balls defined in order to minimize connection
parasitic
VCC capacitor value
1+0.1
4.7+0.22
μF
It should be located as close as possible to the
balls defined in order to minimize connection
parasitic
VDDi capacitor value
CREG
1
4.7+0.1
μF
To stabilize regulator output to controller core
logics. It should be located as close as possible to
the balls defined in order to minimize
connection parasitic
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8.2.4 HS400 REFERENCE LOAD
The circuit in Figure 8.2 shows the reference load used to define the HS400 Device Output Timings and
overshoot / undershoot parameters.
The reference load is made up by the transmission line and the CREFERENCE capacitance.
The reference load is not intended to be a precise representation of the typical system environment nor a
depiction of the actual load presented by a production tester.
System designers should use IBIS or other simulation tools to correlate the reference load to system
environment. Manufacturers should correlate to their production test conditions.
Delay time (td) of the transmission line has been introduced to make the reference load independent from the
PCB technology and trace length.
Figure 8.2 HS400 Reference Load
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Rev. A7
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8.3 BUS SIGNAL LEVELS
As the bus can be supplied with a variable supply voltage, all signal levels are related to the supply voltage.
Figure 8.3 BUS Signal Levels
8.3.1 BUS SIGNAL LINE LOAD
The total capacitance CL of each line of the eMMC bus is the sum of the bus master capacitance CHOST, the bus
capacitance CBUS itself and the capacitance CDEVICE of eMMC connected to this line:
CL = CHOST + CBUS + CDEVICE
The sum of the host and bus capacitances must be under 20pF.
Table 8.4 – Open-drain Bus Signal Level
Parameter
Symbol
Min
Max.
Unit
Conditions
Output HIGH voltage
VOH
VDD – 0.2
V
IOH = -100 μA
Output LOW voltage
VOL
0.3
V
IOL = 2 mA
The input levels are identical with the push-pull mode bus signal levels.
8.3.2 PUSH-PULL MODE BUS SIGNAL LEVEL-eMMC
The device input and output voltages shall be within the following specified ranges for any VDD of the allowed
voltage range
For 2.7V-3.6V VCCQ range (compatible with JESD8C.01)
Table 8.5 – Push-pull Signal Level—High-voltage eMMC
Parameter
Symbol
Min
Max.
Unit
Conditions
Output HIGH voltage
VOH
0.75 * VCCQ
V
IOH = -100 μA @ VCCQ min
Output LOW voltage
VOL
0.125 * VCCQ
V
IOL = 100 μA @ VCCQ min
Input HIGH voltage
VIH
0.625 * VCCQ
VCCQ + 0.3
V
Input LOW voltage
VIL
VSS – 0.3
0.25 * VCCQ
V
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Rev. A7
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For 1.70V – 1.95V VCCQ range (: Compatible with EIA/JEDEC Standard “EIA/JESD8-7 Normal Range” as defined
in the following table.
Table 8.6 – Push-pull Signal Level—1.70 -1.95 VCCQ Voltage Range
Parameter
Symbol
Min
Max.
Unit
Conditions
Output HIGH voltage
VOH
VCCQ – 0.45V
V
IOH = -2mA
Output LOW voltage
VOL
0.45V
V
IOL = 2mA
Input HIGH voltage
VIH
0.65 * VCCQ 1
VCCQ + 0.3
V
Input LOW voltage
VIL
VSS – 0.3
0.35 * VDD2
V
Notes:
1. 0.7 * VDD for MMC™4.3 and older revisions /HS400 devices.
2. 0.3 * VDD for MMC™4.3 and older revisions.
8.3.3 BUS OPERATING CONDITIONS for HS200 & HS400
The bus operating conditions for HS200 devices is the same as specified in sections 10.5.1 of JESD84-B50 through
13.5.2 of JESD84-B50. The only exception is that VCCQ=3.3v is not supported.
8.3.4 BUS DEVICE OUTPUT DRIVER REQUIREMENTS for HS200 & 400
Refer to section 10.5.4 of the JEDEC Standard Specification No.JESD84-B50.
8.4 BUS TIMING
Figure 8.4 BUS Timing Diagram
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8.5 DEVICE INTERFACE TIMIMG
Table 8.7 – High-speed Device Interface Timing
Parameter
Symbol
Min
Max.
Unit
Remark
Clock CLK1
Clock frequency Data Transfer Mode
(PP)2
fPP
0
523
MHz
CL ≤ 30 pF
Tolerance:+100KHz
Clock frequency Identification Mode
(OD)
fOD
0
400
kHz
Tolerance: +20KHz
Clock high time
tWH
6.5
ns
CL ≤ 30 pF
Clock low time
tWL
6.5
ns
CL ≤ 30 pF
Clock rise time4
tTLH
3
ns
CL ≤ 30 pF
Clock fall time
tTHL
3
ns
CL ≤ 30 pF
Inputs CMD, DAT (referenced to CLK)
Input set-up time
tISU
3
ns
CL ≤ 30 pF
Input hold time
tIH
3
ns
CL ≤ 30 pF
Outputs CMD, DAT (referenced to CLK)
Output delay time during data transfer
tODLY
13.7
ns
CL ≤ 30 pF
Output hold time
tOH
2.5
ns
CL ≤ 30 pF
Signal rise time5
tRISE
3
ns
CL ≤ 30 pF
Signal fall time
tFALL
3
ns
CL ≤ 30 pF
Notes:
1. CLK timing is measured at 50% of VDD devices.
2. eMMC shall support the full frequency range from 0-26Mhz or 0-52MH.
3. Device can operate as high-speed Device interface timing at 26 MHz clock frequency.
4. CLK rise and fall times are measured by min (VIH) and max (VIL).
5. Inputs CMD DAT rise and fall times are measured by min (VIH) and max (VIL) and outputs CMD DAT rise and fall
times are measured by min (VOH) and max (VOL).
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Table 8.8 – Backward-compatible Device Interface Timing
Clock CLK2
Clock frequency Data Transfer Mode (PP)3
fPP
0
26
MHz
CL ≤ 30 pF
Clock frequency Identification Mode (OD)
fOD
0
400
kHz
Clock high time
tWH
10
CL ≤ 30 pF
Clock low time
tWL
10
ns
CL ≤ 30 pF
Clock rise time4
tTLH
10
ns
CL ≤ 30 pF
Clock fall time
tTHL
10
ns
CL ≤ 30 pF
Inputs CMD, DAT (referenced to CLK)
Input set-up time
tISU
3
ns
CL ≤ 30 pF
Input hold time
tIH
3
ns
CL ≤ 30 pF
Outputs CMD, DAT (referenced to CLK)
Output set-up time5
tOSU
11.7
ns
CL ≤ 30 pF
Output hold time5
tOH
8.3
ns
CL ≤ 30 pF
Notes:
1. The Device must always start with the backward-compatible interface timing. The timing mode can be switched to
high-speed interface timing by the host sending the SWITCH command (CMD6) with the argument for high-speed
interface select.
2. CLK timing is measured at 50% of VDD.
3. For compatibility with Devices that support the v4.2 standard or earlier, host should not use > 26 MHz before
switching to high-speed interface timing.
4. CLK rise and fall times are measured by min (VIH) and max (VIL).
5. tOSU and tOH are defined as values from clock rising edge. However, there may be Devices or devices which utilize
clock falling edge to output data in backward compatibility mode. Therefore, it is recommended for hosts either to
settWL value as long as possible within the range which will not go over tCK-tOH(min) in the system or to use slow
clock frequency, so that host could have data set up margin for those devices. In this case, each device which
utilizes clock falling edge might show the correlation either between tWL and tOSU or between tCK and tOSU for
the device in its own datasheet as a note or its application notes.
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Rev. A7
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8.6 BUS TIMING FOR DAT SIGNALS DURING DUAL DATA RATE OPERATION
These timings apply to the DAT [7:0] signals only when the device is configured for dual data mode operation. In
this dual data mode, the DAT signals operate synchronously of both the rising and the falling edges of CLK. The
CMD signal still operates synchronously of the rising edge of CLK and therefore complies with the bus timing
specified in section 10.5 of JEDEC Standard Specification No.JESD84-B50, therefore there is no timing change
for the CMD signal.
Figure 8.5 Timing Diagram; Data Input/Output in Dual Data Rate Mode
8.6.1 DUAL DATA RATE INTERFACE TIMINGS
Table 8.9 – High-speed Dual Data Rate Interface Timing
Parameter
Symbol
Min
Max.
Unit
Remark
Input CLK1
Clock duty cycle
45
55
%
Includes jitter, phase
noise
Input DAT (referenced to CLK-DDR mode)
Input set-up time
tISUddr
2.5
ns
CL ≤ 20 pF
Input hold time
tIHddr
2.5
ns
CL ≤ 20 pF
Output DAT (referenced to CLK-DDR mode)
Output delay time during data transfer
tODLYddr
1.5
7
ns
CL ≤ 20 pF
Signal rise time (all signals)2
tRISE
2
ns
CL ≤ 20 pF
Signal fall time (all signals)
tFALL
2
ns
CL ≤ 20 pF
Notes:
1. CLK timing is measured at 50% of VDD.
2. Inputs CMD, DAT rise and fall times are measured by min (VIH) and max (VIL), and outputs CMD, DAT rise and fall
times are measured by min (VOH) and max (VOL)
IS21/22ES04G
Integrated Silicon Solution, Inc. – www.issi.com – 33
Rev. A7
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8.7 BUS TIMING SPECIFICATION IN HS400 MODE
DUAL DATA RATE INTERFACE TIMINGS
The CMD input timing for HS400 mode is the same as CMD input timing for HS200 mode.
Figure 8.6 and Table 8.10 show Device input timing.
Notes:
1. tISU and tIH measured at VIL(max.) and VIH(min.).
2. VIH denotes VIH(min.) and VIL denotes VIL(max.).
Figure 8.6 HS400 Device Data Input Timing
Table 8.10 – HS400 Device input timing
Parameter
Symbol
Min
Max
Unit
Remark
Input CLK
Cycle time data
transfer mode
tPERIOD
5
200MHz (Max), between rising edges
With respect to VT.
Slew rate
SR
1.125
V/ns
With respect to VIH/VIL.
Duty cycle
distortion
tCKDCD
0.0
0.3
ns
Allowable deviation from an ideal 50%
duty cycle.
With respect to VT. Includes jitter, phase
noise
Minimum pulse
width
tCKMPW
2.2
ns
With respect to VT.
Input DAT (referenced to CLK)
Input set-up time
tISUddr
0.4
ns
CDevice ≤ 6pF With respect to VIH/VIL.
Input hold time
tIHddr
0.4
ns
CDevice ≤ 6pF With respect to VIH/VIL.
Slew rate
SR
1.125
V/ns
With respect to VIH/VIL.
IS21/22ES04G
Integrated Silicon Solution, Inc. – www.issi.com – 34
Rev. A7
10/19/2020
8.7.1 HS400 DEVICE OUTPUT TIMING
The Data Strobe is used to read data in HS400 mode. The Data Strobe is toggled only during data read or CRC
status response
Figure 8.7 HS400 Device Output Timing
IS21/22ES04G
Integrated Silicon Solution, Inc. – www.issi.com – 35
Rev. A7
10/19/2020
Table 8.11 – HS400 Device Output timing
Parameter
Symbol
Min
Max
Unit
Remark
Data Strobe
Cycle time
data transfer
mode
tPERIOD
5
200MHz(Max), between rising edges
With respect to VT
Slew rate
SR
1.125
V/ns
With respect to VOH/VOL and HS400
reference load
Duty cycle
distortion
tDSDCD
0.0
0.2
ns
Allowable deviation from the input
CLK duty cycle distortion (tCKDCD)
With respect to VT Includes jitter,
phase noise
Minimum
pulse width
tDSMPW
2.0
ns
With respect to VT
Read pre-
amble
tRPRE
0.4
-
tPERIOD
Max value is specified by
manufacturer. Value up to infinite is
valid
Read post-
amble
tRPST
0.4
-
tPERIOD
Max value is specified by
manufacturer.
Value up to infinite is valid
Output DAT (referenced to Data Strobe)
Output skew
tRQ
0.4
ns
With respect to VOH/VOL and HS400
reference load
Output hold
skew
tRQH
0.4
ns
With respect to VOH/VOL and HS400
reference load.
Slew rate
SR
1.125
V/ns
With respect to VOH/VOL and HS400
reference load
Note:
1. Measured with HS400 reference load.
Table 8.12 – HS400 Capacitance
Parameter
Symbol
Min
Type
Max
Unit
Remark
Pull-up resistance for CMD
RCMD
4.7
100(1)
Kohm
Pull-up resistance for DAT0-7
RDAT
10
100(1)
Kohm
Pull-down resistance for Data Strobe
RDS
10
100(1)
Kohm
Internal pull up resistance DAT1-DAT7
Rint
10
150
Kohm
Single Device capacitance
CDevice
6
pF
IS21/22ES04G
Integrated Silicon Solution, Inc. – www.issi.com – 36
Rev. A7
10/19/2020
9. PACKAGE TYPE INFORMATION
9.1 100-ball FBGA Package (Q)
IS21/22ES04G
Integrated Silicon Solution, Inc. – www.issi.com – 37
Rev. A7
10/19/2020
9.2 153-BALL FBGA Package (C)
IS21/22ES04G
Integrated Silicon Solution, Inc. – www.issi.com – 38
Rev. A7
10/19/2020
10. ORDERING INFORMATION – Valid Part Numbers
IS 21 E S 04G - J Q L I
TEMPERATURE RANGE
I = Industrial (-40°C to +85°C)
A1 = Automotive Grade (-40°C to +85°C)
PACKAGING CONTENT
L = RoHS compliant
PACKAGE Type
C = 153-ball FBGA
Q = 100-ball FBGA
OPTION
J = Standard (Boot Partition size: 2MB)
B = Boot Partition Size: 16MB
Generation.
Blank = 1st Gen.
eMMC Density
04G = 4 GB
INTERFACE
S = eMMC 5.0
F = eMMC 5.1
Technology
E = ISSI eMMC with MLC NAND
Product Family
21 = Managed NAND
22 = Automotive Managed NAND
BASE PART NUMBER
IS = Integrated Silicon Solution Inc.
IS21/22ES04G
Integrated Silicon Solution, Inc. – www.issi.com – 39
Rev. A7
10/19/2020
Note:
1. A1: Meet AEC-Q100 requirements with PPAP
Density
Interface
NAND Flash
Package
Temp. Grade
Order Part Number
4GB
eMMC 5.0
32Gbx1
100 FBGA
I-Temp.
IS21ES04G-JQLI
IS21ES04G-BQLI
Automotive, A1(1)
IS22ES04G-JQLA1
IS22ES04G-BQLA1
153 FBGA
I-Temp.
IS21ES04G-JCLI
IS21ES04G-BCLI
Automotive, A1(1)
IS22ES04G-JCLA1
IS22ES04G-BCLA1
