BGA231L7E6327 - INFINEON TECHNOLOGIES AG

RF & Protection Devices

Data Sheet

Revision 3.0, 2011-04-20

BGA231L7

Silicon Germanium GPS Low Noise Amplifier

Edition 2011-04-20

Published by

Infineon Technologies AG

81726 Munich, Germany

Legal Disclaimer

The information given in this document shall in no event be regarded as a guarantee of conditions or

characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any

information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties

and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights

of any third party.

Information

For further information on technology, delivery terms and conditions and prices, please contact the nearest

Infineon Technologies Office (www.infineon.com).

Warnings

Due to technical requirements, components may contain dangerous substances. For information on the types in

question, please contact the nearest Infineon Technologies Office.

Infineon Technologies components may be used in life-support devices or systems only with the express written

approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure

of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support

devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain

and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may

be endangered.

BGA231L7

Data Sheet 3 Revision 3.0, 2011-04-20

Trademarks of Infineon Technologies AG

AURIX™, C166™, CanPAK™, CIPOS™, CIPURSE™, EconoPACK™, CoolMOS™, CoolSET™,

CORECONTROL™, CROSSAVE™, DAVE™, EasyPIM™, EconoBRIDGE™, EconoDUAL™, EconoPIM™,

EiceDRIVER™, eupec™, FCOS™, HITFET™, HybridPACK™, I²RF™, ISOFACE™, IsoPACK™, MIPAQ™,

ModSTACK™, my-d™, NovalithIC™, OptiMOS™, ORIGA™, PRIMARION™, PrimePACK™, PrimeSTACK™,

PRO-SIL™, PROFET™, RASIC™, ReverSave™, SatRIC™, SIEGET™, SINDRION™, SIPMOS™,

SmartLEWIS™, SOLID FLASH™, TEMPFET™, thinQ!™, TRENCHSTOP™, TriCore™.

Other Trademarks

Advance Design System™ (ADS) of Agilent Technologies, AMBA™, ARM™, MULTI-ICE™, KEIL™,

PRIMECELL™, REALVIEW™, THUMB™, µVision™ of ARM Limited, UK. AUTOSAR™ is licensed by AUTOSAR

development partnership. Bluetooth™ of Bluetooth SIG Inc. CAT-iq™ of DECT Forum. COLOSSUS™,

FirstGPS™ of Trimble Navigation Ltd. EMV™ of EMVCo, LLC (Visa Holdings Inc.). EPCOS™ of Epcos AG.

FLEXGO™ of Microsoft Corporation. FlexRay™ is licensed by FlexRay Consortium. HYPERTERMINAL™ of

Hilgraeve Incorporated. IEC™ of Commission Electrotechnique Internationale. IrDA™ of Infrared Data

Association Corporation. ISO™ of INTERNATIONAL ORGANIZATION FOR STANDARDIZATION. MATLAB™ of

MathWorks, Inc. MAXIM™ of Maxim Integrated Products, Inc. MICROTEC™, NUCLEUS™ of Mentor Graphics

Corporation. Mifare™ of NXP. MIPI™ of MIPI Alliance, Inc. MIPS™ of MIPS Technologies, Inc., USA. muRata™

of MURATA MANUFACTURING CO., MICROWAVE OFFICE™ (MWO) of Applied Wave Research Inc.,

OmniVision™ of OmniVision Technologies, Inc. Openwave™ Openwave Systems Inc. RED HAT™ Red Hat, Inc.

RFMD™ RF Micro Devices, Inc. SIRIUS™ of Sirius Satellite Radio Inc. SOLARIS™ of Sun Microsystems, Inc.

SPANSION™ of Spansion LLC Ltd. Symbian™ of Symbian Software Limited. TAIYO YUDEN™ of Taiyo Yuden

Co. TEAKLITE™ of CEVA, Inc. TEKTRONIX™ of Tektronix Inc. TOKO™ of TOKO KABUSHIKI KAISHA TA.

UNIX™ of X/Open Company Limited. VERILOG™, PALLADIUM™ of Cadence Design Systems, Inc. VLYNQ™

of Texas Instruments Incorporated. VXWORKS™, WIND RIVER™ of WIND RIVER SYSTEMS, INC. ZETEX™ of

Diodes Zetex Limited.

Last Trademarks Update 2011-02-24

Revision History

Page or Item Subjects (major changes since previous revision)

Revision 3.0, 2011-04-20

all “Preliminary” status removed

Revision 2.0, 2011-01-18

all Preliminary data sheet

10, 11 Electrical Characteristics specified for frequency range f= 1550 - 1615 MHz

7 Marking code defined: BD

BGA231L7

Table of Contents

Data Sheet 4 Revision 3.0, 2011-04-20

Table of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

List of Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

List of Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

1 Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

2 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

3 Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

4 Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Table of Contents

BGA231L7

List of Figures

Data Sheet 5 Revision 3.0, 2011-04-20

Figure 1 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Figure 2 Application Schematic BGA231L7 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Figure 3 Package Outline TSLP-7-1 (side and bottom view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Figure 4 Footprint TSLP-7-1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Figure 5 Tape & Reel Dimensions (Ø reel 180 mm, pieces/reel 7500) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

List of Figures

BGA231L7

List of Tables

Data Sheet 6 Revision 3.0, 2011-04-20

Table 1 Pin Definition and Function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Table 2 Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Table 3 Thermal Resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Table 4 Electrical Characteristics: TA = 25 °C, VCC = 2.8 V, VPON,ON = 2.8 V, VPON,OFF = 0 V,

f= 1550 - 1615 MHz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Table 5 Electrical Characteristics: TA = 25 °C, VCC = 1.8 V, VPON,ON = 1.8 V, VPON,OFF = 0 V,

f= 1550 - 1615 MHz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Table 6 Bill of Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

List of Tables

Product Name Marking Package

BGA231L7 BD TSLP-7-1

Silicon Germanium GPS Low Noise Amplifier

BGA231L7

Data Sheet 7 Revision 3.0, 2011-04-20

Features

• Insertion power gain: 16.0 dB

• High out of band input 3rd order intercept point: +5 dBm

• High input 1 dB compression point: -5 dBm

• Low Noise Figure: 0.75 dB

• Low current consumption: 4.4 mA

• Operating frequency: 1550 - 1615 MHz

• Supply voltage: 1.5 V to 3.6 V

• Digital on/off switch (1V logic high level)

• Tiny TSLP-7-1 leadless package

• B7HF Silicon Germanium technology

• RF output internally matched to 50 Ω

• Only 3 external SMD components necessary

• 2 kV HBM ESD protection (including AI-pin)

• Pb-free (RoHS compliant) package

Application

• Suitable for all Global Navigation Satellite Systems (GNSS) like GPS, Galileo, GLONASS, COMPASS

Description

The BGA231L7 is a front-end low noise amplifier for Global Navigation Satellite Systems (GNSS) from 1550 MHz

to 1615 MHz like GPS, Galileo, GLONASS and COMPASS. The LNA provides 16.0 dB gain and 0.75 dB noise

figure at a current consumption of 4.4 mA in the application configuration described in Chapter 3. The BGA231L7

is based upon Infineon Technologies‘ B7HF Silicon Germanium technology. It operates from 1.5 V to 3.6 V supply

voltage.

BGA231L7

Features

Data Sheet 8 Revision 3.0, 2011-04-20

Figure 1 Block Diagram

Table 1 Pin Definition and Function

Pin No. Name Function

1 PON Power on control

2 AI LNA input

3BIASDC bias

4 n.c. not connected

5 AO LNA output

6 VCC DC Supply

7 GND RF and DC ground

BGA231L7_Blockdiagram .vsd

GND

VCC

BIAS

ESD

BIAS

PON

BGA231L7

Maximum Ratings

Data Sheet 9 Revision 3.0, 2011-04-20

1 Maximum Ratings

Attention: Stresses above the max. values listed here may cause permanent damage to the device.

Exposure to absolute maximum rating conditions for extended periods may affect device

reliability. Maximum ratings are absolute ratings; exceeding only one of these values may

cause irreversible damage to the integrated circuit.

Thermal Resistance

Table 2 Maximum Ratings

Parameter Symbol Values Unit Note /

Test Condition

Min. Typ. Max.

Voltage at pin VCC VCC -0.3 – 3.6 V 1)

1) All voltages refer to VSS-Node unless otherwise noted

Voltage at pin AI VAI -0.3 – 0.9 V –

Voltage at pin BIAS VBIAS -0.3 – 0.9 V –

Voltage at pin AO VAO -0.3 – VCC + 0.3 V –

Voltage at pin PON VPON -0.3 – VCC + 0.3 V –

Voltage at pin VSS VSS -0.3 – 0.3 V –

Current into pin VCC ICC ––20mA–

RF input power PIN ––0dBm–

Total power dissipation,

TS< 129 °C2)

2) TS is measured on the ground lead at the soldering point

TJ––72mW–

Junction temperature Ptot ––150°C–

Ambient temperature range TA-40 – 85 °C –

Storage temperature range TSTG -65 – 150 °C –

ESD capability all pins VESD_HBM – – 2000 V according to

JESD22A-114

Table 3 Thermal Resistance

Parameter Symbol Value Unit

Junction - soldering point1)

1) For calculation of RthJA please refer to Application Note Thermal Resistance

RthJS 291 K/W

BGA231L7

Electrical Characteristics

Data Sheet 10 Revision 3.0, 2011-04-20

2 Electrical Characteristics

Table 4 Electrical Characteristics:1) TA = 25 °C, VCC = 2.8 V, VPON,ON = 2.8 V, VPON,OFF = 0 V,

f= 1550 - 1615 MHz

1) Based on the application described in chapter 3

Parameter Symbol Values Unit Note / Test Condition

Min. Typ. Max.

Supply voltage VCC 1.5 – 3.6 V –

Supply current ICC –4.4–mAON-mode

–0.23μA OFF-mode

Power On voltage Vpon 1.0 – Vcc V ON-mode

0 – 0.4 V OFF-mode

Power On current Ipon –5–μA ON-mode

––1μA OFF-mode

Insertion power gain |S21|2– 16.0 – dB

Noise figure2)

2) PCB losses are subtracted

NF – 0.75 1.3 dB ZS=50Ω

Input return loss RLin –10–dB

Output return loss RLout –16–dB

Reverse isolation 1/|S12|2–23–dB

Power gain settling time3)

3) To be within 1 dB of the final gain OFF- to ON-mode; to be within 3 dB of the final gain ON- to OFF-mode

tS–5–μs OFF- to ON-mode

–5–μs ON- to OFF-mode

Inband input 1 dB compression

point

IP1dB –-5–dBm

Inband input 3rd order intercept

point4)

4) Input Power = -30 dBm for each tone

IIP3–0–dBmf1= 1575 MHz

f2=f1+/-1 MHz

Out of band input 3rd order

intercept point5)

5) Input Power = -20 dBm for each tone

IIP3oob –+5–dBmf1= 1712.7 MHz

f2= 1850 MHz

Stability k–> 1– f= 20 MHz ... 10 GHz

BGA231L7

Electrical Characteristics

Data Sheet 11 Revision 3.0, 2011-04-20

Table 5 Electrical Characteristics:1) TA = 25 °C, VCC = 1.8 V, VPON,ON = 1.8 V, VPON,OFF = 0 V,

f= 1550 - 1615 MHz

1) Based on the application described in chapter 3

Parameter Symbol Values Unit Note / Test Condition

Min. Typ. Max.

Supply voltage VCC 1.5 – 3.6 V –

Supply current ICC –4.4–mAON-mode

–0.23μA OFF-mode

Gain switch control voltage Vpon 1.0 – Vcc V ON-mode

0 – 0.4 V OFF-mode

Gain switch control current Ipon –5–μA ON-mode

––1μA OFF-mode

Insertion power gain |S21|2– 16.0 – dB

Noise figure2)

2) PCB losses are subtracted

NF – 0.75 1.3 dB ZS=50Ω

Input return loss RLin –10–dB

Output return loss RLout –16–dB

Reverse isolation 1/|S12|2–23–dB

Power gain settling time3)

3) To be within 1 dB of the final gain OFF- to ON-mode; to be within 3 dB of the final gain ON- to OFF-mode

tS–5–μs OFF- to ON-mode

–5–μs ON- to OFF-mode

Inband input 1 dB compression

point

IP1dB –-8–dBm

Inband input 3rd order intercept

point4)

4) Input Power = -30 dBm for each tone

IIP3–0–dBmf1= 1575 MHz

f2=f1+/-1 MHz

Out of band input 3rd order

intercept point5)

5) Input Power = -20 dBm for each tone

IIP3oob –+5–dBmf1= 1712.7 MHz

f2= 1850 MHz

Stability k–> 1– f= 20 MHz ... 10 GHz

BGA231L7

Application Information

Data Sheet 12 Revision 3.0, 2011-04-20

3 Application Information

Application Board Configuration

Figure 2 Application Schematic BGA231L7

A list of all application notes is available at http://www.infineon.com/gpslna.appnotes.

Table 6 Bill of Materials

Name Value Package Manufacturer Function

C1 (optional) 100 nF 0201 Various RF block

C2 (optional) 33 pF 0201 Various DC block

L1 39 nH 0201 Murata LQP03T Bias feed and RF choke

L2 6.8 nH 0201 Murata LQP03T Input matching

N1 BGA231L7 TSLP-7-1 Infineon SiGe LNA

BGA231L7_ Schematic.vsd

N1 BGA231L7

AI, 2

BIAS, 3

PON, 1

n.c., 4

VCC, 6

AO, 5

GND, 7

(optional)

RFin

VCC

RFout

n. c.

(optional)

PON

BGA231L7

Package Information

Data Sheet 13 Revision 3.0, 2011-04-20

4 Package Information

Figure 3 Package Outline TSLP-7-1 (side and bottom view)

Figure 4 Footprint TSLP-7-1

Figure 5 Tape & Reel Dimensions (Ø reel 180 mm, pieces/reel 7500)

0.05 MAX.

+0.1

0.4

1) Dimension applies to plated terminal

±0.035

1.2

±0.05

1.3

±0.05

1.7

±0.05

6 x 0.2

±0.035 1)

6 x 0.2

±0.035 1)

±0.035

1.1

456

123

Top view Bottom view

Pin 1 marking

TSLP-7-1-PO V04

0.25

1.4

1.9

0.25

0.20.25

0.250.2

1.4

1.9

0.3 0.3

0.3

0.20.2

0.2

Stencil apertures

Copper Solder mask

R0.1

0.25

1.4

1.9

0.25

0.20.25

0.250.2

1.4

1.9

0.3 0.3

0.3

0.20.2

0.2

Stencil apertures

Copper Solder mask

R0.1

SMDNSMD

TSLP-7-1-FP V01

TSLP-7-1-TP V0

1.45

2.18

0.5

Pin 1

marking

Published by Infineon Technologies AG