Description
These high intensity white LED lamps are based on In-
GaN material technology. A blue LED die is coated by
phosphor to produce white. The typical resulting color is
described by the coordinates x = 0.31, y = 0.31 using the
1931 CIE Chromaticity Diagram.
These T-1 ¾ lamps are untinted, di used, and incorporate
precise optics which produce well-de ned spatial radia-
tion patterns at speci c viewing cone angle.
Bene t
Reduced power consumption, higher reliability, and
increased optical/mechanical design  exibility com-
pared to incandescent bulbs and other alternative
white light sources.
Caution: Devices are Class 1 ESD sensitive. Please observe appropriate precautions during handling and processing.
Refer to Application Note AN-1142 for additional details.
HLMP-CW46, HLMP-CW47, HLMP-CW76, HLMP-CW77
T-1 ¾ (5mm) Extra Bright Precision Optical
Performance White LED Lamps
Data Sheet
Features
Well de ned spatial radiation pattern
High luminous white emission
Viewing angle: 50° and 70°.
Stando or non-stando leads
Superior resistance to moisture
Applications
Electronic signs and signals
Small area illumination
Legend backlighting
General purpose indicators
2
Part Numbering System
Package Dimensions
Package Dimension BPackage Dimension A
Notes:
1. All dimensions are in millimeters /inches.
2. Epoxy meniscus may extend about 1mm (0.040”) down the leads.
3. If heat-sinking application is required, the terminal for heat sink is anode.
DIMENSION H:
50°: 11.98 ± 0.25mm (0.4715 ± 0.01 inches)
70°: 11.09 ± 0.25mm (0.4365 ± 0.01 inches)
Mechanical Option
00: Bulk
DD: Ammo Pack Straight Leads
H L M P --X XXXXX XC W
Color Bin Options
0: Full color bin distribution
B: Color bin 2 & 3 only
Minimum Intensity Bin
Refer to Device Selection Guide
Maximum Intensity Bin
0: No maximum intensity bin limit
Others: Refer to Device Selection Guide
Viewing Angle and Stando Option
46: 50° without stando
47: 50° with stando
76: 70° without stando
77: 70° with stando
1.14 ± 0.20
(0.045 ± 0.008)
5.80 ± 0.20
(0.228 ± 0.008)
5.00 ± 0.20
(0.197 ± 0.008)
31.60
(1.244) MIN.
0.70 (0.028)
MAX.
1.00
(0.039) MIN.
8.71 ± 0.20
(0.343 ± 0.008)
2.54 ± 0.38
(0.100 ± 0.015)
0.50 ± 0.10
(0.020 ± 0.004) SQ. TYP.
CATHODE
LEAD
2.35 (0.093)
MAX.
CATHODE
FLAT
1.14 ± 0.20
(0.045 ± 0.008)
5.80 ± 0.20
(0.228 ± 0.008)
5.00 ± 0.20
(0.197 ± 0.008)
31.60
(1.244) MIN.
0.70 (0.028)
MAX.
1.00
(0.039) MIN.
8.71 ± 0.20
(0.343 ± 0.008)
2.54 ± 0.38
(0.100 ± 0.015)
0.50 ± 0.10
(0.020 ± 0.004) SQ. TYP.
CATHODE
LEAD
CATHODE
FLAT
1.50 ± 0.15
(0.059 ± 0.006)
DIMENSION H
3
Device Selection Guide
Part Number
Typical Viewing Angle,
2 ½ (Degree)
Intensity (mcd) at 20 MA
Stando
Package
DimensionMin. Max.
HLMP-CW46-PS0xx 50 880 2500 No A
HLMP-CW46-QR0xx 50 1150 1900 No A
HLMP-CW46-QRBxx 50 1150 1900 No A
HLMP-CW46-RU0xx * 50 1500 4200 No A
HLMP-CW46-ST0xx * 50 1900 3200 No A
HLMP-CW46-STBxx * 50 1900 3200 No A
HLMP-CW47-PS0xx 50 880 2500 Yes B
HLMP-CW47-QR0xx 50 1150 1900 Yes B
HLMP-CW47-QRBxx 50 1150 1900 Yes B
HLMP-CW47-RU0xx * 50 1500 4200 Yes B
HLMP-CW47-ST0xx * 50 1900 3200 Yes B
HLMP-CW47-STBxx * 50 1900 3200 Yes B
HLMP-CW76-NR0xx 70 680 1900 No A
HLMP-CW76-PQ0xx 70 880 1500 No A
HLMP-CW76-PQBxx 70 880 1500 No A
HLMP-CW76-QT0xx * 70 1150 3200 No A
HLMP-CW76-RS0xx * 70 1500 2500 No A
HLMP-CW76-RSBxx * 70 1500 2500 No A
HLMP-CW77-NR0xx 70 680 1900 Yes B
HLMP-CW77-PQ0xx 70 880 1500 Yes B
HLMP-CW77-PQBxx 70 880 1500 Yes B
HLMP-CW77-QT0xx * 70 1150 3200 Yes B
HLMP-CW77-RS0xx * 70 1500 2500 Yes B
HLMP-CW77-RSBxx * 70 1500 2500 Yes B
* recommended for new designs.
Notes:
1. Tolerance for luminous intensity measurement is +/- 15%
2. The luminous intensity is measured on the mechanical axis of the lamp package.
3. The optical axis is closely aligned with the package mechanical axis.
4. 21/2 is the o -axis angle where the luminous intensity is ½ the on axis intensity
4
Figure 3. Relative Intensity versus DC Forward
Current
Figure 1. Relative Intensity vs. Wavelength Figure 2. Forward Current vs. Ambient Tempera-
ture
Absolute Maximum Rating at TA = 25oC
Parameters Value Unit
DC forward current [1] 30 mA
Peak pulsed forward current [2] 100 mA
Power dissipation 105 mW
LED junction temperature 110 C
Operating temperature range -40 to +85 C
Storage temperature range -40 to +100 C
Notes:
1. Derate linearly as shown in  gure 2.
2. Duty factor 10%, frequency 1KHz
Electrical/Optical Characteristics TA = 25oC
Parameters Symbol Min Typ Max Units Test Condition
Forward voltage VF3.2 4.0 V IF = 20 mA
Reverse Voltage [1] VR5.0 V IR = 10 mA
Thermal resistance RJ-PIN 240 C/W LED Junction to anode lead
Chromaticity Coordinates [2] XY 0.31
0.31
IF = 20 mA
Capacitance C 70 VF=0, f=1MHz
Notes:
1. The reverse voltage of the product is equivalent to the forward voltage of the protective chip at IR = 10 A
2. The chromaticity coordinates are derived from the CIE 1931 Chromaticity Diagram and represent the perceived color of the device.
0.0
0.2
0.4
0.6
0.8
1.0
380 480 580 680 780
WAVELENGTH - nm
RELATIVE LUMINOUS INTENSITY
0
5
10
15
20
25
30
35
0 20 40 60 80 100
AMBIENT TEMPERATURE - °C
IF - FORWARD CURRENT - mA
RθJ-A = 585°C/W
RθJ-A = 780°C/W
0
0.3
0.6
0.9
1.2
1.5
0102030
FORWARD CURRENT - mA
RELATIVE LUMINOUS INTENSITY
5
Figure 7. Spatial Radiation Pattern for CW7x
Figure 4. Chromaticity shift vs. Current
*Note: (x,y) values @ 20mA reference to (0,0)
Figure 5. Forward Current vs. Forward Voltage
Figure 6. Spatial Radiation Pattern for CW4x
Intensity Bin Limit Table
Bin
Intensity (mcd) at 20 mA
Min Max
N 680 880
P 880 1150
Q 1150 1500
R 1500 1900
S 1900 2500
T 2500 3200
U 3200 4200
Tolerance for each bin limit is ± 15%
-0.010
-0.005
0.000
0.005
0.010
0.015
0.020
0.025
-0.005 0.000 0.005 0.010 0.015
X-COORDINATES
Y-COORDINATES
30mA
20mA
10mA
5mA
1mA
0
5
10
15
20
25
30
2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6
VF - FORWARD VOLTAGE - VOLTS
IF - FORWARD CURRENT - mA
0
0.5
1
-90 -60 -30 0 30 60 90
ANGULAR DISPLACEMENT (°)
RELATIVE LUMINOUS INTENSITY
0
0.5
1
-90 -60 -30 0 30 60 90
ANGULAR DISPLACEMENT (°)
RELATIVE LUMINOUS INTENSITY
6
Color Bin Limit Table
Rank Limits (Chromaticity Coordinates)
1X 0.330 0.330 0.356 0.361
Y 0.360 0.318 0.351 0.385
2X 0.287 0.296 0.330 0.330
Y 0.295 0.276 0.318 0.339
3X 0.264 0.280 0.296 0.283
Y 0.267 0.248 0.276 0.305
4X 0.283 0.287 0.330 0.330
Y0.305 0.295 0.339 0.360
Tolerance for each bin limit is ± 0.01
Note:
1. Bin categories are established for classi cation of products. Products
may not be available in all bin categories. Please contact your Avago
Technologies representative for information on currently available
bins.
Color Bin Limits with Respect to CIE 1931 Chromaticity
Diagram
0.40
0.35
0.30
0.25
0.20
0.26 0.30 0.34 0.38
Y-COORDINATE
X-COORDINATE
3
2
41
BLACK
BODY
CURVE
Precautions:
Lead Forming:
The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering into PC board.
If lead forming is required before soldering, care must
be taken to avoid any excessive mechanical stress in-
duced to LED package. Otherwise, cut the leads of LED
to length after soldering process at room temperature.
The solder joint formed will absorb the mechanical
stress of the lead cutting from traveling to the LED
chip die attach and wirebond.
It is recommended that tooling made to precisely form
and cut the leads to length rather than rely upon hand
operation.
Soldering Condition:
Care must be taken during PCB assembly and solder-
ing process to prevent damage to LED component.
The closest LED is allowed to solder on board is
1.59mm below the body (encapsulant epoxy) for those
parts without stando .
Recommended soldering condition:
Wave
Soldering
Manual
Solder
Dipping
Pre-heat temperature 105 °C Max. -
Preheat time 30 sec Max -
Peak temperature 250 °C Max. 260 °C Max.
Dwell time 3 sec Max. 5 sec Max
Wave soldering parameter must be set and maintain
according to recommended temperature and dwell
time in the solder wave. Customer is advised to peri-
odically check on the soldering pro le to ensure the
soldering pro le used is always conforming to recom-
mended soldering condition.
If necessary, use  xture to hold the LED component
in proper orientation with respect to the PCB during
soldering process.
Proper handling is imperative to avoid excessive
thermal stresses to LED components when heated.
Therefore, the soldered PCB must be allowed to cool
to room temperature, 25°C before handling.
Special attention must be given to board fabrication,
solder masking, surface plating and lead holes size and
component orientation to assure solderability.
Recommended PC board plated through holes size for
LED component leads.
LED component
Lead size Diagonal
Plated through
hole diameter
0.457 x 0.457mm
(0.025 inch)
0.646 mm
(0.038 to 0.042 inch)
(0.018 x 0.018inch)
0.976 to 1.078 mm
0.508 x 0.508mm
(0.028 inch)
0.718 mm
(0.041 to 0.045 inch
(0.020 x 0.020inch)
1.049 to 1.150mm
Note: Refer to application note AN1027 for more information on solder-
ing LED components.
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
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Data subject to change. Copyright © 2005-2012 Avago Technologies. All rights reserved. Obsoletes 5989-4119EN
AV02-3629EN - June 15, 2012
Recommended Wave Soldering Pro le
BOTTOM SIDE
OF PC BOARD
TOP SIDE OF
PC BOARD
NOTE: ALLOW FOR BOARDS TO BE
SUFFICIENTLY COOLED BEFORE
EXERTING MECHANICAL FORCE.
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)
PREHEAT SETTING = 150 C (100 C PCB)
SOLDER WAVE TEMPERATURE = 245 C
AIR KNIFE AIR TEMPERATURE = 390 C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40
SOLDER: SN63; FLUX: RMA
250
200
150
FLUXING
TURBULENT WAVE
PREHEAT
TIME - SECONDS
TEMPERATURE - °C
100
50
30
0102030405060708090100
LAMINAR WAVE
HOT AIR KNIFE