4 3 2 1 THIS DRAWING IS UNPUBLISHED. | RELEASED FOR PUBLICATION N/A. Loc DIST REVISIONS COPYRIGHT N/A BY TYCO ELECTRONICS CORPORATION. ALL RIGHTS RESERVED. DF SO P LTR DESCRIPTION DATE DWN APVD PART NO. DIM A DIM B DIM C eeetine SIZE B | REV PER 0H14-0191-05 05-05 | AA | DE S49088 | 1.437 [36.50] 1.81 L46.02]| 468 [11.9] AN LGH=2 /\ PLATED 93/7 TINLEAD .0001[0.0025] MIN THK OR TIN PER 849588-2 |1.437[36.50]| 1.81 [46.02]] .468 [11.9] / LGH-2 | OBSOLETE ASTMB545 .0001[0.0025] MIN THK. D SA9988 9 1,.812[46.02]| 2.18 [S5.55]| .312 [7.92] ZN UGH J GOLD PLATED .000030 [0.00076] MIN THK PER MILG45204, TYPE ll. D 8495884 1.812[46.02]| 2.18 [55.55]} .312 [7.92] / LGH-3 OBSOLETE 59-849588-3 |1.812[46.02]| 2.18 [55.55]} .312 [7.92] J LGH-J3 4. LGH-3 RECEPTACLE TO MATE WITH AMP LGHJ3 LEAD ASSEMBLY. /\ PER FEDERAL STANDARD H28 3 WIRE METHOD. DIMENSION OVER WIRES TO BE: .7474.7654 [18.9819.44]. 6. AMP INFO MARKED PER MILSTD130. LN PLATED TIN PER ASTMB545 .0001[0.0025] MIN THK. C C