6
Color Bin Limit Table
Rank Limits (Chromaticity Coordinates)
1X 0.330 0.330 0.356 0.361
Y 0.360 0.318 0.351 0.385
2X 0.287 0.296 0.330 0.330
Y 0.295 0.276 0.318 0.339
3X 0.264 0.280 0.296 0.283
Y 0.267 0.248 0.276 0.305
4X 0.283 0.287 0.330 0.330
Y0.305 0.295 0.339 0.360
Tolerance for each bin limit is ± 0.01
Note:
1. Bin categories are established for classi cation of products. Products
may not be available in all bin categories. Please contact your Avago
Technologies representative for information on currently available
bins.
Color Bin Limits with Respect to CIE 1931 Chromaticity
Diagram
0.40
0.35
0.30
0.25
0.20
0.26 0.30 0.34 0.38
Y-COORDINATE
X-COORDINATE
3
2
41
BLACK
BODY
CURVE
Precautions:
Lead Forming:
The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering into PC board.
If lead forming is required before soldering, care must
be taken to avoid any excessive mechanical stress in-
duced to LED package. Otherwise, cut the leads of LED
to length after soldering process at room temperature.
The solder joint formed will absorb the mechanical
stress of the lead cutting from traveling to the LED
chip die attach and wirebond.
It is recommended that tooling made to precisely form
and cut the leads to length rather than rely upon hand
operation.
Soldering Condition:
Care must be taken during PCB assembly and solder-
ing process to prevent damage to LED component.
The closest LED is allowed to solder on board is
1.59mm below the body (encapsulant epoxy) for those
parts without stando .
Recommended soldering condition:
Wave
Soldering
Manual
Solder
Dipping
Pre-heat temperature 105 °C Max. -
Preheat time 30 sec Max -
Peak temperature 250 °C Max. 260 °C Max.
Dwell time 3 sec Max. 5 sec Max
Wave soldering parameter must be set and maintain
according to recommended temperature and dwell
time in the solder wave. Customer is advised to peri-
odically check on the soldering pro le to ensure the
soldering pro le used is always conforming to recom-
mended soldering condition.
If necessary, use xture to hold the LED component
in proper orientation with respect to the PCB during
soldering process.
Proper handling is imperative to avoid excessive
thermal stresses to LED components when heated.
Therefore, the soldered PCB must be allowed to cool
to room temperature, 25°C before handling.
Special attention must be given to board fabrication,
solder masking, surface plating and lead holes size and
component orientation to assure solderability.
Recommended PC board plated through holes size for
LED component leads.
LED component
Lead size Diagonal
Plated through
hole diameter
0.457 x 0.457mm
(0.025 inch)
0.646 mm
(0.038 to 0.042 inch)
(0.018 x 0.018inch)
0.976 to 1.078 mm
0.508 x 0.508mm
(0.028 inch)
0.718 mm
(0.041 to 0.045 inch
(0.020 x 0.020inch)
1.049 to 1.150mm
Note: Refer to application note AN1027 for more information on solder-
ing LED components.