TVS Diode Arrays (SPA(R) Devices) General Purpose ESD Protection - SD05C Series SD05C Series 450W Discrete Bidirectional TVS Diode RoHS Pb GREEN The bidirectional SD05C TVS diode is designed to replace multilayer varistors (MLVs) in electronic equipment for low speed and DC applications. It will protect any sensitive equipment from damage due to electrostatic discharge (ESD) and other transient events. The SD05C can safely absorb repetitive ESD strikes at 30kV (contact discharge, IEC 61000-4-2) without performance degradation and safely dissipate 30A of 8/20s induced surge current (IEC61000-4-5) with very low clamping voltages. Pinout and Functional Block Diagram Features 1 * Low clamping voltage * EFT, IEC61000-4-4, 50A (5/50ns) * Small SOD323 package fits 0805 footprints * Low leakage current * Lightning, IEC61000-4-5, 30A (tP=8/20s) Applications 2 Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. (c)2012 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com for current information. * ESD, IEC61000-4-2, 30kV contact, 30kV air * Switches / Buttons * Medical Equipment * Test Equipment / Instrumentation * Notebooks / Desktops / Servers * Point-of-Sale Terminals * Computer Peripherals 1 Revision: December 19, 2012 SD05C Series SD05C Description TVS Diode Arrays (SPA(R) Devices) General Purpose ESD Protection - SD05C Series Absolute Maximum Ratings Symbol Parameter Value Units IPP Peak Current (tp=8/20s) 30 A IPP Peak Pulse Power (tp=8/20s) 450 W TOP Operating Temperature -40 to 85 C TSTOR Storage Temperature -60 to 150 C Notes: CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Thermal Information Parameter Rating Units -65 to 150 C Maximum Junction Temperature 150 C Maximum Lead Temperature (Soldering 20-40s) 260 C Storage Temperature Range Electrical Characteristics (TOP=25C) Parameter Symbol Test Conditions Min VR IR=1mA 6 Reverse Standoff Voltage VRWM IR1A 5.0 V Leakage Current ILEAK VR=5V 1.0 A Reverse Voltage Drop Clamp Voltage1 RDYN ESD Withstand Voltage1 VESD Diode Capacitance Units V 9.7 V IPP=2A, tp=8/20s, Fwd 10.3 V IPP=10A, tP=8/20s, Fwd 13.5 V IPP=24A, tP=8/20s, Fwd 18.0 V (VC2 - VC1) / (IPP2 - IPP1) 0.6 IEC61000-4-2 (Contact Discharge) 30 kV IEC61000-4-2 (Air Discharge) 30 kV CD 1 Max IPP=1A, tp=8/20s, Fwd VC Dynamic Resistance Typ Reverse Bias=0V, f=1MHz 200 pF Note: 1 Parameter is guaranteed by design and/or device characterization. Capacitance vs. Reverse Bias Non-Repetitive Peak Pulse Power vs. Pulse Time 300.0 10 pk (kW) 200.0 Peak Pulse Power - P Capacitance (pF) 250.0 150.0 100.0 50.0 0.0 1 0.1 0.01 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 0.1 5.0 Bias Voltage (V) SD05C Series 2 Revision: December 19, 2012 1 10 100 Pulse Duration - t p (s) 1000 (c)2012 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. TVS Diode Arrays (SPA(R) Devices) General Purpose ESD Protection - SD05C Series Pulse Waveform 110 110% 100 100% 90 90% 80 80% 60 50 40 30 60% 50% 40% 30% 20 20% 10 0 70% SD05C 70 Percent of IPP % of Rated Power I PP Power Derating Curve 10% 0 25 50 75 100 125 150 0% Ambient Temperature - T A (oC) 0.0 5.0 10.0 15.0 20.0 25.0 30.0 Time (s) Soldering Parameters Pb - Free assembly Pre Heat - Temperature Min (Ts(min)) 150C - Temperature Max (Ts(max)) 200C - Time (min to max) (ts) 60 - 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3C/second max TS(max) to TL - Ramp-up Rate 3C/second max Reflow - Temperature (TL) (Liquidus) 217C - Temperature (tL) 60 - 150 seconds 260+0/-5 C Time within 5C of actual peak Temperature (tp) 20 - 40 seconds Ramp-down Rate 6C/second max Time 25C to peak Temperature (TP) 8 minutes Max. Do not exceed 260C Critical Zone TL to TP Ramp-up TL TS(max) tL Ramp-do Ramp-down Preheat TS(min) 25 Peak Temperature (TP) tP TP Temperature Reflow Condition tS time to peak temperature Time Product Characteristics Lead Plating Matte Tin Lead Material Copper Alloy Lead Coplanarity 0.0004 inches (0.102mm) Substitute Material Silicon Body Material Molded Epoxy Flammability UL 94 V-0 Notes : 1. All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 5. Package surface matte finish VDI 11-13. (c)2012 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com for current information. 3 Revision: December 19, 2012 SD05C Series TVS Diode Arrays (SPA(R) Devices) General Purpose ESD Protection - SD05C Series Part Marking System Part Numbering System SD05C - 01 F T G G= Green G TVS Diode Arrays (SPA(R) Devices ) Series Number of Channels T= Tape & Reel Package F: SOD323 Ordering Information Part Number Package Marking Min. Order Qty. SD05C-01FTG SOD323 G 3000 Package Dimensions -SOD323 SOD323 E A2 A1 Symbol Millimeters Min D b E1 L1 L 0.2 L Max 0.039 A1 0.00 0.10 0.000 0.004 A2 0.80 0.90 0.031 0.035 b 0.25 0.35 0.010 0.014 c 0.08 0.15 0.003 0.006 D 1.20 1.40 0.047 0.055 E 1.60 1.80 0.063 0.071 E1 2.50 2.70 0.098 0.106 0.475 REF L c Min 1.00 A A Inches Max 0.019 REF L1 0.25 0.40 0.010 0.016 O 0 8 0 8 Embossed Carrier Tape & Reel Specification -- SOD323 2.00 o1.50 o178 12.3 5 R2 .6 8 R7 .0 1.75 4.00 3000 2500 2000 1000 500 54.4 5.6 .5 R2 R6 A 8.00 A 3.50 1500 B 12.3 4.00 B 9.5 0.254 1.25 Cover Tape 2.90 1.46 A-A B-B SD05C Series 4 Revision: December 19, 2012 (c)2012 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information.