Pressure sensors
C32 series
Series/Type: Absolute pressure sensor die for wet media
Ordering code:
Date: 2009-08-03
Version: 3
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Identification/Classification 1
(header 1 + top left bar):
Pressure sensors
Identification/Classification 2
(header 2 + bottom left header bar):
C32 series
Ordering code: (top right header bar)
Series/Type: (top right header bar) Absolute pressure sensor die for wet media
Preliminary data (optional):
(if necessary)
Preliminary data
AS SEN PD
EPCOS AG 2015. Reproduction, publication and dissemination of this publication, enclosures hereto and the information
contained therein without EPCOS' prior express consent is prohibited.
EPCOS AG is a TDK Group Company.
Pressure sensors
C32 series Absolute pressure sensor die for wet media
Preliminary data
AS SEN PD 2009-08-03
Please read Cautions and warnings and Page 2 of 8
Important notes at the end of this document.
Applications
Medical devices
Automotive
Automation
Features
Piezoresistive MEMS technology
Small dimensions: 1.65 × 1.65 mm
Square diaphragm
Reference pressure chamber on topside
Measured media (back side):
Non-aggressive gases and fluids.
Unsuitable for substances which react with
glass or silicon.
Whetstone bridge with mV output,
ratiometric to supply voltage
Rated pressure ranges 1.6 up to 40 bar
Outstanding long-term stability
Delivery mode
Tray / foil
Dimensional drawings
760 260
1425
1650±100
763
X2
X2
R3
R1
R4
R2
X1
X5
X1
p
X10
1650±100
713
X5
713
713 613
423
X4
electrical diagram:
X10
125
125
glass
BOROFLOAT
TM
Si 100
allowable edge disruptions
80 µm max.
400±100
800±20300±5
allowable edge disruptions
50 µm max.
A
150 A B
B
B Note1
Note1
Note1: geometry of diaphragm depend on
specification
Note2
glass
BOROFLOAT
TM
140
X10
X10
X11
X11
50±25
1325
400
+100
-0
all dimensions in µm
X4
X1 : Vout+
X2 : VDD–
X4 : Vout–
X5 : VDD+
X10 : Substrate
X11 : Shield
Pressure sensors
C32 series Absolute pressure sensor die for wet media
Preliminary data
AS SEN PD 2009-08-03
Please read Cautions and warnings and Page 3 of 8
Important notes at the end of this document.
Technical data
Absolute maximum ratings
Parameter Symbol Conditions Min. Typ. Max. Units
Supply voltage
Maximum supply voltage V
DD
Without damage
1)
10 V
Temperature ranges
2)
–40 135 °C
Operating temperature range T
a
For t <15 min –40 140 °C
Storage temperature range T
st 3)
–40 150 °C
Pressure ranges
Operating pressure ranges p
r
Absolute pressure
4)
0 ... 1.6 0 ... 40 bar
Over pressure
p
ov
Absolute pressure
5)
2.5 p
r
Burst pressure
p
berst
Absolute pressure
6)
3 p
r
Electrical specifications
Parameter Symbol Conditions Min. Typ. Max. Units
Operating pressure p
r 4)
See next table bar
Supply voltage / bridge resistance
Operating supply voltage V
DD 7)
1.0 5.0 V
Total bridge resistance R
S
@ 25 °C
8)
2.6 3.3 4.0 kΩ
α
Rs
@ 25 °C
9)
2.0 2.3 2.7 10
–3
/K
Temperature coefficient
of total bridge resistance
β
Rs
3 5 8 10
–6
/K
2
Output signal @ V
DD
= 5 V
Offset V
0
@ 25 °C
10)
See next table mV
Sensitivity
S @ 25 °C
13)
See next table mV/bar
α
S
@ 25 °C
15)
–2.5 –2.2 –1.9 10
–3
/K
Temperature coefficient
of the sensitivity β
S
3 5 8 10
–6
/K
2
Pressure hysteresis pHys
16)
–0.1 0.1 % FS
Long-term stability (Full scale normal output FSON = 120 mV)
Temperature hysteresis of offset THV
0
17)
–0.2 ±0.1 0.2 % FSON
Temperature cycle drift of offset TCDV
0 17)
–0.1 ±0.05 0.1 % FSON
High temperature drift of offset HTDV
0
17)
–0.25 ±0.05 0.25 % FSON
Long term stability of offset LTSV
0
17)
–0.3 ±0.1 0.3 % FSON
Pressure sensors
C32 series Absolute pressure sensor die for wet media
Preliminary data
AS SEN PD 2009-08-03
Please read Cautions and warnings and Page 4 of 8
Important notes at the end of this document.
Operating pressures and ordering codes
Parameter @ 25 °C, V
DD
= 5 V Symbol Typ. Typ. Typ. Typ. Units
Operating pressure
4)
p
r
1.6 4 10 25 bar
Offset voltage
10)
[min/typ/max] V
0
–50/–15/25 –40/–5/25 –35/–3/25 –30/0/25 mV
TCV
0–
–20 –10 –7 –6 µV/VK
Temperature coefficient
of offset voltage (unglued)
11)
[typ] TCV
0+
–10 ±5 ±3 ±3 µV/VK
Nonlinearity
14)
[typ/max] L ±0.2/±0.3 ±0.2/±0.3 ±0.2/±0.3 ±0.2/±0.3 % FS
Sensitivity
13)
[min/typ/max]
S 45/70/95 23/30/38 9/12/15 3.6/4.8/6 mV/bar
Product type
AEA 1.600 C32/2 F04 G08 N
AEA 4.000 C32/2 F04 G08 N
AEA 10.00 C32/2 F04 G08 N
AEA 25.00 C32/2 F04 G08 N
Ordering code
B58600H8400A037
B58600H8400A039
B58600H8400A038
B58600H8400A040
Other operating pressures upon request.
Pressure sensors
C32 series Absolute pressure sensor die for wet media
Preliminary data
AS SEN PD 2009-08-03
Please read Cautions and warnings and Page 5 of 8
Important notes at the end of this document.
Symbols and terms
1)
Maximum power supply V
DD
This is the maximal allowed voltage, which may be applied to the piezoresistive bridge circuit without damage.
2)
Operating temperature range T
a
This is the operating Temperature range T
a,min
to T
a,max
.
Because most of the sensor parameters depend on assembling
conditions like gluing, wire bonding etc, the die has to be tested over the operating temperature range by the customer
fully assembled. For design verification and process control samples, mounted in AK transducer package (AK2 series)
are tested over a reduced measuring temperature range of T
meas,min
to T
meas,max
.
3)
Storage temperature range T
st
If the pressure sensor dies are stored in the temperature range T
st,min
to T
st,max
without applied voltage power supply, this
will not affect the performance of the pressure sensor dies.
4)
Operating pressure range p
r
In the operating pressure range 0 to p
r,max
the pressure sensor die output characteristic is as defined in this specification.
5)
Over pressure p
OV
Pressure cycles in the pressure range 0 to p
ov
do not affect the performance of the pressure sensor dies.
6)
Burst pressure p
berst
Up to the burst pressure p
berst
the diaphragm of the sensor die will not be destroyed mechanically. This parameter is
tested at room temperature on samples mounted on an aluminium socket by applying the specified burst pressure for
10 minutes. The evaluation of this test is done by optical inspection of the diaphragm.
7)
Operating power supply V
DD
The pressure sensor parameters are defined for a power supply voltage of V
DD
= 5 V. In the operating power supply
voltage range V
DD,min
to V
DD,max
the ratiometric parameters r(V
DD
) like sensitivity, offset voltage and the temperature
coefficient of the offset voltage are defined by:
( )
]V[5
V
])V[5(rVr
DD
DD
=
8)
Total bridge resistance R
S
The total bridge resistance is defined between pad X5 and X2, (see the dimensional drawing in this data sheet) of the
closed piezoresistive bridge circuit. The total bridge resistance is in a good approximation the output impedance of the
piezoresistive bridge circuit. This parameter is tested completely on a wafer (wafer level test measurement).
9)
Temperature coefficients of resistance α
αα
α
Rs
and β
ββ
β
Rs
:
The temperature coefficients of resistance are tested for design verification on samples, mounted on AK transducer
package (AK2 series) over a reduced temperature range T
meas
,
min
= –20 °C to T
meas
,
max
= 80 °C with T
R
= 25 °C.
The temperature coefficients of first and second order are defined with the polynomial:
(
)
(
)
°−β+°−α+°==
2
RsRs
SS
C25TC25T1)C25T(R)T(R
The coefficients α
Rs
and β
Rs
are calculated using the three measurement points of R
s
(T) at T
meas,min
, T
R
and T
meas,max
.
10)
Offset voltage V
0
The offset voltage V
0
is the output voltage V
out
(p = 0 bar absolute) at zero absolute pressure and for a bridge voltage
power supply V
DD
= 5 V. The high range of the allowed offset voltage is due to the reference pressure in the glass cap
from 0 to 0.3 bar and to the tolerance of the sensitivity. The typical value of the reference pressure is 0.2 bar.
Before anodic glass bonding the offset voltage is tested completely on a wafer (wafer level test measurement)
with limits –25 mV < V
0
< 25 mV. For design verification V
0
is measured on samples, mounted in AK transducer package
(AK2 series) by extrapolating the output characteristic to zero bar.
It should be noted that this parameter may be influenced by assembly.
11)
Temperature coefficients of offset voltage TCV
0+
and TCV
0–
The temperature coefficients of offset voltage are defined for a bridge voltage power supply V
DD
= 5 V.
These parameters strongly depend on assembly conditions like gluing, wire bonding etc.
The temperature coefficients of offset voltage are tested for design verification on samples, mounted on AK transducer
package (AK2 series) over a reduced temperature range T
meas
,
min
= –20 °C to T
meas
,
max
= 80 °C with T
R
= 25 °C.
Assuming the offset voltage is mainly due to induce stress TCV
0
may be calculated by extrapolating using:
(
)
(
)
2
21o
2
ss0 )C25T(v)C25T(v)C25(V)C25T()C25T(1)T(V °−+°−+°°−β+°−α+=
Pressure sensors
C32 series Absolute pressure sensor die for wet media
Preliminary data
AS SEN PD 2009-08-03
Please read Cautions and warnings and Page 6 of 8
Important notes at the end of this document.
α
s
and β
s
are the linear and nonlinear temperature coefficient of the sensitivity respectively (see
15)
).
Therefore TCV
0+
and TCV
0–
are defined for the measurement temperature range by:
C25T
)C25(V)T(V
TCVo
max
omaxo
°−
°−
=
+
C25T
)C25(V)T(V
TCVo
min
omino
°−
°−
=
−
12)
Full scale value FS
omaxrout
V)p(VFS −=
13)
Sensitivity S
The sensitivity is defined for a bridge voltage power supply V
DD
= 5 V. It can be determined by the formula:
maxr
omaxrout
p
V)p(V
S−
=
This parameter is tested for process control on samples, mounted on AK transducer package (AK2 series).
14)
Nonlinearity L
This parameter may be influenced by assembly.
The nonlinearity is measured using the endpoint method. Assuming a characteristic, this can be approximated
by a polynomial of second order, where the maximum is at p
x
= p
r,max
/2. The nonlinearity is defined at p
x
= p
r,max
/2,
using the equation:
max,r
x
omax,rout
oxout
p
p
V)p(V
V)p(V
L−
−
−
=
This parameter is tested for process control on samples, mounted on AK transducer package (AK2 series).
15)
Temperature coefficients of sensitivity α
αα
α
Rs
and β
ββ
β
Rs
:
These parameters may be influenced by assembly.
The temperature coefficients of sensitivity are tested for design verification on samples, mounted on AK transducer
package (AK2 series) over a reduced temperature range T
meas
,
min
= –20 °C to T
meas
,
max
= 80 °C with T
R
= 25 °C.
The temperature coefficients of first and second order are defined with the polynomial:
( ) ( )
°−β+°−α+°==
2
SS
C25TC25T1)C25T(S)T(S
The coefficients α
S
and β
S
are calculated using the three measurement points of S(T) at T
meas,min
, T
R
and T
meas,max
.
16)
Pressure hysteresis pHys
The pressure hysteresis is the difference between output voltages at constant pressure and constant temperature while
applying a pressure cycle with pressure steps of p
r, min
, p
1
, p
2
, p
3
, p
r,max
, p
3
, p
2
, p
1
, p
r, min
:
FS
)p(V)p(V
pHys
k1,outk2,out
−
=
With k = min, 1, 2, 3, max. The pressure steps are: p
rmin
= 0, p
1
= 0.25·p
r,max
, p
2
= 0.5·p
r,max
, p
3
= 0.75·p
r, max
, p
r,max
.
This parameter is tested for design verification on samples, mounted on AK transducer package (AK2 series).
17)
Reliability data
For long-term stability of offset voltage LTSV
0
please refer to the defined Aktiv Sensor’s standard AS100001 in chapter
“Reliability data” on the internet.
Pressure sensors
C32 series Absolute pressure sensor die for wet media
Preliminary data
AS SEN PD 2009-08-03
Please read Cautions and warnings and Page 7 of 8
Important notes at the end of this document.
Cautions and warnings
Storage (general)
All pressure sensors should be stored in their original packaging. They should not be placed in harmful environments such
as corrosive gases nor exposed to heat or direct sunlight, which may cause deformations. Similar effects may result from
extreme storage temperatures and climatic conditions. Avoid storing the sensor dies in an environment where condensation
may form or in a location exposed to corrosive gases, which will adversely affect their performance. Plastic materials should
not be used for wrapping/packing when storing or transporting these dies, as they may become charged. Pressure sensor
dies should be used soon after opening their seal and packaging.
Operation (general)
Media compatibility with the pressure sensors must be ensured to prevent their failure. The use of other media can cause
damage and malfunction. Never use pressure sensors in atmospheres containing explosive liquids or gases.
Ensure pressure equalization to the environment, if gauge pressure sensors are used. Avoid operating the pressure sensors
in an environment where condensation may form or in a location exposed to corrosive gases. These environments adversely
affect their performance.
If the operating pressure is not within the rated pressure range, it may change the output characteristics. This may also
happen with pressure sensor dies if an incorrect mounting method is used. Be sure that the applicable pressure does not
exceed the overpressure, as it may damage the pressure sensor.
Do not exceed the maximum rated supply voltage nor the rated storage temperature range, as it may damage the pressure
sensor.
Temperature variations in both the ambient conditions and the media (liquid or gas) can affect the accuracy of the output
signal from the pressure sensors. Be sure to check the operating temperature range and thermal error specification of the
pressure sensors to determine their suitability for the application.
Connections must be wired in accordance with the terminal assignment specified in the data sheets. Care should be taken
as reversed pin connections can damage the pressure transmitters or degrade their performance. Contact between the
pressure sensor terminals and metals or other materials may cause errors in the output characteristics.
Design notes (dies)
This specification describes the mechanical, electrical and physical requirements of a piezoresistive sensor die for
measuring pressure. The specified parameters are valid for the pressure sensor die with pressure application either to the
front or back side of the diaphragm as described in the data sheet. Pressure application to the other side may result in
differing data. Most of the parameters are influenced by assembly conditions. Hence these parameters and the reliability
have to be specified for each specific application and tested over its temperature range by the customer.
Handling/Mounting (dies)
Pressure sensor dies should be handled appropriately and not be touched with bare hands. They should only be picked up
manually by the sides using tweezers. Their top surface should never be touched with tweezers. Latex gloves should not be
used for handling them, as this will inhibit the curing of the adhesive used to bond the die to the carrier. When handling, be
careful to avoid cuts caused by the sharp-edged terminals. The sensor die must not be contaminated during manufacturing
processes (gluing, soldering, silk-screen process).
The package of pressure sensor dies should not to be opened until the die is mounted and should be closed after use. The
sensor die must not be cleaned. The sensor die must not be damaged during the assembly process (especially scratches on
the diaphragm).
Soldering (transducers, transmitters)
The thermal capacity of pressure sensors is normally low, so steps should be taken to minimize the effects of external heat.
High temperatures may lead to damage or changes in characteristics.
A non-corrosive type of flux resin should normally be used and complete removal of the flux is recommended.
Avoid rapid cooling due to dipping in solvent. Note that the output signal may change if pressure is applied to the terminals
during soldering.
This listing does not claim to be complete, but merely reflects the experience of EPCOS AG.
Important notes
Page 8 of 8
The following applies to all products named in this publication:
1. Some parts of this publication contain statements about the suitability of our products for
certain areas of application. These statements are based on our knowledge of typical
requirements that are often placed on our products in the areas of application concerned. We
nevertheless expressly point out that such statements cannot be regarded as binding
statements about the suitability of our products for a particular customer application. As a
rule, EPCOS is either unfamiliar with individual customer applications or less familiar with them
than the customers themselves. For these reasons, it is always ultimately incumbent on the
customer to check and decide whether an EPCOS product with the properties described in the
product specification is suitable for use in a particular customer application.
2. We also point out that in individual cases, a malfunction of electronic components or failure
before the end of their usual service life cannot be completely ruled out in the current state
of the art, even if they are operated as specified. In customer applications requiring a very high
level of operational safety and especially in customer applications in which the malfunction or
failure of an electronic component could endanger human life or health (e.g. in accident
prevention or life-saving systems), it must therefore be ensured by means of suitable design of the
customer application or other action taken by the customer (e.g. installation of protective circuitry
or redundancy) that no injury or damage is sustained by third parties in the event of malfunction or
failure of an electronic component.
3. The warnings, cautions and product-specific notes must be observed.
4. In order to satisfy certain technical requirements, some of the products described in this
publication may contain substances subject to restrictions in certain jurisdictions (e.g.
because they are classed as hazardous). Useful information on this will be found in our Material
Data Sheets on the Internet (www.epcos.com/material). Should you have any more detailed
questions, please contact our sales offices.
5. We constantly strive to improve our products. Consequently, the products described in this
publication may change from time to time. The same is true of the corresponding product
specifications. Please check therefore to what extent product descriptions and specifications
contained in this publication are still applicable before or when you place an order.
We also reserve the right to discontinue production and delivery of products. Consequently,
we cannot guarantee that all products named in this publication will always be available.
The aforementioned does not apply in the case of individual agreements deviating from the
foregoing for customer-specific products.
6. Unless otherwise agreed in individual contracts, all orders are subject to the current version of
the “General Terms of Delivery for Products and Services in the Electrical Industry”
published by the German Electrical and Electronics Industry Association (ZVEI).
7. The trade names EPCOS, BAOKE, Alu-X, CeraDiode, CSMP, CSSP, CTVS, DSSP, MiniBlue,
MiniCell, MKK, MLSC, MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap, SIFERRIT,
SIFI, SIKOREL, SilverCap, SIMDAD, SIMID, SineFormer, SIOV, SIP5D, SIP5K, ThermoFuse,
WindCap are trademarks registered or pending in Europe and in other countries. Further
information will be found on the Internet at www.epcos.com/trademarks.
