Issue 9 - January 2008 1 www.zetex.com
© Zetex Semiconductors plc 2008
ZMR series
Fixed 2.5, 3.3 and 5 volt miniature voltage regulators
Description
Ordering information
The ZMR series of three terminal fixed
positive voltage regulators feature internal
current limit and will shut down under
thermal overload conditions making the
devices difficult to destroy.
The circuit design offers an exceptionally low
quiescent current, only 30µA for the 2.5V
device, ideal for low power applications. The
initial devices in the series regulate to 2.5 or
5V with a drive capability up to 50mA.
The device is designed with space saving in
mind and is available in the small outline SOT23
package. The ZMR250 has expanded its input
voltage range to 22.5V and the ZMR500 has
expanded its input voltage range to 25V;
equalling that of the ZMR25H and ZMR50H
respectively.
The ZMR330 provides a 3.3V output over an
input range of 5V to 24V.
Features
• Small outline SOT23 package
• 2.5V, 3.3V and 5V output
• Output current up to 50mA
• Very low quiesent current (30µA)
• Unconditionally stable
• Internal short circuit current limit
Pinout details
Order reference Package Part mark Status Reel size
(inches)
Quantity
per reel
Tape width
(mm)
ZMR25HCL TO92 ZMR25H Obsolete Loose 4000 -
ZMR25HCSTZ TO92 ZMR25H Obsolete -1500 -
ZMR25HFTA SOT23 25X Obsolete 7" 3000 8mm
ZMR250CL TO92 ZMR250 Obsolete Loose 4000 -
ZMR250CSTOB TO92 ZMR250 Obsolete 12.5" 1500 -
ZMR250CSTZ TO92 ZMR250 Obsolete -1500 -
ZMR250FTA SOT23 25K Active 7" 3000 8mm
ZMR330FTA SOT23 330 Active 7" 3000 8mm
ZMR50HCL TO92 ZMR50H Obsolete Loose 4000 -
ZMR50HCSTZ TO92 ZMR50H Obsolete -1500 -
ZMR50HFTA SOT23 50R Obsolete 7" 3000 8mm
ZMR500CL TO92 ZMR500 Obsolete Loose 4000 -
ZMR500CSTZ TO92 ZMR500 Obsolete Concertina 1500 -
ZMR500FTA SOT23 50K Active 7" 3000 8mm
ZMR500FTC SOT23 50K Obsolete 13" 10000 8mm
GND
OUT
IN
2
3
1
1
2
3
Top view
SOT23
package suffix - F
TO92
package suffix - C
IN
Underside view
GND
OUT
Obsolete
ZMR series
Issue 9 - January 2008 2 www.zetex.com
© Zetex Semiconductors plc 2008
Absolute maximum ratings
Note:
1. The maximum operating input voltage and output current of the device will be governed bythe
maximum power dissipation of the selected package. Maximum package power dissipationis
specified at 25°C and must be linearly derated to zero at Tamb =125°C.
2. The following data represents pulse test conditions with junction temperatures as indicated
atthe initiation of the test. Continuous operation of the devices with the stated conditions
mightexceed the power dissipation limits of the chosen package.
3. Maximum power dissipation for the SOT23 package, is calculated assuming that the device
ismounted on a ceramic substrate measuring 15 x 15 x 0.6mm.
Recommended Operating Conditions
Input voltage:
ZMR25H, ZMR250 22.5V
ZMR330 24V
ZMR50H, ZMR500 25V
Package power dissipation SOT23 500mW (Note 3)
(Tamb=25 °C) TO92 600mW
Output current (IO)100mA
Operating temperature -55 to 125°C
Storage temperature -65 to 150°C
Input voltage range Min Max Unit
ZMR25H/250 4.2 22.5 V
ZMR330 4.8 24 V
ZMR50H/500 7.0 25 V
Ambient temperature range -55 125 °C
ZMR series
Issue 9 - January 2008 3 www.zetex.com
© Zetex Semiconductors plc 2008
ZMR25H and ZMR250
Electrical characteristics test conditions (unless otherwise stated):Tj=25°C,
IO = 10mA, VIN = 6.5V
Symbol Parameter Conditions Min. Typ. Max. Units
VO Output voltage 2.438 2.5 2.563 V
IO=0 to 50mA
Tj=-55 to 125°C
2.360 2.640 V
VIN=4.5 to 22.5V 2.360 2.640 V
IO=0 to 50mA
Tj=-55 to 125°C
⌬VO Line regulation VIN=4.5 to 22.5V 5 15 mV
⌬VOLoad regulation IO=0 to 50mA 20 30 mV
IO=0 to 10mA 12 mV
lSSupply current Tj=-55 to 125°C 30 40 µA
⌬lS Supply current change IO=0 to 50mA 1 ±10 µA
VIN=4.5 to 22.5V 2 10 µA
VN Output noise voltage f=10Hz to 10kHz 65 µV rms
⌬VIN / ⌬VO Ripple rejection VIN=6.3 to 18V
f=120Hz
55 75 dB
VIN Input voltage required to
maintain regulation
3.9 V
⌬VO /⌬T Average temperature
coefficient of VO
IO=5.0mA
Tj=-55 to 125°C
0.275 0.700 mV/°C
ZMR series
Issue 9 - January 2008 4 www.zetex.com
© Zetex Semiconductors plc 2008
ZMR330
Electrical characteristics test conditions (unless otherwise stated):Tj=25°C,
IO = 10mA, VIN = 7V
Symbol Parameter Conditions Min. Typ. Max. Units
VO Output voltage 3.217 3.3 3.383 V
IO=0 to 50mA
Tj=-55 to 125°C
3.148 3.393 V
VIN=5 to 24V 3.148 3.408 V
IO=0 to 50mA
Tj=-55 to 125°C
⌬VO Line regulation VIN=5 to 24V 5 15 mV
⌬VOLoad regulation IO=0 to 50mA 20 50 mV
IO=0 to 10mA 13 mV
lSSupply current Tj=-55 to 125°C 120 170 µA
⌬lS Supply current change IO=0 to 50mA 5 10 µA
VIN=5 to 20V 2 10 µA
VN Output noise voltage f=10Hz to 10kHz 80 µV rms
⌬VIN / ⌬VO Ripple rejection VIN=6 to 20V
f=120Hz
55 dB
VIN Input voltage required to
maintain regulation
VOUT = 3.217V 4.74 V
ZMR series
Issue 9 - January 2008 5 www.zetex.com
© Zetex Semiconductors plc 2008
ZMR50H and ZMR500
Electrical characteristics test conditions (unless otherwise stated):Tj=25°C,
IO = 10mA, VIN = 10V
Symbol Parameter Conditions Min. Typ. Max. Units
VO Output voltage 4.785 5 5.125 V
IO=0 to 50mA
Tj=-55 to 125°C
4.780 5.160 V
VIN=7 to 25V 4.780 5.175 V
IO=0 to 50mA
Tj=-55 to 125°C
⌬VO Line regulation VIN=7 to 25V 5 15 mV
⌬VOLoad regulation IO=0 to 50mA 25 40 mV
IO=0 to 10mA 15 mV
lSSupply current Tj=-55 to 125°C 50 70 µA
⌬lS Supply current change IO=0 to 50mA 1 ±10 µA
VIN=7 to 25V 2 10 µA
VN Output noise voltage f=10Hz to 10kHz 90 µV rms
⌬VIN / ⌬VO Ripple rejection VIN=8 to 18V
f=120Hz
55 72 dB
VIN Input voltage required to
maintain regulation
6.7 V
⌬VO /⌬T Average temperature
coefficient of VO
IO=5.0mA
Tj=-55 to 125°C
0.275 0.700 mV/°C
ZMR series
Issue 9 - January 2008 6 www.zetex.com
© Zetex Semiconductors plc 2008
Typical characteristics
-50 -25 025 50 75 100 125
-50 -25 025 50 75 100 125
2.5
2.0
1.5
1.0
0.5
0
Drop-Out Voltage (V)
Drop-Out Voltage v Temperature
Quiescent Current v Temperature
-50 -25 025 50 75 100 125
Temperature (°C)
Output Voltage Temperature
0
20
40
2468
10 12 14 16 18 20
60
10
30
50
Input Voltage (V)
Quiescent Current v Voltage
28
0.1 110 100
27
29
47
48
49
50
30
75
Quiescent Current v Temperature
Quiescent Current (µA)
-50 -25
26
28
02550
32
30
34
125100
40
44
48
52
56
60
Output Current Temperature (°C)
Temperature (°C) Temperature (°C)
5.00
5.02
4.98
4.96
2.50
2.48
2.46
2.52
ZMR50H/500
ZMR25H/250
Output Voltage
Quiescent Current v Output Current
Io=5mA
Vin=Vo+4
Io=5mA
Vin=Vo+4
Io=10mA
Io=0
Vin=V o+4
Io=0
Vin=V o+4
Io=0
Vin=V o+4
Io=0
Vin=Vo+4
Io=10 mA
Quiescent Current (µA) Quiescent Current (µA)
Quiescent Current (µA)
ZMR25H/250
ZMR50H/500
ZMR25H/250 ZMR50H/500
ZMR25H/250
ZMR25H/ZMR250
ZMR50H/ZMR500
ZMR50H/500
ZMR series
Issue 9 - January 2008 7 www.zetex.com
© Zetex Semiconductors plc 2008
Typical characteristics
0
Time (µs)
Line Transient Response
Load Current
01020
30 40 50
Time (µ s)
Output Voltage Deviation (V)
Load Transient Response
0
10
20
30
40
50
60
70
80
90
10 100 1K 10K 100K
Ripple Frequency (Hz)
Ripple Rejection (dB)
100 1K 10K 100K
10
1.0
0.1
0.01
Frequency (Hz)
Output Impedance (Ω)
I = 10mA
V = V + 4V
O
IN OUT
Output Impedance v Frequency Ripple Rejection v Ripple Frequency
ZMR50H/500
ZMR25H/250
ZMR50H/500
ZMR25H/750
ZMR25H/250
ZMR50H/500
20 40 60 80 100
0
10mA
ZMR50H/500
ZMR25H/250
Vin
0
-0.4
0
-0.4
0.4
0.4
0V
5V
0
0.4
-0.4
0
-0.4
0.4
Output Voltage Deviation (V)
0
1
2
Power Dissipation (mW)
Power Dissipation (mW)
800
600
400
200
0
Power Derating Power Derating
TO92
o
I = 2mA
-50 -25 025 50 75 100 125
Temperature (°C)
-50 -25 025 50 75 100 125
Temperature (°C)
Io= 10mA
SOT23
Surface Mount Devices Through Hole Device
COUT=0
VIN=V o+4
dVIN/dt=5V/µs
COUT=0
VIN=V o+4
dIo/dt=1A/µs
ZMR series
Issue 9 - January 2008 10 www.zetex.com
© Zetex Semiconductors plc 2008
Package outline - SOT23
Note: Controlling dimensions are in millimeters. Approximate dimensions are provided in inches
Dim. Millimeters Inches Dim. Millimeters Inches
Min. Max. Min. Max. Min. Max. Max. Max.
A - 1.12 - 0.044 e1 1.90 NOM 0.075 NOM
A1 0.01 0.10 0.0004 0.004 E 2.10 2.64 0.083 0.104
b 0.30 0.50 0.012 0.020 E1 1.20 1.40 0.047 0.055
C 0.085 0.120 0.003 0.008 L 0.25 0.62 0.018 0.024
D 2.80 3.04 0.110 0.120 L1 0.45 0.62 0.018 0.024
e0.95 NOM0.0375 NOM-----
E
e
L
e1
D
A
c
E1
L1
A1
b
3 leads
ZMR series
Issue 9 - January 2008 11 www.zetex.com
© Zetex Semiconductors plc 2008
Package outline - TO92
Note: Controlling dimensions are in millimeters. Approximate dimensions are provided in inches
DIM Millimeters Inches
Min. Max. Min. Max.
A 4.32 4.95 0.170 0.195
b 0.36 0.51 0.014 0.020
E 3.30 3.94 0.130 0.155
e 2.41 2.67 0.095 0.105
e1 1.14 1.40 0.045 0.055
L 12.70 15.49 0.500 0.610
R 2.16 2.41 0.085 0.095
S1 1.14 1.52 0.045 0.060
W 0.41 0.56 0.016 0.022
D 4.45 4.95 0.175 0.195
*° 4° 6° 4° 6°
ZMR series
Issue 9 - January 2008 12 www.zetex.com
© Zetex Semiconductors plc 2008
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© 2007 Published by Zetex Semiconductors plc
Definitions
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service. Customers are solely responsible for obtaining the latest relevant information before placing orders.
Applications disclaimer
The circuits in this design/application note are offered as design ideas. It is the responsibility of the user to ensure that the circuit is fit for
the user’s application and meets with the user’s requirements. No representation or warranty is given and no liability whatsoever is
assumed by Zetex with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights
arising from such use or otherwise. Zetex does not assume any legal responsibility or will not be held legally liable (whether in contract,
tort (including negligence), breach of statutory duty, restriction or otherwise) for any damages, loss of profit, business, contract,
opportunity or consequential loss in the use of these circuit applications, under any circumstances.
Life support
Zetex products are specifically not authorized for use as critical components in life support devices or systems without the express written
approval of the Chief Executive Officer of Zetex Semiconductors plc. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body
or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labelling can be reasonably expected to result in significant injury to the user.
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cause the failure of the life support device or to affect its safety or effectiveness.
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To ensure quality of service and products we strongly advise the purchase of parts directly from Zetex Semiconductors or one of our
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Zetex Semiconductors does not warrant or accept any liability whatsoever in respect of any parts purchased through unauthorized sales channels.
ESD (Electrostatic discharge)
Semiconductor devices are susceptible to damage by ESD. Suitable precautions should be taken when handling and transporting devices.
The possible damage to devices depends on the circumstances of the handling and transporting, and the nature of the device. The extent
of damage can vary from immediate functional or parametric malfunction to degradation of function or performance in use over time.
Devices suspected of being affected should be replaced.
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Zetex Semiconductors is committed to environmental excellence in all aspects of its operations which includes meeting or exceeding
regulatory requirements with respect to the use of hazardous substances. Numerous successful programs have been implemented to
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All Zetex components are compliant with the RoHS directive, and through this it is supporting its customers in their compliance with
WEEE and ELV directives.
Product status key:
“Preview” Future device intended for production at some point. Samples may be available
“Active” Product status recommended for new designs
“Last time buy (LTB)” Device will be discontinued and last time buy period and delivery is in effect
“Not recommended for new designs”
Device is still in production to support existing designs and production
“Obsolete” Production has been discontinued
Datasheet status key:
“Draft version” This term denotes a very early datasheet version and contains highly provisional information, which
may change in any manner without notice.
“Provisional version” This term denotes a pre-release datasheet. It provides a clear indication of anticipated performance.
However, changes to the test conditions and specifications may occur, at any time and without notice.
“Issue” This term denotes an issued datasheet containing finalized specifications. However, changes to
specifications may occur, at any time and without notice.
