www.osram-os.com Produktdatenblatt | Version 1.1 SFH 4715S SFH 4715S OSLON (R) Black OSLON Black Series (850 nm) - 80 Applications ----Safety and Security, CCTV ----Eye Tracking ----Gesture Recognition Features: ----Package: clear silicone ----Corrosion Robustness Class: 3B ----Qualifications: The product qualification test plan is based on the guidelines of AEC-Q101-REV-C, Stress Test Qualification for Automotive Grade Discrete Semiconductors. ----ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2) ----IR lightsource with high efficiency ----Double stack emitter ----Low thermal resistance ----Centroid wavelength 850 nm ----Optimized for high current pulse operation Ordering Information Type Radiant intensity 1)2) IF=1A; tp=10ms Ie Ordering Code 355 ... 560 mW/sr Q65111A5563 SFH 4715S 560 ... 900 mW/sr Q65111A1549 SFH 4715S-CBDA 1 Version 1.9 | 2020-12-21 SFH 4715S Maximum Ratings TA=25C Parameter Symbol Values Operating temperature Top min. max. -40 C 125 C Storage temperature Tstg min. max. -40 C 125 C Junction temperature Tj max. 145 C Forward current IF max. 1A Surge current tp500s; D=0 IFSM max. 5A Reverse current3) IR max. 200 mA Power consumption Ptot max. 3.4 W ESD withstand voltage acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2) VESD max. 2 kV For the forward current and power consumption please see "maximum permissible forward current" diagram 2 Version 1.9 | 2020-12-21 SFH 4715S Characteristics IF=1000mA; tp=10ms; TA=25C Parameter Symbol Peak wavelength peak typ. 860 nm Centroid wavelength centroid typ. 850 nm Spectral bandwidth at 50% Irel,max (FWHM) typ. 30 nm Half angle typ. 40 Dimensions of active chip area LxW typ. 1x1 mmxmm Rise time (10% / 90%) IF=5A; RL=50 tr typ. 10 ns Fall time (10% / 90%) IF=5A; RL=50 tf typ. 15 ns Forward voltage4) IF=1A; tp=100s VF typ. max. 2.95 V 3.4 V Forward voltage4) IF=5A; tp=100s VF typ. max. 3.5 V 4.5 V Reverse voltage3) IR=20mA VR max. 1.2 V Reverse voltage (ESD device)3) VR ESD min. 5V Total radiant flux5) e typ. 1360 mW Temperature coefficient of voltage TCV typ. -2 mV / K Temperature coefficient of brightness TCI typ. -0.3 % / K Temperature coefficient of wavelength TC typ. 0.3 nm / K Thermal resistance junction solder point real6) RthJS real typ. max. 6.0 K / W 9.0 K / W 3 Version 1.9 | 2020-12-21 Values SFH 4715S Brightness Groups Group Radiant intensity 1)2) IF=1000mA; tp=10ms min. Ie Radiant intensity 1)2) IF=1000mA; tp=10ms max. Ie CB 355 mW/sr 450 mW/sr DA 450 mW/sr 560 mW/sr DB 560 mW/sr 710 mW/sr EA 710 mW/sr 900 mW/sr Only one group in one packing unit (variation lower 1.6:1) Relative Spectral Emission 7), 8) Ie,rel=f(); IF=1000mA; tp=10ms OHF04132 100 I rel % 80 60 40 20 0 700 750 800 850 nm 950 4 Version 1.9 | 2020-12-21 SFH 4715S Radiation Characteristics 7), 8) Ie,rel=f() [ ] -20 -10 0 10 20 30 40 50 60 70 80 90 1.0 -30 : 0 0.9 -40 0.8 -50 0.7 0.6 -60 0.5 0.4 -70 0.3 0.2 -80 0.1 -90 0.0 Forward current Relative Total Radiant Flux 7), 8) IF=f(VF); single pulse; tp=100s [ ] e/e(1000mA)=f(IF); single pulse; tp=100s 5 1 0.5 7), 8) 5 1 0.5 0.1 0.1 0.05 0.05 0.01 0.01 2.6 2.8 3.0 3.2 0.005 0.01 3.4 [ ] 5 Version 1.9 | 2020-12-21 0.05 0.5 1 5 [ ] SFH 4715S Max. Permissible Forward Current Permissible Pulse Handling Capability IF,max=f(TS); Rthjs=9K / W; single pulse IF=f(tp); D=parameter; TS=85C [ ] 1.0 [ ] 0.8 5 4 0.6 3 0.4 2 0.2 1 0.0 0 20 40 60 6 Version 1.9 | 2020-12-21 80 100 120 [ ] :D=1 : D = 0,5 : D =0,2 : D =0,1 : D =0,05 : D =0,02 : D =0,01 : D =0,005 0 -6 -5 -4 -3 10 10 10 10 0.01 0.1 1 10 100 [ ] SFH 4715S Dimensional Drawing 9) Further Information: Approximate Weight: 31.0 mg Package marking: Cathode Corrosion test: Class: 3B Test condition: 40C / 90 % RH / 15 ppm H2S / 14 days (stricter than IEC 60068-2-43) ESD advice: The device is protected by ESD device which is connected in parallel to the Chip. 7 Version 1.9 | 2020-12-21 SFH 4715S Recommended Solder Pad 9) For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. Package not suitable for ultra sonic cleaning. 8 Version 1.9 | 2020-12-21 SFH 4715S Reflow Soldering Profile Product complies to MSL Level 2 acc. to JEDEC J-STD-020E OHA04525 300 C T 250 Tp 245 C 240 C tP 217 C 200 tL 150 tS 100 50 25 C 0 0 50 100 150 200 250 s 300 t Profile Feature Symbol Pb-Free (SnAgCu) Assembly Minimum Recommendation Maximum Ramp-up rate to preheat*) 25 C to 150 C tS Time tS TSmin to TSmax Ramp-up rate to peak*) TSmax to TP Liquidus temperature 60 2 3 100 120 2 3 Unit K/s s K/s TL 217 Time above liquidus temperature tL 80 100 s Peak temperature TP 245 260 C Time within 5 C of the specified peak temperature TP - 5 K tP 20 30 3 6 Ramp-down rate* TP to 100 C 10 Time 25 C to TP All temperatures refer to the center of the package, measured on the top of the component * slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range 9 Version 1.9 | 2020-12-21 C 480 s K/s s SFH 4715S Taping 9) 10 Version 1.9 | 2020-12-21 SFH 4715S Tape and Reel 10) Reel Dimensions A 180 mm W Nmin 12 + 0.3 / - 0.1 mm 11 Version 1.9 | 2020-12-21 W1 60 mm W2 max 12.4 + 2 mm 18.4 mm Pieces per PU 600 SFH 4715S Barcode-Product-Label (BPL) Dry Packing Process and Materials 9) Moisture-sensitive label or print L E E V l e be sela ). k, H de L If an bl r co ba (R id m ity . H R hu 0% e e /6 tiv C la ared ag ck re fr 30 _ < in pa % k of to 90 rs ea s d ). rs ou or te (p on rs H de , ou iti H an bjec ng ou rs co C 72 si nd H ou 5 te 48 C su es e H co 24 6 da e y 40 be oc tim C e or < ith tim ill pr). or ct w O w nt 23 tim e at lo or fa M TO F s al tim at le C at lo at or e. P th F l tic th va lo or ur O F lo s ui on be if: read en w ed l 4 5 F m la ce eq id lo g, n oc l ve vi 5a is in or be 24 de pr ve l 6 Le de , nt whe e te co g: , w e Le ve l ke r ou se da ba ed flo ur e Le ve m % ba e ba al st ur e Le r en re ed e re> 10 oi st e e fo tim ur se al op fo M se oi st ur as k, is or . 33 se is M oi st bed k, lo H an , g ph -0 M oi in an in F R ng ar rbl D M e ba T r po If bl ith % lif ki r C. (if S is p. w ea r ks lf J10 ba to et th va Y ea m rs m _ r w, < he ed 1 ee te Y d, EC iredicat S fte at nt > 1 W Hou D A flody qu In no ire 1. d e ou 4 8 re reity is qu/JE re 2. bo e M tim to es id 2b re C 16 : e a) S tim is IP ic ed loor tim e b) ev Humor or e en F tim lo or D 2a king nc te F op a) lo or 3. b) ba re F lo da e fe l 1 2 F If al re tim ve l 4. se d l 2a ve Le 3 an ve l ag e Le e B ve ur e Le at st ur e Le D oi st ur e M oi st ur M oi st M oi M N E RS s in IV O IT T S C nta N U TIO U coSEND Ais bUagRMEICO T E CThIS S d Barcode label < M RA OS Humidity indicator Barcode label Please check the HIC immidiately after bag opening. Discard if circles overrun. Avoid metal contact. Do not eat. Comparator check dot WET If wet, examine units, if necessary bake units 15% If wet, examine units, if necessary bake units 10% 5% If wet, parts still adequately dry. change desiccant Humidity Indicator MIL-I-8835 Desiccant AM OSR OHA00539 Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card according JEDEC-STD-033. 12 Version 1.9 | 2020-12-21 SFH 4715S Notes The evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of lamps and lamp systems). Within the risk grouping system of this IEC standard, the device specified in this data sheet falls into the class exempt group (exposure time 10000 s). Under real circumstances (for exposure time, conditions of the eye pupils, observation distance), it is assumed that no endangerment to the eye exists from these devices. As a matter of principle, however, it should be mentioned that intense light sources have a high secondary exposure potential due to their blinding effect. When looking at bright light sources (e.g. headlights), temporary reduction in visual acuity and afterimages can occur, leading to irritation, annoyance, visual impairment, and even accidents, depending on the situation. Subcomponents of this device contain, in addition to other substances, metal filled materials including silver. Metal filled materials can be affected by environments that contain traces of aggressive substances. Therefore, we recommend that customers minimize device exposure to aggressive substances during storage, production, and use. Devices that showed visible discoloration when tested using the described tests above did show no performance deviations within failure limits during the stated test duration. Respective failure limits are described in the IEC60810. For further application related information please visit www.osram-os.com/appnotes 13 Version 1.9 | 2020-12-21 SFH 4715S Disclaimer Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. If printed or downloaded, please find the latest version on the OSRAM OS website. Packing Please use the recycling operators known to you. We can also help you - get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Product and functional safety devices/applications or medical devices/applications OSRAM OS components are not developed, constructed or tested for the application as safety relevant component or for the application in medical devices. OSRAM OS products are not qualified at module and system level for such application. In case buyer - or customer supplied by buyer - considers using OSRAM OS components in product safety devices/applications or medical devices/applications, buyer and/or customer has to inform the local sales partner of OSRAM OS immediately and OSRAM OS and buyer and /or customer will analyze and coordinate the customer-specific request between OSRAM OS and buyer and/or customer. 14 Version 1.9 | 2020-12-21 SFH 4715S Glossary 1) Radiant intensity:Measured at a solid angle of = 0.01 sr 2) Brightness:The brightness values are measured with a tolerance of 11%. 3) Reverse Operation:This product is intended to be operated applying a forward current within the specified range. Applying any continuous reverse bias or forward bias below the voltage range of light emission shall be avoided because it may cause migration which can change the electro-optical characteristics or damage the LED. 4) Forward Voltage:The forward voltages are measured with a tolerance of 0.1 V. 5) Total radiant flux:Measured with integrating sphere. 6) Thermal resistance:junction - soldering point, of the device only, mounted on an ideal heatsink (e.g. metal block) 7) Typical Values:Due to the special conditions of the manufacturing processes of semiconductor devices, the typical data or calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily correspond to the actual parameters of each single product, which could differ from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice. 8) Testing temperature:TA = 25C (unless otherwise specified) 9) Tolerance of Measure:Unless otherwise noted in drawing, tolerances are specified with 0.1 and dimensions are specified in mm. 10) Tape and Reel:All dimensions and tolerances are specified acc. IEC 60286-3 and specified in mm. 15 Version 1.9 | 2020-12-21 SFH 4715S Revision History Version Date Change 1.8 2020-08-25 Schematic Transportation Box Dimensions of Transportation Box 1.9 2020-12-21 Characteristics 16 Version 1.9 | 2020-12-21 SFH 4715S Published by OSRAM Opto Semiconductors GmbH Leibnizstrae 4, D-93055 Regensburg www.osram-os.com (c) All Rights Reserved. 17 Version 1.9 | 2020-12-21