0404 Thin Film On Silicon Resistor
Surface Mount, Top-Side Termination/Bottom Isolated
STATE OF THE ART, INC. 2470 Fox Hill Road, State College, PA 16803-1797
Phone (814) 355-8004 Fax (814) 355-2714 Toll Free 1-800-458-3401
Where Quality Isn't a Goal...It's Our Tradition
Silicon chips are only packaged in waffle pack at a
maximum of 400 per tray.
PACKAGING
SOTA offers a full line of component parts in the 0404 size
including termination style D (top-side termination with
isolated metalized bottom) and style F (Back Contact
Resistor - BCR). Also offered in center-tap
configurations.
OPTIONS
PERFORMANCE CHARACTERISTICS
TCR (-55 to +125 °C in ppm/°C)
Thermal Shock
Low Temperature Operation
Short-time Overload
Resistance to Bonding Exposure
Moisture Resistance
High Temperature Exposure
Life
(1) Minimum resistance range at 0.1% tolerance is 100 ohms.
(2) ±0.05% in limited availability - consult factory
<25ppm
±0.02%
±0.02%
±0.02%
±0.03%
±0.05%
±0.05%
See Chart
ENVIRONMENTAL PERFORMANCE
Resistance Range (1)
Tolerances (2)
Maximum Power
Maximum Voltage
5W-1.5MW
0.1%, 0.25%, 0.5%, 1%, 2%, 5%, 10%
350 mW
100 Volts
TCR
E: ±25 ppm H: ±50 ppm K: ±100 ppm
TERMINATION MATERIAL
W: Gold A: Aluminum
S0404AS 150 J H W
TOLERANCES
B: 0.1% C: 0.25% D: 0.5% F: 1% G: 2% J: 5% K: 10% M: 20%
RESISTANCE VALUE
Three or four digits are used with all leading digits significant. Four digits
are used for 1% tolerance or lower, otherwise three digits are used. The last
digit specifies the number of zeros to add. The letter "R" is used to
represent the decimal for fractional ohmic values. Example: 5R6 is 5.6
ohms.
MECHANICAL
Length
Width
Thickness
Termination
Approx. Weight
INCHES
.040 (+.002/-.002)
.040 (+.002/-.002)
.009 - .012
.004 - .006
.00074 grams
MM
1.02 (+.05/-.05)
1.02 (+.05/-.05)
.23 - .30
.10 - .15
CURRENT NOISE
TYPICAL LIFE TEST PERFORMANCE POWER DERATING
10,000 A SiO
2
O
PRECISION
THIN FILM
RESISTOR
BONDING PADS
SILICON CHIP
(STYLE DEPENDS ON VALUE)
• TCR's to ± 25 ppm
• Delivers greater power handling capability
and lighter weight for the size than chips
constructed on alumina.
• Tolerances to ±0.1%
• Operating temperature range :
-55°C to +150°C
• For high-density hybrid circuits
where space is at a premium.
FEATURES
POWER DISSIPATION
