DEVELOPMENT KIT (Info Click here) ZMN2405HP * 2.4 GHz ZigBee Transceiver Module * Small Size, Light Weight, +18 dBm Transmitter Power * Sleep Current less than 3 A * FCC and ETSI Certified for Unlicensed Operation The ZMN2405HP 2.4 GHz transceiver module is a low cost, high-power solution for point-to-point, point-to-multipoint and MESH wireless systems. The ZMN2405HP module provides the flexibility and versatility to serve applications ranging from cable replacements to sensor networks. Based on the IEEE 802.15.4 wireless standard and the ZigBee protocol stack, the ZMN2405HP module is easy to integrate and provides robust wireless communications including MESH network operation. The ZMN2405HP includes RFM's powerful CSM application profile, which eliminates the need for customer firmware programming. High Power ZigBee Module ZMN2405HP Absolute Maximum Ratings Rating All Input/Output Pins Value -0.3 to +3.6 Non-Operating Ambient Temperature Range -40 to +85 Units V o Shown with Shield Removed C ZMN2405HP Electrical Characteristics Characteristic Sym Notes Minimum Operating Frequency Range 2405 Operating Frequency Tolerance -300 Spread Spectrum Method Typical Maximum Units 2475 MHz 300 kHz Direct Sequence Modulation Type O-QPSK Number of RF Channels 15 RF Data Transmission Rate 250 Symbol Rate Tolerance kb/s 120 RF Channel Spacing ppm 5 MHz Receiver Sensitivity, 10E-5 BER -95 dBm Upper Adjacent Channel Rejection, +5 MHz 41 dB Lower Adjacent Channel Rejection, -5 MHz 30 dB Upper Alternate Channel Rejection, +10 MHz 55 dB Lower Alternate Channel Rejection, -10 MHz 53 dB Maximum RF Transmit Power 16 17 Transmit Power Adjustment Optimum Antenna Impedance www.RFM.com E-mail: info@rfm.com (c)2008 by RF Monolithics, Inc. 50 18 dBm 20 dB Page 1 of 6 ZMN2405HP- 5/20/08 ZMN2405HP Electrical Characteristics Maximum Units ADC Input Range Characteristic Sym Notes Minimum 0 Typical 3.3 V ADC Input Resolution 7 12 bits ADC Input Impedance 55 M PWM Output Resolution UART Baud Rate 1.2 12 bits 115.2 kb/s Digital I/O: Logic Low Input Level -0.3 0.5 V Logic High Input Level 2.8 3.6 V Logic Input Internal Pull-up/Pull-down Resistor 20 20 mA +5.5 Vdc 10 mVP-P K GPIO3 Logic Low Sink Current Power Supply Voltage Range VCC +3.3 Power Supply Voltage Ripple Receive Mode Current 33 mA Transmit Mode Current 130 mA Sleep Mode Current Operating Temperature Range 3 -40 85 A o C ZMN2405HP Firmware Configurations ZMN2405HP modules are shipped loaded with one of three firmware configurations: coordinator, router or end node. Each ZigBee network will include one, and only one coordinator. This module coordinates the overall network operation and is the host application or gateway interface point for the network. The part number designation for a coordinator is ZMN2405HP-C. Router modules are capable of retransmitting messages and provide the mesh networking infrastructure in a ZigBee network. The part number designation for a router is ZMN2405HP-R. End node modules provide field connection points for sensors, data loggers, PLCs, etc. The coordinator and the routers in a ZigBee network must stay active (awake) continuously to support network operation. End nodes can be sleep duty cycled where needed for extended battery life operation. The part number designation for an end node is ZMN2405HP-E. A router can provide the same field connection support as an end node, but a router cannot be sleep duty cycled without affecting mesh network operation. Specify the number of modules for each firmware configuration when ordering ZMN2405HP modules. CAUTION: Electrostatic Sensitive Device. Observe precautions when handling. www.RFM.com E-mail: info@rfm.com (c)2008 by RF Monolithics, Inc. Page 2 of 6 ZMN2405HP- 5/20/08 Z M N 2 4 0 5 H P B lo c k D ia g r a m + 3 .3 V V C C 3 2 M H z 2 P W M A 3 P W M B 4 5 G P IO 1 6 G P IO 2 7 + 3 .3 V 3 9 G P IO 3 8 G P IO 4 9 G P IO 5 1 0 G N D 1 1 L IN K /T D O 1 2 /R E S E T 1 3 A C T /T C K 1 4 N C 1 5 R E F F ilte r F ilte r P W R G P IO 0 A D C 3 2 .7 6 8 k H z R e g 1 G N D C C 8 0 2 R a d M ic r o c 2 4 .1 io o n T X /R X C o m b in e r 3 0 5 .4 a n d tr o lle r T /R + 3 .3 V T /R F ilte r 3 8 3 7 R F IO P R E 1 6 3 3 3 4 3 5 3 6 N C 3 2 G N D 3 1 G N D 3 0 S P I_ M IS O 2 9 G N D 2 5 S P I_ M O S I 2 8 S P I_ S C L K U A R T _ T X 2 7 S P I_ E N U A R T _ R X 2 6 A D C Z G N D 2 4 G N D G N D 2 3 F ilte r 2 2 A D C X 2 1 N C 2 0 R E S E T 1 9 A D C Y 1 8 F ilte r 1 7 G N D F ilte r G N D Figure 1 ZMN2405HP Hardware ZMN2405HP Firmware The major hardware component of the ZMN2405HP is the CC2430 IEEE 802.15.4 compatible transceiver with integrated 8051 microcontroller. The ZMN2405HP operates in the frequency band of 2405 to 2475 MHz at a nominal output power of 63 mW. The main firmware components in the ZMN2405HP include the ZigBee protocol stack and the RFM's CSM standard module application profile. The ZigBee protocol stack implements networking and security, with underlying support from the 802.15.4 Media Access Control (MAC) layer. The CSM profile provides an application programming interface (API) for all the ZMN2405HP application hardware interfaces. The CSM profile includes Network Discovery, Send/Receive Serial Data, Read/Write SPI Port, Read ADC Inputs, Write DAC Outputs, Read/Write GPIO and Module Configuration services. In addition, the CSM profile provides two sleep modes - timer sleep and interrupt sleep. See the ZMN2405HP ZigBee Module Developer's Kit User's Manual for complete details of the CSM profile API. The ZMN2405HP includes a low noise preamplifier in the receiver path and a power amplifier in the transmitter path, greatly increasing the operating range of the CC2430. Two crystals are provided to operate the CC2430, a 32 MHz crystal for normal operation and a 32.768 kHz crystal for precision sleep mode operation. The ZMN2405HP provides a variety of application hardware interfaces including an SPI interface, UART interface, three 12-bit ADC inputs, two PWM (DAC) outputs, and six general purpose digital I/O ports. www.RFM.com E-mail: info@rfm.com (c)2008 by RF Monolithics, Inc. Page 3 of 6 ZMN2405HP- 5/20/08 ZMN2405HP I/O Pad Descriptions Pad Name Description 1 VCC Power supply input, +3.3 to +5.5 Vdc. 2 GND Power supply and signal ground. Connect to the host circuit board ground. 3 PWMA Pulse-width modulated output A. Provides a DAC function when used with an external low-pass filter. 4 PWMB Pulse-width modulated output B. Provides a DAC function when used with an external low-pass filter. 5 GPIO0 Configurable digital I/O port 0. When configured as an output, the power-on state is also configurable. 6 GPIO1 Configurable digital I/O port 1. When configured as an output, the power-on state is also configurable. 7 GPIO2 Configurable digital I/O port 2. When configured as an output, the power-on state is also configurable. 8 GPIO3 Configurable digital I/O port 3. When configured as an output, this high current port can sink up to 20 mA. The power-on output state is also configurable. 9 GPIO4 Configurable digital I/O port 4. When configured as an output, the power-on state is also configurable. 10 GPIO5 Configurable digital I/O port 5. When configured as an output, the power-on state is also configurable. 11 GND 12 LINK/DD Output signal indicating module's link status in default mode. Also used by JTAG interface as Data Output. 13 /RESET Active low hardware reset. Hold this input low when the power supply is below 2.7 V. In parallel with pad 24. 14 ACT/DC Output signal indicating RF data activity. Also used by JTAG interface as Data Clock Input. 15 NC 16 ADC REF 17 - 20 GND 21 UART_RX Serial data input to UART. 22 UART_TX Serial data output from UART. 23 NC 24 /RESET 25 ADCX 7- to 12-bit ADC input X. ADC full scale can be referenced to +3.3 V supply or internal +2.5 V reference. 26 ADCY 7- to 12-bit ADC input Y. ADC full scale can be referenced to +3.3 V supply or internal +2.5 V reference. 27 ADCZ 7- to 12-bit ADC input Z. ADC full scale can be referenced to +3.3 V supply or internal +2.5 V reference. 28 GND Power supply and signal ground. Connect to the host circuit board ground. 29 SPI_EN 30 SPI_SCLK SPI port clock signal. 31 SPI_MOSI SPI port data output. 32 SPI_MISO SPI port data input. 33-34 GND 35 NC 36 GND Power supply and signal ground. Connect to the host circuit board ground. 37 GND RF ground. Connect to the host circuit board ground plane, and to shield when using coaxial cable. 38 RFIO RF port. Connect the antenna to this port with a 50 stripline or semi-rigid coaxial cable. 39 GND RF ground. Connect to the host circuit board ground plane, and to shield when using coaxial cable. Power supply and signal ground. Connect to the host circuit board ground. No connection. Module's +3.3 V regulated supply, used for ratiometric ADC readings. Current drain on this output should be no greater than 5 mA. Power supply and signal grounds. Connect to the host circuit board ground. No connection. Active low hardware reset. Hold this input low when the power supply is below 2.7 V. In parallel with pad 13. Active-low enable output for SPI bus devices. Power supply and signal ground. Connect to the host circuit board ground. No connection. www.RFM.com E-mail: info@rfm.com (c)2008 by RF Monolithics, Inc. Page 4 of 6 ZMN2405HP- 5/20/08 RFIO Stripline The RFIO pad on the radio module is connected directly to an antenna on the host circuit board, or to an MMCX or similar RF connector. It is important that this connection be implemented as a 50 ohm stripline. Referring to Figure 3, the width of this stripline depends on the thickness of the circuit board between the stripline and the Z M N 2 4 0 5 H P O u tlin e a n d M o u n tin g D im e n s io n s 1 .6 0 0 0 .0 6 0 0 .0 9 0 1 8 0 .5 9 5 0 .1 1 5 0 .3 5 5 0 .0 3 0 S q u a re 0 .1 2 0 0 .0 7 0 1 3 9 3 7 0 .8 3 5 0 .7 9 0 T o p V ie w 3 6 1 9 0 .0 9 5 N o te : L ig h t g r a y p a d s a r e fo r m e c h a n ic a l s ta b ility d u r in g s o ld e r r e flo w m o u n tin g . H o s t P C B s h o u ld h a v e m a tc h in g p a d s w ith n o e le c tr ic a l c o n n e c tio n . Figure 2 groundplane. For FR-4 type circuit board materials (dielectric constant of 4.7), the width of the stripline is equal to 1.75 times the thickness of the circuit board. Note that other circuit board traces should be spaced away from the stripline to prevent signal coupling, as shown in Figure 4. The stripline trace should be kept short to minimize its insertion loss. C ir c u it B o a r d S tr ip lin e T r a c e D e ta il C o p p e r S tr ip lin e T ra c e C o p p e r G ro u n d P la n e F R -4 P C B M a te r ia l F o r 5 0 o h m im p e d a n c e W Figure 3 www.RFM.com E-mail: info@rfm.com (c)2008 by RF Monolithics, Inc. Trace Separation from 50 Ohm Microstrip Length of Trace Run Parallel to Microstrip 100 mil 125 mil 150 mil 200 mil 200 mil 290 mil 250 mil 450 mil 300 mil 650 mil = 1 .7 5 * H Figure 4 Page 5 of 6 ZMN2405HP- 5/20/08 Reflow Profile An example solder reflow profile for mounting the radio module on its host circuit board is shown in Figure 5. Figure 5 Note: Specifications subject to change without notice. www.RFM.com E-mail: info@rfm.com (c)2008 by RF Monolithics, Inc. Page 6 of 6 ZMN2405HP- 5/20/08