AXE262324 - Panasonic Industrial Devices

2.2 mm Ultra-slim body with the inherited high reliability

2011.07 panasonic-electric-works.net/ac

For board-to-FPC

Narrow pitch connectors

ADVANCED Series

0.4mm pitch

AXE1/AXE2

2ACCTB4E 201107-T

ORDERING INFORMATION

For board-to-FPC A4US Series

Narrow pitch connectors

(0.4mm pitch)

FEATURES

1. Ultra-slim (Mated width: 2.2 mm and

Mated height: 0.8 mm, 1.0 mm and 1.5

mm)

The footprint when mated is down

appro x. 12% from our existing A4S model

(50 contacts), contributing to the

functionality enhancement and size

reduction of target equipment.

* Suction face size for the 1.0 mm/1.5 mm mated

height type: Soc ket — 0.64 mm, Header — 0.76 mm

2. Improving the degree of design

freedom

(Mated height of 0.8 mm, 1.0 mm, or

1.5 mm with the same foot pattern)

3. “ ”

structure adopted to ensure high

resistance to various environments in

spite of the ultra-slim space-saving

body.

4. The simple lock structure for high

mating/unmating operation feel.

5. The contact at the four corners

enhance the mounting strength.

6. The gull-wing-shaped terminals

facilitate imaging inspections.

APPLICATIONS

• Particularly suitable for boar d-to-FPC

connections in ultra-compact mobile

equipment that requires size and

thickness reduction and functionality

enhancement

Socket Header

Compliance with RoHS Directive

Header

Socket

2.2mm

1.8mm

Suction face: 0.7mm*

Suction face: 0.6mm*

Soldering terminals

at the four corners

Soldering terminals

at the four corners

12.5 mm (50 contacts)

11.8 mm (50 contacts)

Bellows contact

construction

(Tough against dropping!)

Ni barrier

construction

(Tough against solder rise!)

Porosity treatment

(Tough against

corrosive gases!)

V notch and Double contact constructions

(Tough against foreign particles and flux!)

New

Surface treatment (Contact portion / Terminal portion)

4: Base: Ni plating, Surface: Au plating (for Ni barrier available)

4: Base: Ni plating, Surface: Au plating

1: Socket

2: Header

Mated height

1: 0.8 mm

2: 1.0 mm/1.5 mm

1: 0.8 mm

2: 1.0 mm

3: 1.5 mm

AXE 421

Number of contacts (2 digits)

Functions

2: Without positioning bosses

AXE1/AXE2

ACCTB4E 201107-T

PRODUCT TYPES

Notes: 1. Order unit:

For mass production: in 1-inner carton (1-reel) units

Samples for mounting check: in 50-connector units. Please contact our sales ofﬁce.

2. The abov e part numbers are f or connectors without positioning bosses, which are standard. When ordering connectors with positioning bosses, please contact our

sales ofﬁce.

3. Please contact us for connectors having a number of contacts other than those listed above.

SPECIFICATIONS

1. Characteristics

2. Material and surface treatment

Mated height Number of contacts Part number Packing

Socket Header Inner carton (1-reel) Outer carton

0.8mm

10 AXE110124 AXE210124

5,000 pieces 10,000 pieces

14 AXE114124 AXE214124

20 AXE120124 AXE220124

24 AXE124124 AXE224124

30 AXE130124 AXE230124

36 AXE136124 AXE236124

40 AXE140124 AXE240124

50 AXE150124 AXE250124

60 AXE160124 AXE260124

70 AXE170124 AXE270124

80 AXE180124 AXE280124

1.0mm

20 AXE120224 AXE220224

34 AXE134224 AXE234224

60 AXE160224 AXE260224

80 AXE180224 AXE280224

1.5mm 20 AXE120224 AXE220324

60 AXE160224 AXE260324

80 AXE180224 AXE280324

Item Speciﬁcations Conditions

Electrical

characteristics

Rated current 0.30A/contact (Max. 5 A at total contacts)

Rated voltage 60V AC/DC

Breakdown voltage 150V AC for 1 min. No short-circuiting or damage at a detection current of 1 mA

when the speciﬁed voltage is applied for one minute.

Insulation resistance Min. 1,000MΩ (initial) Using 250V DC megger (applied for 1 min.)

Contact resistance Max. 90mΩBased on the contact resistance measurement method

speciﬁed by JIS C 5402.

Mechanical

characteristics

Composite insertion force Max. 0.981N/contacts × contacts (initial)

Composite removal force Min. 0.165N/contacts × contacts

Contact holding force

(Socket contact) Min. 0.20N/contacts Measuring the maximum force.

As the contact is axially pull out.

Environmental

characteristics

Ambient temperature –55°C to +85°C No freezing at low temperatures. No dew condensation.

Soldering heat resistance Peak temperature: 260°C or less (on the surface of

the PC board around the connector terminals) Infrared reﬂow soldering

300°C within 5 sec. 350°C within 3 sec. Soldering iron

Storage temperature –55°C to +85°C (product only)

–40°C to +50°C (emboss packing) No freezing at low temperatures. No dew condensation.

Thermal shock resistance

(header and socket mated)

5 cycles,

insulation resistance min. 100MΩ,

contact resistance max. 90mΩ

Sequence

1. –55 °C, 30 minutes

2. ~ , Max. 5 minutes

3. 85 °C, 30 minutes

4. ~ , Max. 5 minutes

Humidity resistance

(header and socket mated) 120 hours, insulation resistance min. 100MΩ,

contact resistance max. 90mΩBath temperature 40±2°C,

humidity 90 to 95% R.H.

Saltwater spray resistance

(header and socket mated) 24 hours, insulation resistance min. 100MΩ,

contact resistance max. 90mΩBath temperature 35±2°C,

saltwater concentration 5±1%

H2S resistance

(header and socket mated) 48 hours, contact resistance max. 90mΩBath temperature 40±2°C, gas concentration 3±1 ppm,

humidity 75 to 80% R.H.

Lifetime

characteristics Insertion and removal life 30 times Repeated insertion and removal speed of max. 200 times/

hours

Unit weight 60 contacts Socket (h = 0.8mm: 0.03g, h = 1.0/1.5mm: 0.04g)

Header (h = 0.8mm: 0.01g, h = 1.0mm: 0.02g, h = 1.5mm: 0.03g)

Part name Material Surface treatment

Molded

portion LCP resin

(UL94V-0) —

Contact and

Post Copper alloy

Contact portion:

Base: Ni plating, Surface: Au plating

Terminal portion: Base: Ni plating, Surface: Au plating (except the terminal tips)

The socket terminals close to the portion to be soldered have nickel barriers (exposed nickel portions).

Soldering terminals: Sockets: Base: Ni plating, Surface: Pd+Au ﬂash plating (except the terminal tips)

Headers: Base: Ni plating, Surface: Au plating (except the terminal tips)

−3

AXE1/AXE2

4ACCTB4E 201107-T

DIMENSIONS (Unit: mm)

Socket (Mated height: 0.8 mm)

Z (Note)

Y (Note)

Terminal coplanarity

(Contact and

soldering terminals)

C±0.1

B±0.1

0.40±0.05

0.15±0.03

0.30±0.03

2.20

1.24

(0.80)

1.90

0.60 (Suction face)

0.77 0.08

General tolerance: ±0.2

Note: Since soldering terminals are built into the body, the Y and Z parts are connected electrically.

Dimension table (mm)

Number of contacts/

dimension A B C

10 4.5 1.6 3.6

14 5.3 2.4 4.4

20 6.5 3.6 5.6

24 7.3 4.4 6.4

30 8.5 5.6 7.6

36 9.7 6.8 8.8

40 10.5 7.6 9.6

50 12.5 9.6 11.6

60 14.5 11.6 13.6

70 16.5 13.6 15.6

80 18.5 15.6 17.6

Header (Mated height: 0.8 mm)

B±0.1

0.40±0.05

0.15±0.03

C±0.1

0.15±0.03

1.80

(0.72)

(0.54)

0.70 (Suction face)

1.28

0.65 Terminal coplanarity

(Post and

soldering terminals)

0.08

Soldering terminals

(Soldering terminals portion)

General tolerance: ±0.2

Dimension table (mm)

Number of contacts/

dimension A B C

10 3.8 1.6 3.2

14 4.6 2.4 4.0

20 5.8 3.6 5.2

24 6.6 4.4 6.0

30 7.8 5.6 7.2

36 9.0 6.8 8.4

40 9.8 7.6 9.2

50 11.8 9.6 11.2

60 13.8 11.6 13.2

70 15.8 13.6 15.2

80 17.8 15.6 17.2

AXE1/AXE2

ACCTB4E 201107-T

Socket and Header are mated

Socket (Mated height: 1.0 mm and 1.5 mm)

0.97 Terminal coplanarity

(Contact and

soldering terminals)

0.08

Z (Note)

Y (Note)

C±0.1

B±0.1

0.40±0.05

0.15±0.03

0.30±0.03

2.20

1.30

(0.80)

1.96

0.64

(Suction face)

General tolerance: ±0.2

Note: Since soldering terminals are built into the body, the Y and Z parts are connected electrically.

Dimension table (mm)

Number of contacts/

dimension A B C

20 6.5 3.6 5.6

34 9.3 6.4 8.4

60 14.5 11.6 13.6

80 18.5 15.6 17.6

Header (Mated height: 1.0 mm)

Terminal coplanarity

(Post and

soldering terminals)

0.08

0.76

(Suction face)

0.85

B±0.1

0.40±0.05

0.15±0.03

C±0.1

0.15±0.03

1.80

(0.88)

(0.46) 1.36

Soldering terminals

(Soldering terminals portion)

General tolerance: ±0.2

Dimension table (mm)

Number of contacts/

dimension A B C

20 5.8 3.6 5.2

34 8.6 6.4 8.0

60 13.8 11.6 13.2

80 17.8 15.6 17.2

Header (Mated height: 1.5 mm)

Terminal coplanarity

(Post and

soldering terminals)

0.08

0.76

(Suction face)

1.35

B±0.1

0.40±0.05

0.15±0.03

C±0.1

0.15±0.03

1.80

(0.88)

(0.46) 1.36

Soldering terminals

(Soldering terminals portion)

General tolerance: ±0.2

Dimension table (mm)

Number of contacts/

dimension A B C

20 5.8 3.6 5.2

60 13.8 11.6 13.2

80 17.8 15.6 17.2

Header Header Header

Socket Socket Socket

0.80±0.1

1.00±0.1

1.50±0.1

AXE1/AXE2

6ACCTB4E 201107-T

EMBOSSED T APE DIMENSIONS (Unit: mm)

• Dimension table (Unit: mm)

• Connector orientation with respect to embossed tape feeding direction

NOTES

Type/Mated height Number of contacts Type of taping A B C D Quantity per reel

Common for sockets and headers:

0.8mm, 1.0mm and 1.5mm

Max. 24 Tape I 16.0 — 7.5 17.4 5,000

30 to 70 Tape I 24.0 — 11.5 25.4 5,000

80 Tape II 32.0 28.4 14.2 33.4 5,000

• Speciﬁcations for taping

(In accordance with JIS C 0806-3:1999. However, not applied to

the mounting-hole pitch of some connectors.)

• Speciﬁcations for the plastic reel

(In accordance with EIAJ ET-7200B.)

Tape I Tape II

Leading direction after packaging

1.5 dia.

+0.1

1.5 dia.

+0.1

(1.75) (1.75)

(B)

(A±0.3)(A )

(4.0)

(2.0)

8.0

+0.3

−0.1

Embossed mounting-hole

Taping reel

Top cover tape

Embossed carrier tape

(D±1)

380 dia.

Type

Direction

of tape progress Common for A4US

Socket Header

Note: There is no indication on this product regarding top-bottom or left-right orientation.

1. Regarding the design of PC board

patterns

Conduct the recommended foot pattern

design, in order to preserve the

mechanical strength of terminal solder

areas.

2. Recommended PC board and metal

mask patterns

Appropriate control of solder amount is

required to minimize solder bridges and

other defects for connectors with 0.35

mm, 0.4 mm or 0.5 mm pitch terminals,

which require high-density mounting.

Refer to the right-hand drawing for

recommended patterns.

3. See the common “NOTES FOR

USE” on the next page for other points

to be noted.

• Socket (Mated height: 0.8 mm, 1.0

mm and 1.5 mm)

Recommended PC board pattern (TOP VIEW)

Recommended metal mask opening pattern

Metal mask thickness: When 120µm

(Terminal opening ratio: 70%)

(Metal-par t opening ratio: 100%)

• Header (Mated height: 0.8 mm, 1.0

mm and 1.5 mm)

Recommended PC board pattern (TOP VIEW)

Recommended metal mask opening pattern

Metal mask thickness: When 120µm

(Terminal opening ratio: 70%)

(Metal-par t opening ratio: 100%)

C0.30

2.60±0.03

0.20±0.03

1.60±0.03

1.04±0.03

(0.78)

(0.50)

0.40±0.03

0.80±0.03

1.45±0.03

0.23±0.03

: Insulatin area

C0.30

1.70±0.01

2.50±0.01

2.60±0.01

1.04±0.01

(0.78)

(0.40)

0.40±0.01

0.20±0.01

0.80±0.01

1.45±0.01

2.20±0.03

0.90±0.03

2.20±0.03

0.50±0.03

(0.85)

(0.65)

0.40±0.03

0.80±0.03

0.28±0.03

0.23±0.03

2.20±0.01

1.03±0.01

2.07±0.01

0.50±0.01

(0.85)

(0.52)

0.40±0.01

0.20±0.01

0.80±0.01

0.28±0.01

AXE1/AXE2

ACCTB4E 201107-T

NOTES FOR USE

 Connector mounting

When the working environment is dry, be

careful for static buildup.

The buildup of static electricity

occasionally causes the products to cling

to the taping material. To prevent static

buildup, it is recommended that you

maintain the relative humidity of your

working environment at 40 to 60%, while

eliminating static using an ionizer or other

means.

 Soldering

1) Manual soldering.

• Due to the low proﬁle, if an excessive

amount of solder is applied to this

product during manual soldering, the

solder may creep up to near the contact

points, or interference by solder may

cause imperfect contact.

• Make sure that the soldering iron tip is

heated within the temperature and time

limits indicated in the speciﬁcations.

• Flux from the solder wire ma y adhere to

the contact surfaces during soldering

operations. After soldering, carefully

check the contact surfaces and clean off

any ﬂux before use.

• Be aware that a load applied to the

connector terminals while soldering may

displace the contact.

• Thoroughly clean the iron tip.

2) Reﬂow soldering

• Screen-printing is recommended for

printing paste solder.

• To determine the relationship between

the screen opening area and the PC-

board foot pattern area, refer to the

diagrams in the recommended patterns

for PC boards and metal masks. Make

sure to use the terminal tip as a reference

position when setting.

Avoid an excessive amount of solder

from being applied, otherwise,

interference by the solder will cause an

imperfect contact.

• Consult us when using a screen-printing

thickness other than that recommended.

• Depending on the size of the connector

being used, self alignment may not be

possible. Accordingly, carefully position

the terminal with the PC board pattern.

• The recommended reﬂow temperature

proﬁle is given in the ﬁgure below

Recommended reﬂow temperature proﬁle

• The temperature is measured on the

surface of the PC board near the

connector terminal.

• Some solder and ﬂux types may cause

serious solder creeping. Take the solder

and ﬂux characteristics into consideration

when setting the reﬂow soldering

conditions.

3) Reworking on a soldered portion

• Finish reworking in one operation.

• For reworking of the solder bridge, use

a soldering iron with a ﬂat tip. Do not add

ﬂux, otherwise, the ﬂux may creep to the

contact parts.

• Use a soldering iron whose tip

temperature is within the temperature

range speciﬁed in the speciﬁcations.

 Do not dr op the pr oduct or handle it

carelessly. Otherwise, the terminals

may become deformed due to

excessive force or the solderability

during reﬂow soldering may degrade.

 Do not insert or remove the

connector when it is not soldered.

Also, forcibly applied external

pressure on the terminals can weaken

the adherence of the terminals to the

molded part or cause the terminals to

lose their evenness.

 Excessive prying-force applied to

one end may cause product breakage

and separation of the solder joints at

the terminal.

In particular, when removing the

connector, be sure not to tilt the

connector exceeding 15 degrees

widthwise. Excessive f orce applied f or

insertion in a pivot action as shown

may also cause product breakage.

Align the header and socket positions

before connecting them.

 When cutting or bending the PC

board after mounting the connector,

be careful that the soldered sections

are subjected to excessive forces.

 Notes when using a FPC.

When the connector is soldered to an

FPC board, during its insertion and

removal procedures, forces may be

applied to the terminals and cause the

soldering to come off. It is recommended

to use a reinforcement board on the

backside of the FPC board to which the

connector is being connected. Make sure

that the reinf orcing plate is larger than the

outline of the recommended PC board

pattern (Outline + approx. 1 mm). The

reinforcing plate is made of glass epoxy

or polyimide that is 0.2 to 0.3 mm thick.

This connector employs a simple locking

structure. However, the connector may

come off depending on the size and

weight of the FPC, layout and reaction

force of FPC, or by drop impact. Make

sure to fully check the equipment’s

condition. To prevent any problem with

loose connectors, adopt measures to

prevent the connector from coming off

inside the equipment.

 Other Notes

When coating the PC board after

soldering the connector to prevent the

deterioration of insulation, perform the

coating in such a way so that the coating

does not get on the connector.

The connectors are not meant to be used

for switching.

Terminal Paste

solder

PC board

foot pattern

60 to 120 sec.

Preheating

Time

Temperature Peak temperature

200°C

220°C

Upper limit (Soldering heat resistance)

260°C

230°C

180°C

150°C

70 sec.

25 sec.

Lower limit (Solder wettability)

15 degrees

or less

When designing the target

equipment, please verify with the