I1610PI - Winbond Electronics

Publication Release Date: November 4, 2004

- 1 - Revision 1

ISD1600 SERIES

SINGLE-MESSAGE

SINGLE-CHIP

6.6- TO 40-SECOND DURATION

VOICE RECORD/PLAYBACK DEVICE

ISD1600 SERIES

- 2 -

1. GENERAL DESCRIPTION

Winbond’s ISD1600 Series ChipCorder® is a single-message, single chip, record/playback solution

with selectable durations from 6.6 to 40 seconds. The CMOS device includes an on-chip oscillator (via

external control), microphone preamplifier, automatic gain control, anti-aliasing filter, Multi-Level

Storage (MLS) array, smoothing filter, PWM Class D speaker amplifier for standard 8Ω speaker or

buzzer, plus an extra current output. Recording is stored into the embedded Flash memory cells,

providing zero-power message storage. This unique single-chip solution ultilizes Winbond’s patented

MLS technology. Therefore, voice or audio data are stored directly into the memory in their natural

form without any compressions alike digital approach, providing high-quality, solid-state audio

reproduction. The device enters into standby mode automatically once an operation is completed for

power saving purposes.

Moreover, a minimum record/playback subsystem can be configured with a microphone, a speaker or

buzzer, several passive components, two push buttons, and a power source.

2. FEATURES

• User-friendly single-chip, single-message voice record/playback solution

• Wide operating voltage range: 2.4V to 5.5V

• Push-button interface

o Playback is either edge- or level-triggered

o Record is level-triggered

• Variable duration selected by external oscillator resistor

Sample Rate 12 KHz 8 KHz 6.4 KHz 5.3 KHz 4 HKz

Rosc 60 kΩ 80 kΩ 100 kΩ 120 kΩ 160 kΩ

ISD1610 6.6 secs 10 secs 12.5 secs 15 secs 20 secs

ISD1612 8 secs 12 secs 15 secs 18 secs 24 secs

ISD1616 10.6 secs 16 secs 20 secs 24 secs 32 secs

ISD1620 13.3 secs 20 secs 25 secs 30 secs 40 secs

• Automatic power-down mode

o Enters standby mode immediately after a record or playback cycle

o 1µA standby current (maximum) at room temperature

• PWM Class D speaker amplifier and AUD output driver simultaneously

o Direct drive an 8 speaker or typical buzzer

o AUD current output to drive external power transistor

• High-quality, natural voice/audio reproduction

• Zero-power message storage

o Eliminates battery backup circuits

• 100-year message retention (typical)

• 10,000 record cycles (typical)

• On-chip oscillator

• Available in die, 16L 150mil SOIC and 16L 300mil PDIP

• Temperature options:

o Commercial: 0°C to +50°C (Die); 0°C to +70°C (Packaged)

o Industrial: -40°C to +85°C (Packaged)

ISD1600 SERIES

Publication Release Date: November 4, 2004

- 3 - Revision 1

3. BLOCK DIAGRAM

Internal

Clock Timing

Nonvolatile

Multilevel Storage

Array

Analog Transceivers

Decoders

Device Control

Power Conditioning

Automatic

Gain Control

(AGC)

Active

Antialiasing Filter

Active

Smoothing Filter Amp

AGC

Amp

Sampling Clock

SP+

SP-

LEDPLAYL

PLAYEREC

VCCA VSSA

AGC

MIC-

MIC+

ROSC

AUD

Amp

VCCD

VSSD

VSSAD

ISD1600 SERIES

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4. TABLE OF CONTENTS

1. GENERAL DESCRIPTION.................................................................................................................. 2

2. FEATURES ......................................................................................................................................... 2

3. BLOCK DIAGRAM .............................................................................................................................. 3

4. TABLE OF CONTENTS ...................................................................................................................... 4

5. PIN CONFIGURATION ....................................................................................................................... 5

6. PIN DESCRIPTION............................................................................................................................. 6

7. FUNCTIONAL DESCRIPTION............................................................................................................ 8

7.1. Detailed Description.................................................................................................................. 8

8. TIMING DIAGRAMS.......................................................................................................................... 10

9. ABSOLUTE MAXIMUM RATINGS [1] ................................................................................................ 12

9.1 Operating Conditions ............................................................................................................... 13

10. ELECTRICAL CHARACTERISTICS ............................................................................................... 14

10.1. DC Parameters...................................................................................................................... 14

10.2. AC Parameters...................................................................................................................... 15

11. TYPICAL APPLICATION CIRCUIT.................................................................................................16

12. PACKAGE DRAWING AND DIMENSIONS .................................................................................... 17

12.1. 16-Lead 150mil Small Outline IC (SOIC) Package.......................................................... 17

12.2. 16-Lead 300mil Plastic Dual Inline Package (PDIP) ....................................................... 18

12.3. Die Physical Layout .............................................................................................................. 19

13. ORDERING INFORMATION........................................................................................................... 20

14. VERSION HISTORY ....................................................................................................................... 21

ISD1600 SERIES

Publication Release Date: November 4, 2004

- 5 - Revision 1

5. PIN CONFIGURATION

SOIC / PDIP

VSSD

REC

PLAYE

PLAYL

AGC

VCCD

ROSC

Sp+

VSSA

VCCA

LED

MIC-

MIC+

I1600

VSSAD

SP-

AUD

ISD1600 SERIES

- 6 -

6. PIN DESCRIPTION

SOIC / PDIP PIN NAME

PIN NO.

FUNCTIONS

VSSD, VSSA,

VSSAD

1, 5, 9 Ground: VSSD is the ground for digital circuits. VSSA is the

ground for analog circuits, whereas VSSAD is the ground for

PWM speaker driver. They should be separate ground paths

connecting to ground of power supply to minimize noises.

REC [1] 2

Record: The device starts recording whenever REC transits

from HIGH to LOW and stays at LOW. Recording stops

when the signal returns to HIGH. This pin has an internal

pull-up device[2].

PLAYE [1] 3

Edge-trigger Playback: A playback operation starts when

this input detects a LOW going signal exceeding the

specified debounced time. This pin has an internal pull-up

device[2].

PLAYL [1] 4

Level-trigger Playback: A playback operation begins when

this input detects a LOW going signal and remains at LOW.

Playback stops when the signal returns to HIGH. This pin

has an internal pull-up device[2].

MIC+ 6

Microphone Positive Input: The input transfers the signals

to the preamplifier. The internal Automatic Gain Control

(AGC) circuit controls the gain of the preamplifier. An

external microphone should be AC coupled to this pin via a

series capacitor. The capacitor value, together with an

internal 10 K resistance on this pin, determines the low-

frequency cutoff for the ISD1600 passband.

MIC- 7

Microphone Negative Input: This is the inverting input to

the microphone preamplifier. It provides input noise-

cancellation, or common-mode rejection, when the

microphone is connected differentially to the device.

SP- 8

Speaker Negative : The SP-, Class D PWM output, provide

a differential output with SP+ pin to drive 8 speaker or

buzzer. During power down or recording, this pin is tri-

stated.

VCCA, VCCD 10, 15

Supply Voltages: Internal analog and digital circuits use

separate power busses to minimize noises inside the chip.

These power busses are brought out to separate pads and

should be tied together as close to the power supply as

possible. It is important that the power supplies are

decoupled as close as possible to the device.

SP+ 11

Speaker Positive : The SP+, Class D PWM output, provide

a differential output with SP- pin to drive an 8 speaker or

buzzer directly. During power down or recording, this pin is

tri-stated.

ISD1600 SERIES

Publication Release Date: November 4, 2004

- 7 - Revision 1

SOIC / PDIP PIN NAME

PIN NO.

FUNCTIONS

AGC 12

Automatic Gain Control: The AGC dynamically adjusts the

gain of the preamplifier to compensate the wide range of

microphone input levels. The AGC allows the full range of

signal to be recorded with minimal distortion. Nominal

values of 4.7 µF give satisfactory results in most cases.

Connecting this pin to ground provides maximum gain to the

preamplifier circuitry. Conversely, connecting this pin to

power supply provides minimum gain to the preamplifier

circuitry.

AUD 13

AUD: The AUD provides a single-ended current output to

drive an external amplifier. During standby or recording, this

pin is tri-stated.

ROSC 14

Oscillator Resistor: This enables the user to vary the

record and/or playback duration of the device. A resistor

connected between the ROSC pin and VSS determines the

sample frequency for the ISD1600 device. Please refer to

the Duration Section in Section 7.1.

16 : This output is LOW during a record cycle and blinks

during playback cycle. It can be used to drive an LED to

indicate either a record or playback cycle is in progress.

Note:

[1] The REC and Play signal are internally debounced on the falling edge to prevent a false re-triggering

from a push-button switch.

[2] The internal pull-up resistors are 600kΩ (typical).

LED LED

ISD1600 SERIES

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7. FUNCTIONAL DESCRIPTION

7.1. DETAILED DESCRIPTION

Audio Quality

Winbond’s patented ChipCorder® MLS technology provides natural high quality record and playback

solution on a single chip. The input audio signals are stored directly into the non-volatile memory and

are reproduced in its natural form without any compression artifacts caused by the digital speech

solutions. A complete sample is stored in a single cell, minimizing the memory needed to store a

single message.

Duration

The ISD1600 series offer single-chip solution with record/playback duration from 6.6 seconds to 40

seconds. Sampling rate and duration are determined by an external resistor connected to the Rosc

pin.

Sample Rate Rosc ISD1610 ISD1612 ISD1616 ISD1620

12 KHz 60 kΩ 6.6 secs 8 secs 10.6 secs 13.3 secs

8 KHz 80 kΩ 10 secs 12 secs 16 secs 20 secs

6.4 KHz 100 kΩ 12.5 secs 15 secs 20 secs 25 secs

5.3 KHz 120 kΩ 15 secs 18 secs 24 secs 30 secs

4 KHz 160 kΩ 20 secs 24 secs 32 secs 40 secs

Flash Storage

The ISD1600 product utilizes the on-chip Flash memory providing zero-power message storage. The

message is retained for up to 100 years without power. In addition, the device can be re-recorded

typically over 10,000 times.

Basic Operation

The ISD1600 ChipCorder® device is controlled by either the REC pin, or one of the two playback

modes, PLAYE and PLAYL. The ISD1600 parts are configured for design simplicity in a single-

message application. Device operation is explained in Section 7.2.

Automatic Power-Down Mode

At the end of a playback or record cycle, the ISD1600 device automatically enters into a low-power

standby mode, consuming typically 0.5µA, provided that PLAY and REC pins are HIGH (see DC

parameters, Section 10). During a playback cycle, the device powers down automatically at the end of

the message. During a record cycle, the device powers down immediately after REC is released to

HIGH.

ISD1600 SERIES

Publication Release Date: November 4, 2004

- 9 - Revision 1

7.2. Functional Description Example

The following example operating sequences demonstrate the functionality of the ISD1600 series.

1. Record a message

The device starts recording from the beginning of the memory when REC transits from HIGH to LOW

and stays at LOW. A record cycle is completed when REC is pulled to HIGH or entire memory is filled

up. Then an End-of-Message (EOM) marker is written at the end of message, enabling a subsequent

playback cycle to terminate appropriately. Hence, the device automatically enters into standby mode.

REC takes precedence over any playback operations. If REC is pulled LOW during a playback cycle,

the playback immediately halts and recording starts from the beginning of the memory.

The REC pin has an internal pull-up device[2]. Holding this pin LOW after recording cycle will increase

standby current consumption.

2. Edge-trigger playback

A playback operation starts from the beginning of the memory when PLAYE detects a LOW going

signal exceeding the specified debounced time. Playback continues until an EOM marker is

encountered. Upon completion of a playback cycle, the device automatically powers down and enters

into standby mode.

During playback, a subsequent LOW going signal will terminate the current playback operation.

This pin has an internal pull-up device[2]. Holding this pin LOW after playback operation will increase

standby current consumption.

3. Level- trigger playback

When PLAYL switches from HIGH to LOW and stays at LOW, a playback starts from the beginning of

the memory until either an EOM marker is reached, then it automatically powers down.

If PLAYL is pulled HIGH any time during playback, the playback operation stops immediately and the

device enters into the power-down mode.

4. LED operation

The output pin provides an active-LOW signal during recording, which is used to turn on an LED

as a “record-in-progress” indicator. However, during playback, the LED blinks a few times per second

to indicate a “playback-in-progress” operation. It returns to a HIGH state when operation stops.

5. ROSC operation

The duration of the device can be varied by changing the value of ROSC. This means the designer has

the flexibility to choose different sampling frequency, up to 12 KHz, depending upon the needs.

This feature allows frequency shifting where a recorded audio can be played back faster or slower

than normal for special sound effects.

Another feature is a “Pause” function that can be activated by taking the ROSC resistor to VCC to stop

playback momentarily, and to resume when the resistor is switched back to ground.

LED

ISD1600 SERIES

- 10 -

8. TIMING DIAGRAMS

Rec

LED

Mic+

Mic-

TfTr

TDb1

TRS

FIGURE 1: RECORD OPERATION

ISD1600 SERIES

Publication Release Date: November 4, 2004

- 11 - Revision 1

Sp+

Sp-

TRU

TPS1 or TPS2

LED

PlayL

TDb2

Odd # pulses starts playback

Tcyc Tr

TDb1

PlayE

Even # pulses stops playback

TDb1

Aud

TRU

Ramps up gradually to analog ground

to eliminate the "pop" at the beginning

TPS1 or TPS2

Slowly returns to analog ground

to eliminate the "pop" at the end

FIGURE 2: PLAYBACK OPERATION

ISD1600 SERIES

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9. ABSOLUTE MAXIMUM RATINGS [1]

ABSOLUTE MAXIMUM RATINGS (DIE)

CONDITIONS VALUES

Junction temperature 150°C

Storage temperature range -65°C to +150°C

Voltage applied to any pins (VSS –0.3V) to (VDD +0.3V)

Power supply voltage to ground potential -0.3V to +7.0V

ABSOLUTE MAXIMUM RATINGS (PACKAGED PARTS)

CONDITIONS VALUES

Junction temperature 150°C

Storage temperature range -65°C to +150°C

Voltage applied to any pins (VSS –0.3V) to (VDD +0.3V)

Lead temperature (Soldering – 10 sec) 300°C

Power supply voltage to ground potential -0.3V to +7.0V

[1] Stresses above those listed may cause permanent damage to the device. Exposure to the

absolute maximum ratings may affect device reliability and performance. Functional operation is

not implied at these conditions.

ISD1600 SERIES

Publication Release Date: November 4, 2004

- 13 - Revision 1

9.1 OPERATING CONDITIONS

OPERATING CONDITIONS (DIE)

CONDITIONS VALUES

Operating temperature range 0°C to +50°C

Supply voltage (VDD) [1] +2.4V to +5.5V

Ground voltage (VSS) [2] 0V

Input voltage (VDD) [1] 0V to 5.5V

Voltage applied to any pins (VSS –0.3V) to (VDD +0.3V)

OPERATING CONDITIONS (PACKAGED PARTS)

CONDITIONS VALUES

Operating temperature range (Case temperature) -40°C to +85°C

Supply voltage (VDD) [1] +2.4V to +5.5V

Ground voltage (VSS) [2] 0V

Input voltage (VDD) [1] 0V to 5.5V

Voltage applied to any pins (VSS –0.3V) to (VDD +0.3V)

[1] VDD = VCCA = VCCD

[2] VSS = VSSA = VSSD = VSSAD

ISD1600 SERIES

- 14 -

10. ELECTRICAL CHARACTERISTICS

10.1. DC PARAMETERS

PARAMETER SYMBOL MIN TYP [1] MAX UNITS CONDITIONS

Supply Voltage VDD 2.4 5.5 V

Input Low Voltage VIL V

SS-0.3 0.3xVDD V

Input High Voltage VIH 0.7xVDD V

DD V

Output Low Voltage VOL V

SS-0.3 0.3xVDD V IOL = 4.0 mA[2]

Output High Voltage VOH 0.7xVDD V

DD V IOH = -1.6 mA[2]

Record Current IDD_Record 20 mA

Playback Current IDD_Playback 20 mA

VDD = 5.5V, No load,

Sampling freq = 12 kHz

Standby Current ISB 0.5 1 µA

VDD = 5.5V, T=25°C [3] [4] [7]

Input Leakage Current IILPD1

±1 µA Force VDD

[5]

Input Current HIGH IILPD2 -3 -10 µA Force VSS

[5]

Preamp Input Resistance RMIC+,RMIC- 20 K Across both pins

MIC Input Voltage VIN 15 300 mV Peak-to-Peak[6]

Gain from MIC to SP+/- AMSP 6 40 dB VIN = 15 to 300mV,

AGC = 4.7µF,

VDD = 2.4V to 5.5V

Output Load Impedance REXT 8  Speaker Load

670 mW

VDD = 5.5V

313 mW

VDD = 4.4V

117 mW

VDD= 3V

Speaker Output Power Pout

49 mW

VDD= 2.4V

15mVp-p

1kHz freq

sinewave,

REXT = 8;

Speaker Output Voltage Vout VDD V

REXT = 8 (Speaker),

70mH-160 (Buzzer)

AUD IAUD -3.0 mA VDD =4.5V, REXT= 100

Total Harmonic Distortion THD 1 % 15mV p-p 1KHz sinewave,

Cmessage weighted

Notes:

[1] Conditions: VCC = 4.5V, 8kHz sampling frequency and TA = 25°C, unless otherwise stated.

[2] LED output during Record operation.

[3] V

CCA and VCCD are connected together. VSSA, VSSAD and VSSD are connected together.

[4] REC, PLAYL, PLAYE must be at VCCD.

[5] REC, PLAYL and PLAYE are forced to specified condition.

[6] Balanced input signal applied between MIC and MIC REF as shown in the applications example. Single-

ended MIC or MIC REF recommended to be less than 100 mV peak to peak.

[7] For industrial grade, the maximum limit is 10µA.

ISD1600 SERIES

Publication Release Date: November 4, 2004

- 15 - Revision 1

10.2. AC PARAMETERS

CHARACTERISTIC SYMBOL MIN TYP [1] MAX UNITS CONDITIONS

Sampling Frequency [2] F

S 4 12 KHz Vcc=2.4V~5.5V

I1610 I1612 I1616 I1620

6.6 8 10.6 13.3 Sec SF=12kHz

10 12 16 20 Sec SF=8kHz

12.5 15 20 25 Sec SF=6.4kHz

15 18 24 30 Sec SF=5.3kHz

Duration [3] Dur

20 24 32 40 Sec SF=4kHz

Vcc=2.4

V~5.5V

Rising time Tr 0 100 nsec

Falling Time Tf 0 100 nsec

26.6 26.6 26.6 26.6 msec SF=12kHz

40 40 40 40 msec SF=8kHz

50 50 50 50 msec SF=6.4kHz

60.4 60.4 60.4 60.4 msec SF=5.3kHz

Debounce Time

(Record & PlayL)

TDb1

80 80 80 80 msec SF=4kHz

Vcc=2.4

V~5.5V

13.3 13.3 13.3 13.3 msec SF=12kHz

20 20 20 20 msec SF=8kHz

25 25 25 25 msec SF=6.4kHz

30.2 30.2 30.2 30.2 msec SF=5.3kHz

Debounce Time

(PlayE)

TDb2

40 40 40 40 msec SF=4kHz

Vcc=2.4

V~5.5V

Signal Ramp Up Time TRU 100 msec Vcc=2.4V~5.5V

Record Stop Time TRS 2 Sample Clock Vcc=2.4V~5.5V

PlayL Stop Time TPS1 T

Db1 msec Vcc=2.4V~5.5V

PlayE Stop Time TPS2 2 X TDb1 msec Vcc=2.4V~5.5V

LED Cycle frequency TCyc 1 6 Hz Playback at any SF

Notes:

[1] Typical values : VCC = 4.5V, SF = 8 kHz and @ TA = 25°C, unless otherwise stated.

[2] Sampling Frequency can vary as much as ±2.25 percent over the commercial temperature and voltage

ranges, and –6/+4 percent over the industrial temperature and voltage ranges.

[6] Duration can vary as much as ±2.25 percent over the commercial temperature and voltage ranges, and –

6/+4 percent over the industrial temperature and voltage ranges.

ISD1600 SERIES

- 16 -

11. TYPICAL APPLICATION CIRCUIT

I1800

ROSC

VCCD

VCCA

VSSD

VSSA

AUD

SP+

MIC+

MIC -

AGC

PLAYL

PLAYE

REC

LED

1 K

4.7 F

0.1 F

4.7 F

0.1 F

4.7 K Ω

ELECTRET

MICROPHONE

1 KΩ

RECORD

PLAYE

PLAYL

LED

1600

4.7 K Ω

VCC

Ω

SP-

VSSAD

390 Ω0.1 F

VCC

8050

Speaker or

Buzzer

80 K ΩC9 *

C8 *

0.1 F

10 F

Speaker

Ω

VCCA

VCCD

VCC

VSS

VSSD

VSSA

VSSAD

Schematic shows both speaker and AUD outputs

* C8 and C9 may be needed in order to optimize for the best voice quality, which is also depended upon the layout

of the PCB. Please refer to ChipCorder Applications section or consult Winbond for layout advice.

The above example represents a typical implementation of ISD1600 in most applications.

In addition, it is important to have a separate path for each ground (VSSD, VSSA & VSSAD) back to the

ground terminal of power source to minimize the noises. Please refer to the ChipCorder Applications

section in our website.

Good Audio Design Practices

Winbond products are very high-quality single-chip voice recording and playback systems. To ensure

the highest quality voice reproduction, it is important that good audio design practices on layout and

power supply decoupling be followed. See Application Information or below links for details.

Good Audio Design Practices

http://www.winbond-usa.com/products/isd_products/chipcorder/applicationinfo/apin11.pdf

Single-Chip Board Layout Diagrams

http://www.winbond-usa.com/products/isd_products/chipcorder/applicationinfo/apin12.pdf

ISD1600 SERIES

Publication Release Date: November 4, 2004

- 17 - Revision 1

12. PACKAGE DRAWING AND DIMENSIONS

12.1. 16-LEAD 150MIL SMALL OUTLINE IC (SOIC) PACKAGE

ISD1600 SERIES

- 18 -

12.2. 16-Lead 300mil Plastic Dual Inline Package (PDIP)

ISD1600 SERIES

Publication Release Date: November 4, 2004

- 19 - Revision 1

12.3. DIE PHYSICAL LAYOUT

ISD1610 / 1612 / 1616 / 1620

Notes:

[1] The backside of die is internally connected to VSS. It MUST NOT be connected to any other potential or damage may occur.

VSSA

MIC+

MIC-

SP-

SP+

VSSAD

VCCA

AGC

AUD

PLAYL

VCCD

ROSC

VSSD

LED

PLAYE

REC

ISD1600 SERIES

- 20 -

13. ORDERING INFORMATION

Product Number Descriptor Key

When ordering, please refer to the following part numbers that are supported in volume for this

product series. Consult the local Winbond Sales Representative or Distributor for availability

information.

Die / Package Ordering Part Number

Die I1610X I1612X I1616X I1620X

I1610P I1612P I1616P I1620P PDIP

I1610PI I1612PI I1616PI I1620PI

I1610S I1612S I1616S I1620S SOIC

I1610SI I1612SI I1616SI I1620SI

For the latest product information, access Winbond’s worldwide website at

http://www.winbond-usa.com

I16xxxx

I1600 Series

Duration:

I1610 : 6.6 – 20 secs

I1612 : 8 – 24 secs

I1616 : 10.6 – 30 secs

I1620 : 13.3 – 40 secs Package Type:

X = Die

S = Small Outline Integrated Circuit

(SOIC) Package

P = Plastic Dual Inline Package (PDIP)

Temperature:

I = Industrial (-40°C to +85°C)

Blank = Commerical

• Die (0°C to +50°C)

• Package (0°C to +70°C)

ISD1600 SERIES

Publication Release Date: November 4, 2004

- 21 - Revision 1

14. VERSION HISTORY

VERSION DATE DESCRIPTION

0.1 July 2004

Initial draft

1 Nov. 2004

Revise Ground description

Revise application diagram

Revise die information

ISD1600 SERIES

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Headquarters Winbond Electronics Corporation America Winbond Electronics (Shanghai) Ltd.

No. 4, Creation Rd. III 2727 North First Street, San Jose, 27F, 299 Yan An W. Rd. Shanghai,

Science-Based Industrial Park, CA 95134, U.S.A. 200336 China

Hsinchu, Taiwan TEL: 1-408-9436666 TEL: 86-21-62365999

TEL: 886-3-5770066 FAX: 1-408-5441797 FAX: 86-21-62356998

FAX: 886-3-5665577 http://www.winbond-usa.com/

http://www.winbond.com.tw/

Taipei Office Winbond Electronics Corporation Japan Winbond Electronics (H.K.) Ltd.

9F, No. 480, Pueiguang Rd. 7F Daini-ueno BLDG. 3-7-18 Unit 9-15, 22F, Millennium City,

Neihu District Shinyokohama Kohokuku, No. 378 Kwun Tong Rd.,

Taipei, 114 Taiwan Yokohama, 222-0033 Kowloon, Hong Kong

TEL: 886-2-81777168 TEL: 81-45-4781881 TEL: 852-27513100

FAX: 886-2-87153579 FAX: 81-45-4781800 FAX: 852-27552064

Please note that all data and specifications are subject to change without notice.

All the trademarks of products and companies mentioned in this datasheet belong to their respective owners.

The contents of this document are provided only as a guide for the applications of Winbond products. Winbond

makes no representation or warranties with respect to the accuracy or completeness of the contents of this

publication and reserves the right to discontinue or make changes to specifications and product descriptions at

any time without notice. No license, whether express or implied, to any intellectual property or other right o

Winbond or others is granted by this publication. Except as set forth in Winbond's Standard Terms and

Conditions of Sale, Winbond assumes no liability whatsoever and disclaims any express or implied warranty o

merchantability, fitness for a particular purpose or infringement of any Intellectual property.

Winbond products are not designed, intended, authorized or warranted for use as components in systems o

equipments intended for surgical implantation, atomic energy control instruments, airplane or spaceship

instruments, transportation instruments, traffic signal instruments, combustion control instruments, or for othe

applications intended to support or sustain life. Furthermore, Winbond products are not intended for applications

wherein failure of Winbond products could result or lead to a situation wherein personal injury, death or severe

property or environmental injury could occur.

pplication examples and alternative uses of any integrated circuit contained in this publication are for illustration

only and Winbond makes no representation or warranty that such applications shall be suitable for the use

specified.

The 100-year retention and 10K record cycle projections are based upon accelerated reliability tests, as published

in the Winbond Reliability Report, and are neither warranted nor guaranteed by Winbond. This product

incorporates SuperFlash® technology.

Information contained in this Winbond ChipCorder® datasheet supersedes all data for the ISD® ChipCorder®

products published by ISD® prior to August, 1998.

This datasheet and any future addendum to this data sheet is(are) the complete and controlling ISD® ChipCorder®

product specifications. In the event any inconsistencies exist between the information in this and other product

documentation, or in the event that other product documentation contains information in addition to the information

in this, the information contained herein supersedes and governs such other information in its entirety.

trademarks of Winbond Electronics Corporation. SuperFlash®is the trademark of Silicon Storage Technology, Inc.

ll other trademarks are properties of their respective owners.