LM35
+VS
R1
VOUT
tVS
LM35
+VS
(4 V to 20 V)
OUTPUT
0 mV + 10.0 mV/°C
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An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LM35
SNIS159H –AUGUST 1999–REVISED DECEMBER 2017
LM35 Precision Centigrade Temperature Sensors
1
1 Features
1• Calibrated Directly in Celsius (Centigrade)
• Linear + 10-mV/°C Scale Factor
• 0.5°C Ensured Accuracy (at 25°C)
• Rated for Full −55°C to 150°C Range
• Suitable for Remote Applications
• Low-Cost Due to Wafer-Level Trimming
• Operates From 4 V to 30 V
• Less Than 60-μA Current Drain
• Low Self-Heating, 0.08°C in Still Air
• Non-Linearity Only ±¼°C Typical
• Low-Impedance Output, 0.1 Ωfor 1-mA Load
2 Applications
• Power Supplies
• Battery Management
• HVAC
• Appliances
3 Description
The LM35 series are precision integrated-circuit
temperature devices with an output voltage linearly-
proportional to the Centigrade temperature. The
LM35 device has an advantage over linear
temperature sensors calibrated in Kelvin, as the user
is not required to subtract a large constant voltage
from the output to obtain convenient Centigrade
scaling. The LM35 device does not require any
external calibration or trimming to provide typical
accuracies of ±¼°C at room temperature and ±¾°C
over a full −55°C to 150°C temperature range. Lower
cost is assured by trimming and calibration at the
wafer level. The low-output impedance, linear output,
and precise inherent calibration of the LM35 device
makes interfacing to readout or control circuitry
especially easy. The device is used with single power
supplies, or with plus and minus supplies. As the
LM35 device draws only 60 μA from the supply, it has
very low self-heating of less than 0.1°C in still air. The
LM35 device is rated to operate over a −55°C to
150°C temperature range, while the LM35C device is
rated for a −40°C to 110°C range (−10° with
improved accuracy). The LM35-series devices are
available packaged in hermetic TO transistor
packages, while the LM35C, LM35CA, and LM35D
devices are available in the plastic TO-92 transistor
package. The LM35D device is available in an 8-lead
surface-mount small-outline package and a plastic
TO-220 package.
Device Information(1)
PART NUMBER PACKAGE BODY SIZE (NOM)
LM35
TO-CAN (3) 4.699 mm × 4.699 mm
TO-92 (3) 4.30 mm × 4.30 mm
SOIC (8) 4.90 mm × 3.91 mm
TO-220 (3) 14.986 mm × 10.16 mm
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
Basic Centigrade Temperature Sensor
(2°C to 150°C) Full-Range Centigrade Temperature Sensor
Choose R1= –VS/ 50 µA
VOUT = 1500 mV at 150°C
VOUT = 250 mV at 25°C
VOUT = –550 mV at –55°C
2
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Table of Contents
1 Features.................................................................. 1
2 Applications ........................................................... 1
3 Description............................................................. 1
4 Revision History..................................................... 2
5 Pin Configuration and Functions......................... 3
6 Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4
6.2 ESD Ratings.............................................................. 4
6.3 Recommended Operating Conditions....................... 4
6.4 Thermal Information.................................................. 4
6.5 Electrical Characteristics: LM35A, LM35CA Limits... 5
6.6 Electrical Characteristics: LM35A, LM35CA............. 6
6.7 Electrical Characteristics: LM35, LM35C, LM35D
Limits.......................................................................... 8
6.8 Electrical Characteristics: LM35, LM35C, LM35D ... 9
6.9 Typical Characteristics............................................ 11
7 Detailed Description............................................ 13
7.1 Overview................................................................. 13
7.2 Functional Block Diagram....................................... 13
7.3 Feature Description................................................. 13
7.4 Device Functional Modes........................................ 13
8 Application and Implementation ........................ 14
8.1 Application Information............................................ 14
8.2 Typical Application.................................................. 15
8.3 System Examples ................................................... 16
9 Power Supply Recommendations...................... 19
10 Layout................................................................... 19
10.1 Layout Guidelines ................................................. 19
10.2 Layout Example .................................................... 20
11 Device and Documentation Support................. 21
11.1 Receiving Notification of Documentation Updates 21
11.2 Community Resources.......................................... 21
11.3 Trademarks........................................................... 21
11.4 Electrostatic Discharge Caution............................ 21
11.5 Glossary................................................................ 21
12 Mechanical, Packaging, and Orderable
Information........................................................... 21
4 Revision History
Changes from Revision G (August 2016) to Revision H Page
• Changed NDV Package (TO-CAN) pinout from bottom view back to top view; added textnote to pinout............................. 3
• Added pin numbers to the TO-CAN (TO46) pinout................................................................................................................ 3
Changes from Revision F (January 2016) to Revision G Page
•Equation 1, changed From: 10 mV/°F To: 10mv/°C ............................................................................................................ 13
•Power Supply Recommendations, changed From: "4-V to 5.5-V power supply" To: "4-V to 30-V power supply: .............. 19
Changes from Revision E (January 2015) to Revision F Page
• Changed NDV Package (TO-CAN) pinout from Top View to Bottom View ........................................................................... 3
Changes from Revision D (October 2013) to Revision E Page
• Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional
Modes,Application and Implementation section, Power Supply Recommendations section, Layout section, Device
and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .............................. 1
Changes from Revision C (July 2013) to Revision D Page
• Changed Wto Ω.................................................................................................................................................................... 1
• Changed Wto Ωin Abs Max tablenote. ................................................................................................................................ 4
+VSVOUT
GND
LM
35DT
1 2 3
+VS
VOUT
GND
N.C.
N.C.
N.C.
N.C.
N.C.
1
2
3
4
8
7
6
5
(1) +VS
(2) VOUT
(3) GND
3
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5 Pin Configuration and Functions
NDV Package
3-Pin TO-CAN
(Top View)
Case is connected to negative pin (GND)
Refer the second NDV0003H page for
reference
D Package
8-PIN SOIC
(Top View)
N.C. = No connection
LP Package
3-Pin TO-92
(Bottom View)
NEB Package
3-Pin TO-220
(Top View)
Tab is connected to the negative pin
(GND).
NOTE: The LM35DT pinout is different than
the discontinued LM35DP
Pin Functions
PIN TYPE DESCRIPTION
NAME TO46 TO92 TO220 SO8
VOUT 2 2 3 1 O Temperature Sensor Analog Output
N.C. — — — 2 — No Connection
— — — 3
GND 3 3 2 4 GROUND Device ground pin, connect to power supply negative
terminal
N.C. — — — 5 — No Connection— — — 6
— — — 7
+VS1 1 1 8 POWER Positive power supply pin
4
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(1) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(2) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not
apply when operating the device beyond its rated operating conditions.
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)(2)
MIN MAX UNIT
Supply voltage –0.2 35 V
Output voltage –1 6 V
Output current 10 mA
Maximum Junction Temperature, TJmax 150 °C
Storage Temperature, Tstg TO-CAN, TO-92 Package –60 150 °C
TO-220, SOIC Package –65 150
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
6.2 ESD Ratings VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2500 V
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT
Specified operating temperature: TMIN to
TMAX
LM35, LM35A –55 150 °CLM35C, LM35CA –40 110
LM35D 0 100
Supply Voltage (+VS) 4 30 V
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2) For additional thermal resistance information, see Typical Application.
6.4 Thermal Information
THERMAL METRIC(1)(2) LM35
UNITNDV LP D NEB
3 PINS 8 PINS 3 PINS
RθJA Junction-to-ambient thermal resistance 400 180 220 90 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 24 — — —
5
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(1) Tested Limits are ensured and 100% tested in production.
(2) Design Limits are ensured (but not 100% production tested) over the indicated temperature and supply voltage ranges. These limits are
not used to calculate outgoing quality levels.
(3) Accuracy is defined as the error between the output voltage and 10 mv/°C times the case temperature of the device, at specified
conditions of voltage, current, and temperature (expressed in °C).
(4) Non-linearity is defined as the deviation of the output-voltage-versus-temperature curve from the best-fit straight line, over the rated
temperature range of the device.
(5) Regulation is measured at constant junction temperature, using pulse testing with a low duty cycle. Changes in output due to heating
effects can be computed by multiplying the internal dissipation by the thermal resistance.
(6) Quiescent current is defined in the circuit of Figure 14.
6.5 Electrical Characteristics: LM35A, LM35CA Limits
Unless otherwise noted, these specifications apply: −55°C ≤TJ≤150°C for the LM35 and LM35A; −40°C ≤TJ≤110°C for the
LM35C and LM35CA; and 0°C ≤TJ≤100°C for the LM35D. VS= 5 Vdc and ILOAD = 50 μA, in the circuit of Full-Range
Centigrade Temperature Sensor. These specifications also apply from 2°C to TMAX in the circuit of Figure 14.
PARAMETER TEST CONDITIONS LM35A LM35CA UNIT
TYP TESTED
LIMIT(1) DESIGN
LIMIT(2) TYP TESTED
LIMIT(1) DESIGN
LIMIT(2)
Accuracy(3)
TA= 25°C ±0.2 ±0.5 ±0.2 ±0.5
°C
TA= –10°C ±0.3 ±0.3 ±1
TA= TMAX ±0.4 ±1 ±0.4 ±1
TA= TMIN ±0.4 ±1 ±0.4 ±1.5
Nonlinearity(4) TMIN ≤TA≤TMAX,
–40°C ≤TJ≤125°C ±0.18 ±0.35 ±0.15 ±0.3 °C
Sensor gain
(average slope) TMIN ≤TA≤TMAX 10 9.9 10 9.9 mV/°C
–40°C ≤TJ≤125°C 10 10.1 10 10.1
Load regulation(5)
0≤IL≤1 mA
TA= 25°C ±0.4 ±1 ±0.4 ±1 mV/mA
TMIN ≤TA≤TMAX,
–40°C ≤TJ≤125°C ±0.5 ±3 ±0.5 ±3
Line regulation(5) TA= 25°C ±0.01 ±0.05 ±0.01 ±0.05 mV/V
4 V ≤VS≤30 V,
–40°C ≤TJ≤125°C ±0.02 ±0.1 ±0.02 ±0.1
Quiescent current(6)
VS= 5 V, 25°C 56 67 56 67
µA
VS= 5 V, –40°C ≤TJ≤125°C 105 131 91 114
VS= 30 V, 25°C 56.2 68 56.2 68
VS= 30 V, –40°C ≤TJ≤125°C 105.5 133 91.5 116
Change of quiescent
current(5)
4 V ≤VS≤30 V, 25°C 0.2 1 0.2 1 µA
4 V ≤VS≤30 V,
–40°C ≤TJ≤125°C 0.5 2 0.5 2
Temperature
coefficient of
quiescent current –40°C ≤TJ≤125°C 0.39 0.5 0.39 0.5 µA/°C
Minimum temperature
for rate accuracy In circuit of Figure 14, IL= 0 1.5 2 1.5 2 °C
Long term stability TJ= TMAX, for 1000 hours ±0.08 ±0.08 °C
6
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(1) Accuracy is defined as the error between the output voltage and 10 mv/°C times the case temperature of the device, at specified
conditions of voltage, current, and temperature (expressed in °C).
(2) Tested Limits are ensured and 100% tested in production.
(3) Design Limits are ensured (but not 100% production tested) over the indicated temperature and supply voltage ranges. These limits are
not used to calculate outgoing quality levels.
(4) Non-linearity is defined as the deviation of the output-voltage-versus-temperature curve from the best-fit straight line, over the rated
temperature range of the device.
(5) Regulation is measured at constant junction temperature, using pulse testing with a low duty cycle. Changes in output due to heating
effects can be computed by multiplying the internal dissipation by the thermal resistance.
6.6 Electrical Characteristics: LM35A, LM35CA
Unless otherwise noted, these specifications apply: −55°C ≤TJ≤150°C for the LM35 and LM35A; −40°C ≤TJ≤110°C for the
LM35C and LM35CA; and 0°C ≤TJ≤100°C for the LM35D. VS= 5 Vdc and ILOAD = 50 μA, in the circuit of Full-Range
Centigrade Temperature Sensor. These specifications also apply from 2°C to TMAX in the circuit of Figure 14.
PARAMETER TEST CONDITIONS LM35A LM35CA UNIT
MIN TYP MAX TYP TYP MAX
Accuracy(1)
TA= 25°C ±0.2 ±0.2
°C
Tested Limit(2) ±0.5 ±0.5
Design Limit(3)
TA= –10°C ±0.3 ±0.3
Tested Limit(2)
Design Limit(3) ±1
TA= TMAX
±0.4 ±0.4
Tested Limit(2) ±1 ±1
Design Limit(3)
TA= TMIN
±0.4 ±0.4
Tested Limit(2) ±1
Design Limit(3) ±1.5
Nonlinearity(4) TMIN ≤TA≤TMAX,
–40°C ≤TJ≤125°C
±0.18 ±0.15 °CTested Limit(2)
Design Limit(3) ±0.35 ±0.3
Sensor gain
(average slope)
TMIN ≤TA≤TMAX
10 10
mV/°C
Tested Limit(2) 9.9
Design Limit(3) 9.9
–40°C ≤TJ≤125°C 10 10
Tested Limit(2) 10.1
Design Limit(3) 10.1
Load regulation(5)
0≤IL≤1 mA
TA= 25°C ±0.4 ±0.4
mV/mA
Tested Limit(2) ±1 ±1
Design Limit(3)
TMIN ≤TA≤TMAX,
–40°C ≤TJ≤125°C
±0.5 ±0.5
Tested Limit(2)
Design Limit(3) ±3 ±3
Line regulation(5)
TA= 25°C ±0.01 ±0.01
mV/V
Tested Limit(2) ±0.05 ±0.05
Design Limit(3)
4 V ≤VS≤30 V,
–40°C ≤TJ≤125°C
±0.02 ±0.02
Tested Limit(2)
Design Limit(3) ±0.1 ±0.1
7
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Electrical Characteristics: LM35A, LM35CA (continued)
Unless otherwise noted, these specifications apply: −55°C ≤TJ≤150°C for the LM35 and LM35A; −40°C ≤TJ≤110°C for the
LM35C and LM35CA; and 0°C ≤TJ≤100°C for the LM35D. VS= 5 Vdc and ILOAD = 50 μA, in the circuit of Full-Range
Centigrade Temperature Sensor. These specifications also apply from 2°C to TMAX in the circuit of Figure 14.
PARAMETER TEST CONDITIONS LM35A LM35CA UNIT
MIN TYP MAX TYP TYP MAX
(6) Quiescent current is defined in the circuit of Figure 14.
Quiescent
current(6)
VS= 5 V, 25°C 56 56
µA
Tested Limit(2) 67 67
Design Limit(3)
VS= 5 V,
–40°C ≤TJ≤125°C
105 91
Tested Limit(2)
Design Limit(3) 131 114
VS= 30 V, 25°C 56.2 56.2
Tested Limit(2) 68 68
Design Limit(3)
VS= 30 V,
–40°C ≤TJ≤125°C
105.5 91.5
Tested Limit(2)
Design Limit(3) 133 116
Change of
quiescent
current(5)
4 V ≤VS≤30 V, 25°C 0.2 0.2
µA
Tested Limit(2) 1 1
Design Limit(3)
4 V ≤VS≤30 V,
–40°C ≤TJ≤125°C
0.5 0.5
Tested Limit(2)
Design Limit(3) 2 2
Temperature
coefficient of
quiescent current –40°C ≤TJ≤125°C 0.39 0.39 µA/°CTested Limit(2)
Design Limit(3) 0.5 0.5
Minimum
temperature for
rate accuracy In circuit of Figure 14, IL=
0
1.5 1.5 °CTested Limit(2)
Design Limit(3) 2 2
Long term
stability TJ= TMAX, for 1000 hours ±0.08 ±0.08 °C
8
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(1) Tested Limits are ensured and 100% tested in production.
(2) Design Limits are ensured (but not 100% production tested) over the indicated temperature and supply voltage ranges. These limits are
not used to calculate outgoing quality levels.
(3) Accuracy is defined as the error between the output voltage and 10 mv/°C times the case temperature of the device, at specified
conditions of voltage, current, and temperature (expressed in °C).
(4) Non-linearity is defined as the deviation of the output-voltage-versus-temperature curve from the best-fit straight line, over the rated
temperature range of the device.
(5) Regulation is measured at constant junction temperature, using pulse testing with a low duty cycle. Changes in output due to heating
effects can be computed by multiplying the internal dissipation by the thermal resistance.
(6) Quiescent current is defined in the circuit of Figure 14.
6.7 Electrical Characteristics: LM35, LM35C, LM35D Limits
Unless otherwise noted, these specifications apply: −55°C ≤TJ≤150°C for the LM35 and LM35A; −40°C ≤TJ≤110°C for the
LM35C and LM35CA; and 0°C ≤TJ≤100°C for the LM35D. VS= 5 Vdc and ILOAD = 50 μA, in the circuit of Full-Range
Centigrade Temperature Sensor. These specifications also apply from 2°C to TMAX in the circuit of Figure 14.
PARAMETER TEST CONDITIONS LM35 LM35C, LM35D UNIT
TYP TESTED
LIMIT(1) DESIGN
LIMIT(2) TYP TESTED
LIMIT(1) DESIGN
LIMIT(2)
Accuracy, LM35,
LM35C(3)
TA= 25°C ±0.4 ±1 ±0.4 ±1
°C
TA= –10°C ±0.5 ±0.5 ±1.5
TA= TMAX ±0.8 ±1.5 ±0.8 ±1.5
TA= TMIN ±0.8 ±1.5 ±0.8 ±2
Accuracy, LM35D(3) TA= 25°C ±0.6 ±1.5 °CTA= TMAX ±0.9 ±2
TA= TMIN ±0.9 ±2
Nonlinearity(4) TMIN ≤TA≤TMAX,
–40°C ≤TJ≤125°C ±0.3 ±0.5 ±0.2 ±0.5 °C
Sensor gain
(average slope)
TMIN ≤TA≤TMAX,
–40°C ≤TJ≤125°C 10 9.8 10 9.8 mV/°C
10 10.2 10 10.2
Load regulation(5)
0≤IL≤1 mA
TA= 25°C ±0.4 ±2 ±0.4 ±2 mV/mA
TMIN ≤TA≤TMAX,
–40°C ≤TJ≤125°C ±0.5 ±5 ±0.5 ±5
Line regulation(5) TA= 25°C ±0.01 ±0.1 ±0.01 ±0.1 mV/V
4 V ≤VS≤30 V,
–40°C ≤TJ≤125°C ±0.02 ±0.2 ±0.02 ±0.2
Quiescent current(6)
VS= 5 V, 25°C 56 80 56 80
µA
VS= 5 V, –40°C ≤TJ≤125°C 105 158 91 138
VS= 30 V, 25°C 56.2 82 56.2 82
VS= 30 V, –40°C ≤TJ≤125°C 105.5 161 91.5 141
Change of quiescent
current(5)
4 V ≤VS≤30 V, 25°C 0.2 2 0.2 2 µA
4 V ≤VS≤30 V,
–40°C ≤TJ≤125°C 0.5 3 0.5 3
Temperature
coefficient of
quiescent current –40°C ≤TJ≤125°C 0.39 0.7 0.39 0.7 µA/°C
Minimum temperature
for rate accuracy In circuit of Figure 14, IL= 0 1.5 2 1.5 2 °C
Long term stability TJ= TMAX, for 1000 hours ±0.08 ±0.08 °C
9
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(1) Accuracy is defined as the error between the output voltage and 10 mv/°C times the case temperature of the device, at specified
conditions of voltage, current, and temperature (expressed in °C).
(2) Tested Limits are ensured and 100% tested in production.
(3) Design Limits are ensured (but not 100% production tested) over the indicated temperature and supply voltage ranges. These limits are
not used to calculate outgoing quality levels.
(4) Non-linearity is defined as the deviation of the output-voltage-versus-temperature curve from the best-fit straight line, over the rated
temperature range of the device.
(5) Regulation is measured at constant junction temperature, using pulse testing with a low duty cycle. Changes in output due to heating
effects can be computed by multiplying the internal dissipation by the thermal resistance.
6.8 Electrical Characteristics: LM35, LM35C, LM35D
Unless otherwise noted, these specifications apply: −55°C ≤TJ≤150°C for the LM35 and LM35A; −40°C ≤TJ≤110°C for the
LM35C and LM35CA; and 0°C ≤TJ≤100°C for the LM35D. VS= 5 Vdc and ILOAD = 50 μA, in the circuit of Full-Range
Centigrade Temperature Sensor. These specifications also apply from 2°C to TMAX in the circuit of Figure 14.
PARAMETER TEST CONDITIONS LM35 LM35C, LM35D UNIT
MIN TYP MAX MIN TYP MAX
Accuracy, LM35,
LM35C(1)
TA= 25°C ±0.4 ±0.4
°C
Tested Limit(2) ±1 ±1
Design Limit(3)
TA= –10°C ±0.5 ±0.5
Tested Limit(2)
Design Limit(3) ±1.5
TA= TMAX
±0.8 ±0.8
Tested Limit(2) ±1.5
Design Limit(3) ±1.5
TA= TMIN
±0.8 ±0.8
Tested Limit(2)
Design Limit(3) ±1.5 ±2
Accuracy,
LM35D(1)
TA= 25°C ±0.6
°C
Tested Limit(2) ±1.5
Design Limit(3)
TA= TMAX
±0.9
Tested Limit(2)
Design Limit(3) ±2
TA= TMIN
±0.9
Tested Limit(2)
Design Limit(3) ±2
Nonlinearity(4) TMIN ≤TA≤TMAX,
–40°C ≤TJ≤125°C
±0.3 ±0.2 °CTested Limit(2)
Design Limit(3) ±0.5 ±0.5
Sensor gain
(average slope)
TMIN ≤TA≤TMAX,
–40°C ≤TJ≤125°C
10 10
mV/°C
Tested Limit(2) 9.8
Design Limit(3) 9.8
10 10
Tested Limit(2) 10.2
Design Limit(3) 10.2
Load regulation(5)
0≤IL≤1 mA
TA= 25°C ±0.4 ±0.4
mV/mA
Tested Limit(2) ±2 ±2
Design Limit(3)
TMIN ≤TA≤TMAX,
–40°C ≤TJ≤125°C
±0.5 ±0.5
Tested Limit(2)
Design Limit(3) ±5 ±5
10
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Electrical Characteristics: LM35, LM35C, LM35D (continued)
Unless otherwise noted, these specifications apply: −55°C ≤TJ≤150°C for the LM35 and LM35A; −40°C ≤TJ≤110°C for the
LM35C and LM35CA; and 0°C ≤TJ≤100°C for the LM35D. VS= 5 Vdc and ILOAD = 50 μA, in the circuit of Full-Range
Centigrade Temperature Sensor. These specifications also apply from 2°C to TMAX in the circuit of Figure 14.
PARAMETER TEST CONDITIONS LM35 LM35C, LM35D UNIT
MIN TYP MAX MIN TYP MAX
(6) Quiescent current is defined in the circuit of Figure 14.
Line regulation(5)
TA= 25°C ±0.01 ±0.01
mV/V
Tested Limit(2) ±0.1
Design Limit(3) ±0.1
4 V ≤VS≤30 V,
–40°C ≤TJ≤125°C
±0.02 ±0.02
Tested Limit(2)
Design Limit(3) ±0.2 ±0.2
Quiescent
current(6)
VS= 5 V, 25°C 56 56
µA
Tested Limit(2) 80 80
Design Limit(3)
VS= 5 V, –40°C ≤TJ≤
125°C
105 91
Tested Limit(2)
Design Limit(3) 158 138
VS= 30 V, 25°C 56.2 56.2
Tested Limit(2) 82 82
Design Limit(3)
VS= 30 V,
–40°C ≤TJ≤125°C
105.5 91.5
Tested Limit(2)
Design Limit(3) 161 141
Change of
quiescent
current(5)
4 V ≤VS≤30 V, 25°C 0.2 0.2
µA
Tested Limit(2) 2
Design Limit(3) 2
4 V ≤VS≤30 V,
–40°C ≤TJ≤125°C
0.5 0.5
Tested Limit(2)
Design Limit(3) 3 3
Temperature
coefficient of
quiescent current –40°C ≤TJ≤125°C 0.39 0.39 µA/°CTested Limit(2)
Design Limit(3) 0.7 0.7
Minimum
temperature for
rate accuracy In circuit of Figure 14, IL= 0 1.5 1.5 °CTested Limit(2)
Design Limit(3) 2 2
Long term
stability TJ= TMAX, for 1000 hours ±0.08 ±0.08 °C
0
20
40
60
80
100
120
140
160
±75 ±25 25 75 125 175
QUIESCENT CURRENT (A)
TEMPERATURE (ƒC)
C006
2.4
2.6
2.8
3.0
3.2
3.4
3.6
3.8
4.0
4.2
4.4
±75 ±25 25 75 125 175
SUPPLY VOLTAGE (V)
TEMPERATURE (ƒC)
C005
TYPICAL
IOUT = 2.0 mA
TYPICAL
IOUT = 1.0 mA
TYPICAL
IOUT = 0 A or 50 A
±20
0
20
40
60
80
100
120
0 2 4 6 8
PERCENT OF FINAL VALUE (%)
TIME (MINUTES)
C003
±20
0
20
40
60
80
100
120
0 2 4 6 8
PERCENT OF FINAL VALUE (%)
TIME (SEC)
C004
T0-46
T0-92
0
100
200
300
400
0 400 800 1200 1600 2000
THERMAL RESISTANCE (ƒC/W)
AIR VELOCITY (FPM)
C001
T0-46
T0-92
0
5
10
15
20
25
30
35
40
45
0 400 800 1200 1600 2000
TIME CONSTANT (SEC)
AIR VELOCITY (FPM)
C002
T0-46
T0-92
11
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6.9 Typical Characteristics
Figure 1. Thermal Resistance Junction To Air Figure 2. Thermal Time Constant
Figure 3. Thermal Response In Still Air Figure 4. Thermal Response In Stirred Oil Bath
Figure 5. Minimum Supply Voltage vs Temperature Figure 6. Quiescent Current vs Temperature (in Circuit of
Figure 14)
-20 -10 0 10 20 30 40 50 60
-0.2
0
0.2
0.4
0.6
0
2
4
6
TIME (SEC)
C011
VOUT (V)
VIN (V)
±2.5
±2.0
±1.5
±1.0
±0.5
0.0
0.5
1.0
1.5
2.0
2.5
±75 ±25 25 75 125 175
TEMPERATURE ERROR (ƒC)
TEMPERATURE (ƒC)
C009
LM35C
LM35CA
LM35D
LM35C
TYPICAL
LM35CA
10 100 1k 10k 100k
0
200
400
600
800
1000
1200
1400
1600
Noise (nV/—Hz)
FREQUENCY (Hz)
C010
40
60
80
100
120
140
160
180
200
±75 ±25 25 75 125 175
QUIESCENT CURRENT (A)
TEMPERATURE (ƒC)
C007
±2.0
±1.5
±1.0
±0.5
0.0
0.5
1.0
1.5
2.0
±75 ±25 25 75 125 175
TEMPERATURE ERROR (ƒC)
TEMPERATURE (ƒC)
C008
LM35
LM35A
LM35
LM35A
TYPICAL
12
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Typical Characteristics (continued)
Figure 7. Quiescent Current vs Temperature (in Circuit of
Full-Range Centigrade Temperature Sensor)Figure 8. Accuracy vs Temperature (Ensured)
Figure 9. Accuracy vs Temperature (Ensured) Figure 10. Noise Voltage
Figure 11. Start-Up Response
.125 R2
VOUT = 10 mV/°C
+
+VS
R2
A2
A1
V0
nR1
i
8.8 mV/°C
nR1
Q1 Q2
10E E
1.38 VPTAT
13
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7 Detailed Description
7.1 Overview
The LM35-series devices are precision integrated-circuit temperature sensors, with an output voltage linearly
proportional to the Centigrade temperature. The LM35 device has an advantage over linear temperature sensors
calibrated in Kelvin, as the user is not required to subtract a large constant voltage from the output to obtain
convenient Centigrade scaling. The LM35 device does not require any external calibration or trimming to provide
typical accuracies of ± ¼ °C at room temperature and ± ¾ °C over a full −55°C to 150°C temperature range.
Lower cost is assured by trimming and calibration at the wafer level. The low output impedance, linear output,
and precise inherent calibration of the LM35 device makes interfacing to readout or control circuitry especially
easy. The device is used with single power supplies, or with plus and minus supplies. As the LM35 device draws
only 60 μA from the supply, it has very low self-heating of less than 0.1°C in still air. The LM35 device is rated to
operate over a −55°C to 150°C temperature range, while the LM35C device is rated for a −40°C to 110°C range
(−10° with improved accuracy). The temperature-sensing element is comprised of a delta-V BE architecture.
The temperature-sensing element is then buffered by an amplifier and provided to the VOUT pin. The amplifier
has a simple class A output stage with typical 0.5-Ωoutput impedance as shown in the Functional Block
Diagram. Therefore the LM35 can only source current and it's sinking capability is limited to 1 μA.
7.2 Functional Block Diagram
7.3 Feature Description
7.3.1 LM35 Transfer Function
The accuracy specifications of the LM35 are given with respect to a simple linear transfer function:
VOUT = 10 mv/°C × T
where
• VOUT is the LM35 output voltage
• T is the temperature in °C (1)
7.4 Device Functional Modes
The only functional mode of the LM35 is that it has an analog output directly proportional to temperature.
LM35
+
OUT
HEAVY CAPACITIVE LOAD, WIRING, ETC.
TO A HIGH-IMPEDANCE LOAD
v75
1 PF
0.01 PF BYPASS
OPTONAL
LM35
+
OUT
2 k
HEAVY CAPACITIVE LOAD, WIRING, ETC.
TO A HIGH-IMPEDANCE LOAD
v
14
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8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
The features of the LM35 make it suitable for many general temperature sensing applications. Multiple package
options expand on it's flexibility.
8.1.1 Capacitive Drive Capability
Like most micropower circuits, the LM35 device has a limited ability to drive heavy capacitive loads. Alone, the
LM35 device is able to drive 50 pF without special precautions. If heavier loads are anticipated, isolating or
decoupling the load with a resistor is easy (see Figure 12). The tolerance of capacitance can be improved with a
series R-C damper from output to ground (see Figure 13).
When the LM35 device is applied with a 200-Ωload resistor as shown in Figure 16,Figure 17,orFigure 19, the
device is relatively immune to wiring capacitance because the capacitance forms a bypass from ground to input
and not on the output. However, as with any linear circuit connected to wires in a hostile environment,
performance is affected adversely by intense electromagnetic sources (such as relays, radio transmitters, motors
with arcing brushes, and SCR transients), because the wiring acts as a receiving antenna and the internal
junctions act as rectifiers. For best results in such cases, a bypass capacitor from VIN to ground and a series R-C
damper, such as 75 Ωin series with 0.2 or 1 μF from output to ground, are often useful. Examples are shown in
Figure 13,Figure 24, and Figure 25.
Figure 12. LM35 with Decoupling from Capacitive Load
Figure 13. LM35 with R-C Damper
±2.0
±1.5
±1.0
±0.5
0.0
0.5
1.0
1.5
2.0
±75 ±25 25 75 125 175
TEMPERATURE ERROR (ƒC)
TEMPERATURE (ƒC)
C008
LM35
LM35A
LM35
LM35A
TYPICAL
LM35
+VS
(4 V to 20 V)
OUTPUT
0 mV + 10.0 mV/°C
15
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8.2 Typical Application
8.2.1 Basic Centigrade Temperature Sensor
Figure 14. Basic Centigrade Temperature Sensor (2 °C to 150 °C)
8.2.1.1 Design Requirements
Table 1. Design Parameters
PARAMETER VALUE
Accuracy at 25°C ±0.5°C
Accuracy from –55 °C to 150°C ±1°C
Temperature Slope 10 mV/°C
8.2.1.2 Detailed Design Procedure
Because the LM35 device is a simple temperature sensor that provides an analog output, design requirements
related to layout are more important than electrical requirements. For a detailed description, refer to the Layout.
8.2.1.3 Application Curve
Figure 15. Accuracy vs Temperature (Ensured)
+VS
LM35
18 k
10%
VOUT
+
v
1N914
LM35
+
OUT
VOUT = 10 mV/°C (TAMBIENT = 10 °C)
FROM t 5 °C TO + 40 °C
5 V
200
1%
200
1%
TWISTED PAIR
0.01 PF
BYPASS
OPTIONAL 2 k
1%
2 k
1%
LM35
+
OUT
VOUT = 10 mV/°C (TAMBIENT = 1 °C)
FROM + 2 °C TO + 40 °C
v
5 V
200
1%
6.8 k
5%
200
1%
TWISTED PAIR
HEAT
FINS
+
v
LM35
+
OUT
VOUT = 10 mV/°C (TAMBIENT = 1 °C)
FROM + 2 °C TO + 40 °C
v
5 V
200
1%
6.8 k
5%
OR 10K RHEOSTAT
FOR GAIN ADJUST
200
1%
TWISTED PAIR
HEAT
FINS
16
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8.3 System Examples
Figure 16. Two-Wire Remote Temperature Sensor
(Grounded Sensor) Figure 17. Two-Wire Remote Temperature Sensor
(Output Referred to Ground)
Figure 18. Temperature Sensor, Single Supply
(−55° to +150°C) Figure 19. Two-Wire Remote Temperature Sensor
(Output Referred to Ground)
LM35
9 V
1 k
25.5 k
LM385-
2.5
100 A,
60 mV
FULL-
SCALE
LM35
5 V
LM35
+VS
(6 V to 20 V)
45.5 kO
1%
10 kO
1%
26.4 kO
1%
1 MO
1%
18 kO
LM385-1.2
VOUT = +1 mV/°F
LM35 LM317
402
1%
50
OUT
OFFSET
ADJUST
+
v
OUT
62.5
0.5%
4.7 k
IN
ADJ
+ 5 V TO + 30 V
2N2907
17
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System Examples (continued)
Figure 20. 4-To-20 mA Current Source
(0°C to 100°C) Figure 21. Fahrenheit Thermometer
Figure 22. Centigrade Thermometer
(Analog Meter) Figure 23. Fahrenheit Thermometer, Expanded
Scale Thermometer
(50°F to 80°F, for Example Shown)
LM35
+
OUT
200*
1.5 k*
HEAT
FINS
VA
RA
1 k
1 PF
+
20 PF
+
LM3914 LM3914
1.2 k*
67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86
10
20 k
18
1 2 3
7 V
4 5 6 7 8 9 1 2 3 4 5 6 7 8 9
NC
VB
VC
499*499*
10 18
7 V
7 V
1.5 k*
RC
1 k
1 k*
RB
1 k
20 LEDs
°F
LM35 LM131
47
+
GND
8
6 V
100 k
0.01 PF100 k 1 PF12 k
5 k
FULL
SCALE
ADJ
1 2 4
6
7
0.01 PF
LOW TEMPCO
3
5
1 k6.8 k
4N28
fOUT
LM35
+
OUT
GND
75
1 PF
16 k
ADC0804
+
2 k
1 k +
IN
VREF
0.64 V
5 V
8PARALLEL
DATA
OUTPUT
INTR
CS
RD
WR
GND
LM35
+
OUT
GND
75
1 PF
3.9 k
+
10 k
100k +
IN
5 V
SERIAL
DATA OUTPUT
CLOCK
ENABLE
GND
ADC08031
LM385
FB
REF
1.28 V
18
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System Examples (continued)
Figure 24. Temperature to Digital Converter
(Serial Output)
(128°C Full Scale)
Figure 25. Temperature to Digital Converter
(Parallel TRI-STATE Outputs for Standard Data Bus
to μP Interface)
(128°C Full Scale)
*=1% or 2% film resistor
Trim RBfor VB= 3.075 V
Trim RCfor VC= 1.955 V
Trim RAfor VA= 0.075 V + 100 mV/°C ×Tambient
Example, VA= 2.275 V at 22°C
Figure 26. Bar-Graph Temperature Display
(Dot Mode) Figure 27. LM35 With Voltage-To-Frequency
Converter and Isolated Output
(2°C to 150°C; 20 to 1500 Hz)
19
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9 Power Supply Recommendations
The LM35 device has a very wide 4-V to 30-V power supply voltage range, which makes it ideal for many
applications. In noisy environments, TI recommends adding a 0.1 μF from V+ to GND to bypass the power
supply voltage. Larger capacitances maybe required and are dependent on the power-supply noise.
(1) Wakefield type 201, or 1-in disc of 0.02-in sheet brass, soldered to case, or similar.
(2) TO-92 and SOIC-8 packages glued and leads soldered to 1-in square of 1/16-in printed circuit board with 2-oz foil or similar.
10 Layout
10.1 Layout Guidelines
The LM35 is easily applied in the same way as other integrated-circuit temperature sensors. Glue or cement the
device to a surface and the temperature should be within about 0.01°C of the surface temperature.
The 0.01°C proximity presumes that the ambient air temperature is almost the same as the surface temperature.
If the air temperature were much higher or lower than the surface temperature, the actual temperature of the
LM35 die would be at an intermediate temperature between the surface temperature and the air temperature;
this is especially true for the TO-92 plastic package. The copper leads in the TO-92 package are the principal
thermal path to carry heat into the device, so its temperature might be closer to the air temperature than to the
surface temperature.
Ensure that the wiring leaving the LM35 device is held at the same temperature as the surface of interest to
minimize the temperature problem. The easiest fix is to cover up these wires with a bead of epoxy. The epoxy
bead will ensure that the leads and wires are all at the same temperature as the surface, and that the
temperature of the LM35 die is not affected by the air temperature.
The TO-46 metal package can also be soldered to a metal surface or pipe without damage. Of course, in that
case the V−terminal of the circuit will be grounded to that metal. Alternatively, mount the LM35 inside a sealed-
end metal tube, and then dip into a bath or screw into a threaded hole in a tank. As with any IC, the LM35 device
and accompanying wiring and circuits must be kept insulated and dry, to avoid leakage and corrosion. This is
especially true if the circuit may operate at cold temperatures where condensation can occur. Printed-circuit
coatings and varnishes such as a conformal coating and epoxy paints or dips are often used to insure that
moisture cannot corrode the LM35 device or its connections.
These devices are sometimes soldered to a small light-weight heat fin to decrease the thermal time constant and
speed up the response in slowly-moving air. On the other hand, a small thermal mass may be added to the
sensor, to give the steadiest reading despite small deviations in the air temperature.
Table 2. Temperature Rise of LM35 Due To Self-heating (Thermal Resistance, RθJA)
TO, no heat
sink TO(1), small
heat fin TO-92, no heat
sink TO-92(2), small
heat fin SOIC-8, no
heat sink
SOIC-8(2),
small heat
fin
TO-220, no
heat sink
Still air 400°C/W 100°C/W 180°C/W 140°C/W 220°C/W 110°C/W 90°C/W
Moving air 100°C/W 40°C/W 90°C/W 70°C/W 105°C/W 90°C/W 26°C/W
Still oil 100°C/W 40°C/W 90°C/W 70°C/W — — —
Stirred oil 50°C/W 30°C/W 45°C/W 40°C/W — — —
(Clamped to
metal, Infinite
heat sink) (24°C/W) — — (55°C/W) —
VOUT
N.C.
N.C.
+VS
N.C.
0.01 µF
VIA to ground plane
VIA to power plane
GND N.C.
N.C.
20
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10.2 Layout Example
Figure 28. Layout Example
21
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11 Device and Documentation Support
11.1 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document
11.2 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
11.3 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.5 Glossary
SLYZ022 —TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
PACKAGE OPTION ADDENDUM
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Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LM35AH ACTIVE TO NDV 3 500 Non-RoHS &
Non-Green Call TI Call TI -55 to 150 ( LM35AH, LM35AH)
LM35AH/NOPB ACTIVE TO NDV 3 500 RoHS & Green Call TI Level-1-NA-UNLIM -55 to 150 ( LM35AH, LM35AH)
LM35CAH ACTIVE TO NDV 3 500 Non-RoHS &
Non-Green Call TI Call TI -40 to 110 ( LM35CAH, LM35CAH
)
LM35CAH/NOPB ACTIVE TO NDV 3 500 RoHS & Green Call TI Level-1-NA-UNLIM -40 to 110 ( LM35CAH, LM35CAH
)
LM35CAZ/LFT4 ACTIVE TO-92 LP 3 2000 RoHS & Green SN N / A for Pkg Type LM35
CAZ
LM35CAZ/NOPB ACTIVE TO-92 LP 3 1800 RoHS & Green SN N / A for Pkg Type -40 to 110 LM35
CAZ
LM35CH ACTIVE TO NDV 3 500 Non-RoHS &
Non-Green Call TI Call TI -40 to 110 ( LM35CH, LM35CH)
LM35CH/NOPB ACTIVE TO NDV 3 500 RoHS & Green Call TI Level-1-NA-UNLIM -40 to 110 ( LM35CH, LM35CH)
LM35CZ/LFT1 ACTIVE TO-92 LP 3 2000 RoHS & Green SN N / A for Pkg Type LM35
CZ
LM35CZ/NOPB ACTIVE TO-92 LP 3 1800 RoHS & Green SN N / A for Pkg Type -40 to 110 LM35
CZ
LM35DH ACTIVE TO NDV 3 1000 Non-RoHS &
Non-Green Call TI Call TI 0 to 70 ( LM35DH, LM35DH)
LM35DH/NOPB ACTIVE TO NDV 3 1000 RoHS & Green Call TI Level-1-NA-UNLIM 0 to 70 ( LM35DH, LM35DH)
LM35DM NRND SOIC D 8 95 Non-RoHS
& Green Call TI Call TI 0 to 100 LM35D
M
LM35DM/NOPB ACTIVE SOIC D 8 95 RoHS & Green SN Level-1-260C-UNLIM 0 to 100 LM35D
M
LM35DMX NRND SOIC D 8 2500 Non-RoHS
& Green Call TI Call TI 0 to 100 LM35D
M
LM35DMX/NOPB ACTIVE SOIC D 8 2500 RoHS & Green SN Level-1-260C-UNLIM 0 to 100 LM35D
M
LM35DT NRND TO-220 NEB 3 45 Non-RoHS
& Green Call TI Call TI 0 to 100 LM35DT
PACKAGE OPTION ADDENDUM
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Addendum-Page 2
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LM35DT/NOPB ACTIVE TO-220 NEB 3 45 RoHS & Green SN Level-1-NA-UNLIM 0 to 100 LM35DT
LM35DZ/LFT1 ACTIVE TO-92 LP 3 2000 RoHS & Green SN N / A for Pkg Type LM35
DZ
LM35DZ/LFT4 ACTIVE TO-92 LP 3 2000 RoHS & Green SN N / A for Pkg Type LM35
DZ
LM35DZ/NOPB ACTIVE TO-92 LP 3 1800 RoHS & Green SN N / A for Pkg Type 0 to 100 LM35
DZ
LM35H ACTIVE TO NDV 3 500 Non-RoHS &
Non-Green Call TI Call TI -55 to 150 ( LM35H, LM35H)
LM35H/NOPB ACTIVE TO NDV 3 500 RoHS & Green Call TI Level-1-NA-UNLIM -55 to 150 ( LM35H, LM35H)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
PACKAGE OPTION ADDENDUM
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Addendum-Page 3
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LM35DMX SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
LM35DMX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 29-Sep-2019
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM35DMX SOIC D 8 2500 367.0 367.0 35.0
LM35DMX/NOPB SOIC D 8 2500 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 29-Sep-2019
Pack Materials-Page 2
www.ti.com
PACKAGE OUTLINE
C
.228-.244 TYP
[5.80-6.19]
.069 MAX
[1.75]
6X .050
[1.27]
8X .012-.020
[0.31-0.51]
2X
.150
[3.81]
.005-.010 TYP
[0.13-0.25]
0 - 8 .004-.010
[0.11-0.25]
.010
[0.25]
.016-.050
[0.41-1.27]
4X (0 -15 )
A
.189-.197
[4.81-5.00]
NOTE 3
B .150-.157
[3.81-3.98]
NOTE 4
4X (0 -15 )
(.041)
[1.04]
SOIC - 1.75 mm max heightD0008A
SMALL OUTLINE INTEGRATED CIRCUIT
4214825/C 02/2019
NOTES:
1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches.
Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed .006 [0.15] per side.
4. This dimension does not include interlead flash.
5. Reference JEDEC registration MS-012, variation AA.
18
.010 [0.25] C A B
5
4
PIN 1 ID AREA
SEATING PLANE
.004 [0.1] C
SEE DETAIL A
DETAIL A
TYPICAL
SCALE 2.800
www.ti.com
EXAMPLE BOARD LAYOUT
.0028 MAX
[0.07]
ALL AROUND
.0028 MIN
[0.07]
ALL AROUND
(.213)
[5.4]
6X (.050 )
[1.27]
8X (.061 )
[1.55]
8X (.024)
[0.6]
(R.002 ) TYP
[0.05]
SOIC - 1.75 mm max heightD0008A
SMALL OUTLINE INTEGRATED CIRCUIT
4214825/C 02/2019
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
METAL SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
EXPOSED
METAL
OPENING
SOLDER MASK METAL UNDER
SOLDER MASK
SOLDER MASK
DEFINED
EXPOSED
METAL
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:8X
SYMM
1
45
8
SEE
DETAILS
SYMM
www.ti.com
EXAMPLE STENCIL DESIGN
8X (.061 )
[1.55]
8X (.024)
[0.6]
6X (.050 )
[1.27] (.213)
[5.4]
(R.002 ) TYP
[0.05]
SOIC - 1.75 mm max heightD0008A
SMALL OUTLINE INTEGRATED CIRCUIT
4214825/C 02/2019
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
SOLDER PASTE EXAMPLE
BASED ON .005 INCH [0.125 MM] THICK STENCIL
SCALE:8X
SYMM
SYMM
1
45
8
www.ti.com
PACKAGE OUTLINE
8.89
8.38
6.6
6.1
3.05
2.54
10.16 +0.38
-0.13
3X 1.40
1.22
3.78-3.89
8.55
8.15
12.5
12.1
(6.3)
4.70
4.45
1.32
1.22
2.67 +0.25
-0.38
70 -6
7
5.33
4.83
2X 2.79
2.29
0.38+0.18
-0.03
26.29
25.53
4.06
3.30
3X 0.94
0.69
1.40
1.14
9.86+0.38
-0.13
0.250
0.178
85 -86
11.56
8.52
29.34
28.07
4215014/A 12/2017
TO-220 - 19.65 mm max heightNEB0003F
TRANSISTOR OUTLINE
NOTES:
1. All controlling linear dimensions are in inches. Dimensions in brackets are in millimeters. Any dimension in brackets or parenthesis are for
reference only. Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Reference JEDEC registration TO-220.
13
PIN# 1 ID
www.ti.com
EXAMPLE BOARD LAYOUT
0.07 MAX
ALL AROUND
0.07 MAX
ALL AROUND
(1.7)
3X (1.2)
(2.54)
(5.08)
R (0.05)
2X (1.7)
METAL 2X SOLDER MASK
OPENING
4215014/A 12/2017
TO-220 - 19.65 mm max heightNEB0003F
TRANSISTOR OUTLINE
LAND PATTERN EXAMPLE
NON-SOLDER MASK DEFINED
SCALE:15X
123
OPENING
SOLDER MASK
www.ti.com
PACKAGE OUTLINE
3X 2.67
2.03
5.21
4.44
5.34
4.32
3X
12.7 MIN
2X 1.27 0.13
3X 0.55
0.38
4.19
3.17
3.43 MIN
3X 0.43
0.35
(2.54)
NOTE 3
2X
2.6 0.2
2X
4 MAX
SEATING
PLANE
6X
0.076 MAX
(0.51) TYP
(1.5) TYP
TO-92 - 5.34 mm max heightLP0003A
TO-92
4215214/B 04/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Lead dimensions are not controlled within this area.
4. Reference JEDEC TO-226, variation AA.
5. Shipping method:
a. Straight lead option available in bulk pack only.
b. Formed lead option available in tape and reel or ammo pack.
c. Specific products can be offered in limited combinations of shipping medium and lead options.
d. Consult product folder for more information on available options.
EJECTOR PIN
OPTIONAL
PLANE
SEATING
STRAIGHT LEAD OPTION
321
SCALE 1.200
FORMED LEAD OPTION
OTHER DIMENSIONS IDENTICAL
TO STRAIGHT LEAD OPTION
SCALE 1.200
www.ti.com
EXAMPLE BOARD LAYOUT
0.05 MAX
ALL AROUND
TYP
(1.07)
(1.5) 2X (1.5)
2X (1.07)
(1.27)
(2.54)
FULL R
TYP
( 1.4)0.05 MAX
ALL AROUND
TYP
(2.6)
(5.2)
(R0.05) TYP
3X ( 0.9) HOLE
2X ( 1.4)
METAL
3X ( 0.85) HOLE
(R0.05) TYP
4215214/B 04/2017
TO-92 - 5.34 mm max heightLP0003A
TO-92
LAND PATTERN EXAMPLE
FORMED LEAD OPTION
NON-SOLDER MASK DEFINED
SCALE:15X
SOLDER MASK
OPENING
METAL
2X
SOLDER MASK
OPENING
123
LAND PATTERN EXAMPLE
STRAIGHT LEAD OPTION
NON-SOLDER MASK DEFINED
SCALE:15X
METAL
TYP
SOLDER MASK
OPENING
2X
SOLDER MASK
OPENING
2X
METAL
12 3
www.ti.com
TAPE SPECIFICATIONS
19.0
17.5
13.7
11.7
11.0
8.5
0.5 MIN
TYP-4.33.7
9.75
8.50
TYP
2.9
2.4 6.75
5.95
13.0
12.4
(2.5) TYP
16.5
15.5
32
23
4215214/B 04/2017
TO-92 - 5.34 mm max heightLP0003A
TO-92
FOR FORMED LEAD OPTION PACKAGE
www.ti.com
PACKAGE OUTLINE
( 2.54)
1.16
0.92
4.95
4.55
0.76 MAX 2.67 MAX
0.64 MAX
UNCONTROLLED
LEAD DIA
3X
12.7 MIN
3X 0.483
0.407
-5.565.32
1.22
0.72
45
TO-CAN - 2.67 mm max heightNDV0003H
TO-46
4219876/A 01/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Reference JEDEC registration TO-46.
1
2
3
SCALE 1.250
www.ti.com
EXAMPLE BOARD LAYOUT
0.07 MAX
ALL AROUND
0.07 MAX
TYP
( 1.2)
METAL
2X ( 1.2)
METAL
3X ( 0.7) VIA
(R0.05) TYP
(2.54)
(1.27)
TO-CAN - 2.67 mm max heightNDV0003H
TO-46
4219876/A 01/2017
LAND PATTERN EXAMPLE
NON-SOLDER MASK DEFINED
SCALE:12X
2X
SOLDER MASK
OPENING
SOLDER MASK
OPENING
1
2
3
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