Surface Mount Information
Pick and Place
The Austin SuperLynxTM SMT modules use an open frame
construction and are designed for a fully automated assembly
process. The modules are fitted with a label designed to
provide a large surface area for pick and place operations.
The label meets all the requirements for surface mount
processing, as well as safety standards, and is able to
withstand reflow temperatures of up to 300oC. The label also
carries product information such as product code, serial
number and the location of manufacture.
Figure 35. Pick and Place Location.
Nozzle Recommendations
The module weight has been kept to a minimum by using
open frame construction. Even so, these modules have a
relatively large mass when compared to conventional SMT
components. Variables such as nozzle size, tip style, vacuum
pressure and placement speed should be considered to
optimize this process. The minimum recommended nozzle
diameter for reliable operation is 6mm. The maximum nozzle
outer diameter, which will safely fit within the allowable
component spacing, is 9 mm.
Oblong or oval nozzles up to 11 x 9 mm may also be used
within the space available.
Reflow Soldering Information
The Austin SuperLynxTM SMT power modules are large mass,
low thermal resistance devices and typically heat up slower
than other SMT components. It is recommended that the
customer review data sheets in order to customize the solder
reflow profile for each application board assembly. The
following instructions must be observed when soldering these
units. Failure to observe these instructions may result in the
failure of or cause damage to the modules, and can adversely
affect long-term reliability.
Typically, the eutectic solder melts at 183oC, wets the land,
and subsequently wicks the device connection. Sufficient time
must be allowed to fuse the plating on the connection to
ensure a reliable solder joint. There are several types of SMT
reflow technologies currently used in the industry. These
surface mount power modules can be reliably soldered using
natural forced convection, IR (radiant infrared), or a
combination of convection/IR. For reliable soldering the
solder reflow profile should be established by accurately
measuring the modules pin temperatures.
Figure 36. Reflow Profile.
An example of a reflow profile (using 63/37 solder) for the
Austin SuperLynxTM SMT power module is :
• Pre-heating zone: room temperature to 183oC (2.0 to 4.0
minutes maximum)
• Initial ramp rate < 2.5oC per second
• Soaking Zone: 155 oC to 183 oC – 60 to 90 seconds typical
(2.0 minutes maximum)
• Reflow zone ramp rate:1.3oC to 1.6oC per second
• Reflow zone: 210oC to 235oC peak temperature – 30 to 60
seconds (90 seconds maximum