Quad Small Form-factor Pluggable Plus (QSFP) Assembly, Stacked 2 by 1 with Elastomer Gaskets and Light Pipes, Tin-Lead
Status: OBSOLETE
Replacement: Contact Molex
Series: 76871
Category: I/O Connectors
Overview:
(QSFP+) Interconnect Solution
Use With:
,
EU RoHS:RoHS Compliant by Exemption
China RoHS:
REACH SVHC:Contains SVHC: No
:Not Low-Halogen
Status Obsolete
Category I/O Connectors
Series
76871
Application Module-to-Board
Component Type Receptacle
Overview
Quad Small Form-factor Pluggable Plus (QSFP+) Interconnect Solution
Product Name QSFP
Type N/A
Boot Color N/A
Circuits (Loaded) 76
Circuits (maximum) 76
Circuits Detail 76
Durability (mating cycles max) 100
Flammability 94V-0
Gender Female
Keying to Mating Part None
Lock to Mating Part Yes
Material - Metal Phosphor Bronze
Material - Plating Mating Gold
Material - Plating Termination Tin-Lead
Number of Rows 2
Orientation Right Angle
PC Tail Length 1.25mm
PCB Locator Yes
PCB Retention Yes
PCB Thickness - Recommended 1.57mm
Packaging Type Tray
Panel Mount No
Pitch - Mating Interface 0.80mm
Pitch - Termination Interface 0.80mm
Polarized to Mating Part Yes
Polarized to PCB Yes
Ports 2
Surface Mount Compatible (SMC) No
Temperature Range - Operating -40°C to +85°C
Termination Interface: Style Through Hole - Compliant Pin
Waterproof / Dustproof No
(Please review the Product Specification for specific details.)
Current - Maximum per Contact 0.5A
Grounding to Panel None
Shield Type EMI Gasket
Shielded Yes
Voltage - Maximum 120V AC (RMS)/DC
General
Physical
Electrical
Agency Certification
Material Info
Molex Connector Part Number
http://www.molex.com/molex/products/datasheet.jsp?part=active/0768710002_IO_CO