KA-3535SELZ4S - Kingbright Corporation

SPEC NO: DSAM0798 REV NO: V.4B DATE: MAR/29/2013 PAGE: 1 OF 6

APPROVED: WYNEC CHECKED: Allen Liu DRAWN: F.Cui ERP: 1201007945

3.5x3.5 mm SMD CHIP LED LAMP

ATTENTION

OBSERVE PRECAUTIONS

FOR HANDLING

ELECTROSTATIC

DISCHARGE

SENSITIVE

DEVICES

Part Number: KA-3535SELZ4S Hyper Orange

Features

zWhite SMD package, silicone resin.

zLow thermal resistance.

zCompatible with IR-reflow processes.

zESD protection.

zPackage: 2000pcs / reel.

zMoisture sensitivity level : level 2a.

zRoHS compliant.

Package Dimensions

Applications

zSignal and symbol luminaire for orientation.

zMarker lights (e.g. steps, exit ways, etc).

zDecorative and entertainment lighting.

zCommercial and residential lighting.

zAutomotive interior lighting.

Description

The Hyper Orange device is made with TS AlGaInP light

emitting diode.

Static electricity and surge damage the LEDS.

It is recommended to use a wrist band or anti-electrostatic

glove when handling the LEDs.

All devices, equipment and machinery must be electrically

grounded.

Notes:

1. All dimensions are in millimeters (inches).

2. Tolerance is ±0.25(0.01") unless otherwise noted.

3. The specifications, characteristics and technical data described in the datasheet are subject to change without prior notice.

4. The device has a single mounting surface. The device must be mounted according to the specifications.

SPEC NO: DSAM0798 REV NO: V.4B DATE: MAR/29/2013 PAGE: 2 OF 6

APPROVED: WYNEC CHECKED: Allen Liu DRAWN: F.Cui ERP: 1201007945

Handling Precautions

Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic

significantly reduces thermal stress, it is more susceptible to damage by external mechanical force.

As a result, special handling precautions need to be observed during assembly using silicone encapsulated

LED products. Failure to comply might lead to damage and premature failure of the LED.

1. Handle the component along the side surfaces by using forceps or appropriate tools.

2. Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry.

3. Do not stack together assembled PCBs containing exposed LEDs. Impact may scratch the silicone lens or

damage the internal circuitry.

4.1. The inner diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks.

4.2. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup.

4.3. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure precise pickup

and avoid damage during production.

5. As silicone encapsulation is permeable to gases, some corrosive substances such as H2S might corrode silver plating of

leadframe. Special care should be taken if an LED with silicone encapsulation is to be used near such substances.

Detailed application notes are listed on our website.

http://www.kingbright.com/application_notes

SPEC NO: DSAM0798 REV NO: V.4B DATE: MAR/29/2013 PAGE: 3 OF 6

APPROVED: WYNEC CHECKED: Allen Liu DRAWN: F.Cui ERP: 1201007945

Absolute Maximum Ratings at TA=25°C

Electrical / Optical Characteristics at TA=25°C

Notes:

1.Results from mounting on PC board FR4(pad size ≥70mm2), mounted on pc board-metal core PCB is recommend

for lowest thermal Resistance.

2.1/10 Duty Cycle, 0.1ms Pulse Width.

Parameter Symbol Value Unit

Power Dissipation PD 510 mW

Junction Temperature [1] TJ 130 °C

Operating Temperature Top -40 To +85 °C

Storage Temperature Ts tg -40 To +85 °C

DC Forward Current [1] IF 150 mA

Peak Forward Current [2] IFM 270 mA

Thermal Resistance [1]

(Junction/ambient) Rth j-a 240 °C/W

Thermal Resistance [1]

(Junction/solder point) Rth j-S 100 °C/W

8000 V Electrostatic Discharge Threshold (HBM)

Reverse Voltage VR 5 V

Selection Guide

Notes:

1.Wavelength: +/-1nm.

2. Forward Voltage: +/-0.1V.

3. Wavelength value is traceable to the CIE127-2007 compliant national standards.

Parameter Symbol Value Unit

Wavelength at peak emission IF=150mA [Typ.] λpeak 630 nm

Dominant Wavelength IF=150mA [Typ.] λ dom [1] 618 nm

Spectral Line Half-width IF=150mA [Typ.] Δλ 20 nm

Forward Voltage IF=150mA [Min.]

VF [2]

2.4

V Forward Voltage IF=150mA [Typ.] 2.9

Forward Voltage IF=150mA [Max.] 3.4

Allowable Reverse Current [Max.] IR 85 mA

Temperature coefficient of λpeak

IF=150mA, -10 °C≤ T≤100 °C [Typ.] TC λpeak 0.11 nm/°C

Temperature coefficient of λdom

IF=150mA, -10 °C≤ T≤100 °C [Typ.] TC λdom 0.09 nm/°C

Temperature coefficient of VF

IF=150mA, -10 °C≤ T≤100 °C [Typ.] TCV -3.6 mV/°C

Part No. Dice Lens Type

Iv (cd) [2]

@ 150mA

Φv (lm) [2]

@ 150mA

V

iewing

Angle [1]

Min. Typ. Min. Typ. 2θ1/2

KA-3535SELZ4S Hyper Orange (AlGaInP) Water Clear 120 °

2.7 3.6 8.6 11

Notes:

1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 of the optical peak value.

2. Luminous intensity/ luminous Flux: +/-15%.

3.LEDs are binned according to their luminous flux.

4.Luminous intensity/ luminous Flux value is traceable to the CIE127-2007 compliant national standards.

SPEC NO: DSAM0798 REV NO: V.4B DATE: MAR/29/2013 PAGE: 4 OF 6

APPROVED: WYNEC CHECKED: Allen Liu DRAWN: F.Cui ERP: 1201007945

Hyper Orange KA-3535SELZ4S

SPEC NO: DSAM0798 REV NO: V.4B DATE: MAR/29/2013 PAGE: 5 OF 6

APPROVED: WYNEC CHECKED: Allen Liu DRAWN: F.Cui ERP: 1201007945

KA-3535SELZ4S

Reflow soldering is recommended and the soldering profile is shown below.

Other soldering methods are not recommended as they might cause damage to the product.

Recommended Soldering Pattern

(Units : mm; Tolerance: ±0.1)

Tape Specifications

(Units : mm)

Reel Dimension

SPEC NO: DSAM0798 REV NO: V.4B DATE: MAR/29/2013 PAGE: 6 OF 6

APPROVED: WYNEC CHECKED: Allen Liu DRAWN: F.Cui ERP: 1201007945

PACKING & LABEL SPECIFICATIONS KA-3535SELZ4S