
148
Detector
Detector
Slide
Slide
Push
Push
Rotary
Rotary
Power
Power
Dual-in-line
Package Type
Dual-in-line
Package Type
Soldering time
Example of Reflow Soldering Condition
1. Heating method: Double heating method with infrared heater.
2. Temperature measurement: Thermocouple φ0.1 to 0.2 CA (K) or CC (T) at soldering portion(copper foil surface).
A heat resisting tape should be used for fixed measurement.
3. Temperature profile
300
200
100
A max.
B
D
E
C
Time (s)
F max.
Room
temperature
Temperature (˚C )
Pre-heating
1.The condition mentioned above is the temperature on the mounting surface of a PC board. There are cases where the
PC board's temperature greatly differs from that of the switch, depending on the PC board's material, size, thickness, etc.
The above-stated conditions shall also apply to switch surface temperatures.
2. Soldering conditions differ depending on reflow soldering machines. Prior verification of soldering condition is highly recommended.
Notes
300
200
100
A max.
B
C
Time (s)
25s max.
E max.
D max.
Pre-heating
F
Room
temperature
Temperature (˚C )
SRBQ —250 200 —15 0±5 8 0 to 10 0
D(s)Series(Reflow type) A(℃)
3s max. B(℃) C(℃) E(s) F(s)
SRBD
F(s)Series(Reflow type)
260 230 15 0 12 040 18 0
A(℃)
3s max. B(℃) C(s) D(℃) E(℃)
SRBQ
(Reflow type)
SRBQ, SRBM, SRBV, SRRM, SRRN
3s max.
Soldering temperature Duration of immersionPreheating time
Series
60s max.
3 +1/ 0 s
260±5℃ 5s max.
260±5℃ 10 ±1s
260±5℃ 5 ±1s
350±5℃
3 5 0 ±10 ℃
Soldering temperature
Dip soldering
Reference for Hand Soldering
Reference for Dip Soldering
(For PC board terminal types)
Rotary Switches / Soldering Conditions
SRBQ
SRBV, SRRM, SRRN
SRBM
Series
—
Preheating temperature
10 0 ℃ ma x .
—
Items