1
©2012 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com for current information.
TVS Diode Arrays (SPA® Devices)
Revision: December 19, 2012
SD05C Series
SD05C
General Purpose ESD Protection - SD05C Series
Description
Applications
The bidirectional SD05C TVS diode is designed to replace
multilayer varistors (MLVs) in electronic equipment for low
speed and DC applications. It will protect any sensitive
equipment from damage due to electrostatic discharge
(ESD) and other transient events.
The SD05C can safely absorb repetitive ESD strikes
at ±30kV (contact discharge, IEC 61000-4-2) without
performance degradation and safely dissipate 30A of
8/20μs induced surge current (IEC61000-4-5) with very low
clamping voltages.
Features
• ESD, IEC61000-4-2,
±30kV contact, ±30kV air
• EFT, IEC61000-4-4, 50A
(5/50ns)
• Lightning, IEC61000-4-5,
30A (tP=8/20μs)
• Low clamping voltage
• Low leakage current
• Small SOD323 package
ts 0805 footprints
• Switches / Buttons
Test Equipment /
Instrumentation
• Point-of-Sale Terminals
• Medical Equipment
• Notebooks / Desktops /
Servers
• Computer Peripherals
Pinout and Functional Block Diagram
Life Support Note:
Not Intended for Use in Life Support or Life Saving Applications
The products shown herein are not designed for use in life sustaining or life saving
applications unless otherwise expressly indicated.
RoHS
Pb
GREEN
SD05C Series 450W Discrete Bidirectional TVS Diode
1
2
©2012 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
2
TVS Diode Arrays (SPA® Devices)
Revision: December 19, 2012
SD05C Series
General Purpose ESD Protection - SD05C Series
Notes:
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of
the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
Absolute Maximum Ratings
Symbol Parameter Value Units
IPP Peak Current (tp=8/20μs) 30 A
IPP Peak Pulse Power (tp=8/20μs) 450 W
TOP Operating Temperature -40 to 85 °C
TSTOR Storage Temperature -60 to 150 °C
Electrical Characteristics (TOP=25ºC)
Parameter Symbol Test Conditions Min Typ Max Units
Reverse Voltage Drop VRIR=1mA 6 V
Reverse Standoff Voltage VRWM IR≤1μA 5.0 V
Leakage Current ILEAK VR=5V 1. 0 μA
Clamp Voltage1VC
IPP=1A, tp=8/20µs, Fwd 9.7 V
IPP=2A, tp=8/20µs, Fwd 10.3 V
IPP=10A, tP=8/20μs, Fwd 13.5 V
IPP=24A, tP=8/20μs, Fwd 18.0 V
Dynamic Resistance RDYN (VC2 - VC1) / (IPP2 - IPP1) 0.6
ESD Withstand Voltage1VESD
IEC61000-4-2 (Contact Discharge) ±30 kV
IEC61000-4-2 (Air Discharge) ±30 kV
Diode Capacitance1CDReverse Bias=0V, f=1MHz 200 pF
Note:
1Parameter is guaranteed by design and/or device characterization.
Thermal Information
Parameter Rating Units
Storage Temperature Range -65 to 150 °C
Maximum Junction Temperature 150 °C
Maximum Lead Temperature (Soldering 20-40s) 260 °C
Non-Repetitive Peak Pulse Power vs. Pulse Time
Pulse Duration - tp
s)
Peak Pulse Power - Ppk (kW)
0.01
0.1
1
10
0.11 10 100 1000
Capacitance vs. Reverse Bias
Bias Voltage (V)
Capacitance (pF)
0.0
50.0
100.0
150.0
200.0
250.0
300.0
0.0 0.5 1.01.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
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©2012 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com for current information.
TVS Diode Arrays (SPA® Devices)
Revision: December 19, 2012
SD05C Series
SD05C
General Purpose ESD Protection - SD05C Series
Pulse Waveform
0%
10%
20%
30%
40%
50%
60%
70%
80%
90%
100%
110%
0.0 5.0 10.0 15.0 20.0 25.0 30.0
Time (μs)
Percent of I
PP
Time
Temperature
TP
TL
TS(max)
TS(min)
25
tP
tL
tS
time to peak temperature
Preheat
P
rehea
t
Ramp-up
R
amp-up
Ramp-down
R
amp-d
o
Critical Zone
TL to TP
C
ritical Zon
e
T
L
to
P
Reflow Condition Pb – Free assembly
Pre Heat
- Temperature Min (Ts(min))150°C
- Temperature Max (Ts(max))200°C
- Time (min to max) (ts)60 – 180 secs
Average ramp up rate (Liquidus) Temp
(TL) to peak 3°C/second max
TS(max) to TL - Ramp-up Rate 3°C/second max
Reflow - Temperature (TL) (Liquidus) 217°C
- Temperature (tL)60 – 150 seconds
Peak Temperature (TP)260+0/-5 °C
Time within 5°C of actual peak
Temperature (tp)20 – 40 seconds
Ramp-down Rate 6°C/second max
Time 25°C to peak Temperature (TP)8 minutes Max.
Do not exceed 260°C
Soldering Parameters
Product Characteristics
Lead Plating Matte Tin
Lead Material Copper Alloy
Lead Coplanarity 0.0004 inches (0.102mm)
Substitute Material Silicon
Body Material Molded Epoxy
Flammability UL 94 V-0
Notes :
1. All dimensions are in millimeters
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
5. Package surface matte finish VDI 11-13.
Power Derating Curve
0
10
20
30
40
50
60
70
80
90
100
110
0255075100 125150
Ambient Temperature - TA
(
o
C)
% of Rated Power IPP
©2012 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
4
TVS Diode Arrays (SPA® Devices)
Revision: December 19, 2012
SD05C Series
General Purpose ESD Protection - SD05C Series
Package Dimensions -SOD323
Symbol
SOD323
Millimeters Inches
Min Max Min Max
A1. 0 0 0.039
A1 0.00 0.10 0.000 0.004
A2 0.80 0.90 0.031 0.035
b0.25 0.35 0.010 0.014
c0.08 0.15 0.003 0.006
D1.20 1.40 0.047 0.055
E1.60 1.80 0.063 0.071
E1 2.50 2.70 0.098 0.106
L0.475 REF 0.019 REF
L1 0.25 0.40 0.010 0.016
Ø0º8º0º8º
E
E1
b
L1
c
D
L
L
A1 A2
A
0.2
Ordering Information
Part Number Package Marking Min. Order Qty.
SD05C-01FTG SOD323 G 3000
Part Numbering System
Part Marking System
SD05C 01 TG
Series
Number of
Channels
Package
T= Tape & Reel
G= Green
F: SOD323
F
TVS Diode Arrays
(SPA® Devices )
G
Embossed Carrier Tape & Reel Specification — SOD323
4.00 2.00
AA
4.00
B
B
ø1.50
1.75
3.50
8.00
1.25
Cover Tape
2.90
B-B
0.254
1.46
A-A
ø178
12.3
9.5
12.3
54.4
R78.0
R25.6
R25.6
R6.5
3000
2500
2000
1500
1000
500