32-Macrocell MAX® EPLD
CY7C344B
USE ULTRA37000TM FOR
ALL NEW DESIGNS
Cypress Semiconductor Corporation 3901 North First Street San Jose,CA 95134 408-943-2600
Document #: 38-03006 Rev. *A Revised April 19, 2004
Features
High-performance, high-density replacement for TTL,
74HC, and cu s t om lo g ic
32 macrocells, 64 expander product terms in one LAB
8 dedicated inputs, 16 I/O pins
0.8-micron do ub le-metal CMOS EPROM technology
28-pin, 300-mil DIP, cerDIP or 28-pin HLCC, PLCC
package
Functional Description
Available in a 28-pin, 300-mil DIP or windowed J-leaded
ceramic chip carrier (HLCC), the CY7C344 represents the
densest EPLD of this size. Eight dedicated inputs and 16
bidirectional I/O pins communicate to one logic array block. In
the CY7C344 LAB there are 32 macrocells and 64 expander
product terms. When an I/O macrocell is used as an input, two
expanders are used to create an input path. Even if all of the
I/O pins are driven by macrocell registers, there are still 16
“buried” registers available. All inputs, macrocells, and I/O pins
are interconnected within the LAB.
The speed and density of the CY7C344 makes it a natural for
all types of applications. With just this one device, the designer
can implement complex state machines, registered logic, and
combinatorial “glue” logic, without using multiple chips. This
architectural flexibility allows the CY7C344 to replace
multichip TTL solutions, whether they are synchronous,
asynchronous, combinatorial, or all three.
Logic Block Diagram
MACROCELL 2
MACROCELL 4
MACROCELL 6
MACROCELL 8
MACROCELL 10
MACROCELL 12
MACROCELL 14
MACROCELL 16
MACROCELL 18
MACROCELL 20
MACROCELL 22
MACROCELL 24
MACROCELL 26
MACROCELL 28
MACROCELL 30
MACROCELL 32
MACROCELL 1
MACROCELL 3
MACROCELL 5
MACROCELL 7
MACROCELL 9
MACROCELL 11
MACROCELL 13
MACROCELL 15
MACROCELL 17
MACROCELL 19
MACROCELL 21
MACROCELL 23
MACROCELL 25
MACROCELL 27
MACROCELL 29
MACROCELL 31
G
L
O
B
A
L
B
U
S
I
O
C
O
N
T
R
O
L
INPUT
INPUT
INPUT
INPUT
15(22)
15(23)
27(6)
28(7)
INPUT 1(8)
INPUT/CLK 2(9)
INPUT 13(20)
INPUT 14(21)
I/O 3(10)
I/O 4(11)
I/O 5(12)
I/O 6(13)
I/O 9(16)
I/O 10(17)
I/O 11(18)
I/O 12(19)
I/O 17(24)
I/O 18(25)
I/O 19(26)
I/O 20(27)
I/O 23(2)
I/O 24(3)
I/O 25(4)
I/O 26(5)
64 EXPANDER PRODUCT TERM ARRAY 32
Pin Configurations
Top View
HLCC
25
24
23
22
21
20
19
5
6
7
8
9
10
11 12 13 141516 1718
432 28 2726
I/O
I/O
INPUT
INPUT
INPUT
I/O
I/O
INPUT
INPUT
INPUT/CLK
I/O
I/O
I/O
I/O
I/O
GND
I/O
I/O
I/O
I/O
V
CC
1
VCC
INPUT
I/O
GND
I/O
I/O
INPUT
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
INPUT
INPUT
Top View
CerDIP
INPUT/CLK
I/O
I/O
I/O
I/O
VCC
GND
I/O
I/O
I/O
I/O
INPUT
INPUT
INPUT
I/O
I/O
I/O
I/O
VCC
GND
I/O
I/O
I/O
I/O
INPUT
INPUT
[1]
CY7C344B
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Document #: 38-03006 Rev. *A Page 2 of 16
Selection Guide 7C344-15 7C344-20 7C344-25 Unit
Maximum Access Time 15 20 25 ns
Maximum Operating Current Commercial 200 200 200 mA
Military 220 220
Industrial 220 220 220
Maximum Standby Current Commercial 150 150 150 mA
Military 170 170
Industrial 170 170 170
Note:
1. Numbers in () refer to J-leaded packages.
CY7C344B
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Document #: 38-03006 Rev. *A Page 3 of 16
Maximum Ratings
(Above which the useful life may be impaired. For user guide-
lines, not tested.)
Storage Temperature ............. ... ... ... ...........–65°C to +150°C
Ambient Temperature with
Power Applied.............. .............. ... .............. ... ...0°C to +70°C
Maximum Junction Temperature (Under Bias).............150°C
Supply Voltage to Ground Potential...............–2.0V to +7.0V
Maximum Power Dissipation................. ... ...............1500 mW
DC VCC or GND Current............................................500 mA
Static Discharge V oltage
(per MIL-STD-883, Method 3015) .............................>2001V
DC Output Current, per Pin.................. ....–25 mA to +25 mA
DC Input Voltage[2] ......... .............. .. ............... .–3.0V to +7.0V
DC Program Voltage....................... ... .............. ... ........+13.0V
Operating Range
Range Ambient
Temperature VCC
Commercial 0°C to +70°C5V ±5%
Industrial –40°C to +85°C5V ±10%
Military –55°C to +125°C (Case) 5V ±10%
Electrical Characteristics Over the Operating Range[3]
Parameter Description Test Conditions Min. Max. Unit
VOH Output HIGH Voltage VCC = Min., IOH = –4.0 mA 2.4 V
VOL Output LOW Voltage VCC = Min., IOL = 8 mA 0.45 V
VIH Input HIGH Level 2.2 VCC+0.3 V
VIL Input LOW Level –0.3 0.8 V
IIX Input Current GND VIN VCC –10 +10 µA
IOZ Output Leakage Current VO = VCC or GND –40 +40 µA
IOS Output Short Circuit Current VCC = Max., VOUT = 0.5V[4, 5] –30 –90 mA
ICC1 Power Supply
Current (Standby) VI = VCC or GND (No
Load) Commercial 150 mA
Military/Industrial 170 mA
ICC2 Power Supply Current VI = VCC or GND (No
Load) f = 1.0 MHz[4,6] Commercial 200 mA
Military/Industrial 220 mA
tRRecommended Input Rise Time 100 ns
tFRecommended Input Fall Time 100 ns
Capacitance
Parameter Description Test Conditions Max. Unit
CIN Input Capacitance VIN = 2V, f = 1.0 MHz 10 pF
COUT Output Capacit ance VOUT = 2.0V, f = 1.0 MHz 10 pF
AC Test Loads and Waveforms[7]
Notes:
2. Minimum DC input is –0.3V. During transitions, the inputs may undershoot to –2.0V for periods less than 20 ns.
3. Typical values are for TA = 25°C and VCC = 5V.
4. Guaranteed by design but not 100% tested.
5. Not more than one out put shou ld be test ed at a t ime. Durat ion of the short ci rcuit shou ld not be mo re than o ne second. V OUT = 0.5V has been chosen to avoid
test problems cau sed by tester grou nd degradatio n.
6. Measured with device programmed as a 16-bit counter.
7. Part (a) in AC Test Load and Waveforms is used for all parameters except tER and tXZ, which is used for part (b) in AC T e st Load and Waveforms. All external timing
paramet ers are measure d referenced to external pins of the device.
3.0V
5V
OUTPUT
R1 464
R2
250
50 pF
INCLUDING
JIG AND
SCOPE
GND
90%
10%
90%
10%
6 ns 6 ns
5V
OUTPUT
R1 464
R2
250
(a) (b)
OUTPUT 1.75V
Equivalent to: THÉVENIN EQUIVALENT (commercial/military)
ALL INPUT PULSES
tf
5pF
tRtF
163
CY7C344B
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Document #: 38-03006 Rev. *A Page 4 of 16
Timing Delays
Timing delays within the CY7C3 44 may be easily de termined
using Warp®, Warp Professional™, or Warp Enterprise™
software. The CY7C344 has fixed internal delays, allowing the
user to determine the worst case timing delays for any design.
Design Recommendations
Operation of the devices described herein with conditions
above those listed under “Maximum Ratings” may cause
permanent damage to the device. This is a stress rating only
and functional operation of the device at these or any other
conditions above those ind icated in the op erational se ctions of
this data sheet is not implied. Exposure to absolute maximum
ratings conditions for extended periods of time may affect
device reliability. The CY7C344 contains circuitry to protect
device pins from high-static voltages or electric fields; however,
normal precautions should be taken to avoid applying any
voltage higher than maximum rated voltages.
For proper operation, input and output pins must be
constrained to the range GND (VIN or VOUT) VCC. Unused
inputs must always be tied to an appropriate logic level (either VCC or
GND). Each set of VCC and GND pins must be connected together
directly at the device. Power su pply decoupling capacito rs of at least
0.2 µF must be connected between VCC and GND. For the most
effe ctive decoupling, ea ch VCC pin should be separately decoupled.
Timing Considerations
Unless otherwise stated, propagation delays do not include
expanders. When using expanders, add the maximum
expander delay tEXP to the overall delay.
When calculating synchronous frequencies, use tS1 if all input s
are on the in pu t pins. tS2 shoul d be used if data i s ap plied at an I/O
pin. If tS2 is greater than tCO1, 1/tS2 becomes the limiti ng frequen cy
in the dat a-path mode unless 1/(tWH + tWL) is less than 1/tS2.
When expander logic is used in the data path, add the appro-
priate maximum ex pande r delay, tEXP to tS1. Determine which of
1/(tWH + tWL), 1/tCO1, or 1/(tEXP + tS1) is the lowest frequency. The
lowest of these frequencies is the maximum data-path frequency for
the synchronous con figuration.
When calculating external asynchronous frequencies, use
tAS1 if all input s are on ded icated inpu t pins. If any data i s applied to
an I/O pin, tAS2 must be u sed as the require d set-up time . If (tAS2 +
tAH) is greater than tACO1, 1/(tAS2 + tAH) becomes the limiting
frequency in the data-path mo de unless 1/(tAWH + tAWL) is less than
1/(tAS2 + tAH).
When expander logic is used in the data path, add the appro-
priate maximum expander delay, tEXP to tAS1. Determine which
of 1/(tAWH + tAWL), 1/tACO1, or 1/(tEXP + tAS1) is the lowest frequency.
The lowest of these frequencies is the maximum data-path frequency
for the asynchronous configuration.
The parameter tOH indicates the system compatibility of this device
when driving other synchro no us lo gi c wi th p osi tive inp ut hold times,
which is controlled by the same synchronous clock. If t OH is greater
than the minimum required input hold time of the subsequent
synchronous logic, then the devices are guaranteed to function
properly with a common synchronous clock under worst-case
environment al and supply volt age conditions.
The parameter tAOH indicates the system compatibility of this
device when drivi ng subsequent registere d logic with a positive hold
t im e an d u si ng t he sa me c lo ck as th e C Y7 C 34 4. In general, if tAOH
is greater than the minimum required input hold time of the subse-
quent logic (synchronous or asynchronous), then the devices are
guaranteed to function properly under worst-case environmental and
supply voltage conditions, provided the clock signal source is the
same. This also appli es if expander logic is used in the clock signal
path of the driving device, but not for the driven device. This is due to
the expander logic in the second device’s clock signal path adding an
additional delay (tEXP), causing the output data from the preceding
device to change prior to the arrival of the clock signal at the following
device’s re gister .
Figure 1. CY7C344 Timing Model
LOGIC ARRAY
CONTROLDELAY
tLAC
EXPANDER
DELAY
tEXP
CLOCK
DELAY
tIC
tRD
tCOMB
tLATCH
INPUT
DELAY
tIN
REGISTER
OUTPUT
DELAY
tOD
tXZ
tZX
LOGIC ARRAY
DELAY
tLAD
FEEDBACK
DELAY
tFD
OUTPUT
INPUT
C344–7
SYSTEM CLOCK DELAYtICS
tRH
tRSU
tPRE
tCLR
I/O
I/O DELAY
tIO
I/O
CY7C344B
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Document #: 38-03006 Rev. *A Page 5 of 16
External Synchronous Switching Characteristics Over Operating Ran ge [7]
Parameter Description
7C344-15 7C344-20 7C344-25
UnitMin. Max. Min. Max. Min. Max.
tPD1 Dedicated Input to Combinatorial Output Delay[8] Com’l/Ind 15 20 25 ns
Mil 15 20 25
tPD2 I/O Input to Combinatorial Ou tput Delay[9] Com’l/Ind 15 20 25 ns
Mil 15 20 25
tPD3 Dedicated Input to Combinatorial Output Delay
with Expander Delay[10] Com’l/Ind 30 30 40 ns
Mil 30 30 40
tPD4 I/O Input to Combinatorial Output Delay with
Expander Delay[4, 11] Com’l/Ind 30 30 40 ns
Mil 30 30 40
tEA Input to Output Enable Delay[4] Com’l/Ind 20 20 25 ns
Mil 20 20 25
tER Input to Output Disable Delay[4] Com’l/Ind 20 20 25 ns
Mil 20 20 25
tCO1 Synchronous Clock Input to Output Delay Com’l/Ind 10 12 15 ns
Mil 10 12 15
tCO2 Synchronous Clock to Local Feedback to
Combinatorial Ou tput[4, 12] Com’l/Ind 20 22 29 ns
Mil 20 22 29
tSDedicated Input or Feedback Set-Up Time to
Synchronous Clock Input Com’l/Ind 10 12 15 ns
Mil 10 12 15
tHInput Hold Ti me from Synchronous Clock Input[7] Com’l/Ind 0 0 0 ns
Mil 0 0 0
tWH Synchronous Clock Input HIGH Time[4] Com’l/Ind 6 7 8 ns
Mil 6 7 8
tWL Synchronous Clock Input LOW Time[4] Com’l/Ind 6 7 8 ns
Mil 6 7 8
tRW Asynchronous Clear Width[4] Com’l/Ind 20 20 25 ns
Mil 20 20 25
tRR Asynchronous Clear Recovery Time[4] Com’l/Ind 20 20 25 ns
Mil 20 20 25
tRO Asynchronous Clear to Registered Output
Delay[4] Com’l/Ind 15 20 25 ns
Mil 15 20 25
tPW Asynchronous Preset Width[4] Com’l /Ind 20 20 25 ns
Mil 20 20 25
tPR Asynchronous Preset Recovery Time[4] Com’l /Ind 20 20 25 ns
Mil 20 20 25
Notes:
8. This parameter is the delay from an input sig nal applied to a dedicated input pin to a combinato rial output on an y outp ut pin. This dela y assumes no expan der
terms are used to form the logic function.
9. This parameter is the delay associated with an input signal applied to an I/O macrocell pin to any output. This delay assumes no expander terms are used to
form the logic function.
10.This parameter is the delay associa ted with an input signal applied to a dedicate d i nput pin to combinatorial output on any output pin. This delay assu me s
expander terms are used to f orm the logic funct ion and includes the worst -case expander logic delay for on e p ass through the ex pande r logic. This par ameter
is tested periodically by sampling production material.
11.This paramet er is the delay associated wit h an input signal app lied to an I/O macrocell pin to any output pi n. This delay assumes expander te rms are used to
form the logic function and includes the worst-case expander logic delay for one pass through the expander logic. This parameter is tested periodically by
sampling production material.
12.This specification is a measure of the delay from syn chronous register cl ock input to intern al feedback of the r egister output signal to a combinato rial output for
which the registered o utput signal is used as an inpu t. This p arameter assu mes no ex pander s are used in the logic of t he combinatori al output and the register
is synchronously clocked. This parameter is tested periodically by sampling production material.
CY7C344B
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tPO Asynchronous Preset to Registered Output
Delay[4] Com’l /Ind 15 20 25 ns
Mil 15 20 25
tCF Synchronous Clock to Local Feedback Input[4, 13] Com’l /Ind 4 4 7 ns
Mil 4 4 7
tPExternal Synchronous Clock Period (1/fMAX3)[4] Com’l/Ind 13 14 16 ns
Mil 13 14 16
fMAX1 External Maximum Frequency(1/(tCO1 + tS))[4, 14] Com’l/Ind 50.0 41.6 33.3 MHz
Mil 50.0 41.6 33.3
fMAX2 Maximum Frequency with Internal Only
Feedback (1/(tCF + tS))[4 , 15] Com’l/Ind 71.4 62.5 45.4 MHz
Mil 71.4 62.5 45.4
fMAX3 Data Path Maximum Frequency, least of
1/(tWL + tWH), 1/(tS + tH), or (1/tCO1)[4, 16] Com’l/Ind 83.3 71.4 62.5 MHz
Mil 83.3 71.4 62.5
fMAX4 Maximum Register Toggle Frequency
1/(tWL + tWH)[4, 17] Com’l/Ind 83.3 71.4 62.5 MHz
Mil 83.3 71.4 62.5
tOH Output Data Stable Time from Synchronous
Clock Input[4, 18] Com’l/Ind 3 3 3 ns
Mil 3 3 3
Notes:
13.This specification is a measure of the delay associ ated with the intern al register feedback path. This delay plus the register set-up time, tS, is the minimum internal
period for an i nternal stat e machine configur ation. This par ameter is tested per iodically by sampli ng production mat erial.
14.This specification indicates the guaranteed maximum frequency at which a state machine configuration with external only feedback can operate.
15.This specification indicates the guaran teed maximum frequency at whi ch a state machine with inte rnal-only feedback can operat e. If register output sta tes must
also control external points, this frequ ency can still be observed as long as it is less than 1/tCO1. This specification assumes no exp ander logic is used. This parameter
is tested perio dically by samplin g production mate rial.
16.This frequency indicates the maximum fr equency at which t he device ma y operate in data -path mod e (dedicated input pin to o utput pin). This assumes that no
expander logic is used.
17.This specification indicate s the guaran teed maximum frequency in synchronous mode, at which an individual output or buried registe r can be cycled by a clock
signal applied to either a dedicat ed input pin or an I/O pin.
18.This parameter indicates the minimum time after a synchronous register clock input th at the previous register output data is maintained on the output pin.
External Synchronous Switching Characteristics Over Operating Ran ge (continued)[7]
Parameter Description
7C344-15 7C344-20 7C344-25
UnitMin. Max. Min. Max. Min. Max.
CY7C344B
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Document #: 38-03006 Rev. *A Page 7 of 16
External Asynchronous Switching Characteristics Over Operating Ran ge[7]
7C344-15 7C344-20 7C344-25
Parameter Description Min. Max. Min. Max. Min. Max. Unit
tACO1 Asynchronous Clock Input to Output Delay Com’l/Ind 15 20 25 ns
Mil 15 20 25
tACO2 Asynchronous Clock Input to Local Feedback to
Combinatorial Output[19] Com’l/Ind 30 30 37 ns
Mil 30 30 37
tAS Dedicated Input or Feedback Set-Up Time to
Asynchronous Clock Input Com’l/Ind 7 9 12 ns
Mil 7 9 12
tAH Input Hold Time from Asynchronous Clock Input Com’l/Ind 7 9 12 ns
Mil 7 9 12
tAWH Asynchronous Clock Input HIGH Time[4, 20] Com’l/Ind 679ns
Mil 679
tAWL Asynchronous Clock Input LOW Time[4] Com’l/Ind 7 9 11 ns
Mil 7 9 11
tACF Asynchronous Clock to Local Feedback Input[4, 21] Com’l/Ind 18 18 21 ns
Mil 18 18 21
tAP External Asynchronous Clock Period (1/fMAX4)[4] Com’l/Ind 13 16 20 ns
Mil 13 16 20
fMAXA1 External Maximum Frequency in Asynchronous
Mode 1/(tACO1 + tAS)[4, 22] Com’l/Ind 45.4 34.4 27 MHz
Mil 45.4 34.4 27
fMAXA2 Maximum Internal Asynchronous Frequency
1/(tACF + tAS) or 1/(tAWH + tAWL)[4, 23] Com’l/Ind 40 37 30.3 MHz
Mil 40 37 30.3
fMAXA3 Data Path Maximum Frequency in Asynchronous
Mode[4, 24] Com’l/Ind 66.6 50 40 MHz
Mil 66.6 50 40
fMAXA4 Maximum Asynchronou s Register Toggle
Frequency 1/(tAWH + tAWL)[4, 25] Com’l/Ind 76.9 62.5 50 MHz
Mil 76.9 62.5 50
tAOH Output Data S table Time from Asynchronous Clock
Input[4, 26] Com’l/Ind 15 15 15 ns
Mil 15 15 15
Notes:
19.This specification is a measure of the delay from an asynchronous register clock input to internal feedback of the registered output signal to a combinatorial
output for which the registered output signal is used as an input. Assumes no expanders are used in logic of combinatorial output or the asynchronous clock
input. This parameter is tested periodically by sampling production material.
20.This parameter is measured with a po sitive- edge-tr iggered clock at t he register. For negative edge tr iggering, th e tAWH and tAWL parameters mu st be swapped. If a
given input is used to clock multiple registers with both positive and negative polarity , tAWH should be used for both tAWH and tAWL.
21.This specification is a measure of the delay associated with the internal register feedback pat h for an asynchronously clocked register. This delay plus the
asynchronous regi ster set-up ti me, tAS, is the minimum internal period for an asynchronously clocked state machine configuration. This delay assumes no expander logic in
the asynchronous cl ock path. Thi s parameter is tested periodical ly by sampling pro duction materi al.
22.This parameter indicates the guaranteed maximum frequency at which an asynchronously clocked state machine configuration with external feedback can
operate. It is assumed that no exp ander logic is employed in the clock signal p ath or data path.
23.This specification indicates the guara nteed maximum frequ ency at which an asynch ronously cl ocked state mach ine with internal -only feedba ck can ope rate. I f
register output states must also control external points, this frequency can still be observed as long as this frequency is less than 1/tACO1. This specification assumes
no expand er logic is utilized . This para meter is tested pe riodically by samp ling production material.
24.This specification indicate s the guaranteed ma ximum frequency at which an individual output or burie d register can be cycled in asynchronously clocked mode.
This frequency is least of 1/(tAWH + tAWL), 1/(tAS + tAH), or 1/tACO1. It also indicates the maximum frequency at which the device may oper ate in the asynchronously clocked
data-p ath mode. Assumes n o expander lo gic is used.
25.This specification indicates the guaranteed maximum f requency at which a n individual output or b uried register can be cycled in asynchronously clocked mode
by a clock signal applied to an external dedicated input or an I/O pin.
26.This parameter indicates the minimum time that the previous register output data is maintained on the output pin after an asynchronous register clock input to
an external dedicated input or I/O pin.
CY7C344B
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Typical Internal Switching Characteristics Over Operating Range[7]
7C344-15 7C344-20 7C344-25
Parameter Description Min. Max. Min. Max. Min. Max. Unit
tIN Dedicated Input Pad and Buffer Delay Com’l/Ind 4 5 7 ns
Mil 4 5 7
tIO I/O Input Pad and Buffer Delay Com’l/Ind 4 5 7 ns
Mil 4 5 7
tEXP Expander Array Delay Com’l/Ind 810 15 ns
Mil 810 15
tLAD Logic Array Data Delay Com’l/Ind 7 9 10 ns
Mil 7 9 10
tLAC Logic Array Control Delay Com’l/Ind 5 7 7 ns
Mil 5 7 7
tOD Output Buffer and Pad Delay Com’l/Ind 4 5 5 ns
Mil 4 5 5
tZX Output Buffer Enable Delay[27] Com’l/Ind 7 8 11 ns
Mil 7 8 11
tXZ Output Buffer Disable Delay Com’l/Ind 7 8 11 ns
Mil 7 8 11
tRSU Register Set-Up Time Relative to Clock Signal
at Register Com’l/Ind 5 5 8 ns
Mil 5 5 8
tRH Register Hold Time Relative to Clock Signal at
Register Com’l/Ind 7 9 12 ns
Mil 7 9 12
tLATCH Flow-Through Latch Delay Com’l/Ind 1 1 3 ns
Mil 1 1 3
tRD Register Delay Com’l/Ind 1 1 1 ns
Mil 1 1 1
tCOMB Transparent Mode Delay[28] Com’l/Ind 1 1 3 ns
Mil 1 1 3
tCH Clock HIGH Time Com’l/Ind 6 7 8 ns
Mil 6 7 8
tCL Clock LOW Time Com’l/Ind 6 7 8 ns
Mil 6 7 8
tIC Asynchronous Clock Logic Delay Com’l/Ind 7 8 10 ns
Mil 7 8 10
tICS Synchronous Clock Delay Com’l/Ind 1 2 3 ns
Mil 1 2 3
tFD Feedback Delay Com’l/Ind 1 1 1 ns
Mil 1 1 1
tPRE Asynchronous Register Preset Time Com’l/Ind 5 6 9 ns
Mil 5 6 9
Notes:
27.Sample tested only for an output change of 500 mV.
28.This specification guarantees the maximum combinatorial delay associated with the macrocell register bypass when the macrocell is configured for combinatorial
operation.
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tCLR Asynchronous Register Clear Time Com’l/Ind 5 6 9 ns
Mil 5 6 9
tPCW Asynchronous Preset and Clear Pulse Width Com’l/Ind 5 5 7 ns
Mil 5 5 7
tPCR Asynchronous Preset and Clear Recovery Time Com’l/Ind 5 5 7 ns
Mil 5 5 7
Typical Internal Switching Characteristics Over Operating Range[7] (continued)
7C344-15 7C344-20 7C344-25
Parameter Description Min. Max. Min. Max. Min. Max. Unit
Switching Waveforms
External Combinatorial
tPD1/tPD2
tER
tEA VALID OUTPUT
DEDICATED INPUT/
I/O INPUT
COMBINATORIAL
OUTPUT
COMBINATORIAL OR
REGISTERED OUTPUT
HIGH-IMPEDANCE
THREE-STATE
HIGH-IMPEDANCE
THREE-STATE
External Synchronous
tH
tStWH tWL
tRR/tPR
tRW/tPW
tOH
tCO1
tRO/tPO
tCO2
DEDICATED INPUTS OR
REGISTERED FEEDBACK
SYNCHRONOUS
CLOCK
ASYNCHRONOUS
CLEAR/PRESET
REGISTERED
OUTPUTS
COMBINATORIAL OUTPUT FROM
REGISTERED FEEDBACK[12]
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Switching Waveforms (continued)
tACO1
External Asynchronous
tAH
tAS tAWH tAWL
tRR/tPR
tRW/tPW
tAOH
tRO/tPO
tACO2
ASYNCHRONOUS
CLOCK INPUT
ASYNCHRONOUS REGISTERED
OUTPUTS
DEDICATED INPUTS OR
REGISTERED FEEDBACK
ASYNCHRONOUS
CLEAR/PRESET
COMBINATORIAL OUTPUT FROM
ASYNCH. REGISTERED
FEEDBACK[19]
Internal Combinatorial tIN
tIO tPIA
tEXP
tLAC,t
LAD
INPUT PIN
EXPANDER
I/O PIN
LOGIC ARRAY
ARRAY DELAY
OUTPUT
LOGIC ARRAY
INPUT
CY7C344B
USE ULTRA37000TM FOR
ALL NEW DESIGNS
Document #: 38-03006 Rev. *A Page 11 of 16
Switching Waveforms (continued)
Internal Asynchronous
tIO tAWH tAWL tF
tIN
tIC
tRSU tRH
tRD,tLATCH tFD tCLR,tPRE tFD
CLOCK PIN
LOGIC ARRAY
LOGIC ARRAY
CLOCK FROM
DATA FROM
CLOCK INTO
LOGIC ARRAY
REGISTER OUTPUT
TO ANOTHER LAB
tPIA
TO LOCAL LAB
REGISTER OUTPUT
LOGIC ARRAY
tR
Internal Synchronous (Input Path)
tCH tCL
tIN tICS
tRSU tRH
SYSTEM CLOCK PIN
SYSTEM CLOCK
AT REGISTER
DATA FROM
LOGIC ARRAY
Internal Synchron ou s (Ou tpu t P ath )
tXZ tZX
tOD
HIGH Z
CLOCK FROM
LOGIC ARRAY
LOGIC ARRAY
DATA FROM
OUTPUT PIN
tRD
CY7C344B
USE ULTRA37000TM FOR
ALL NEW DESIGNS
Document #: 38-03006 Rev. *A Page 12 of 16
MILITARY SPECIFICATIONS
Group A Subgroup Testing
Ordering Information
Speed
(ns) Ordering Code Package
Name Package Type Operating
Range
15 CY7C344-15HC/HI H64 28-Lead Windowed Leaded Chip Carrier Commercial/Industrial
CY7C344-15JC/JI J64 28-Lead Plastic Leaded Chip Carrier
CY7C344-15PC/PI P21 28-Lead (300-Mil) Molded DIP
CY7C344-15WC/WI W22 28-Lead Windowed CerDIP
20 CY7C344-20HC/HI H64 28-Lead Windowed Leaded Chip Carrier Commercial/Industrial
CY7C344-20JC/JI J64 28-Lead Plastic Leaded Chip Carrier
CY7C344-20PC/PI P21 28-Lead (300-Mil) Molded DIP
CY7C344-20WC/WI W22 28-Lead Windowed CerDIP
CY7C344-20HMB H64 28-Lead Windowed Leaded Chip Carrier Military
CY7C344-20WMB W22 28-Lead Windowed CerDIP
25 CY7C344-25HC/HI H64 28-Lead Windowed Leaded Chip Carrier Commercial/Industrial
CY7C344-25JC/JI J64 28-Lead Plastic Leaded Chip Carrier
CY7C344-25PC/PI P21 28-Lead (300-Mil) Molded DIP
CY7C344-25WC/WI W22 28-Lead Windowed CerDIP
CY7C344-25HMB H64 28-Lead Windowed Leaded Chip Carrier Military
CY7C344-25WMB W22 28-Lead Windowed CerDIP
DC Characteristics
Parameter Subgroups
VOH 1, 2, 3
VOL 1, 2, 3
VIH 1, 2, 3
VIL 1, 2, 3
IIX 1, 2, 3
IOZ 1, 2, 3
ICC1 1, 2, 3
Switching Characteristics
Parameter Subgroups
tPD1 7, 8, 9, 10, 11
tPD2 7, 8, 9, 10, 11
tPD3 7, 8, 9, 10, 11
tCO1 7, 8, 9, 10, 11
tS7, 8, 9, 10, 11
tH7, 8, 9, 10, 11
tACO1 7, 8, 9, 10, 11
tACO1 7, 8, 9, 10, 11
tAS 7, 8, 9, 10, 11
tAH 7, 8, 9, 10, 11
CY7C344B
USE ULTRA37000TM FOR
ALL NEW DESIGNS
Document #: 38-03006 Rev. *A Page 13 of 16
Package Diagrams
28-Pin Windowed Leaded Chip Carrier H64
51-80077-**
CY7C344B
USE ULTRA37000TM FOR
ALL NEW DESIGNS
Document #: 38-03006 Rev. *A Page 14 of 16
Package Diagrams (continued)
28-Lead Plastic Leaded Chip Carrier J64
51-85001-*A
DIMENSIONS IN INCHES[MM] MIN.
MAX.
SEATING PLANE
0.260[6.60]
0.280[7.11]
0.090[2.28]
0.110[2.79]
0.055[1.39]
0.065[1.65] 0.015[0.38]
0.020[0.50]
0.015[0.38]
0.060[1.52]
0.120[3.05]
0.140[3.55]
0.009[0.23]
0.012[0.30]
0.310[7.87]
0.385[9.78]
0.290[7.36]
0.325[8.25]
0.030[0.76]
0.080[2.03]
0.115[2.92]
0.160[4.06]
0.140[3.55]
0.190[4.82]
1.370[34.79]
1.425[36.19]
MIN.
114
15 28
REFERENCE JEDEC MO-095
PART #
P28.3 STANDARD PKG.
LEAD FREE PKG.PZ28.3
28-Lead (300-Mil) PDIP P21
51-85014-*C
CY7C344B
USE ULTRA37000TM FOR
ALL NEW DESIGNS
Document #: 38-03006 Rev. *A Page 15 of 16
© Cypress Semiconductor Corporation, 2004. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no resp onsibility for the use
of any circ uitry other than cir cuitry embodied i n a Cypress Semi conductor product. Nor does it convey or imply any l icense under patent or other rights. Cypress Semiconductor does not authorize
its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
Semiconductor product s in life-support syste ms application implies th at th e manu fac turer assu mes all risk of such use and in doing so ind emnifie s Cypress Semicondu ctor ag ainst all charges.
MAX and Warp are registered trademarks and Ultra37000, Warp Professional and Warp Enterprise are trademarks of Cypress
Semiconductor Corporation. All products and company names mentioned in this document may be the trademarks of their respective
holders.
Package Diagrams (continued)
28-Lead (300-Mil) Windowed CerDIP W22
MIL-STD-1835 D-15 Config. A
51-80087-**
CY7C344B
USE ULTRA37000TM FOR
ALL NEW DESIGNS
Document #: 38-03006 Rev. *A Page 16 of 16
Document History Page
Document Title: CY7C344 32-Macrocell MAX® EPLD
Document Number: 38-03006
REV. ECN NO. Issue Date Orig. of
Change Description of Change
** 106271 04/19/01 SZV Change from Spec number: 38-00127 to 38-03006
*A 213375 See ECN FSG Added note to title page: “Use Ultra37000 For All New Designs”