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©2008 by RF Monolithics, Inc. DM1810-434MB - 4/17/08
DM1810-
434MB
Rating Value Units
All Input/Output Pins Except VIN -0.3 to +3.3 V
Non-Operating Ambient Temperature Range -40 to 85 oC
Absolute Maximum Ratings
Electrical Characteristics
Characteristic Sym Notes Minimum Typical Maximum Units
Operating Frequency fO433.72 434.12 MHz
Modulation Type OOK
RF Encoded Data Transmission Rate 4.8 kb/s
Average Receive Input Current, No External Power Supply Load IR5.5 mA
Receiver Input Signal for 10-3 BER, 25 °C-101.5 dBm
Average Transmit Input Current, No External Power Supply Load ITA 15.75 mA
Peak Transmit Input Current, No External Power Supply Load ITP 28.5 mA
Peak Transmitter Output Power PO10 mW
Bind Input and Serial RX Logic High 2.4 V
Bind Input and Serial RX Logic Low 0.45 V
Serial TX Logic High, No Load 2.4 V
Serial TX Logic Low, No Load 0.3 V
Serial Port Data Rate 9.6 kb/s
Average Sleep Input Current, No External Power Supply Load ISA 60 µA
Power Supply Input Voltage Range, -40 to +85 oC VIN 3.1 10 V
Power Supply Input Voltage Range, 0 to +85 oC VIN 2.6 10 V
Regulated Power Supply Output Voltage, VIN 3.1 to 10 V VOUT 3.0 Vdc
Regulated Power Supply Voltage Ripple 10 mVP-P
Relative Humidity Range, Non-Condensing RH 10 90 %
433.92 MHz
Transceiver
Module
The DM1810-434MB is the 433.92 MHz base station module in the DM1810 family of RF transceiv-
ers. The DM1810 family is designed for adding wireless mesh network connectivity to a wide range
of monitoring and control systems. The DM1810-434MB is equipped with a serial I/O port to inter-
face a host microcontroller. Radio communications range in an “open field” environment is typically
600 meters/hop. The DM1810-434MB combines RFM’s very low current ASH radio technology with
low power microcontroller technology to achieve long battery life. This module is compatible with
RFM miniMESHTM network protocol, which provides “plug- and-play” multicast mesh network rout-
ing. The DM1810-434MB is certified for operation under ETSI I-ETS 300 220 regulations.
•Base Station with Host Serial Interface
•Compatible with RFM miniMESHTM Network Protocol
•3 V, Very Low Current Operation
•Ready-to-Use OEM Module
DEVELOPMENT KIT
(Info Click here)
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©2008 by RF Monolithics, Inc. DM1810-434MB - 4/17/08
Theory of Operation
The major components of the DM1810- 433.92MB
include an RFM TR7000 ASH transceiver and a Micro-
chip PIC16F689 microcontroller. The TR7000 oper-
ates on a frequency of 433.92 MHz, at a nominal
output power of 10 mW.
The 16F689 provides a 9.6 kb/s serial interface for
communication with a host microcontroller. A compan-
ion interface board, the IM1800, is also available with
USB bridge circuitry to interface the DM1810 to a host
PC.
The DM1810-434MB includes two LEDs that indicate
the module’s operating mode.
The DM1810-434MB firmware is based on RFM’s
miniMESH network protocol, which utilizes time-
synchronized redundant routing to provide robust,
deterministic packet delivery though a network with up
to 15 routers. Network configuration and maintenance
features are built into the miniMESH protocol, simplify-
ing commissioning and operating logistics. The firm-
ware also includes several sleep cycling methods for
extended battery life operation.
Please refer to the DM1810 User’s Guide and the
AN1810 series Application Notes for installation and
application programming information. See the RFM
web site at www.RFM.com.
TXM O D
RX DATA
CNTRL1
CNTRL0
PIC
16F689
µP
D M 1810-434M B B lock D iagram
LED 1
LED 2
TR 7000
ASH
Transceiver
GND
SERIAL TX
SERIAL RX
BIND
GND
VOUT
VIN
3 V
Reg
GND
GND
J1-1
J1-2
J1-3
J1-4
J1-5
J1-6
J1-7
J1-8
J1-9
J1-10
J3-2
J3-1
J3-3
RSSI
J4-1
J4-2
D1
D2
Figure 1
Pin Name Description
J1-1 GND This pad is a signal and power supply ground.
J1-2 VIN This is the power supply input pad. The allowed input voltage range is 2.6 to 10 V.
J1-3 VOUT
VOUT tracks 50 to 100 mV below VIN when VIN is in the range of 2.6 to 3.1 V. When VIN is in the range of 3.1
to 10 V, VOUT is regulated at 3.0 Vdc. Up to 10 mA can be supplied from this pad for powering external circuits
such as thermistor-resistor networks. External circuitry must not impress more than 10 mVp-p ripple on the regu-
lated output voltage.
J1-4 BIND
This pad is connected to a logic input on the microcontroller, and is configured with a weak pull-up. When this
pin is momentarily grounded to J1-1 or J1-10, the module is placed into the bind mode, allowing this module to
be associated with other modules to form a network.
J1-5 - This pad is unused in base station operation. Leave this pad electrically unconnected.
J1-6 - This pad is unused in base station operation. Leave this pad electrically unconnected.
J1-7 - This pad is unused in base station operation. Leave this pad electrically unconnected.
J1-8 SERIAL RX
This pad is connected to the module’s serial data input (USART). Data to this pin is received at 9.6 kb/s, using
8 data bits, no parity, and one stop bit. The input voltage range on this pad is 0 to VOUT. Applying a voltage
outside of this range may damage the module.
J1-9 SERIAL TX This pad is connected to the module’s serial data output (USART) through a 1 kilohm resistor, which provides
short-circuit protection. Data from this pad is sent at 9.6 kb/s, using 8 data bits, no parity, and one stop bit.
J1-10 GND This pad is a signal and power supply ground.
J3-1 GND This pad is a ground for the antenna port.
J3-2 ANT This pad is the antenna port.
J3-3 GND This pad is a ground for the antenna port.
J4-1 D1 This pad is the LED 1 signal.
J4-2 D2 This pad is the LED 2 signal.
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©2008 by RF Monolithics, Inc. DM1810-434MB - 4/17/08
DM1810-434MB I/O Pad Descriptions
CAUTION: Electrostatic Sensitive Device. Observe precautions when handling.
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©2008 by RF Monolithics, Inc. DM1810-434MB - 4/17/08
D M 1810-434M B I/O P ad Labels
SERIA L TX
SERIAL RX
GND
BIND
VOUT
VIN
GND
GND
RFIO
GND
D1
D2
Figure 2
1.485
DM 1810-434M B SM T M ounting Pattern
1.000
.1 3 0 .0 9 0.0 9 0
.2 0 0 .2 0 0
.070 TY P
Dim ensions in inches. PCB plus com ponent height is .170 m ax;
PC B plus antenna height is 2.15 m ax
.100 TY P
.1 2 0 .1 8 0
.1 0 0
.1 2 0
.0 9 5
P la c e .1 0 0 u n p la te d
antenna clearance hole
u n d e r a n te n n a p a d (d o
not solder antenna pad)
Figure 3
Note: Specifications subject to change without notice.
