ISD1600 SERIES SINGLE-MESSAGE SINGLE-CHIP 6.6- TO 40-SECOND DURATION VOICE RECORD/PLAYBACK DEVICE -1- Publication Release Date: November 4, 2004 Revision 1 ISD1600 SERIES 1. GENERAL DESCRIPTION Winbond's ISD1600 Series ChipCorder(R) is a single-message, single chip, record/playback solution with selectable durations from 6.6 to 40 seconds. The CMOS device includes an on-chip oscillator (via external control), microphone preamplifier, automatic gain control, anti-aliasing filter, Multi-Level Storage (MLS) array, smoothing filter, PWM Class D speaker amplifier for standard 8 speaker or buzzer, plus an extra current output. Recording is stored into the embedded Flash memory cells, providing zero-power message storage. This unique single-chip solution ultilizes Winbond's patented MLS technology. Therefore, voice or audio data are stored directly into the memory in their natural form without any compressions alike digital approach, providing high-quality, solid-state audio reproduction. The device enters into standby mode automatically once an operation is completed for power saving purposes. Moreover, a minimum record/playback subsystem can be configured with a microphone, a speaker or buzzer, several passive components, two push buttons, and a power source. 2. FEATURES * User-friendly single-chip, single-message voice record/playback solution * Wide operating voltage range: 2.4V to 5.5V * Push-button interface o Playback is either edge- or level-triggered o Record is level-triggered Variable duration selected by external oscillator resistor * Sample Rate Rosc ISD1610 ISD1612 ISD1616 ISD1620 * * * * * * * * * 12 KHz 60 k 6.6 secs 8 secs 10.6 secs 13.3 secs 8 KHz 80 k 10 secs 12 secs 16 secs 20 secs 6.4 KHz 100 k 12.5 secs 15 secs 20 secs 25 secs 5.3 KHz 120 k 15 secs 18 secs 24 secs 30 secs 4 HKz 160 k 20 secs 24 secs 32 secs 40 secs Automatic power-down mode o Enters standby mode immediately after a record or playback cycle o 1A standby current (maximum) at room temperature PWM Class D speaker amplifier and AUD output driver simultaneously o Direct drive an 8 speaker or typical buzzer o AUD current output to drive external power transistor High-quality, natural voice/audio reproduction Zero-power message storage o Eliminates battery backup circuits 100-year message retention (typical) 10,000 record cycles (typical) On-chip oscillator Available in die, 16L 150mil SOIC and 16L 300mil PDIP Temperature options: o Commercial: 0C to +50C (Die); 0C to +70C (Packaged) o Industrial: -40C to +85C (Packaged) -2- ISD1600 SERIES 3. BLOCK DIAGRAM Internal Clock ROSC Timing Sampling Clock Amp Active Antialiasing Filter Decoders MIC+ MIC- AGC Amp AUD Analog Transceivers Nonvolatile Multilevel Storage Array Active Smoothing Filter SP+ Amp SP- Automatic Gain Control (AGC) AGC Device Control Power Conditioning VCCA VSSA VSSAD VSSD VCCD REC -3- PLAYE PLAYL LED Publication Release Date: November 4, 2004 Revision 1 ISD1600 SERIES 4. TABLE OF CONTENTS 1. GENERAL DESCRIPTION.................................................................................................................. 2 2. FEATURES ......................................................................................................................................... 2 3. BLOCK DIAGRAM .............................................................................................................................. 3 4. TABLE OF CONTENTS ...................................................................................................................... 4 5. PIN CONFIGURATION ....................................................................................................................... 5 6. PIN DESCRIPTION ............................................................................................................................. 6 7. FUNCTIONAL DESCRIPTION............................................................................................................ 8 7.1. Detailed Description .................................................................................................................. 8 8. TIMING DIAGRAMS.......................................................................................................................... 10 9. ABSOLUTE MAXIMUM RATINGS [1] ................................................................................................ 12 9.1 Operating Conditions ............................................................................................................... 13 10. ELECTRICAL CHARACTERISTICS ............................................................................................... 14 10.1. DC Parameters ...................................................................................................................... 14 10.2. AC Parameters ...................................................................................................................... 15 11. TYPICAL APPLICATION CIRCUIT ................................................................................................. 16 12. PACKAGE DRAWING AND DIMENSIONS .................................................................................... 17 12.1. 16-Lead 150mil Small Outline IC (SOIC) Package .......................................................... 17 12.2. 16-Lead 300mil Plastic Dual Inline Package (PDIP) ....................................................... 18 12.3. Die Physical Layout .............................................................................................................. 19 13. ORDERING INFORMATION........................................................................................................... 20 14. VERSION HISTORY ....................................................................................................................... 21 -4- ISD1600 SERIES 5. PIN CONFIGURATION VSSD 1 16 LED REC 2 15 VCCD PLAYE 3 14 ROSC PLAYL 4 13 AUD VSSA 5 12 AGC MIC+ 6 11 Sp+ MIC- 7 10 VCCA SP- 8 9 VSSAD I1600 SOIC / PDIP -5- Publication Release Date: November 4, 2004 Revision 1 ISD1600 SERIES 6. PIN DESCRIPTION PIN NAME SOIC / PDIP FUNCTIONS PIN NO. VSSD, VSSA, VSSAD 1, 5, 9 Ground: VSSD is the ground for digital circuits. VSSA is the ground for analog circuits, whereas VSSAD is the ground for PWM speaker driver. They should be separate ground paths connecting to ground of power supply to minimize noises. REC [1] 2 Record: The device starts recording whenever REC transits from HIGH to LOW and stays at LOW. Recording stops when the signal returns to HIGH. This pin has an internal pull-up device[2]. PLAYE [1] 3 Edge-trigger Playback: A playback operation starts when this input detects a LOW going signal exceeding the specified debounced time. This pin has an internal pull-up device[2]. PLAYL [1] 4 Level-trigger Playback: A playback operation begins when this input detects a LOW going signal and remains at LOW. Playback stops when the signal returns to HIGH. This pin has an internal pull-up device[2]. MIC+ 6 Microphone Positive Input: The input transfers the signals to the preamplifier. The internal Automatic Gain Control (AGC) circuit controls the gain of the preamplifier. An external microphone should be AC coupled to this pin via a series capacitor. The capacitor value, together with an internal 10 K resistance on this pin, determines the lowfrequency cutoff for the ISD1600 passband. MIC- 7 Microphone Negative Input: This is the inverting input to the microphone preamplifier. It provides input noisecancellation, or common-mode rejection, when the microphone is connected differentially to the device. SP- 8 Speaker Negative : The SP-, Class D PWM output, provide a differential output with SP+ pin to drive 8 speaker or buzzer. During power down or recording, this pin is tristated. VCCA, VCCD 10, 15 Supply Voltages: Internal analog and digital circuits use separate power busses to minimize noises inside the chip. These power busses are brought out to separate pads and should be tied together as close to the power supply as possible. It is important that the power supplies are decoupled as close as possible to the device. SP+ 11 Speaker Positive : The SP+, Class D PWM output, provide a differential output with SP- pin to drive an 8 speaker or buzzer directly. During power down or recording, this pin is tri-stated. -6- ISD1600 SERIES PIN NAME SOIC / PDIP FUNCTIONS PIN NO. AGC 12 Automatic Gain Control: The AGC dynamically adjusts the gain of the preamplifier to compensate the wide range of microphone input levels. The AGC allows the full range of signal to be recorded with minimal distortion. Nominal values of 4.7 F give satisfactory results in most cases. Connecting this pin to ground provides maximum gain to the preamplifier circuitry. Conversely, connecting this pin to power supply provides minimum gain to the preamplifier circuitry. Note: AUD 13 AUD: The AUD provides a single-ended current output to drive an external amplifier. During standby or recording, this pin is tri-stated. ROSC 14 Oscillator Resistor: This enables the user to vary the record and/or playback duration of the device. A resistor connected between the ROSC pin and VSS determines the sample frequency for the ISD1600 device. Please refer to the Duration Section in Section 7.1. LED 16 LED : This output is LOW during a record cycle and blinks during playback cycle. It can be used to drive an LED to indicate either a record or playback cycle is in progress. [1] The REC and Play signal are internally debounced on the falling edge to prevent a false re-triggering from a push-button switch. [2] The internal pull-up resistors are 600k (typical). -7- Publication Release Date: November 4, 2004 Revision 1 ISD1600 SERIES 7. FUNCTIONAL DESCRIPTION 7.1. DETAILED DESCRIPTION Audio Quality Winbond's patented ChipCorder(R) MLS technology provides natural high quality record and playback solution on a single chip. The input audio signals are stored directly into the non-volatile memory and are reproduced in its natural form without any compression artifacts caused by the digital speech solutions. A complete sample is stored in a single cell, minimizing the memory needed to store a single message. Duration The ISD1600 series offer single-chip solution with record/playback duration from 6.6 seconds to 40 seconds. Sampling rate and duration are determined by an external resistor connected to the Rosc pin. Sample Rate Rosc 12 KHz 8 KHz 60 k 80 k 10 secs 12 secs 16 secs 20 secs 6.4 KHz 100 k 12.5 secs 15 secs 20 secs 25 secs 5.3 KHz 120 k 15 secs 18 secs 24 secs 30 secs 4 KHz 160 k 20 secs 24 secs 32 secs 40 secs ISD1610 6.6 secs ISD1612 8 secs ISD1616 10.6 secs ISD1620 13.3 secs Flash Storage The ISD1600 product utilizes the on-chip Flash memory providing zero-power message storage. The message is retained for up to 100 years without power. In addition, the device can be re-recorded typically over 10,000 times. Basic Operation The ISD1600 ChipCorder(R) device is controlled by either the REC pin, or one of the two playback modes, PLAYE and PLAYL. The ISD1600 parts are configured for design simplicity in a singlemessage application. Device operation is explained in Section 7.2. Automatic Power-Down Mode At the end of a playback or record cycle, the ISD1600 device automatically enters into a low-power standby mode, consuming typically 0.5A, provided that PLAY and REC pins are HIGH (see DC parameters, Section 10). During a playback cycle, the device powers down automatically at the end of the message. During a record cycle, the device powers down immediately after REC is released to HIGH. -8- ISD1600 SERIES 7.2. Functional Description Example The following example operating sequences demonstrate the functionality of the ISD1600 series. 1. Record a message The device starts recording from the beginning of the memory when REC transits from HIGH to LOW and stays at LOW. A record cycle is completed when REC is pulled to HIGH or entire memory is filled up. Then an End-of-Message (EOM) marker is written at the end of message, enabling a subsequent playback cycle to terminate appropriately. Hence, the device automatically enters into standby mode. REC takes precedence over any playback operations. If REC is pulled LOW during a playback cycle, the playback immediately halts and recording starts from the beginning of the memory. The REC pin has an internal pull-up device[2]. Holding this pin LOW after recording cycle will increase standby current consumption. 2. Edge-trigger playback A playback operation starts from the beginning of the memory when PLAYE detects a LOW going signal exceeding the specified debounced time. Playback continues until an EOM marker is encountered. Upon completion of a playback cycle, the device automatically powers down and enters into standby mode. During playback, a subsequent LOW going signal will terminate the current playback operation. This pin has an internal pull-up device[2]. Holding this pin LOW after playback operation will increase standby current consumption. 3. Level- trigger playback When PLAYL switches from HIGH to LOW and stays at LOW, a playback starts from the beginning of the memory until either an EOM marker is reached, then it automatically powers down. If PLAYL is pulled HIGH any time during playback, the playback operation stops immediately and the device enters into the power-down mode. 4. LED operation The LED output pin provides an active-LOW signal during recording, which is used to turn on an LED as a "record-in-progress" indicator. However, during playback, the LED blinks a few times per second to indicate a "playback-in-progress" operation. It returns to a HIGH state when operation stops. 5. ROSC operation The duration of the device can be varied by changing the value of ROSC. This means the designer has the flexibility to choose different sampling frequency, up to 12 KHz, depending upon the needs. This feature allows frequency shifting where a recorded audio can be played back faster or slower than normal for special sound effects. Another feature is a "Pause" function that can be activated by taking the ROSC resistor to VCC to stop playback momentarily, and to resume when the resistor is switched back to ground. -9- Publication Release Date: November 4, 2004 Revision 1 ISD1600 SERIES 8. TIMING DIAGRAMS Tf Tr Rec TRS TDb1 LED Mic+ Mic- FIGURE 1: RECORD OPERATION - 10 - ISD1600 SERIES Odd # pulses starts playback Even # pulses stops playback Tf PlayE TDb2 TDb1 PlayL TDb1 Tr Tcyc LED TPS1 or TPS2 TRU Sp+ Sp- TPS1 or TPS2 TRU Aud Slowly returns to analog ground to eliminate the "pop" at the end Ramps up gradually to analog ground to eliminate the "pop" at the beginning FIGURE 2: PLAYBACK OPERATION - 11 - Publication Release Date: November 4, 2004 Revision 1 ISD1600 SERIES 9. ABSOLUTE MAXIMUM RATINGS [1] ABSOLUTE MAXIMUM RATINGS (DIE) CONDITIONS VALUES Junction temperature 150C Storage temperature range -65C to +150C Voltage applied to any pins (VSS -0.3V) to (VDD +0.3V) Power supply voltage to ground potential -0.3V to +7.0V ABSOLUTE MAXIMUM RATINGS (PACKAGED PARTS) CONDITIONS [1] VALUES Junction temperature 150C Storage temperature range -65C to +150C Voltage applied to any pins (VSS -0.3V) to (VDD +0.3V) Lead temperature (Soldering - 10 sec) 300C Power supply voltage to ground potential -0.3V to +7.0V Stresses above those listed may cause permanent damage to the device. Exposure to the absolute maximum ratings may affect device reliability and performance. Functional operation is not implied at these conditions. - 12 - ISD1600 SERIES 9.1 OPERATING CONDITIONS OPERATING CONDITIONS (DIE) CONDITIONS VALUES Operating temperature range Supply voltage (VDD) Ground voltage (VSS) Input voltage (VDD) 0C to +50C [1] +2.4V to +5.5V [2] 0V [1] 0V to 5.5V Voltage applied to any pins (VSS -0.3V) to (VDD +0.3V) OPERATING CONDITIONS (PACKAGED PARTS) CONDITIONS VALUES Operating temperature range (Case temperature) Supply voltage (VDD) Ground voltage (VSS) Input voltage (VDD) [1] +2.4V to +5.5V [2] 0V [1] 0V to 5.5V Voltage applied to any pins [1] VDD = VCCA = VCCD [2] VSS = VSSA = VSSD = VSSAD -40C to +85C (VSS -0.3V) to (VDD +0.3V) - 13 - Publication Release Date: November 4, 2004 Revision 1 ISD1600 SERIES 10. ELECTRICAL CHARACTERISTICS 10.1. DC PARAMETERS PARAMETER SYMBOL MIN TYP [1] MAX UNITS CONDITIONS Supply Voltage VDD 2.4 5.5 V Input Low Voltage VIL VSS-0.3 0.3xVDD V Input High Voltage VIH 0.7xVDD VDD V Output Low Voltage VOL VSS-0.3 0.3xVDD V IOL = 4.0 mA[2] Output High Voltage VOH 0.7xVDD VDD V IOH = -1.6 mA[2] Record Current IDD_Record 20 mA Playback Current IDD_Playback 20 mA Standby Current ISB 1 A VDD = 5.5V, T=25C [3] [4] [7] Input Leakage Current IILPD1 1 A Force VDD [5] Input Current HIGH IILPD2 -10 A Force VSS [5] K Across both pins 300 mV Peak-to-Peak[6] 40 dB VIN = 15 to 300mV, AGC = 4.7F, VDD = 2.4V to 5.5V Speaker Load VDD = 5.5V 15mVp-p VDD = 4.4V 1kHz freq sinewave, VDD= 3V REXT = 8; VDD= 2.4V Preamp Input Resistance 0.5 -3 RMIC+,RMIC- 20 MIC Input Voltage VIN 15 Gain from MIC to SP+/- AMSP 6 Output Load Impedance REXT 8 Speaker Output Power Pout 670 mW 313 mW 117 mW 49 mW Speaker Output Voltage Vout VDD V AUD IAUD -3.0 mA Total Harmonic Distortion THD 1 % VDD = 5.5V, No load, Sampling freq = 12 kHz REXT = 8 (Speaker), 70mH-160 (Buzzer) VDD =4.5V, REXT= 100 15mV p-p 1KHz sinewave, Cmessage weighted Notes: [1] Conditions: VCC = 4.5V, 8kHz sampling frequency and TA = 25C, unless otherwise stated. [2] LED output during Record operation. [3] VCCA and VCCD are connected together. VSSA, VSSAD and VSSD are connected together. [4] REC, PLAYL, PLAYE must be at VCCD. [5] REC, PLAYL and PLAYE are forced to specified condition. [6] Balanced input signal applied between MIC and MIC REF as shown in the applications example. Singleended MIC or MIC REF recommended to be less than 100 mV peak to peak. [7] For industrial grade, the maximum limit is 10A. - 14 - ISD1600 SERIES 10.2. AC PARAMETERS CHARACTERISTIC Sampling Frequency Duration [2] [3] SYMBOL FS TYP [1] MIN 4 Dur MAX UNITS 12 KHz Vcc=2.4V~5.5V I1610 I1612 I1616 I1620 6.6 8 10.6 13.3 Sec SF=12kHz 10 12 16 20 Sec SF=8kHz 12.5 15 20 25 Sec SF=6.4kHz 15 18 24 30 Sec SF=5.3kHz 20 24 32 40 Sec SF=4kHz Rising time Tr 0 100 nsec Falling Time Tf 0 100 nsec Debounce Time (Record & PlayL) TDb1 Debounce Time (PlayE) TDb2 CONDITIONS Vcc=2.4 V~5.5V 26.6 26.6 26.6 26.6 msec SF=12kHz 40 40 40 40 msec SF=8kHz 50 50 50 50 msec SF=6.4kHz 60.4 60.4 60.4 60.4 msec SF=5.3kHz 80 80 80 80 msec SF=4kHz 13.3 13.3 13.3 13.3 msec SF=12kHz 20 20 20 20 msec SF=8kHz 25 25 25 25 msec SF=6.4kHz 30.2 30.2 30.2 30.2 msec SF=5.3kHz 40 40 40 40 msec SF=4kHz msec Vcc=2.4V~5.5V 100 Vcc=2.4 V~5.5V Vcc=2.4 V~5.5V Signal Ramp Up Time TRU Record Stop Time TRS 2 Sample Clock PlayL Stop Time TPS1 TDb1 msec Vcc=2.4V~5.5V PlayE Stop Time TPS2 2 X TDb1 msec Vcc=2.4V~5.5V LED Cycle frequency TCyc 1 Vcc=2.4V~5.5V 6 Hz Playback at any SF Notes: [1] Typical values : VCC = 4.5V, SF = 8 kHz and @ TA = 25C, unless otherwise stated. [2] Sampling Frequency can vary as much as 2.25 percent over the commercial temperature and voltage ranges, and -6/+4 percent over the industrial temperature and voltage ranges. [6] Duration can vary as much as 2.25 percent over the commercial temperature and voltage ranges, and - 6/+4 percent over the industrial temperature and voltage ranges. - 15 - Publication Release Date: November 4, 2004 Revision 1 ISD1600 SERIES 11. TYPICAL APPLICATION CIRCUIT VCC VCCD ROSC DI LED VCCA R2 80 K C3 0.1 F C2 0.1 F VSSD VSSA R1 1 K C8 * 10 F C9 * 10 F VCC Q1 8050 VSSAD PLAYL I1800 1600 C4 0.1 F PLAYE RECORD R6 1 K REC LED VCC VCCD VCCA Speaker or Buzzer AUD SP+ SP- PLAYL PLAYE R3 4.7 K R5 390 C6 4.7 F C5 0.1 F C7 0.1 F C1 4.7 F ELECTRET MICROPHONE MIC+ MIC AGC VSS 8 Speaker R4 4.7 K VSSAD VSSA VSSD Schematic shows both speaker and AUD outputs * C8 and C9 may be needed in order to optimize for the best voice quality, which is also depended upon the layout of the PCB. Please refer to ChipCorder Applications section or consult Winbond for layout advice. The above example represents a typical implementation of ISD1600 in most applications. In addition, it is important to have a separate path for each ground (VSSD, VSSA & VSSAD) back to the ground terminal of power source to minimize the noises. Please refer to the ChipCorder Applications section in our website. Good Audio Design Practices Winbond products are very high-quality single-chip voice recording and playback systems. To ensure the highest quality voice reproduction, it is important that good audio design practices on layout and power supply decoupling be followed. See Application Information or below links for details. Good Audio Design Practices http://www.winbond-usa.com/products/isd_products/chipcorder/applicationinfo/apin11.pdf Single-Chip Board Layout Diagrams http://www.winbond-usa.com/products/isd_products/chipcorder/applicationinfo/apin12.pdf - 16 - ISD1600 SERIES 12. PACKAGE DRAWING AND DIMENSIONS 12.1. 16-LEAD 150MIL SMALL OUTLINE IC (SOIC) PACKAGE - 17 - Publication Release Date: November 4, 2004 Revision 1 ISD1600 SERIES 12.2. 16-Lead 300mil Plastic Dual Inline Package (PDIP) - 18 - ISD1600 SERIES 12.3. DIE PHYSICAL LAYOUT VSSD LED PLAYE REC ISD1610 / 1612 / 1616 / 1620 VCCD ROSC PLAYL VSSA AUD MIC+ MICSP+ VSSAD VCCA VCCA SP- AGC Notes: [1] The backside of die is internally connected to VSS. It MUST NOT be connected to any other potential or damage may occur. - 19 - Publication Release Date: November 4, 2004 Revision 1 ISD1600 SERIES 13. ORDERING INFORMATION Product Number Descriptor Key I16xxxx I1600 Series Temperature: I = Industrial (-40C to +85C) Blank = Commerical * Die (0C to +50C) * Package (0C to +70C) Duration: I1610 : 6.6 - 20 secs I1612 : 8 - 24 secs I1616 : 10.6 - 30 secs I1620 : 13.3 - 40 secs Package Type: X = Die S = Small Outline Integrated Circuit (SOIC) Package P = Plastic Dual Inline Package (PDIP) When ordering, please refer to the following part numbers that are supported in volume for this product series. Consult the local Winbond Sales Representative or Distributor for availability information. Die / Package Ordering Part Number Die I1610X I1612X I1616X I1620X PDIP I1610P I1612P I1616P I1620P I1610PI I1612PI I1616PI I1620PI I1610S I1612S I1616S I1620S I1610SI I1612SI I1616SI I1620SI SOIC For the latest product information, access Winbond's worldwide website at http://www.winbond-usa.com - 20 - ISD1600 SERIES 14. VERSION HISTORY VERSION DATE DESCRIPTION 0.1 July 2004 Initial draft 1 Nov. 2004 Revise Ground description Revise application diagram Revise die information - 21 - Publication Release Date: November 4, 2004 Revision 1 ISD1600 SERIES The contents of this document are provided only as a guide for the applications of Winbond products. Winbond makes no representation or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to discontinue or make changes to specifications and product descriptions at any time without notice. No license, whether express or implied, to any intellectual property or other right of Winbond or others is granted by this publication. Except as set forth in Winbond's Standard Terms and Conditions of Sale, Winbond assumes no liability whatsoever and disclaims any express or implied warranty of merchantability, fitness for a particular purpose or infringement of any Intellectual property. Winbond products are not designed, intended, authorized or warranted for use as components in systems or equipments intended for surgical implantation, atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, or for other applications intended to support or sustain life. Furthermore, Winbond products are not intended for applications wherein failure of Winbond products could result or lead to a situation wherein personal injury, death or severe property or environmental injury could occur. Application examples and alternative uses of any integrated circuit contained in this publication are for illustration only and Winbond makes no representation or warranty that such applications shall be suitable for the use specified. The 100-year retention and 10K record cycle projections are based upon accelerated reliability tests, as published in the Winbond Reliability Report, and are neither warranted nor guaranteed by Winbond. This product incorporates SuperFlash(R) technology. Information contained in this Winbond ChipCorder products published by ISD(R) prior to August, 1998. (R) datasheet supersedes all data for the ISD(R) ChipCorder(R) (R) (R) This datasheet and any future addendum to this data sheet is(are) the complete and controlling ISD ChipCorder product specifications. In the event any inconsistencies exist between the information in this and other product documentation, or in the event that other product documentation contains information in addition to the information in this, the information contained herein supersedes and governs such other information in its entirety. Copyright(c) 2003, Winbond Electronics Corporation. All rights reserved. ISD(R) and ChipCorder(R) are registered trademarks of Winbond Electronics Corporation. SuperFlash(R) is the trademark of Silicon Storage Technology, Inc. All other trademarks are properties of their respective owners. Headquarters Winbond Electronics Corporation America Winbond Electronics (Shanghai) Ltd. No. 4, Creation Rd. III Science-Based Industrial Park, Hsinchu, Taiwan TEL: 886-3-5770066 FAX: 886-3-5665577 http://www.winbond.com.tw/ 2727 North First Street, San Jose, CA 95134, U.S.A. TEL: 1-408-9436666 FAX: 1-408-5441797 http://www.winbond-usa.com/ 27F, 299 Yan An W. Rd. Shanghai, 200336 China TEL: 86-21-62365999 FAX: 86-21-62356998 Taipei Office Winbond Electronics Corporation Japan Winbond Electronics (H.K.) Ltd. 9F, No. 480, Pueiguang Rd. Neihu District Taipei, 114 Taiwan TEL: 886-2-81777168 FAX: 886-2-87153579 7F Daini-ueno BLDG. 3-7-18 Shinyokohama Kohokuku, Yokohama, 222-0033 TEL: 81-45-4781881 FAX: 81-45-4781800 Unit 9-15, 22F, Millennium City, No. 378 Kwun Tong Rd., Kowloon, Hong Kong TEL: 852-27513100 FAX: 852-27552064 Please note that all data and specifications are subject to change without notice. All the trademarks of products and companies mentioned in this datasheet belong to their respective owners. - 22 -