IGF-32511J - Bookham Technology, Inc.

Features:

• Multi-Protocol Compliant

SONET OC-192 IR-2/SDH S-64.2b,

IEEE 802.3 10G Ethernet (10GBASE-ER/EW),

10G Fibre Channel

• Compliant with the XFP MSA

• Ultra small formfactor

•10Gb/s serial operation

• Hot Pluggable

•Supports 40km link distances

• Integrated PIN receiver technology

• Data rates up to 10.7Gb/s

• XFI electrical interface

•On board Enhanced Digital Diagnostics providing I2C

remote monitoring capability

• Typically less than 3.0 W power dissipation

• Integral Signal Conditioning ICs enabling FR4 host

board PCB traces up to 8 inches

• Duplex LC connector

• Low EMI

•Transmit disable and loss-of-signal functions

• RoHS compliant

Applications:

• SONET/SDH Metro Networks

• 10G Ethernet Metro Links

•MetroStorage Networking

• Client side interconnection

• Inter-office connections

Data Sheet

The Bookham IGF-3000 Series optical transceiver modules

are high-performance, cost-effective modules for serial optical

data communication applications at 10Gb/s. The IGF-32511J

is designed to provide SONET/SDH (with or without FEC) and

10Gb/s Ethernet for 40km compliant links.

The modules are designed for single mode fibre and operate

at a nominal wavelength of 1550nm. They incorporate

Bookham’s exclusive optical packaging platform.

The modules aid system hardware engineers in implementing

low-cost single mode PMD solutions, which are protocol

transparent. The “hot pluggable” feature built into every

module reduces manufacturing cost, inventory costs and

allows optical port upgrades at the customer premises.

Built-in remote monitoring via digital diagnostics allows

user access to static and dynamic data as well as

module condition.

The IGF-32511J uses an Electro-absorption Modulated

Laser (EML) packaged in conjunction with an optical isolator.

This design provides for maximum eye opening, minimized

jitter generation, and excellent back reflection performance.

The transmitter is fully IEC60825-1 and CDRH Class 1 laser

eye safety compliant.

XFP Optical Transceivers for 40km

10G Serial Applications

IGF series

IGF-32511J

Data Sheet

Absolute maximum ratings

Parameter Symbol Min Max Units Notes

Storage Temp Tstg -40 85 °C

Supply voltage5VCC5 0 6 V

Supply voltage3VCC3 0 4.0 V

Supply voltage2VCC2 0 2.2 V

Supply voltageE5 VEE5 -6 0 V [1]

Data AC volt. differential Tx+, Tx- -0.5 2 Vpp

Data DC volt. Tx+, Tx- 0 VCC2 Vpp

Optical Damage Threshold Pdamage +5 dBm

Parameter Symbol Min Typical Max Units Notes

Baud Rate 9.95 10.75 GBd STM-64/OC192;

G.709; 10 GbE;

Supply Voltage5VCC5 4.75 5.0 5.25 V

Supply Current5ICC5 350 550 mA [1]

Supply voltage3VCC3 3.13 3.3 3.47 V

Supply Current3ICC3 90 200 mA [1]

Supply voltage2VCC2 1.71 1.8 1.89 V

Supply Current2ICC2 50 750 mA Supplies TEC,

current draw

depends on temp [1]

Supply voltageE5 VEE5 -5.2 V [2]

Power Dissipation Pw 2.3 3.5 W [3]

TemperatureCase Tcase -5 70 °C

Operating conditions

Please contact sales for special requirements.

[1] Typical figures for supply current and power dissipation represent start-of-life 40C.

Max figures for supply currents and power dissipation are worst case, end-of-life, over temperature.

Currents are quiescent values and exclude inrush.

[2] VEE5 supply is not used – if voltage is applied to these pins it must be within the limits specified.

[3] Maximum currents from each supply rail not all present simultaneously.

[1] VEE5 supply is not used – if voltage is applied to these pins it must be within the limits specified

Data Sheet

Operating specifications – electrical

Tcase =-5°C to +70°C

Parameter Symbol Value Units Notes

min typical max

CML Input (differential) VTxDiff 150 n/a 900 mVpp 100 ohm

differential

CML Output (differential) VRxDiff 360 600 770 mVpp 100 ohm

differential

Rise/Fall Time Tr/Tf24 ps 20% - 80%

Loss of Signal

Output Voltage High VOH 2 VCC3+0.3 V

Output Voltage Low VOL 0 0.8 V

Loss of Signal Timing

Assert [Off to On] TA100 µs

Deassert [On to Off] TD100 µs

Tx_Disable High VDH 2 VCC3+0.3 V

Tx_Disable Low VDL 0 0.8 V

Transmitter operating specifications – optical

Tcase =-5°C to +70°C

Parameter Symbol Value Units Notes

min typical max

Optical Transmit Power Po-1.0 +2.0 dBm EOL

Side mode suppression SMSR 30 dB

Extinction Ratio ER 8.2 9.8 dB

Jitter Generation TJ rms Compliant to GR-253 Issue 4 UI RMS

Jitter Generation TJp-p and ITU-T G.825/G.8251 UI Peak-to-Peak

Optical Path Penalty OPP 2 dB 800ps/nm disp.

Output Optical Eye Compliant with Telcordia GR-253, ITU-T G.691/G.959.1 and IEEE802.3ae

The IGF-32511J requires a baud/64 external reference clock. Reference clock requirements are defined by the XFP MSA.

Data Sheet

Receiver operating specifications – optical

Tcase =-5°C to +70°C

Parameter Symbol Value Units Notes

min typical max

Receiver Sensitivity PIN-MIN -15.8 dBm Ave. power at

ER=8.2dB[1]

Stressed Receiver Sensitivity (OMA) -13.5 -11.4 dBm [1]

Receiver Overload PIN-MAX +2 dBm Ave. power[1]

Reflectance -27 dB

Loss of Signal

Loss of Signal Assert (Off to On) PA-32 -19 dBm

Loss of Signal Deassert (On to Off) PD-17 dBm

Hysteresis PA- PD0.5 6 dB

[1] BER 1E-12 used for Rx sensitivity measurements

Data Sheet

Electrical pin out

The electrical connection interface of the module and host board is shown below in Figure 1 and Figure 2, respectively.

Data Sheet

Pin definitions

Pin # Logic Symbol Function Plug Seq Notes

1 GND Module Ground; Signal Ground 1 1

2 VEE5 Optional -5.2V Power Supply 2

3 LVTTL-I Mod_Desel Module De-select; When held low by host allows the module 3

to respond to 2-wire serial interface commands

4 LVTTL-O Interrupt_BAR Interrupt_BAR; Indicates the presence of an important condition 3 2

that can be read over the two wire interface

5 LVTTL-I TX_DIS Transmitter Disable; Turns Off Transmitter Laser Source 3

6 VCC5 +5V Power Supply 2

7 GND Module Ground; Signal Ground 1 1

8VCC3 +3.3V Power Supply 2

9 VCC3 +3.3V Power Supply 2

10 LVTTL-I SCA Two WireInterface Clock 3 2

11 LVTTL-I/O SDA Two Wire Interface Data Line 3 2

12 LVTTL-O Mod_Abs Indicates Module Not Present; Grounded in Module 3 2

13 LVTTL-O Mod_NR Module Not Ready or Indicating Module Operational Fault 3 2

14 LVTTL-O RX_LOS Receiver Loss of Signal Indicator 3 2

15 GND Module Ground; Signal Ground 1 1

16 GND Module Ground; Signal Ground 1 1

17 CML-O RD- Receiver Inverted Data Output 3

18 CML-O RD+ Receiver Non-Inverted Data Output 3

19 GND Module Ground; Signal Ground 1 1

20 VCC2 +1.8V Power Supply 2

21 LVTTL-I P_down/RST Power down; When high, places the module in the low power 3

standby mode of less than 1.5W with 2-wireinterface still

operational. Reset; The falling edge of P_Down/RST initiates a

complete module reset including the 2-wire interface.

22 VCC2 +1.8V Power Supply 2

23 GND Module Ground; Signal Ground 1 1

24 PECL-I RefCLK+ Reference Clock Non-Inverted Input, AC coupled on Host Board 3 3

25 PECL-I RefCLK- Reference Clock Inverted Input, AC coupled on Host Board 3 3

26 GND Module Ground; Signal Ground 1 1

27 GND Module Ground; Signal Ground 1 1

28 CML-I TD- Transmitter Inverted Data Input 3

29 CML-I TD+ Transmitter Non-Inverted Data Input 3

30 GND Module Ground; Signal Ground 1 1

[1] Module ground pins are isolated from the module case and chassis ground within the module.

[2] Open Collector should be pulled up with 4.7K-10Kohms to a voltage between 3.15V and 3.6V on the host board.

[3] Required for the IGF-32511J.

Data Sheet

Figure4. Host Board mechanical layout (mm)

Figure3. Host Boardsupply filtering.

Data Sheet

The XFP module is a pluggable module with its foundation based on the successful SFP package configuration. It consists of a

rectangular package that is approximately 18mm wide and 78mm long. The module interface is a 30 lead connector. The module

is inserted into a metal cage assembly.

Mechanical interface:

One of the unique features of the XFP module is that the module cage is designed with the ability to accommodate a clip-on

thermal heat sink, as shown in Figure 5, to enhance the cooling of the module. Thus the equipment manufacturer that designs with

the XFP can select a heat sink that is optimized for the particular environmental conditions of vertical space above module, air flow,

air flow direction and desired pressure drop.

Thermal interface:

Figure 5. Example of clip-on heat sink

Figure 6. Mechanical Dimensions (mm) of XFP module.

Data Sheet

Figure 7. Interface Design with Bezel (mm)

Management Interface

Digital diagnostics is available on all Bookham XFP transceivers. A 2-wireSerial ID interface provides user access to

vendor/module identification, customer specific data, link type, static and dynamic monitor hooks, and a check code

mechanism for verifying accuracy in the data registers. These “static” and “dynamic” diagnostics allow users to remotely

and accurately identify modules and their vendors, make determinations about its compatibility with the system, verify

which “Enhanced” diagnostics are supported, and monitor module parameters to determine the module and

link condition.

The module’s “Enhanced Digital Diagnostics” features provide real-time monitoring of receiver input power, transmitter

power, internal module temperature, laser bias current, and supply voltage parameters.

The 2-wireserial ID interface was originally defined by the GBIC (GigaBit Interface Converter) and SFF-8472 specifications.

The XFP MSA (Multi-Source Agreement) document further defined the diagnostics features and introduced a new memory

map of the diagnostic information. This interface is a 2-wire interface that allows read-only access to separate

memory locations.

The memorylocation starting at A0h [data address 0 ~ 127] contains the Digital Diagnostic Functions.

The normal 256 Byte I2C address space is divided into lower and upper blocks of 128 Bytes. The lower block of 128

Bytes is always directly available and is used for the diagnostics and control functions that must be accessed repeatedly.

One exception to this is that the standard module identifier Byte defined in the GBIC and SFP is located in Byte 0 of the

memory map [in the diagnostics space] to allow software developed for multiple module types to have a common

branching decision point. This Byte is repeated in the Serial ID section so that it also appears in the expected relationship

to other serial ID bits.

Data Sheet

Bookham IGF-3000 Series 1550 nm XFP transceivers aredesigned to be Class 1 Laser compliant.

They arecertified per the following standards:

Regulatory compliance

Feature Agency Standard Certificate/Comments

Laser Safety FDA/CDRH CDRH 21(J) CFR 1040.10

Laser Safety 0520196-02

TÜV IEC/EN 60950-1:2001 US-TUVR-3130

IEC/EN 60825-1/A2:2001

CAN/CSA-60825-1-03 CU72060154

Component Safety UL/CSA CAN/CSA-C22.2 No. 60950-1-03 CU72060154

UL 60950-1:2003

UL 94 V-0

ESD IEC MIL-STD-883 Method 3015 Pass

IEC61000-4-2

EMI FCC/89/336/EE Part 15 Class B FCC Class B margin = 46.0 dBuV/m

[EU Directive] EN55022, EN55024 Class B EN55022 Class B margin = 15.9 dBuV/m

CE EU Directives 73/23/EEC (Low voltage) Pass

89/336/EEC (EMC)

Multiple blocks of memories are available in the upper 128 Bytes of the address space. These are individually addressed

through a table select Byte which the user enters into a location in the lower address space. Thus, there is a total available

address space of 128 * 256 = 32Kbytes in this upper memory space. The upper address space tables are used for less

frequently accessed functions such as serial ID, user writable EEPROM, reserved EEPROM and diagnostics and control

spaces for future standards definition, as well as ample space for vendor specific functions.

These are allocated as follows:

•Table 01h: Serial ID EEPROM

•Table 02h: User writable EEPROM

The details of each memory space are found in the XFP MSA specification Chapter 5.

Reference Documents:

1. XFP MSA revision 4.0, INF-8077i, “10 Gigabit Small Form Factor Pluggable Module” found at www.xfpmsa.org;

April 13, 2004

This product meets the requirements of the relevant EMC standards (EN 55022, EN 55024, FCC Part15). However the EMC performance of the product within

the host system may depend on characteristics of the host system over which Bookham has no control. It may therefore be necessary to ensure that the host

system provides adequate grounding & shielding of the product.

Data Sheet

Important Notice

Performance figures, data and any illustrative material

provided in this data sheet aretypical and must be

specifically confirmed in writing by Bookham before

they become applicable to any particular order or

contract. In accordance with the Bookham policy of

continuous improvement specifications may change

without notice. The publication of information in this

data sheet does not imply freedom from patent or other

protective rights of Bookham or others. Further details

areavailable from any Bookham sales representative.

Contact Information

BH12981 Rev 2.0 October 2006

North America

Bookham Worldwide

Headquarters

2584 Junction Ave.

San Jose

CA 95134

USA

•Tel: +1 408 919 1500

•Fax: +1 408 919 6083

www.bookham.com

sales@bookham.com

Europe

Paignton Office

Brixham Road

Paignton

Devon

TQ4 7BE

United Kingdom

•Tel: +44 (0) 1803 66 2000

•Fax: +44 (0) 1803 66 2801

Asia

Shenzhen Office

2Phoenix Road

Futian Free Trade Zone

Shenzhen 518038

China

•Tel: +86 755 33305888

•Fax: +86 755 33305805

+86 755 33305807

RoHS Compliance

Bookham is fully committed to environment

protection and sustainable development and has

set in place a comprehensive program for

removing polluting and hazardous substances from

all of its products. The relevant evidence of RoHS

compliance is held as part of our controlled

documentation for each of our compliant products.

RoHS compliance parts are available to order,

please refer to the ordering information section for

further details.

Ordering Information:

IGF-32511J TRX 10G XFP 40KM IR MP COM

ROHS 5/6