2001-2012 Microchip Technology Inc. DS2165 3C-page 1
MCP1525/41
Features
Precision Voltage Reference
Output Voltages: 2.5V and 4.096V
Initial Accuracy: ±1% (max.)
Temperature Drift: ±50 ppm/°C (max.)
Output Current Drive: ±2 mA
Maximum Input Current: 100 µA @ +25°C (max.)
Packages: TO-92 and SOT-23-3
Industrial Temperature Range: -40°C to +85°C
Applications
Battery-powered Systems
Handheld Instruments
Instrumentation and Process Control
Test Equipment
Data Acquisition Systems
Communications Equipment
Medical Equipment
Precision Power supplies
8-bit, 10-bit, 12-bit A/D Converters (ADCs)
D/A Converters (DACs)
Typical Application Circuit
Description
The Microchip Technology Inc. MCP1525/41 devices
are 2.5V and 4.09 6V precis ion vol tage references that
use a combination of an advanced CMOS circuit
design and EPROM trimming to provide an initial
tolerance of ±1% (max.) and temperature stability of
±50 ppm/°C (max.). In addition to a low quiescent
current of 100 µA (max.) at 25°C, these devices offer a
clear advantage ov er the traditional Zener tech niques
in term s of stability across time and temper ature. The
output voltage is 2.5V for the MCP1525 and 4.096V for
the MCP1541. These devices are offered in SOT-23-3
and TO-92 packages, and are specified over the
industrial temperature range of -40°C to +85°C.
Temperature Drift
Package Types
Basic Configuration
VSS
VOUT
VIN
VREF
VDD MCP1525
MCP1541
CL
1 µF to 10 µF
CIN
0.1 µF
(optional)
2.475
2.480
2.485
2.490
2.495
2.500
2.505
2.510
2.515
2.520
2.525
-50-250 255075100
Ambient Temperature (°C)
MCP1525 Output Voltage
(V)
4.040
4.050
4.060
4.070
4.080
4.090
4.100
4.110
4.120
4.130
4.140
MCP1541 Output Voltage
(V)
MCP1525
MCP1541
VSS
VOUT
VIN
VSS VIN
VOUT
MCP1525
MCP1541
TO-92
MCP1525
MCP1541
SOT-23-3
3
1
2
3
12
2.5V an d 4.096V Voltage References
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MCP1525/41
DS2165 3C-page 2 2001-2012 Microchip Technology Inc.
1.0 ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings †
VIN –V
SS..........................................................................7.0V
Input Current (VIN) .......................................................20 mA
Output C urrent (VOUT) .............................................. ±20 mA
Continuous Power Dissipation (TA= 125°C)............. 140 mW
All Inputs and Outputs .....................VSS 0.6V to VIN +1.0V
Storage Temperature.....................................-65°C to +150°C
Maximum Junction Temperature (TJ)..........................+125°C
ESD protection on all pins (HBM) 4kV
† Notice: Stresses above those listed under “Absolute
Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of
the device at those or any other conditions above those
indicated in the o peratio nal list ings of this sp ecifica tion is not
implied. Exposure to maximum rating conditions for extended
periods may affect device reliability.
DC ELECTRICAL SPECIFICATIONS
Electrical Characteristics: Unless otherwise indicated, TA=+25°C, V
IN = 5.0V, VSS =GND, I
OUT =0mA and C
L=1µF.
Parameter Sym Min Typ Max Units Conditions
Output
Output Voltage, MCP1525 VOUT 2.475 2.5 2.525 V 2.7V VIN 5.5V
Output Voltage, MCP1541 VOUT 4.055 4.096 4.137 V 4.3V VIN 5.5V
Output Voltage Drift TCVOUT —2750ppm/°CT
A = -40°C to 85°C (Note 1)
Long-Term Output Stability VOUT 2 ppm/hr Exposed 1008 hrs @ +125°C
(see Figure 1-1), measured @ +25°C
Load Regulation VOUT/IOUT —0.51mV/mAI
OUT = 0 mA to -2 mA
VOUT/IOUT —0.61mV/mAI
OUT = 0 mA to 2 mA
VOUT/IOUT ——1.3mV/mAI
OUT = 0 mA to -2 mA,
TA = -40°C to 85°C
VOUT/IOUT ——1.3mV/mAI
OUT = 0 mA to 2 mA,
TA = -40°C to 85°C
Output Voltage Hysteresis VHYS 115 ppm Note 2
Maximum Load Current ISC —±8—mAT
A = -40°C to 85°C, VIN = 5.5V
Input-to-Output
Dropout Voltage VDROP —137—mVI
OUT = 2 mA
Line Regulation VOUT/VIN 107 300 µV/V VIN = 2.7V to 5.5V for MCP1525,
VIN = 4.3V to 5.5V for MCP1541
VOUT/VIN ——350µV/VV
IN = 2.7V to 5.5V for MCP1525,
VIN = 4.3V to 5.5V for MCP1541,
TA = -40°C to 85°C
Input
Input Voltage, MCP1525 VIN 2.7 5.5 V TA = -40°C to 85°C
Input Voltage, MCP1541 VIN 4.3 5.5 V TA = -40°C to 85°C
Input Current IIN 86 100 µA No load
IIN 95 12 0 µA No load, TA = -40°C to 85°C
Note 1: Output temperature coefficient is measured using a “box” method, where the +25°C output voltage is trimmed as close
to typical as possible. The 85°C output voltage is then again trimmed to zero out the tempco.
2: Output Voltage Hysteresis is defined as the change in output voltage measured at +25°C before and after cycling the
temperat ure to +8 5°C and -40° C; refer to Section 1.1.10 “Output Voltage Hysteresis.
21653C.book Page 2 Thursday, January 10, 2013 12:55 PM
2001-2012 Microchip Technology Inc. DS2165 3C-page 3
MCP1525/41
AC ELECTRICAL SPECIFICATIONS
TEMPERATURE SPECIFICATIONS
1.1 Specification Descriptions and
Test Circuits
1.1.1 OUTPUT VOLTAGE
Output voltage is the reference voltage that is available
on the output pin (VOUT).
1.1.2 INPUT VOLTAGE
The input (operating) voltage is the range of voltage
that can be applied to the VIN pin and still have the
device produce the designated output voltage on the
VOUT pin.
1.1.3 OUTPUT VOLTAGE DRIFT (TCVOUT)
The output te mperature coefficient or voltage drift is a
measure of how much the output voltage (VOUT) will
vary from its initial value with changes in ambient
temperature. The value specified in the electrical
specifications is measured and equal to:
EQUATION 1-1:
Electrical Characteristics: Unless otherwise indicated, TA=+25°C, V
IN = 5.0V, VSS =GND, I
OUT = 0 mA and CL=1µF.
Parameter Sym Min Typ Max Units Conditions
AC Response
Bandwidth BW 100 kHz
Input and Load Capacito rs (se e Figur e 4-1)
Input Capacitor CIN —0.1—µFNotes 1
Load Capacitor CL1—10µFNotes 2
Noise
MCP1525 Output Noise Voltage Eno —90—µV
P-P 0.1 Hz to 10 Hz
Eno —500—µV
P-P 10 Hz to 10 kHz
MCP1541 Output Noise Voltage Eno —145—µV
P-P 0.1 Hz to 10 Hz
Eno —700—µV
P-P 10 Hz to 10 kHz
Note 1: The input capacitor is optional; Microchip recommends using a ceramic capacitor.
2: These parts are tested at both 1 µF and 10 µF to ensure proper operation over this range of load capacitors. A wider
range of load capacitor values has been characterized successfully, but is not tested in production.
Electrical Characteristics: Unless otherwise indicated, TA=+25°C, V
IN = 5.0V and VSS =GND.
Parameter Sym Min Typ Max Units Conditions
Temperature Ranges
Specified Temperature Range TA-40 +85 °C
Operating Temperature Range TA-40 +125 °C Note 1
Storage Temperature Range TA-65 +150 °C
Thermal Pac kag e Res istan ce s
Thermal Resistance, TO-92 JA —132—°C/W
Thermal Resistance, SOT-23-3 JA —336—°C/W
Note 1: These voltage references operate over the Operating Temperature Range, but with reduced performance. In any case,
the internal Junction Temperature (TJ) must not exceed the Absolute Maximum specification of +150°C.
TCVOUT
VOUT VNOM
TA
------------------------------------
=ppm C
Where:
VNOM =2.5V, MCP1525
VNOM = 4.096V, MCP1541
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MCP1525/41
DS2165 3C-page 4 2001-2012 Microchip Technology Inc.
1.1.4 DROPO UT VOLTAGE
The dropout voltage of these devices is measured by
reducing VIN to the point where the output drops by 1%.
Under these conditions the dropout voltage is equal to:
EQUATION 1-2:
The dropout voltage is affected by ambient
temperature and load current.
In Figure 2-18, the dropout voltage is shown over a
negative and positive range of output current. For
currents above zero milliamps, the dropout voltage is
positive. In this case, the voltage reference is primarily
powered by VIN. With output currents below zero
milliamps, the dropout voltage is negative. As the
output current becomes more negative, the input
current (IIN) reduces. Under this condition, the output
current begins to provide the needed power to the
voltage reference.
1.1.5 LINE REGULATION
Line regulation is a measure of the change in output
voltage (VOUT) as a function of a change in the input
voltage (VIN). This is expressed as VOUT/VIN and is
measured in either µV/V or ppm. For example, a 1 µV
change in VOUT caused by a 500 mV change in VIN
would net a VOUT/VIN of 2 µV/V, or 2 ppm.
1.1.6 LOA D REGULATION (VOUT/IOUT)
Load regulation is a measure of the change in the
output voltage (VOUT) as a function of the change in
output current (IOUT). Load regulation is usually
measured in mV/mA.
1.1.7 INPUT CURRENT
The input current (operating current) is the current that
sinks fr o m VIN to VSS without a l oad current on the out-
put pin. This current is affec ted by temperature and the
output current.
1.1.8 INPUT VOLTAGE REJECTION
RATIO
The Input Vol tage Rejection Ratio (IVRR) is a measure
of the change in output voltage versus the change in
input voltage over frequency, as shown in Figure 2-7.
The calculation used for this plot is:
EQUATION 1-3:
1.1.9 LONG-TERM OUTPUT STABILITY
The long-term output stability is measured by exposing
the devices to an ambient temperature of 125°C
(Figure 2-9) while configured in the circuit shown in
Figure 1-1. In this test, all electrical specifications of the
devices are measured periodically at +25°C.
FIGURE 1-1: Dynamic Life Test
Configuration.
1.1.10 OUTPUT VOLTAGE HYSTERESIS
The output voltage hysteresis is a measure of the
output voltage error once the powered devices are
cycled over the entire operating temperature range.
The amount of hysteresis can be quantified by
measuring the change in the +25°C output voltage after
temperature excursions from +25° C to + 85°C to +25°C
and also from +25°C to -40°C to +25°C.
VDROP VIN VOUT
=
IVRR 20 VIN
VOUT
-------------
log dB=
VSS
VOUT
VIN
CL
VIN =5.5V
RL
±2 mA
square wave
@10Hz
MCP1525
MCP1541
F
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2001-2012 Microchip Technology Inc. DS2165 3C-page 5
MCP1525/41
2.0 TYPICAL PERFORMANCE CURVES
Note: Unless otherwise indicated, TA=+25°C, V
IN = 5.0V, VSS = GND, IOUT = 0 mA and CL=1µF.
FIGURE 2-1: Output Voltage vs. Ambient
Temperature.
FIGURE 2-2: Load Regulation vs.
Ambient Temperature.
FIGURE 2-3: Input Current vs. Ambient
Temperature.
FIGURE 2-4: Line Regulation vs. Ambient
Temperature.
FIGURE 2-5: Output Impedance vs.
Frequency.
FIGURE 2-6: Output Noise Voltage
Density vs. Frequency.
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for inf ormational purposes only. The performanc e characteristics listed h erein
are not tested or gua ranteed. In some gr aphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefor e outside the warranted range.
2.475
2.480
2.485
2.490
2.495
2.500
2.505
2.510
2.515
2.520
2.525
-50 -25 0 25 50 75 100
Ambient Temperature (°C)
MCP1525 Output Voltage
(V)
4.040
4.050
4.060
4.070
4.080
4.090
4.100
4.110
4.120
4.130
4.140
MCP1541 Output Voltage
(V)
MCP1525
MCP1541
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
-50-250 255075100
Ambient Temperature (°C)
Load Regulation (mV/mA)
Source Current =
0 mA to 2 mA
Sink Current =
0 mA to -2 mA
MCP1525 and MCP1541
0
10
20
30
40
50
60
70
80
90
100
-50 -25 0 25 50 75 100
Ambient Temperature (°C)
Input Current (µA)
MCP1525
MCP1541
0
20
40
60
80
100
120
140
-50-250 255075100
Ambient Temperature (°C)
Line Regulation (µV/V)
MCP1525
VIN = 2.7V to 5.5V
MCP1541
VIN = 4.3V to 5.5V
0
1
2
3
4
5
6
7
1.E+00 1.E+01 1.E+02 1.E+03 1.E+04 1.E+05 1.E+06
Frequency (Hz)
Output Impedance (:)
MCP1525 and MCP1541
IOUT = +2 mA
IOUT = -2 mA
1 10 100 1k 10k 100k 1M
1
10
100
1,000
Frequency (Hz)
Output Noise Voltage Density
(μV/Hz)
0.1 10 1k 10k 100k1 100
MCP1541
MCP1525
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MCP1525/41
DS2165 3C-page 6 2001-2012 Microchip Technology Inc.
Note: Unless otherwise indicated, TA=+25°C, V
IN = 5.0V, VSS = GND, IOUT = 0 mA and CL=1µF.
FIGURE 2-7: Input Voltage Rejection
Ratio vs. Frequency.
FIGURE 2-8: Output Voltage vs. Input
Voltage.
FIGURE 2-9: Output Voltage Aging vs.
Time (MCP1525 Device Life Test data)
FIGURE 2-10: MCP1541 Output Voltage
vs. Output Current.
FIGURE 2-11: MCP1525 Output Voltage
vs. Output Current.
FIGURE 2-12: Maximum Load Current vs.
Input Voltage
30
40
50
60
70
80
90
1.E+00 1.E+01 1.E+02 1.E+03 1.E+04 1.E+05
Frequency (Hz)
Input Voltage Rejection Ratio
(dB)
MCP1525
1 10 100 1k 10k 100k
MCP1541
2.498
2.499
2.500
2.501
2.502
2.503
2.504
2.505
2.506
2.5 3.0 3.5 4.0 4.5 5.0 5.5
Input Voltage (V)
MCP1525 Output
Voltage (V)
4.090
4.091
4.092
4.093
4.094
4.095
4.096
4.097
4.098
MCP1541 Output
Voltage (V)
IOUT = +2 mA
IOUT = 0 mA
IOUT
= -2 mA
-10
-8
-6
-4
-2
0
2
4
6
8
10
0 200 400 600 800 1000
Time (hr)
Output Voltage Aging (mV)
Average
-3
MCP1525
600 Samples
+3
Life Test (TA = +125°C)
4.0950
4.0955
4.0960
4.0965
4.0970
4.0975
-2.0 -1.5 -1.0 -0.5 0.0 0.5 1.0 1.5 2.0
Output Current (mA)
Output Voltage (V)
MCP1541
2.4990
2.4995
2.5000
2.5005
2.5010
2.5015
-2.0 -1.5 -1.0 -0.5 0.0 0.5 1.0 1.5 2.0
Output Current (mA)
Output Voltage (V)
MCP1525
7.0
7.5
8.0
8.5
9.0
9.5
10.0
2.5 3.0 3.5 4.0 4.5 5.0 5.5
Input Voltage (V)
Maximum Load Current (mA)
Source
MCP1525
MCP1541
MCP1541
Sink
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2001-2012 Microchip Technology Inc. DS2165 3C-page 7
MCP1525/41
Note: Unless otherwise indicated, TA=+25°C, V
IN = 5.0V, VSS = GND, IOUT = 0 mA and CL=1µF.
FIGURE 2-13: Input Cu rrent vs. Input
Voltage.
FIGURE 2-14: MCP1541 0.1 Hz to 10 Hz
Output Noise.
FIGURE 2-15: Turn-on Transient Time.
FIGURE 2-16: MCP1525 Load Transient
Response.
FIGURE 2-17: MCP1525 Line Transient
Response.
FIGURE 2-18: Dropout Voltage vs. Output
Current.
0
10
20
30
40
50
60
70
80
90
100
2.53.03.54.04.55.05.5
Input Voltage (V)
Input Current (µA)
MCP1525
MCP1541
Time (1 s/div)
Output Noise Volta ge
(20 µV/div)
MCP1541 Bandwidth = 0.1 Hz to 10 Hz
Eno = 22 µVRMS = 145 µVP-P
-1
0
1
2
3
4
5
6
Time (200 µs/div)
Voltage (V)
VOUT, MCP1541
VIN
VOUT, MCP1525
-18
-16
-14
-12
-10
-8
-6
-4
-2
0
2
4
Time (100 µs/div )
Output Current (mA)
-20
-15
-10
-5
0
5
10
15
20
25
30
35
Change in
Output Voltage (mV)
VOUT
IOUT
MCP1525
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
Time (100 µs/div)
Input Voltage (V)
-8
-6
-4
-2
0
2
4
6
8
10
12
14
16
Change in
Output Voltage (mV)
VOUT
V
IN
MCP1525
-150
-100
-50
0
50
100
150
-2.0 -1.5 -1.0 -0.5 0.0 0.5 1.0 1.5 2.0
Output Current (mA)
Dropout Voltage (mV)
MCP1525 and MCP1541
21653C.book Page 7 Thursday, January 10, 2013 12:55 PM
MCP1525/41
DS2165 3C-page 8 2001-2012 Microchip Technology Inc.
3.0 PIN DESCRIPTIONS
Descriptions of the pins are listed in Table 3-1.
TABLE 3-1: PIN FUNCTION TABLE.
3.1 Input Voltage (VIN)
VIN functions as the positive power supply input (or
operating inpu t). An optional 0.1 µF ceram ic capacitor
can be placed at this pin if the input voltage is too noisy;
it needs to be within 5 mm of this pin. The input voltage
needs to be at least 0.2V higher than the output voltage
for normal operation.
3.2 Output Voltage (VOUT)
VOUT is an accurate reference voltage output. It can
source and sink small currents, and has a low output
impedance. A load capacitor betw een 1 µF and 10 µF
needs to be located within 5 mm of this pin.
3.3 Ground (VSS)
Normally connected directly to ground. It can be placed
at another voltage as long as all of the voltages shift
with it, and proper bypassing is observed.
MCP1525, MCP1541
(TO-92-3) MCP1525, MCP1541
(SOT-23-3) Symbol Description
31V
IN Input Voltage (or Positive Power Suppl y)
22V
OUT Output Voltage (or Reference Vol tage )
13V
SS Ground (or N egative Power Supply)
21653C.book Page 8 Thursday, January 10, 2013 12:55 PM
2001-2012 Microchip Technology Inc. DS2165 3C-page 9
MCP1525/41
4.0 APPLICATIONS INFORMATION
4.1 Application Tips
4.1.1 B ASIC CIRCUIT CONFIGURATION
The MCP1525 and MCP1541 voltage reference
devices should be applied as shown in Figure 4-1 in all
applications.
FIGURE 4-1: Basic Circuit Configuration.
As shown in Figure 4-1, the input voltage is connected
to the de vice at the VIN input, with an optional 0.1 µF
ceramic ca pacitor. T his capacitor woul d be required if
the input voltage has excess noise. A 0.1 µF capacitor
would reject input voltage noise at approximately
1 to 2 MHz. Noise below this frequency will be amply
rejected by the input voltage rejection of the voltage ref-
erence. Noise at frequencies above 2 MHz will be
beyond the bandwidth of the voltage reference and,
consequently, not transmitted from the input pin
through the device to the output.
The load capacitance (CL) is required in order to
stabilize the voltage reference; see Section 4.1.3
“Load Capacitor”.
4.1.2 INPUT (BYPASS) CAPACITOR
The MCP1525 and MCP1541 voltage references do
not require an input capacitor across VIN to VSS.
However, for added stability and input voltage transient
noise reduction, a 0.1 µF ceramic capacitor is
recommended, as shown in Figure 4-1. This c apacitor
should be close to the device (within 5 mm of the pin).
4.1.3 LOA D CAPACITOR
The output capacitor from VOUT to VSS acts as a
frequency compensation for the references and cannot
be omitted. Use load capacitors between 1 µF and
10 µF to compensate these devices. A 10 µF output
capacitor has slightly better noise, and provides
additional charge for fast load transients, when
compared to a 1 µF output capacitor. This capacitor
should be close to the device (within 5 mm of the pin).
4.1.4 PRINTED CIRCUIT BOARD LAYOUT
CONSIDERATIONS
Mechanical s tress due to Printed Ci rcuit Board ( PCB)
mounting can ca use the output voltage to shift from its
initial value. Devices in the SOT-23-3 package are
generally more prone to as sembly str ess than de vices
in the TO-92 package. To re duce str ess-related output
voltage shifts, mount the reference on low-stress areas
of the PCB (i.e., away from PCB edges, screw holes
and large components).
4.1.5 OUTPUT FILTERING
If the noise at the output of these voltage references is
too high for the particular application, it can be easily
filtered with an external RC filter and op amp buffer.
The op amp’s input and output voltage ranges need to
include the reference output voltage.
FIGURE 4-2: Output Noise-Reducing
Filter.
The RC filter values are selected for a desired cutoff
frequency:
EQUATION 4-1:
The values that are shown in Figure 4-2 (10 k and
1 µF) will create a first-order, low-pass filter at the
output of the amplifier. The cutoff frequency of this filter
is 15.9 Hz, and the attenuation slope is 20 dB/decade.
The MCP6021 amplifier isolates the loading of this low-
pass filter from the remainder of the application circuit.
This amplifier also provides additional drive, with a
faster resp onse time than the voltage reference.
VSS
VOUT
VIN
VREF
VDD MCP1525
MCP1541
CL
1 µF to 10 µF
CIN
0.1 µF
(optional)
VSS
VOUT
VIN
CL
RFIL
MCP1525
MCP1541
10 µF
10 kW
CFIL
F
VDD
VREF
MCP6021
VDD
fC1
2RFILCFIL
------------------------------
=
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MCP1525/41
DS2165 3C-page 10 2001-2012 Microchip Technology Inc.
4.2 Typical Application Circuits
4.2.1 NEGATIVE VOLTAGE REFERENCE
A negative precision voltage reference can be
generated by us ing the MCP1525 or MCP1541 in the
configuration shown in Figure 4-3.
FIGURE 4-3: Negative Voltage
Reference.
In this circuit, the voltage inversion is implemented
using the MCP606 and two equal resistors. The voltage
at the output of the MCP1525 or MCP1541 voltage
reference drives R1, which is connected to the inverting
input of the MCP60 6 amplifie r. Since the non-inverting
input of the a mplifier is biased to g round, the inv erting
input will also be close to ground potential. The second
10 k resistor is placed around the feedback loop of
the amplifier. Si nce the inverting input of the amplifier is
high-im pedance, the current gener ated through R1 will
also flow through R2. As a consequence, the output
voltage of the amplifier is equal to -2.5V for the
MCP1525 and -4.1V for the MCP1541.
4.2.2 A/D CONVERTER REFE RENCE
The MCP152 5 and MC P1541 were c arefully de signed
to provide a voltage reference for Microchip’s 10-bit
and 12-bit families of ADCs. The circuit shown in
Figure 4-4 shows a MCP1541 configured to provide the
reference to the MCP3201, a 12-bit ADC.
FIGURE 4-4: ADC Reference Circuit.
VSS
VOUT
VIN
CL
R1
MCP1525
MCP1541
10 µF
10 k
VDD =5.0V
VREF
MCP606
VSS =- 5.0V
0.1%
R2
10 k
0.1%
VREF =-2.5V, MCP1525
VREF = -4.096V, MCP1541
VSS
VOUT
VIN
MCP1541
VDD =5.0V
CIN
0.1 µF
MCP3201
CL
10 µF
VREF
IN+
IN–
VIN
10 µF
0.1 µF
to PIC®
Microcontroller
3
21653C.book Page 10 Thursday, January 10, 2013 12:55 PM
2001-2012 Microchip Technology Inc. DS21 653C-page 11
MCP1525/41
5.0 PACKAGING I NFORMATION
5.1 Package Marking Information
3-Lead TO-92 (Leaded)
3-Lead SOT-23-3
XXXXXX
XXXXXX
XXYYWW
NNN
XXNN
Example:
Example:
MCP
1525I
TO0544
256
VA25
Device I-Temp
Code
MCP1525 VANN
MCP1541 VBNN
Note: Applies to 3-Lead SOT-23.
Legend: XX...X Customer-specific information
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Pb-free JEDEC designator for M atte Tin (Sn)
*This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
3
e
3
e
3-Lead TO-92 (Lead Free)
XXXXXX
XXXXXX
XXXXXX
YWWNNN
Example:
MCP
1525I
TO^^
544256
21653C.book Page 11 Thursday, January 10, 2013 12:55 PM
MCP1525/41
DS2165 3C-page 12 2001-2012 Microchip Technology Inc.
3-Lead Plastic Transistor Outline (TO) (TO-92)
432432
Mold Draft Angle Bottom 654654
0.560.480.41.022.019.016BLead Width 0.510.430.36.020.017.014
c
Lead Thickness
2.412.292.16.095.090.085RMolded Package Radius 4.954.644.32.195.183.170DOverall Length 4.954.714.45.195.186.175E1Overall Width 3.943.623.30.155.143.130ABottom to Package Flat 1.27.050
p
Pitch 33
n
Numbe r of Pins MAXNOMMINMAXNOMMINDimension Limits MILLIMETERSINCHES*Units
R
n
1
3
p
L
B
A
c
1
D
2
E1
Tip to Seating Plane L .500 .555 .610 12.70 14.10 15.49
*Controlling Parameter
Mold Draft Angle Top
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: TO-92
Draw in g No . C04 -10 1
Note: For the most current package drawings, please see the Micr ochip Packaging Specification located
at http://www.microchip.com/packaging
21653C.book Page 12 Thursday, January 10, 2013 12:55 PM
2001-2012 Microchip Technology Inc. DS21 653C-page 13
MCP1525/41
3-Lead Plastic Small Outline Transistor (TT) (SOT23)
10501050
Mold Draft Angle Bottom 10501050
Mold Draft Angle Top 0.510.440.37.020.017.015BLead Width 0.180.140.09.007.006.004
c
Lead Thickness 10501050
Foot Angle 0.550.450.35.022.018.014LFoot Length 3.042.922.80.120.115.110DOverall Length 1.401.301.20.055.051.047E1Molded Package Width 2.642.372.10.104.093.083EOverall Width 0.100.060.01.004.002.000A1Standoff § 1.020.950.88.040.037.035A2Molded Package Thickness 1.121.010.89.044.040.035AOveral l Height 1.92.076
p1
Outside lead pitch (basic) 0.96
.038
p
Pitch 33
n
Number of Pins MAXNOMMINMAXNOMMINDim en s ion Li m its MILLIMETERSINCHES*Units
2
1
p
D
B
n
E
E1
L
c
A2
A
A1
p1
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or pr otrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equival ent: TO-236
Draw in g No . C04 -10 4
§ Significant Characteristic
Note: For the most current package dr awings , please se e the Microchip Packaging Specification located
at http://www.microchip.com/packaging
21653C.book Page 13 Thursday, January 10, 2013 12:55 PM
MCP1525/41
DS2165 3C-page 14 2001-2012 Microchip Technology Inc.
NOTES:
21653C.book Page 14 Thursday, January 10, 2013 12:55 PM
2001-2012 Microchip Technology Inc. DS21653C-pag e 15
MCP1525/41
APPENDIX A: REVISION HISTORY
Revision C (December 2012)
Added a note to each package outline drawing.
Revision B (February 2005)
The following is the list of modifications :
1. Added bandwidth and capacitor specifications
(Section 1.0 “Electrical Characteristics”).
2. Moved Section 1.1 “Specification Descrip-
tions and Test Circuits” to the specifications
section (Section 1.0 “Electrical Characteris-
tics”).
3. Corrected plots in Section 2.0 “Typical Perfor-
mance Curves”.
4. Added Section 3.0 “Pin Descriptions”.
5. Corrected package markings in
Section 5.0 “ Packaging Information”.
6. Added Appendix A: “Revision History”.
Revision A (July 2001)
Original Release of this Document.
21653C.book Page 15 Thursday, January 10, 2013 12:55 PM
MCP1525/41
DS2165 3C-page 16 2001-2012 Microchip Technology Inc.
NOTES:
21653C.book Page 16 Thursday, January 10, 2013 12:55 PM
2001-2012 Microchip Technology Inc. DS21 653C-page 17
MCP1525/41
PRODUCT IDENTIFI CATI ON SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Device MCP1525: = 2.5V Voltage Reference
MCP1541: = 4.096 Voltage Reference
Temperature Range I = -40C to +85C
Package TO = TO-92, Plastic Transistor Outline, 3-Lead
TT = SOT23 , Plastic Small Outline Transistor, 3-Lead
PART NO. X/XX
PackageTemperature
Range
Device
Examples:
a) MCP1525T-I/TT: Tape and Reel,
Industri al Temperat ure,
SOT23 package.
b) MCP1525-I/TO: Industrial Temperature,
TO-92 package.
c) MCP1541T-I/TT: Tape and Reel,
Industri al Temperat ure,
SOT23 package.
d) MCP1541-I/TO: Industrial Temperature,
TO-92 package.
21653C.book Page 17 Thursday, January 10, 2013 12:55 PM
MCP1525/41
DS2165 3C-page 18 2001-2012 Microchip Technology Inc.
NOTES:
21653C.book Page 18 Thursday, January 10, 2013 12:55 PM
2001-2012 Microchip Technology Inc. DS21653C-pag e 19
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk , and the buyer agr ees to def end, ind emnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microc hip name and logo, the Mic roc hip logo , dsPI C,
FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,
PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash
and UNI/O are registered trademarks of Microchip T echnology
Incorporated in the U.S.A. and other countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MTP, SEEVAL and The Embedded Control Solutions
Comp any are r egi st ere d tr ade mar ks of Mic roc hi p Tech nol ogy
Incorporated in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
Analog-for-the-Digital Age, Application Maestro, BodyCom,
chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB
Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O,
Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA
and Z-Scale are trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
SQTP i s a servi ce mark of Micr ochip Technol ogy Inc orpora ted
in the U.S.A.
GestIC and ULPP are registered trademarks of Microchip
Technology Germany II GmbH & Co. & KG, a subsidiary of
Microchip Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respect ive com panie s.
© 2001-2012, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 9781620768853
Note the following details of the code protection feature on Microchip devices:
Microchip products meet the specification contained in their particular Microchip Data Sheet.
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code pro tect ion i s co nstan tly e volv ing . We at Microch ip ar e co mm itte d to con tinu ou sly im pr ovin g th e co de pro tect ion feat ure s of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such a ct s
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Mic roc h ip rece iv e d IS O/T S- 1 69 49 :2 00 9 certi fi cat io n for its world w id e
headquarters, desig n and wafer fabrication facilities in Chand ler and
Tempe, Arizona; Gre sham, Oregon and design centers in Cali fornia
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC ® DSCs, KEELOQ® code hopping
device s , Ser ial EEPROMs , mi cr ope r ip her al s , no nvo lat ile memory and
analog products. In addition, Microchip’s quality sy stem for the desig n
and manufacture of development systems is ISO 9001:2000 certified.
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
21653C.book Page 19 Thursday, January 10, 2013 12:55 PM
DS2165 3C-page 20 2001-2012 Microchip Technology Inc.
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11/29/12
21653C.book Page 20 Thursday, January 10, 2013 12:55 PM