Product Folder Order Now Support & Community Tools & Software Technical Documents LM60 SNIS119F - MAY 2004 - REVISED AUGUST 2017 LM60 2.7-V, SOT-23 or TO-92 Temperature Sensor 1 Features 3 Description * * * * * The LM60 device is a precision integrated-circuit temperature sensor that can sense a -40C to +125C temperature range while operating from a single 2.7-V supply. The output voltage of the device is linearly proportional to Celsius (Centigrade) temperature (6.25 mV/C) and has a DC offset of 424 mV. The offset allows reading negative temperatures without the need for a negative supply. The nominal output voltage of the device ranges from 174 mV to 1205 mV for a -40C to +125C temperature range. The device is calibrated to provide accuracies of 2C at room temperature and 3C over the full -25C to +125C temperature range. 1 Calibrated Linear Scale Factor of 6.25 mV/C Rated for Full -40C to +125C Range Suitable for Remote Applications Available in SOT-23 and TO-92 Packages Key Specifications - Accuracy at 25C: 2C and 3C (Maximum) - Accuracy for -40C to +125C: 4C (Maximum) - Accuracy for -25C to +125C: 3C (Maximum) - Temperature Slope: 6.25 mV/C - Power-Supply Voltage Range: 2.7 V to 10 V - Current Drain at 25C: 110 A (Maximum) - Nonlinearity: 0.8C (Maximum) - Output Impedance: 800 (Maximum) 2 Applications * * * * * * Cell Phones and Computers Power Supply Modules Battery Management Fax Machines and Printers HVAC and Disk Drives Appliances The linear output of the device, 424-mV offset, and factory calibration simplify external circuitry required in a single supply environment where reading negative temperatures is required. Because the quiescent current of the device is less than 110 A, self-heating is limited to a very low 0.1C in still air in the SOT-23 package. Shutdown capability for the device is intrinsic because its inherent low power consumption allows it to be powered directly from the output of many logic gates. Device Information(1) PART NUMBER LM60 PACKAGE BODY SIZE (NOM) TO-92 (3) 4.30 mm x 4.30 mm SOT-23 (3) 2.92 mm x 1.30 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Simplified Schematic Full-Range Centigrade Temperature Sensor (-40C to +125C) 1.50 1.205 Output Voltage (V) 1.25 1.00 0.580 0.75 0.50 0.174 0.25 VO = (+6.25 mV/C x T C) + 424 mV 0.00 50 25 0 25 50 75 DUT Temperature (C) 100 125 150 C001 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. LM60 SNIS119F - MAY 2004 - REVISED AUGUST 2017 www.ti.com Table of Contents 1 2 3 4 5 6 7 8 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Device Comparison Table..................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 2 3 4 4 7.1 7.2 7.3 7.4 7.5 7.6 4 4 5 5 5 7 Absolute Maximum Ratings ...................................... ESD Ratings ............................................................ Recommended Operating Conditions....................... Thermal Information .................................................. Electrical Characteristics........................................... Typical Characteristics .............................................. Detailed Description .............................................. 9 8.1 Overview ................................................................... 9 8.2 Functional Block Diagram ......................................... 9 8.3 Feature Description................................................... 9 8.4 Device Functional Modes.......................................... 9 9 Application and Implementation ........................ 10 9.1 Application Information............................................ 10 9.2 Typical Applications ................................................ 11 9.3 System Examples ................................................... 13 10 Power Supply Recommendations ..................... 13 11 Layout................................................................... 14 11.1 Layout Guidelines ................................................. 14 11.2 Layout Example .................................................... 14 11.3 Thermal Considerations ........................................ 14 12 Device and Documentation Support ................. 16 12.1 12.2 12.3 12.4 12.5 Receiving Notification of Documentation Updates Community Resources.......................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 16 16 16 16 16 13 Mechanical, Packaging, and Orderable Information ........................................................... 16 4 Revision History Changes from Revision E (September 2015) to Revision F Page * Moved the automotive device to a standalone data sheet (SNIS197) ................................................................................... 1 * Added tablenote for the LM60B.............................................................................................................................................. 3 * Added tablenote for the LM60B.............................................................................................................................................. 5 Changes from Revision D (November 2012) to Revision E * 2 Page Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .............................. 1 Submit Documentation Feedback Copyright (c) 2004-2017, Texas Instruments Incorporated Product Folder Links: LM60 LM60 www.ti.com SNIS119F - MAY 2004 - REVISED AUGUST 2017 5 Device Comparison Table ORDER NUMBER ACCURACY OVER SPECIFIED TEMPERATURE RANGE SPECIFIED TEMPERATURE RANGE LM60BIM3 3 -25C TA +125C (1) 4 -40C TA +125C 4 -40C TA +125C LM60BIZ 3 -25C TA +125C LM60CIZ 4 -40C TA +125C LM60BIM3X LM60CIM3 LM60CIM3X LM60QIM3 LM60QIM3X (1) LM60B will operate down to -40C without damage but the accuracy is only ensured from -25C to 125C. Submit Documentation Feedback Copyright (c) 2004-2017, Texas Instruments Incorporated Product Folder Links: LM60 3 LM60 SNIS119F - MAY 2004 - REVISED AUGUST 2017 www.ti.com 6 Pin Configuration and Functions DBZ Package 3-Pin SOT-23 Top View LP Package 3-Pin TO-92 Bottom View Pin Functions PIN NAME TYPE SOT-23 TO92 GND 3 3 GND VOUT 2 2 O +VS 1 1 POWER DESCRIPTION Device ground, connected to power supply negative terminal Temperature sensor analog output Positive power supply pin 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT V Supply voltage -0.2 12 Output voltage -0.6 VS + 0.6 V 10 mA Output current Input current at any pin (2) Maximum junction temperature (TJMAX) -65 Storage temperature (Tstg) (1) (2) 5 mA 125 C 150 C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. When the input voltage (VI) at any pin exceeds power supplies (VI < GND or VI > +VS), the current at that pin should be limited to 5 mA. 7.2 ESD Ratings VALUE UNIT LM60 in DBZ Package V(ESD) Electrostatic discharge (1) Human-body model (HBM) 2500 Machine model (MM) 250 Human-body model (HBM) 2500 Machine model (MM) 200 V LM60 in LP Package V(ESD) (1) 4 Electrostatic discharge (1) V The human body model is a 100-pF capacitor discharged through a 1.5-k resistor into each pin. The machine model is a 200-pF capacitor discharged directly into each pin. Submit Documentation Feedback Copyright (c) 2004-2017, Texas Instruments Incorporated Product Folder Links: LM60 LM60 www.ti.com SNIS119F - MAY 2004 - REVISED AUGUST 2017 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT (2) 125 C LM60C (TMIN TA TMAX) -40 125 C Supply voltage (+VS) 2.7 10 V LM60B (TMIN TA TMAX) (1) (2) -25 Soldering process must comply with National Semiconductor's Reflow Temperature Profile specifications. Refer to www.national.com/packaging. Reflow temperature profiles are different for lead-free and non-lead-free packages. LM60B will operate down to -40C without damage but the accuracy is only ensured from -25C to 125C. 7.4 Thermal Information LM60 THERMAL METRIC (1) DBZ (SOT-23) LP (TO-92) 3 PINS 3 PINS UNIT RJA (2) Junction-to-ambient thermal resistance 266 162 C/W RJC(top) Junction-to-case (top) thermal resistance 135 85 C/W RJB Junction-to-board thermal resistance 59 -- C/W JT Junction-to-top characterization parameter 18 29 C/W JB Junction-to-board characterization parameter 58 142 C/W (1) (2) For more information about traditional and new thermal metrics, see the Semiconductor or IC Package Thermal Metrics application report. The junction to ambient thermal resistance (RJA) is specified without a heat sink in still air. 7.5 Electrical Characteristics Unless otherwise noted, these specifications apply for +VS = 3 VDC and ILOAD = 1 A. All limits TA = TJ = 25C unless otherwise noted. PARAMETER TEST CONDITIONS LM60B TA = TJ = TMIN to TMAX LM60C TA = TJ = TMIN to TMAX Accuracy (3) MIN (1) TYP (2) MAX (1) -2 2 -3 3 -3 3 -4 4 Output voltage at 0C UNIT C C 424 mV LM60B TA = TJ = TMIN to TMAX -0.6 0.6 LM60C TA = TJ = TMIN to TMAX -0.8 0.8 Nonlinearity (4) C 6.25 Sensor gain (average slope) Output impedance (1) (2) (3) (4) LM60B TA = TJ = TMIN to TMAX 6.06 6.44 LM60C TA = TJ = TMIN to TMAX 6 6.5 TA = TJ = TMIN to TMAX mV/C 800 Limits are specified to TI's AOQL (Average Outgoing Quality Level). Typicals are at TJ = TA = 25C and represent most likely parametric norm. Accuracy is defined as the error between the output voltage and 6.25 mV/C times the case temperature of the device plus 424 mV, at specified conditions of voltage, current, and temperature (expressed in C). Nonlinearity is defined as the deviation of the output-voltage-versus-temperature curve from the best-fit straight line, over the rated temperature range of the device. Submit Documentation Feedback Copyright (c) 2004-2017, Texas Instruments Incorporated Product Folder Links: LM60 5 LM60 SNIS119F - MAY 2004 - REVISED AUGUST 2017 www.ti.com Electrical Characteristics (continued) Unless otherwise noted, these specifications apply for +VS = 3 VDC and ILOAD = 1 A. All limits TA = TJ = 25C unless otherwise noted. PARAMETER TEST CONDITIONS MIN (1) TYP (2) 3 V +VS 10 V -0.3 0.3 mV/V 2.7 V +VS 3.3 V TA = TJ = TMIN to TMAX -2.3 2.3 mV 110 A 125 A 82 Quiescent current 2.7 V +VS 10 V Change of quiescent current 2.7 V +VS 10 V TA = TJ = TMIN to TMAX Temperature coefficient of quiescent current (5) (6) 6 UNIT TA = TJ = TMIN to TMAX Line regulation (5) Long-term stability (6) MAX (1) TJ = TMAX = 125C for 1000 hours 5 A 0.2 A/C 0.2 C Regulation is measured at constant junction temperature, using pulse testing with a low duty cycle. Changes in output due to heating effects can be computed by multiplying the internal dissipation by the thermal resistance. For best long-term stability, any precision circuit will give best results if the unit is aged at a warm temperature, temperature cycled for at least 46 hours before long-term life test begins for both temperatures. This is especially true when a small (surface-mount) part is wavesoldered; allow time for stress relaxation to occur. The majority of the drift will occur in the first 1000 hours at elevated temperatures. The drift after 1000 hours will not continue at the first 1000 hour rate. Submit Documentation Feedback Copyright (c) 2004-2017, Texas Instruments Incorporated Product Folder Links: LM60 LM60 www.ti.com SNIS119F - MAY 2004 - REVISED AUGUST 2017 7.6 Typical Characteristics To generate these curves, the device was mounted to a printed-circuit board as shown in Figure 20. Figure 1. Thermal Resistance Junction to Air Figure 2. Thermal Time Constant Figure 3. Thermal Response in Still Air With Heat Sink Figure 4. Thermal Response in Stirred Oil Bath With Heat Sink 0 Figure 5. Thermal Response in Still Air Without a Heat Sink Figure 6. Start-Up Voltage vs Temperature Submit Documentation Feedback Copyright (c) 2004-2017, Texas Instruments Incorporated Product Folder Links: LM60 7 LM60 SNIS119F - MAY 2004 - REVISED AUGUST 2017 www.ti.com Typical Characteristics (continued) To generate these curves, the device was mounted to a printed-circuit board as shown in Figure 20. Figure 7. Quiescent Current vs Temperature Figure 8. Accuracy vs Temperature Figure 9. Noise Voltage Figure 10. Supply Voltage vs Supply Current SVA-1268122 Figure 11. Start-Up Response 8 Submit Documentation Feedback Copyright (c) 2004-2017, Texas Instruments Incorporated Product Folder Links: LM60 LM60 www.ti.com SNIS119F - MAY 2004 - REVISED AUGUST 2017 8 Detailed Description 8.1 Overview TheLM60 devices are precision analog bipolar temperature sensors that can sense a -40C to +125C temperature range while operating from a single 2.7-V supply. The output voltage of the LM60 is linearly proportional to Celsius (Centigrade) temperature (6.25 mV/C) and has a DC offset of 424 mV. The offset allows reading negative temperatures with a single positive supply. The nominal output voltage of the device ranges from 174 mV to 1205 mV for a -40C to +125C temperature range. The device is calibrated to provide accuracies of 2.0C at room temperature and 3C over the full -25C to +125C temperature range. With a quiescent current of the device is less than 110 A, self-heating is limited to a very low 0.1C in still air in the SOT-23 package. Shutdown capability for the device is intrinsic because its inherent low power consumption allows it to be powered directly from the output of many logic gates. The output of the LM60 is a Class A base emitter follower, thus the LM60 can source quite a bit of current while sinking less than 1 A. In any event load current should be minimized in order to limit it's contribution to the total temperature error. The temperature-sensing element is based on a delta VBE topology of two transistors (Q1 and Q2 in Functional Block Diagram) that are sized with a 10:1 area ratio. 8.2 Functional Block Diagram 8.3 Feature Description 8.3.1 LM60 Transfer Function The LM60 follows a simple linear transfer function to achieve the accuracy as listed in Electrical Characteristics as given: VO = (6.25 mV/C x T C) + 424 mV where * * T is the temperature VO is the LM60 output voltage (1) 8.4 Device Functional Modes The only functional mode for this device is an analog output directly proportional to temperature. Submit Documentation Feedback Copyright (c) 2004-2017, Texas Instruments Incorporated Product Folder Links: LM60 9 LM60 SNIS119F - MAY 2004 - REVISED AUGUST 2017 www.ti.com 9 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI's customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 9.1 Application Information The device has a low supply current and a wide supply range, therefore it can easily be driven by a battery. 9.1.1 Capacitive Loads The device handles capacitive loading well. Without any special precautions, the device can drive any capacitive load as shown in Figure 12. Over the specified temperature range the device has a maximum output impedance of 800 . In an extremely noisy environment, adding some filtering to minimize noise pick-up may be required. TI recommends that 0.1 F be added from +VS to GND to bypass the power supply voltage, as shown in Figure 13. In a noisy environment, adding a capacitor from the output to ground may be required. A 1-F output capacitor with the 800- output impedance forms a 199-Hz, low-pass filter. Because the thermal time constant of the device is much slower than the 6.3-ms time constant formed by the RC, the overall response time of the device is not be significantly affected. For much larger capacitors, this additional time lag increases the overall response time of the device. TI Device Copyright (c) 2017, Texas Instruments Incorporated Figure 12. No Decoupling Required for Capacitive Load Figure 13. Filter Added for Noisy Environment 10 Submit Documentation Feedback Copyright (c) 2004-2017, Texas Instruments Incorporated Product Folder Links: LM60 LM60 www.ti.com SNIS119F - MAY 2004 - REVISED AUGUST 2017 9.2 Typical Applications 9.2.1 Full-Range Centigrade Temperature Sensor Because the LM60 is a simple temperature sensor that provides an analog output, design requirements related to the layout are also important. Refer to Layout for details. VO = (6.25 mV/C x TC) + 424 mV Figure 14. Full-Range Centigrade Temperature Sensor (-40C to +125C) Operating From a Single Li-Ion Battery Cell 9.2.1.1 Design Requirements For this design example, use the design parameters listed in Table 1. Table 1. Temperature and Typical VO Values of Figure 14 TEMPERATURE (T) TYPICAL VO 125C 1205 mV 100C 1049 mV 25C 580 mV 0C 424 mV -25C 268 mV -40C 174 mV Submit Documentation Feedback Copyright (c) 2004-2017, Texas Instruments Incorporated Product Folder Links: LM60 11 LM60 SNIS119F - MAY 2004 - REVISED AUGUST 2017 www.ti.com 9.2.1.2 Detailed Design Procedure Selection of the LM60 is based on the output voltage transfer function being able to meet the needs of the rest of the system. 9.2.1.3 Application Curve 1.50 1.205 Output Voltage (V) 1.25 1.00 0.580 0.75 0.50 0.174 0.25 VO = (+6.25 mV/C x T C) + 424 mV 0.00 50 25 0 25 50 75 100 125 DUT Temperature (C) 150 C001 Figure 15. LM60 Output Transfer Function 9.2.2 Centigrade Thermostat Application V+ R3 R4 TI Device V+ VT R1 4.1V U3 0.1 PF TI Device R2 (High = overtemp alarm) + U1 - VOUT LM7211 VTemp U2 Copyright (c) 2017, Texas Instruments Incorporated Figure 16. Centigrade Thermostat 9.2.2.1 Design Requirements A simple thermostat can be created by using a reference (LM4040) and a comparator (LM7211) as shown in Figure 16. 9.2.2.2 Detailed Design Procedure Use Equation 2 and Equation 3 to calculate the threshold values for T1 and T2. (4.1)R2 R2 + R1||R3 (2) (4.1)R2||R3 VT2 = R1 + R2||R3 (3) VT1 = 12 Submit Documentation Feedback Copyright (c) 2004-2017, Texas Instruments Incorporated Product Folder Links: LM60 LM60 www.ti.com SNIS119F - MAY 2004 - REVISED AUGUST 2017 9.2.2.3 Application Curve VTEMP VT1 VT2 VOUT Figure 17. Thermostat Output Waveform 9.3 System Examples 9.3.1 Conserving Power Dissipation With Shutdown The LM60 draws very little power, therefore it can simply be shutdown by driving the LM60 supply pin with the output of a logic gate as shown in Figure 18. Figure 18. Conserving Power Dissipation With Shutdown 10 Power Supply Recommendations In an extremely noisy environment, add some filtering to minimize noise pick-up. Adding 0.1 F from +VS to GND is recommended to bypass the power supply voltage, as shown in Figure 13. In a noisy environment, add a capacitor from the output to ground. Submit Documentation Feedback Copyright (c) 2004-2017, Texas Instruments Incorporated Product Folder Links: LM60 13 LM60 SNIS119F - MAY 2004 - REVISED AUGUST 2017 www.ti.com 11 Layout 11.1 Layout Guidelines The LM60 can be applied easily in the same way as other integrated-circuit temperature sensors. It can be glued or cemented to a surface. The temperature that the LM60 is sensing will be within about +0.1C of the surface temperature that the leads of th LM60 are attached to. This presumes that the ambient air temperature is almost the same as the surface temperature. If the air temperature were much higher or lower than the surface temperature, the actual temperature of the device die would be at an intermediate temperature between the surface temperature and the air temperature. To ensure good thermal conductivity the backside of the device die is directly attached to the GND pin. The lands and traces to the device will, of course, be part of the printed-circuit board, which is the object whose temperature is being measured. These printed-circuit board lands and traces do not cause the temperature of the device to deviate from the desired temperature. Alternatively, the device can be mounted inside a sealed-end metal tube, and can then be dipped into a bath or screwed into a threaded hole in a tank. As with any IC, the device and accompanying wiring and circuits must be kept insulated and dry to avoid leakage and corrosion. Specifically when the device operates at cold temperatures where condensation can occur. Printed-circuit coatings and varnishes such as a conformal coating and epoxy paints or dips are often used to ensure that moisture cannot corrode the device or connections. 11.2 Layout Example +VS 1 3 VO GND 2 Via to ground plane Via to power plane 1/2-inch square printed circuit board with 2-oz. copper foil or similar. Figure 19. PCB Layout 11.3 Thermal Considerations The thermal resistance junction to ambient (RJA) is the parameter used to calculate the rise of a device junction temperature due to the device power dissipation. Use Equation 4 to calculate the rise in the die temperature of the device. TJ = TA + RJA [(+VS IQ) + (+VS - VO) IL] where * * 14 IQ is the quiescent current IL is the load current on the output (4) Submit Documentation Feedback Copyright (c) 2004-2017, Texas Instruments Incorporated Product Folder Links: LM60 LM60 www.ti.com SNIS119F - MAY 2004 - REVISED AUGUST 2017 Thermal Considerations (continued) Table 2 summarizes the rise in die temperature of the LM60 without any loading, and the thermal resistance for different conditions. The values in Table 2 were actually measured where as the values shown in Thermal Information where calculated using modeling methods as described in the Semiconductor and IC Package Thermal Metrics (SPRA953) application report. Table 2. Temperature Rise of LM60 Due to Self-Heating and Thermal Resistance (RJA) SOT-23 (1) NO HEAT SINK Still air Moving air (1) (2) (3) SOT-23 (2) SMALL HEAT FIN TO-92 (1) NO HEAT FIN TO-92 (3) SMALL HEAT FIN RJA TJ - TA RJA TJ - TA RJA TJ - TA RJA TJ - TA (C/W) (C) (C/W) (C) (C/W) (C) (C/W) (C) 450 0.17 260 0.1 180 0.07 140 0.05 -- -- 180 0.07 90 0.034 70 0.026 Part soldered to 30 gauge wire. Heat sink used is 1/2-in square printed-circuit board with 2-oz. foil with part attached as shown in Figure 20. Part glued or leads soldered to 1-in square of 1/16-in printed-circuit board with 2-oz. foil or similar. Ground Plane on 062 copper clad board. LM60/LM60-Q1 1/2" 1/2" 1/2-in Square Printed-Circuit Board with 2-oz. Copper Foil or Similar. Figure 20. Printed-Circuit Board Used for Heat Sink to Generate Thermal Response Curves Submit Documentation Feedback Copyright (c) 2004-2017, Texas Instruments Incorporated Product Folder Links: LM60 15 LM60 SNIS119F - MAY 2004 - REVISED AUGUST 2017 www.ti.com 12 Device and Documentation Support 12.1 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 12.2 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2ETM Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 12.3 Trademarks E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 12.4 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 12.5 Glossary SLYZ022 -- TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 13 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 16 Submit Documentation Feedback Copyright (c) 2004-2017, Texas Instruments Incorporated Product Folder Links: LM60 PACKAGE OPTION ADDENDUM www.ti.com 11-Jan-2021 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (C) Device Marking (3) (4/5) (6) LM60BIM3 NRND SOT-23 DBZ 3 1000 Non-RoHS & Green Call TI Call TI -25 to 125 T6B LM60BIM3/NOPB ACTIVE SOT-23 DBZ 3 1000 RoHS & Green SN Level-1-260C-UNLIM -25 to 125 T6B LM60BIM3X NRND SOT-23 DBZ 3 3000 Non-RoHS & Green Call TI Call TI -25 to 125 T6B LM60BIM3X/NOPB ACTIVE SOT-23 DBZ 3 3000 RoHS & Green SN Level-1-260C-UNLIM -25 to 125 T6B LM60BIZ/LFT3 ACTIVE TO-92 LP 3 2000 RoHS & Green SN N / A for Pkg Type LM60BIZ/NOPB ACTIVE TO-92 LP 3 1800 RoHS & Green SN N / A for Pkg Type -25 to 125 LM60 BIZ LM60CIM3 NRND SOT-23 DBZ 3 1000 Non-RoHS & Green Call TI Call TI -40 to 125 T6C LM60CIM3/NOPB ACTIVE SOT-23 DBZ 3 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 T6C LM60CIM3X NRND SOT-23 DBZ 3 3000 Non-RoHS & Green Call TI Call TI -40 to 125 T6C LM60CIM3X/NOPB ACTIVE SOT-23 DBZ 3 3000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 T6C LM60CIZ/NOPB ACTIVE TO-92 LP 3 1800 RoHS & Green SN N / A for Pkg Type -40 to 125 LM60 CIZ LM60 BIZ (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 11-Jan-2021 (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF LM60 : * Automotive: LM60-Q1 NOTE: Qualified Version Definitions: * Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 29-Sep-2019 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) LM60BIM3 SOT-23 DBZ 3 1000 178.0 8.4 LM60BIM3/NOPB SOT-23 DBZ 3 1000 178.0 LM60BIM3X SOT-23 DBZ 3 3000 178.0 LM60BIM3X/NOPB SOT-23 DBZ 3 3000 LM60CIM3 SOT-23 DBZ 3 LM60CIM3/NOPB SOT-23 DBZ LM60CIM3X SOT-23 DBZ LM60CIM3X/NOPB SOT-23 DBZ 3.3 2.9 1.22 4.0 8.0 Q3 8.4 3.3 2.9 1.22 4.0 8.0 Q3 8.4 3.3 2.9 1.22 4.0 8.0 Q3 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 Pack Materials-Page 1 W Pin1 (mm) Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 29-Sep-2019 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM60BIM3 SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM60BIM3/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM60BIM3X SOT-23 DBZ 3 3000 210.0 185.0 35.0 LM60BIM3X/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0 LM60CIM3 SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM60CIM3/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM60CIM3X SOT-23 DBZ 3 3000 210.0 185.0 35.0 LM60CIM3X/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0 Pack Materials-Page 2 PACKAGE OUTLINE LP0003A TO-92 - 5.34 mm max height SCALE 1.200 SCALE 1.200 TO-92 5.21 4.44 EJECTOR PIN OPTIONAL 5.34 4.32 (1.5) TYP SEATING PLANE (2.54) NOTE 3 2X 4 MAX (0.51) TYP 6X 0.076 MAX SEATING PLANE 2X 2.6 0.2 3X 12.7 MIN 3X 3X 0.55 0.38 0.43 0.35 2X 1.27 0.13 FORMED LEAD OPTION STRAIGHT LEAD OPTION OTHER DIMENSIONS IDENTICAL TO STRAIGHT LEAD OPTION 3X 2.67 2.03 4.19 3.17 3 2 1 3.43 MIN 4215214/B 04/2017 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Lead dimensions are not controlled within this area. 4. Reference JEDEC TO-226, variation AA. 5. Shipping method: a. Straight lead option available in bulk pack only. b. Formed lead option available in tape and reel or ammo pack. c. Specific products can be offered in limited combinations of shipping medium and lead options. d. Consult product folder for more information on available options. www.ti.com EXAMPLE BOARD LAYOUT LP0003A TO-92 - 5.34 mm max height TO-92 0.05 MAX ALL AROUND TYP FULL R TYP METAL TYP (1.07) 3X ( 0.85) HOLE 2X METAL (1.5) 2X (1.5) 2 1 (R0.05) TYP 3 2X (1.07) (1.27) SOLDER MASK OPENING 2X SOLDER MASK OPENING (2.54) LAND PATTERN EXAMPLE STRAIGHT LEAD OPTION NON-SOLDER MASK DEFINED SCALE:15X 0.05 MAX ALL AROUND TYP ( 1.4) 2X ( 1.4) METAL 3X ( 0.9) HOLE METAL (R0.05) TYP 2 1 (2.6) SOLDER MASK OPENING 3 2X SOLDER MASK OPENING (5.2) LAND PATTERN EXAMPLE FORMED LEAD OPTION NON-SOLDER MASK DEFINED SCALE:15X 4215214/B 04/2017 www.ti.com TAPE SPECIFICATIONS LP0003A TO-92 - 5.34 mm max height TO-92 13.7 11.7 32 23 (2.5) TYP 0.5 MIN 16.5 15.5 11.0 8.5 9.75 8.50 19.0 17.5 6.75 5.95 2.9 TYP 2.4 3.7-4.3 TYP 13.0 12.4 FOR FORMED LEAD OPTION PACKAGE 4215214/B 04/2017 www.ti.com 4203227/C PACKAGE OUTLINE DBZ0003A SOT-23 - 1.12 mm max height SCALE 4.000 SMALL OUTLINE TRANSISTOR C 2.64 2.10 1.4 1.2 PIN 1 INDEX AREA 1.12 MAX B A 0.1 C 1 0.95 3.04 2.80 1.9 3X 3 0.5 0.3 0.2 2 (0.95) C A B 0.25 GAGE PLANE 0 -8 TYP 0.10 TYP 0.01 0.20 TYP 0.08 0.6 TYP 0.2 SEATING PLANE 4214838/C 04/2017 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Reference JEDEC registration TO-236, except minimum foot length. www.ti.com EXAMPLE BOARD LAYOUT DBZ0003A SOT-23 - 1.12 mm max height SMALL OUTLINE TRANSISTOR PKG 3X (1.3) 1 3X (0.6) SYMM 3 2X (0.95) 2 (R0.05) TYP (2.1) LAND PATTERN EXAMPLE SCALE:15X SOLDER MASK OPENING METAL SOLDER MASK OPENING METAL UNDER SOLDER MASK 0.07 MIN ALL AROUND 0.07 MAX ALL AROUND NON SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DEFINED SOLDER MASK DETAILS 4214838/C 04/2017 NOTES: (continued) 4. Publication IPC-7351 may have alternate designs. 5. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com EXAMPLE STENCIL DESIGN DBZ0003A SOT-23 - 1.12 mm max height SMALL OUTLINE TRANSISTOR PKG 3X (1.3) 1 3X (0.6) SYMM 3 2X(0.95) 2 (R0.05) TYP (2.1) SOLDER PASTE EXAMPLE BASED ON 0.125 THICK STENCIL SCALE:15X 4214838/C 04/2017 NOTES: (continued) 6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 7. Board assembly site may have different recommendations for stencil design. www.ti.com IMPORTANT NOTICE AND DISCLAIMER TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES "AS IS" AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you permission to use these resources only for development of an application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these resources. TI's products are provided subject to TI's Terms of Sale (https:www.ti.com/legal/termsofsale.html) or other applicable terms available either on ti.com or provided in conjunction with such TI products. TI's provision of these resources does not expand or otherwise alter TI's applicable warranties or warranty disclaimers for TI products.IMPORTANT NOTICE Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright (c) 2021, Texas Instruments Incorporated