CLD-DS16 REV 7
PRODUCT FAMILY DATA SHEET
Cree® XLamp® MC-E LED
WWW. CREE.COM/XLAMP
Copyright © 2008-2011 Cree, Inc. All rights reserved. The information in this document is subject to change without
notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc.
PRODUCT DESCRIPTION
The XLamp MC-E LED is a family
of lighting-class, multi-chip LEDs
that provides high lumen output
in a small package. Compared to
discrete LEDs, XLamp MC-E LEDs
reduce the distance between LED
die, creating a small optical source
for excellent optical control and ef-
cient color mixing. XLamp MC-E
LEDs can reduce LED system com-
plexity by reducing the number of
components required.
Cree XLamp LEDs bring high perfor-
mance and quality of light to a wide
range of lighting applications, in-
cluding color-changing lighting, por-
table and personal lighting, outdoor
lighting, indoor directional lighting,
and entertainment lighting.
FEATURES
• Available in white (2600 K –
10,000 K CCT), EasyWhite™,
Dynamic White, or color
(RGBW)
• ANSI-compatible neutral &
warm white chromaticity bins
• Individually addressable LEDs
• MC-E Dynamic White LEDs
have two cool-white (6,500 K)
and two warm-white (2,700
K) LED die
• MC-E EasyWhite LEDs avail-
able in 2 and 4-step bins, up
to 85 CRI
• Maximum drive current: 700
mA per LED die
• Reow solderable – JEDEC
J-STD-020
• Electrically neutral thermal
path
• RoHS and REACH-compliant
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300
TABLE OF CONTENTS
Flux Characteristics .................... 2
Flux Characteristics, EasyWhite ... 3
Characteristics -
Complete Package ................. 4
Characteristics -
Per LED Die (White) ............... 4
Characteristics -
Per LED Die (Color) ................ 5
Relative Spectral Power Distribution
- White .................................... 5
Relative Spectral Power Distribution
- Color ..................................... 5
Relative Flux Output vs Junction
Temperature ............................. 6
Electrical Characteristics ............. 7
Relative Intensity vs. Current ...... 7
Typical Spatial Radiation Pattern .. 8
Reow Soldering Characteristics .. 9
Notes ......................................10
Mechanical Dimensions..............11
Tape and Reel ..........................12
Dry Packaging and Packaging .....13
MC-E White MC-E Color MC-E Dynamic White
Copyright © 2008-2011 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trade-
marks of Cree, Inc.
2
xlamp mC-e leds
FLUX CHARACTERISTICS, WHITE, DYNAMIC WHITE, COLOR (TJ = 25°C)
The following tables provide several base order codes for XLamp MC-E. It is important to note that the base order codes
listed here are a subset of the total available order codes for the product family. For more order codes, as well as a
complete description of the order-code nomenclature, please consult the XLamp MC-E Binning and Labeling document.
Part Color
CCT / Dominant Wavelength
Range
Base order codes
Min Luminous Flux (lm)
@ 350 mA* Order Code
Min. Max. Group Flux (lm)
White
Cool White 5,000 K 10,000 K
K 370 MCE4WT-A2-0000-000K01
M 430 MCE4WT-A2-0000-000M01
Neutral White 3,700 K 5,000 K
J320 MCE4WT-A2-0000-000JE4
K 370 MCE4WT-A2-0000-000KE4
Warm White 2,600 K 3,700 K
G 240 MCE4WT-A2-0000-000GE7
H 280 MCE4WT-A2-0000-000HE7
J320 MCE4WT-A2-0000-000JE7
Dynamic White
2 cool-white die 6,500 K K 100
MCEDWT-A1-0000-0000A1001
2 warm-white die 2,700 K G 70
2 cool-white die 6,000 K K 100
MCEDWT-A1-0000-0000A1002
2 warm-white die 2,700 K G 70
Color
Red 620 nm 630 nm
A5
30.6
MCE4CT-A2-0000-00A5AAAA1
Green 520 nm 535 nm 67.2
Blue 450 nm 465 nm 8.2
Cool White 5,700 K 7,000 K 100
Red 620 nm 630 nm
A4
30.6
MCE4CT-A2-0000-00A4AAAB1
Green 520 nm 535 nm 67.2
Blue 450 nm 465 nm 8.2
Neutral White 3,700 K 4,300 K 80
Notes:
• Cree maintains a tolerance of ±7% on ux and power measurements and ±2 on CRI measurements.
• Typical CRI for cool white and neutral white (3,700 K - 10,000 K CCT) is 75.
• Typical CRI for warm white (2,600 K - 3,700 K CCT) is 80.
• Flux and chromaticity are measured with each LED die connected to independent drive circuits at 350 mA. The ux
and chromaticity of XLamp MC-E White are measured with all LEDs lit simultaneously. The ux and color of each LED
in XLamp MC-E Dynamic White and MC-E Color are measured individually.
Copyright © 2008-2011 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trade-
marks of Cree, Inc.
3
xlamp mC-e leds
FLUX CHARACTERISTICS, EASYWHITE MC-E LEDS (TJ = 25°C)
The following table provides order codes for XLamp MC-E EasyWhite LEDs. For a complete description of the order-code
nomenclature, please consult the XLamp MC-E Binning and Labeling document.
Color CCT
Range
Base Order Codes
Min Luminous Flux @
350 mA, 25° C
2-Step Order Code 4-Step Order Code
Group Flux (lm) Chromaticity
Region
Chromaticity
Region
Standard
CRI
EasyWhite
4000 K
K 370
40H
MCEEZW-A1-0000-0000K040H
40F
MCEEZW-A1-0000-0000K040F
J320 MCEEZW-A1-0000-0000J040H MCEEZW-A1-0000-0000J040F
3500 K
J320
35H
MCEEZW-A1-0000-0000J035H
35F
MCEEZW-A1-0000-0000J035F
H 280 MCEEZW-A1-0000-0000H035H MCEEZW-A1-0000-0000H035F
3000 K
J320
30H
MCEEZW-A1-0000-0000J030H
30F
MCEEZW-A1-0000-0000J030F
H 280 MCEEZW-A1-0000-0000H030H MCEEZW-A1-0000-0000H030F
2700 K
J320
27H
MCEEZW-A1-0000-0000J027H
27F
MCEEZW-A1-0000-0000J027F
H 280 MCEEZW-A1-0000-0000H027H MCEEZW-A1-0000-0000H027F
80-CRI
Minimum
EasyWhite
4000 K
K 370
40H
MCEEZW-H1-0000-0000K040H
40F
MCEEZW-H1-0000-0000K040F
J320 MCEEZW-H1-0000-0000J040H MCEEZW-H1-0000-0000J040F
3500 K
J320
35H
MCEEZW-H1-0000-0000J035H
35F
MCEEZW-H1-0000-0000J035F
H 280 MCEEZW-H1-0000-0000H035H MCEEZW-H1-0000-0000H035F
3000 K
J320
30H
MCEEZW-H1-0000-0000J030H
30F
MCEEZW-H1-0000-0000J030F
H 280 MCEEZW-H1-0000-0000H030H MCEEZW-H1-0000-0000H030F
2700 K
J320
27H
MCEEZW-H1-0000-0000J027H
27F
MCEEZW-H1-0000-0000J027F
H 280 MCEEZW-H1-0000-0000H027H MCEEZW-H1-0000-0000H027F
85-CRI
Minimum
EasyWhite
3000 K
H 280
30H
MCEEZW-P1-0000-0000H030H
30F
MCEEZW-P1-0000-0000H030F
G 240 MCEEZW-P1-0000-0000G030H MCEEZW-P1-0000-0000G030F
2700 K
H 280
27H
MCEEZW-P1-0000-0000H027H
27F
MCEEZW-P1-0000-0000H027F
G 240 MCEEZW-P1-0000-0000G027H MCEEZW-P1-0000-0000G027F
Notes:
• For Standard CRI parts, the typical CRI is 80 for 4000 and 3500 K CCT parts and typical CRI is 82 for 3000 and 2700
K CCT.
• Cree maintains a tolerance of ±7% on ux and power measurements.
• Cree maintains a tolerance of ±2 on CRI measurements.
• Flux and chromaticity are measured with each LED die connected to independent drive circuits at 350 mA and with
all LEDs lit simultaneously.
Copyright © 2008-2011 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trade-
marks of Cree, Inc.
4
xlamp mC-e leds
CHARACTERISTICS - COMPLETE PACKAGE
The following table lists the product characteristics for the XLamp MC-E LED package.
Characteristics Unit Minimum Typical Maximum
Thermal Resistance, junction to solder point - white °C/W 3
Thermal Resistance, junction to solder point - color °C/W 4
Viewing Angle (FWHM) - white degrees 110
Viewing Angle (FWHM) - color degrees 115
ESD Classication (HBM per Mil-Std-883D) Class 2
LED Junction Temperature °C 150
CHARACTERISTICS - PER LED DIE (WHITE, EASYWHITE, DYNAMIC WHITE)
The following table lists the product characteristics of each individual LED die within the XLamp MC-E White LED package.
Characteristics Unit Minimum Typical Maximum
Temperature Coefcient of Voltage mV/°C -4
DC Forward Current mA 700
Reverse Voltage V 5
Forward Voltage (@ 350 mA) V 3.2 3.9
Forward Voltage (@ 700 mA) V 3.4
CHARACTERISTICS - PER LED DIE (COLOR)
The following table lists the product characteristics for each LED die within the XLamp MC-E Color LED package.
Characteristics Unit Red Green Blue White
Temperature Coefcient of Voltage mV/°C Typ. -2 -4 -4 -4
DC Forward Current mA Max. 700 700 700 700
Reverse Voltage V Max. 5 5 5 5
Forward Voltage (@ 350 mA) V Typ. 2.1 3.4 3.2 3.2
Max. 2.5 3.9 3.9 3.9
Forward Voltage (@ 700 mA) V Typ. 2.3 3.7 3.5 3.5
Copyright © 2008-2011 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trade-
marks of Cree, Inc.
5
xlamp mC-e leds
RELATIVE SPECTRAL POWER DISTRIBUTION (IF = 350 MA PER LED) - WHITE
The following graph represents typical spectral output of the XLamp MC-E White LED with all four LEDs on simultaneously.
RELATIVE SPECTRAL POWER DISTRIBUTION (IF = 350 MA PER LED) - COLOR
The following graph represents typical spectral output of the XLamp MC-E Color LED with all four LEDs on simultaneously.
Relative Spectral Power Distribution (If = 350 mA per LED) - White
The following graph represents typical spectral output of the XLamp MC-E White LED with all four LEDs on simultaneously.
0
20
40
60
80
100
400 450 500 550 600 650 700 750
Relative Radiant Power (%)
Wavelength (nm)
5000K - 10000K CCT
3700K - 5000K CCT
2600K - 3700K CCT
Relative Spectral Power Distribution (If = 350 mA per LED) - Color
The following graph represents typical spectral output of the XLamp MC-E Color LED with all four LEDs on simultaneously.
0
20
40
60
80
100
400 450 500 550 600 650 700 750
Relative Radiant Power (%)
Wavelength (nm)
RGBW (6000K)
RGBW (4000K)
Copyright © 2008-2011 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trade-
marks of Cree, Inc.
6
xlamp mC-e leds
RELATIVE SPECTRAL POWER DISTRIBUTION (IF = 350 MA PER LED) - COLOR (CONTINUED)
The following graph represents typical spectral output of the XLamp MC-E Color LED with each LED on independently.
RELATIVE FLUX OUTPUT VS JUNCTION TEMPERATURE (IF = 350 MA)
The following graph represents typical performance of each LED die in the XLamp MC-E LED.
The following graph represents typical spectral output of the XLamp MC-E Color LED with each LED on independently.
0
20
40
60
80
100
400 450 500 550 600 650 700 750
Relative Radiant Power (%)
Wavelength (nm)
Red
Green
Blue
White (6000K)
White (4000K)
0%
10%
20%
30%
40%
50%
60%
70%
80%
90%
100%
25 50 75 100 125 150
Relative Luminous Flux
Junction Temperature (ºC)
White
Red
Green
Blue
Copyright © 2008-2011 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trade-
marks of Cree, Inc.
7
xlamp mC-e leds
ELECTRICAL CHARACTERISTICS (TJ = 25˚C)
The following graph represents typical performance of each LED die in the XLamp MC-E LED.
RELATIVE INTENSITY VS. CURRENT (TJ = 25˚C)
The following graph represents typical performance of each LED die in the XLamp MC-E LED.
Relative Intensity vs. Current (Tj = 25ºC)
The following graph represents typical performance of each LED die in the XLamp MC-E LED
0
20
40
60
80
100
120
140
160
180
200
0100 200 300 400 500 600 700
Relative Luminous Flux (%)
Forward Current (mA)
White, Blue
Red
Green
0
100
200
300
400
500
600
700
1.5 2.0 2.5 3.0 3.5 4.0
Forward Current (mA)
Forward Voltage (V)
White, Blue
Red
Green
Copyright © 2008-2011 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trade-
marks of Cree, Inc.
8
xlamp mC-e leds
TYPICAL SPATIAL RADIATION PATTERN
The following graph represents typical output of the XLamp MC-E LED with all four LEDs on simultaneously.
0
20
40
60
80
100
120
-90 -60 -30 030 60 90
Relative Luminous Intensity (%)
Angle (º)
White
Color
Copyright © 2008-2011 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trade-
marks of Cree, Inc.
9
xlamp mC-e leds
REFLOW SOLDERING CHARACTERISTICS
In testing, Cree has found XLamp MC-E LEDs to be compatible with JEDEC J-STD-020C, using the parameters listed
below. As a general guideline, Cree recommends that users follow the recommended soldering prole provided by the
manufacturer of solder paste used.
Note that this general guideline may not apply to all PCB designs and congurations of reow soldering equipment.
Prole Feature Lead-Based Solder Lead-Free Solder
Average Ramp-Up Rate (Tsmax to Tp) 3°C/second max. 3°C/second max.
Preheat: Temperature Min (Tsmin) 100°C 150°C
Preheat: Temperature Max (Tsmax) 150°C 200°C
Preheat: Time (tsmin to tsmax) 60-120 seconds 60-180 seconds
Time Maintained Above: Temperature (TL) 183°C 217°C
Time Maintained Above: Time (tL) 60-150 seconds 60-150 seconds
Peak/Classication Temperature (Tp) 215°C 260°C
Time Within 5°C of Actual Peak Temperature (tp) 10-30 seconds 20-40 seconds
Ramp-Down Rate 6°C/second max. 6°C/second max
Time 25°C to Peak Temperature 6 minutes max. 8 minutes max.
Note: All temperatures refer to topside of the package, measured on the package body surface.
T
P
T
L
Temperature
Time
t 25˚C to Peak
Preheat
ts
tS
tP
25
Ramp-down
Ramp-up
Critical Zone
TL to TP
Tsmax
Tsmin
Copyright © 2008-2011 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trade-
marks of Cree, Inc.
10
xlamp mC-e leds
NOTES
Moisture Sensitivity
XLamp MC-E LEDs are shipped in sealed, moisture-barrier bags (MBB) designed for long shelf life. If XLamp MC-E LEDs
are exposed to moist environments after opening the MBB packaging but before soldering, damage to the LED may oc-
cur during the soldering operation. The following derating table denes the maximum exposure time (in days) for an
XLamp MC-E LED in the listed humidity and tempera-
ture conditions. LEDs with exposure time longer than
the time specied below must be baked according to
the baking conditions listed here.
Baking Conditions
It is not necessary to bake all XLamp MC-E LEDs. Only the LEDs that meet all of the following criteria must be baked:
LEDs that have been removed from the original MBB packaging
LEDs that have been exposed to a humid environment longer than listed in the Moisture Sensitivity section above
LEDs that have not been soldered
LEDs should be baked at 80ºC for 24 hours. LEDs may be baked on the original reels. Remove LEDs from MBB packaging
before baking. Do not bake parts at temperatures higher than 80ºC. This baking operation resets the exposure time as
dened in the Moisture Sensitivity section above.
Storage Conditions
XLamp MC-E LEDs that have been removed from original MBB packaging but not soldered yet should be stored in a room
or cabinet that will maintain an atmosphere of 25 ±5ºC and no greater than 10% RH. For LEDs stored in these condi-
tions, storage time does not add to exposure time as dened in the above Moisture Sensitivity section.
RoHS Compliance
The levels of environmentally sensitive, persistent biologically toxic (PBT), persistent organic pollutants (POP), or other-
wise restricted materials in this product are below the maximum concentration values (also referred to as the threshold
limits) permitted for such substances, or are used in an exempted application, in accordance with EU Directive 2002/95/
EC on the restriction of the use of certain hazardous substances in electrical and electronic equipment (RoHS), as
amended through April 21, 2006.
Vision Advisory Claim
WARNING. Do not look at exposed LED lamps in operation. Eye injury can result. For more information about LEDs and
eye safety, please refer to the Cree LED Eye Safety Application Note (http://www.cree.com/products/pdf/XLamp_Eye-
Safety.pdf).
Temperature Maximum Percent Relative Humidity
30% 40% 50% 60% 70% 80% 90%
30ºC 9543111
25ºC 12 7 5 4 2 1 1
20ºC 17 9 7 6 2 2 1
Copyright © 2008-2011 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trade-
marks of Cree, Inc.
11
xlamp mC-e leds
MECHANICAL DIMENSIONS
All measurements are ±.1mm unless otherwise indicated.
Top View
Bottom View
Side View
9.0 .0
+
.2
.80
TYP.
7.50
7.00
.75
.10
1.50
BSC
PITCH
1 2 3 4
5678
.05
±.05
.25
1.45
R
3.18
4.48
±.20
A
5.40
2.60
2.84 7.70 10.02
5.60
1.00
TYP.
1.50
BSC
PITCH
2.75
1.16
3.85
1.30
2.00
7090MC PARALLEL / INDEPENDENT
CONFIGURATION
D8
D7
D6
D5
D4
D3
D2
D1
NEGATIVE (-) 4
5 4
POSITIVE (+) 4
NEGATIVE (-) 3
6 3
POSITIVE (+) 3
NEGATIVE (-) 2
7 2
POSITIVE (+) 2
8 1
NEGATIVE (-) 1
POSITIVE (+) 1
HEATSINK
RECOMMENDED PCB SOLDER PAD
Tolerances:
.101.
Solder mask windows must be .05 mm bigger
2.
than PCB Solder Pad.
+.13
-.03
D1
D2 D3
D4
REVISIONS
REV
COMMENTS
DATE
APPROVED BY
A
Initial Release
10/16/07
RC
B
Change height due to new lens
10/23/2007
RC
C
Change recommended solder pad footprint
11/26/2007
RC
D
Height change due to new lens (was 3.86)
12/26/2007
RC
E
- Change package height FROM 1.5 TO 1.45
- Add LED reference designators
- Delete Series Configuration schematic
- Add tabs to recommended PCB footprint
5/12/2008
RC
SHEET 1 OF 1
20:1
2610-00005
SIZE
TITLE
REV.
C
DRAWING NO.
DATE
DATE
DATE
CHECK
FINAL PROTECTIVE FINISH
MATERIAL
APPROVED
DRAWN BY
THIRD ANGLE PROJECTION
.X ± 0.3
X° ± 2°
.XX ± .10
.X ± .25
FOR SHEET METAL PARTS ONLY
.XX ± .13
X° ± 1°
UNLESS OTHERWISE SPECIFIED
DIMENSIONS ARE IN
MILLIMETERS & BEFORE FINISH.
TOLERANCE UNLESS SPECIFIED:
SCALE
A
B
C
D
1
23456
65432
1
A
B
C
D
4600 Silicon Drive
Durham, N.C 27703
UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT
MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY
CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT
CONTAINED WITHIN ARE THE PROPRIETARY AND
CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION
OF CREE INC.
NOTICE
OUTLINE DRAWING,
7090MC PACKAGE
E
R.Chaloupecky
10/16/07
Ban Loh
5.40
2.60
HEATSINK
9.0 .0
+
.2
.80
TYP.
7.50
7.00
.75
.10
1.50
BSC
PITCH
1 2 3 4
5678
.05
±.05
.25
1.45
R
3.18
4.48
±.20
A
5.40
2.60
2.84 7.70 10.02
5.60
1.00
TYP.
1.50
BSC
PITCH
2.75
1.16
3.85
1.30
2.00
7090MC PARALLEL / INDEPENDENT
CONFIGURATION
D8
D7
D6
D5
D4
D3
D2
D1
NEGATIVE (-) 4
5 4
POSITIVE (+) 4
NEGATIVE (-) 3
6 3
POSITIVE (+) 3
NEGATIVE (-) 2
7 2
POSITIVE (+) 2
8 1
NEGATIVE (-) 1
POSITIVE (+) 1
HEATSINK
RECOMMENDED PCB SOLDER PAD
Tolerances:
.101.
Solder mask windows must be .05 mm bigger
2.
than PCB Solder Pad.
+.13
-.03
D1
D2 D3
D4
REVISIONS
REV
COMMENTS
DATE
APPROVED BY
A
Initial Release
10/16/07
RC
B
Change height due to new lens
10/23/2007
RC
C
Change recommended solder pad footprint
11/26/2007
RC
D
Height change due to new lens (was 3.86)
12/26/2007
RC
E
- Change package height FROM 1.5 TO 1.45
- Add LED reference designators
- Delete Series Configuration schematic
- Add tabs to recommended PCB footprint
5/12/2008
RC
SHEET 1 OF 1
20:1
2610-00005
SIZE
TITLE
REV.
C
DRAWING NO.
DATE
DATE
DATE
CHECK
FINAL PROTECTIVE FINISH
MATERIAL
APPROVED
DRAWN BY
THIRD ANGLE PROJECTION
.X ± 0.3
X° ± 2°
.XX ± .10
.X ± .25
FOR SHEET METAL PARTS ONLY
.XX ± .13
X° ± 1°
UNLESS OTHERWISE SPECIFIED
DIMENSIONS ARE IN
MILLIMETERS & BEFORE FINISH.
TOLERANCE UNLESS SPECIFIED:
SCALE
A
B
C
D
1
23456
65432
1
A
B
C
D
4600 Silicon Drive
Durham, N.C 27703
UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT
MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY
CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT
CONTAINED WITHIN ARE THE PROPRIETARY AND
CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION
OF CREE INC.
NOTICE
OUTLINE DRAWING,
7090MC PACKAGE
E
R.Chaloupecky
10/16/07
Ban Loh
9.0 .0
+
.2
.80
TYP.
7.50
7.00
.75
.10
1.50
BSC
PITCH
1 2 3 4
5678
.05
±.05
.25
1.45
R
3.18
4.48
±.20
A
5.40
2.60
2.84 7.70 10.02
5.60
1.00
TYP.
1.50
BSC
PITCH
2.75
1.16
3.85
1.30
2.00
7090MC PARALLEL / INDEPENDENT
CONFIGURATION
D8
D7
D6
D5
D4
D3
D2
D1
NEGATIVE (-) 4
5 4
POSITIVE (+) 4
NEGATIVE (-) 3
6 3
POSITIVE (+) 3
NEGATIVE (-) 2
7 2
POSITIVE (+) 2
8 1
NEGATIVE (-) 1
POSITIVE (+) 1
HEATSINK
RECOMMENDED PCB SOLDER PAD
Tolerances:
.101.
Solder mask windows must be .05 mm bigger
2.
than PCB Solder Pad.
+.13
-.03
D1
D2 D3
D4
REVISIONS
REV
COMMENTS
DATE
APPROVED BY
A
Initial Release
10/16/07
RC
B
Change height due to new lens
10/23/2007
RC
C
Change recommended solder pad footprint
11/26/2007
RC
D
Height change due to new lens (was 3.86)
12/26/2007
RC
E
- Change package height FROM 1.5 TO 1.45
- Add LED reference designators
- Delete Series Configuration schematic
- Add tabs to recommended PCB footprint
5/12/2008
RC
SHEET 1 OF 1
20:1
2610-00005
SIZE
TITLE
REV.
C
DRAWING NO.
DATE
DATE
DATE
CHECK
FINAL PROTECTIVE FINISH
MATERIAL
APPROVED
DRAWN BY
THIRD ANGLE PROJECTION
.X ± 0.3
X° ± 2°
.XX ± .10
.X ± .25
FOR SHEET METAL PARTS ONLY
.XX ± .13
X° ± 1°
UNLESS OTHERWISE SPECIFIED
DIMENSIONS ARE IN
MILLIMETERS & BEFORE FINISH.
TOLERANCE UNLESS SPECIFIED:
SCALE
A
B
C
D
1
23456
65432
1
A
B
C
D
4600 Silicon Drive
Durham, N.C 27703
UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT
MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY
CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT
CONTAINED WITHIN ARE THE PROPRIETARY AND
CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION
OF CREE INC.
NOTICE
OUTLINE DRAWING,
7090MC PACKAGE
E
R.Chaloupecky
10/16/07
Ban Loh
Top View
9.0 .0
+
.2
.80
TYP.
7.50
7.00
.75
.10
1.50
BSC
PITCH
1 2 3 4
5678
.05
±.05
.25
1.45
R
3.18
4.48
±.20
A
5.40
2.60
2.84 7.70 10.02
5.60
1.00
TYP.
1.50
BSC
PITCH
2.75
1.16
3.85
1.30
2.00
7090MC PARALLEL / INDEPENDENT
CONFIGURATION
D8
D7
D6
D5
D4
D3
D2
D1
NEGATIVE (-) 4
5 4
POSITIVE (+) 4
NEGATIVE (-) 3
6 3
POSITIVE (+) 3
NEGATIVE (-) 2
7 2
POSITIVE (+) 2
8 1
NEGATIVE (-) 1
POSITIVE (+) 1
HEATSINK
RECOMMENDED PCB SOLDER PAD
Tolerances:
.101.
Solder mask windows must be .05 mm bigger
2.
than PCB Solder Pad.
+.13
-.03
D1
D2 D3
D4
REVISIONS
REV
COMMENTS
DATE
APPROVED BY
A
Initial Release
10/16/07
RC
B
Change height due to new lens
10/23/2007
RC
C
Change recommended solder pad footprint
11/26/2007
RC
D
Height change due to new lens (was 3.86)
12/26/2007
RC
E
- Change package height FROM 1.5 TO 1.45
- Add LED reference designators
- Delete Series Configuration schematic
- Add tabs to recommended PCB footprint
5/12/2008
RC
SHEET 1 OF 1
20:1
2610-00005
SIZE
TITLE
REV.
C
DRAWING NO.
DATE
DATE
DATE
CHECK
FINAL PROTECTIVE FINISH
MATERIAL
APPROVED
DRAWN BY
THIRD ANGLE PROJECTION
.X ± 0.3
X° ± 2°
.XX ± .10
.X ± .25
FOR SHEET METAL PARTS ONLY
.XX ± .13
X° ± 1°
UNLESS OTHERWISE SPECIFIED
DIMENSIONS ARE IN
MILLIMETERS & BEFORE FINISH.
TOLERANCE UNLESS SPECIFIED:
SCALE
A
B
C
D
1
23456
65432
1
A
B
C
D
4600 Silicon Drive
Durham, N.C 27703
UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT
MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY
CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT
CONTAINED WITHIN ARE THE PROPRIETARY AND
CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION
OF CREE INC.
NOTICE
OUTLINE DRAWING,
7090MC PACKAGE
E
R.Chaloupecky
10/16/07
Ban Loh
Color
D1: Red
D2: Green
D3: Blue
D4: White
Recommended PCB Solder Pad
Dynamic White
D1: Cool White
D2: Warm White
D3: Cool White
D4: Warm White
Copyright © 2008-2011 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trade-
marks of Cree, Inc.
12
xlamp mC-e leds
(200 Lamps)
Loaded Pockets
(13 pockets min.)
Trailer
160mm (min) of
empty pockets
sealed with tape
(34 empty pockets min.)
Leader
400mm (min) of
empty pockets with
at least 100mm
sealed by tape
START
END
Cathode Side
Anode Side
(denoted by chamfer)
200.0
A
A
B
5.5
±.1
SECTION A-A
SCALE 2 : 1
16.0 .0
+
.3
12.0
±.1
1.75
±.10
4.0
±.1
1.5
±.1
DETAIL B
SCALE 2 : 1
13
mm
7"
Cover Tape
Pocket Tape
User Feed Direction
User Feed Direction
TAPE AND REEL
All measurements in mm.
Copyright © 2008-2011 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trade-
marks of Cree, Inc.
13
xlamp mC-e leds
DRY PACKAGING AND PACKAGING
CREE Bin Code
& Barcode Label
Vacuum-Sealed
Moisture Barrier Bag
Label with Customer
P/N, Qty, Lot #, PO #
Desiccant
(inside bag)
Humidity Indicator
(inside bag)
Label with Cree Bin
Code, Qty, Lot #
Label with Cree Bin
Code, Qty, Lot #
Vacuum-Sealed
Moisture Barrier Bag
Dessicant
(inside bag)
Humidity Indicator
Card (inside bag)
Patent Label
Label with Customer Order
Code, Qty, Reel ID, PO #
CREE Bin Code
& Barcode Label
Vacuum-Sealed
Moisture Barrier Bag
Label with Customer
P/N, Qty, Lot #, PO #
Desiccant
(inside bag)
Humidity Indicator
(inside bag)
Label with Cree Bin
Code, Qty, Lot #
Label with Cree Bin
Code, Qty, Lot #
Vacuum-Sealed
Moisture Barrier Bag
Dessicant
(inside bag)
Humidity Indicator
Card (inside bag)
Patent Label
Label with Customer Order
Code, Qty, Reel ID, PO #
Label with Customer Order Code,
Qty, Reel ID, PO#
Label with Cree Bin Code,
Qty, Lot #