SDAS096C - JANUARY 1986 - REVISED JANUARY 1995 * * * DW OR NT PACKAGE (TOP VIEW) Functionally Equivalent to AMD's AM29863 Power-Up High-Impedance State Package Options Include Plastic Small-Outline (DW) Packages and Standard Plastic (NT) 300-mil DIPs OEBA1 A1 A2 A3 A4 A5 A6 A7 A8 A9 OEBA2 GND description This 9-bit transceiver is designed for asynchronous two-way communication between data buses. The control-function implementation allows for maximum flexibility in timing. This device allows data transmission from the A bus to the B bus or from the B bus to the A bus, depending on the logic levels at the output-enable (OEAB1, OEAB2, OEBA1, and OEBA2) inputs. The SN74ALS29863 is characterized operation from 0C to 70C. 1 24 2 23 3 22 4 21 5 20 6 19 7 18 8 17 9 16 10 15 11 14 12 13 VCC B1 B2 B3 B4 B5 B6 B7 B8 B9 OEAB2 OEAB1 for FUNCTION TABLE INPUTS OEAB1 OEAB2 OEBA1 OEBA2 L L L L L L H X L L X H H X L L X H L L H X H X H X X H X H X H X H H X OPERATION Latch A and B A to B B to A Isolation Copyright 1995, Texas Instruments Incorporated !"# $ %&'# "$ (&)*%"# +"#', +&%#$ %! # $('%%"#$ (' #-' #'!$ '."$ $#&!'#$ $#"+"+ /""#0, +&%# (%'$$1 +'$ # '%'$$"*0 %*&+' #'$#1 "** (""!'#'$, * DALLAS, TEXAS 75265 * HOUSTON, TEXAS 77251-1443 POST OFFICE BOX 655303 POST OFFICE BOX 1443 1 SDAS096C - JANUARY 1986 - REVISED JANUARY 1995 logic symbol OEBA1 OEBA2 OEAB1 OEAB2 A1 1 logic diagram (positive logic) & 11 13 EN1 & 14 2 OEAB1 OEAB2 A1 EN2 23 1 13 1 14 11 2 23 OEBA1 OEBA2 B1 B1 2 A2 A3 A4 A5 A6 A7 A8 A9 3 22 4 21 5 20 6 19 7 18 8 17 9 16 10 15 B2 B3 To Eight Other Channels B4 B5 B6 B7 B8 B9 This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12. absolute maximum ratings over operating free-air temperature range (unless otherwise noted) Supply voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V Input voltage, VI (all inputs and I/O ports) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.5 V Operating free-air temperature range, TA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0C to 70C Storage temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65C to 150C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. recommended operating conditions MIN NOM MAX UNIT 4.75 5 5.25 V VCC VIH Supply voltage VIL IOH Low-level input voltage 0.8 V High-level output current -24 mA IOL TA Low-level output current 48 mA 70 C 2 High-level input voltage 2 Operating free-air temperature 0 * POST OFFICE BOX 655303 DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251-1443 * V SDAS096C - JANUARY 1986 - REVISED JANUARY 1995 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VIK VCC = 4.75 V, VOH VCC = 4.75 V VOL II VCC = 4.75 V, VCC = 5.25 V, MIN II = - 18 mA IOH = - 15 mA IOH = - 24 mA IOL = 48 mA TYP MAX UNIT -1.2 V 2.4 V 2 0.35 VI = 5.5 V IIH Control inputs A or B ports VCC = 5.25 V, VI = 2.7 V IIL Control inputs A or B ports VCC = 5.25 V, VI = 0.4 V 0.5 V 0.1 mA 20 20 A A -0.1 -0.1 IOS VCC = 5.25 V, VO = 0 -75 ICC VCC = 5.25 V 40 All typical values are at VCC = 5 V, TA = 25C. For I/O ports, the parameters IIH and IIL include the off-state output current. Not more than one output should be shorted at a time and duration of the short circuit should not exceed one second. mA -250 mA 65 mA switching characteristics (see Figure 1) PARAMETER FROM (INPUT) TO (OUTPUT) TEST CONDITIONS tPLH tPHL A or B B or A CL = 300 pF tPLH tPHL A or B B or A CL = 50 pF tPZH tPZL OEAB or OEBA A or B CL = 300 pF tPZH tPZL OEAB or OEBA A or B CL = 50 pF tPHZ tPLZ OEAB or OEBA A or B CL = 50 pF tPHZ tPLZ OEAB or OEBA A or B CL = 5 pF VCC = 4.75 V to 5.25 V MIN MAX UNIT 15 15 ns 8 8 ns 20 23 ns 15 15 ns 17 * POST OFFICE BOX 655303 DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251-1443 * 12 9 9 ns ns 3 SDAS096C - JANUARY 1986 - REVISED JANUARY 1995 PARAMETER MEASUREMENT INFORMATION Test Point VCC SWITCH POSITION TABLE S1 From Output Under Test RL = 180 All Diodes 1N916 or 1N3064 R1 1 k CL (see Note A) S2 TEST S1 S2 tPLH tPHL tPZH tPZL tPHZ tPLZ Closed Closed Open Closed Closed Closed Closed Closed Closed Open Closed Closed LOAD CIRCUIT High-Level Pulse 3V 1.5 V Timing Input 3V 1.5 V 0 0 tw th tsu 1.5 V 3V 3V Low-Level Pulse 1.5 V 1.5 V Data Input 0 1.5 V 1.5 V 0 VOLTAGE WAVEFORMS PULSE DURATIONS VOLTAGE WAVEFORMS SETUP AND HOLD TIMES 3V Output Control 1.5 V 1.5 V 0 tPZL tPLZ 4.5 V 3V Input 1.5 V 1.5 V Waveform 1 (see Note B) 0 tPHL tPLH 1.5 V Out-of-Phase Output tPHZ 1.5 V VOL VOH Waveform 2 (see Note B) VOH 1.5 V 0.5 V tPZH tPLH tPHL 1.5 V VOL VOH In-Phase Output 1.5 V 1.5 V 1.5 V 0.5 V 1.5 V 0 VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES, 3-STATE OUTPUTS NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, ZO = 50 , tr 2.5 ns, tf 2.5 ns. Figure 1. Load Circuit and Voltage Waveforms 4 * POST OFFICE BOX 655303 DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251-1443 * PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74ALS29863DW ACTIVE SOIC DW 24 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALS29863DWE4 ACTIVE SOIC DW 24 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALS29863DWG4 ACTIVE SOIC DW 24 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALS29863NT ACTIVE PDIP NT 24 15 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74ALS29863NTE4 ACTIVE PDIP NT 24 15 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. 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