Preliminary
Data Sheet May 25, 2007
Proprietary Information and Specifications are Subject to Change
1
DFCM-MGC31
WLAN/ Bluetooth Combo Module
An IEEE 802.11g&b WLAN plus v2.0 + EDR
Bluetooth Module for various applications.
1. Features:
z Applications for cellular handsets and consumer electronic
devices that require low power consumption
z Compared with DFWM-MHG21
The same chip ( MARVELL 8686 ), the reusable software
The same radio performance
Lower power dissipation ( 22% current saved when Tx)
A 1.8V DC supply and a ref-clock source required
z Compared with DFBM-CS32x series
The same chip ( CSR BC4 ROM ), the reusable software
Great radio performance
A ref-clock source required
z Compact module size the same as DFWM-MHG21
z High isolation between integrated WLAN and BT circuits
z Two Crystal Mode/ Single XOSC Mode verified
z Single Antenna Mode/ Dual Antenna Mode supported
z 2WBCA (2-Wire Bluetooth Coexist Arbitration)/ 3WBCA
supported ( Please refer to the Section 2, Model No. Definition )
z Fine coexistence performance on embedded platforms
Preliminary
Data Sheet May 25, 2007
Proprietary Information and Specifications are Subject to Change
2
2. Combo Module Model No. Definition
D F C M - M G C 3 1 -D T U R
E=Pb free
R=RoHS
N=NG
L=Process with Lead
Customer code
Version
Free-lead
3= Ver2.0 + EDR
BT Spec
BT Chip
M= Module
C= Combo
F= FR4
L= LTCC
D= DELTA
G= IEEE 802.11bg
B= IEEE 802.11b
A= IEEE 802.11abg
WLAN Spec
WLAN Chip
Product-type
Property
Substrate
Company
M= Marvell
1= Representative version
2= w BT EEPROM, w 2WBCA only
3= w/o BT EEPROM, w 2W/ 3WBCA
U= USA FCC
C= Canada IC
E= Europe ETSI
S= Spain
F= France
J= Japan MKK
Country code
DT= Delta default
C= CSR
Preliminary
Data Sheet May 25, 2007
Proprietary Information and Specifications are Subject to Change
3
3. Block Diagram:
3.1 DFCM-MGC32
EEPROM
CSR BC4
( Bluetooth BB/RF )
Balun BPF
Antenna
PA
MARVELL 8686
( WLAN BB/MAC/RF )
RF Switch
Balun
EEPROM
BPF
Switch Control Signals
WLAN SDIO/ G-SPI
WLAN 1.8V DC SUPPLY
WLAN REF-CLK/ X’TAL
WLAN JTAG/ GPIO
WLAN 3.3V DC SUPPLY
WLAN SLEEP CLK
BT UART/ USB
BT REF-CLK/ X’TAL
BT SPI/ PIO
BT PCM INTERFACE
BT 3.3V DC SUPPLY
Antenna
2-WIRE
COEXISTENCE
CONNECTION
EEPROM
CSR BC4
( Bluetooth BB/RF )
Balun BPF
Antenna
PA
MARVELL 8686
( WLAN BB/MAC/RF )
RF Switch
Balun
EEPROM
BPF
Switch Control Signals
WLAN SDIO/ G-SPI
WLAN 1.8V DC SUPPLY
WLAN REF-CLK/ X’TAL
WLAN JTAG/ GPIO
WLAN 3.3V DC SUPPLY
WLAN SLEEP CLK
BT UART/ USB
BT REF-CLK/ X’TAL
BT SPI/ PIO
BT PCM INTERFACE
BT 3.3V DC SUPPLY
Antenna
2-WIRE
COEXISTENCE
CONNECTION
3.2 DFCM-MGC33
CSR BC4
( Bluetooth BB/RF )
Balun BPF
Antenna
PA
MARVELL 8686
( WLAN BB/MAC/RF )
RF Switch
Balun
EEPROM
BPF
Switch Control Signals
WLAN SDIO/ G-SPI
WLAN 1.8V DC SUPPLY
WLAN REF-CLK/ X’TAL
WLAN JTAG/ GPIO
WLAN 3.3V DC SUPPLY
WLAN SLEEP CLK
BT UART/ USB
BT REF-CLK/ X’TAL
BT SPI/ PIO
BT PCM INTERFACE
BT 3.3V DC SUPPLY
Antenna
2-WIRE/3-WIRE
COEXISTENCE
CONNECTION
CSR BC4
( Bluetooth BB/RF )
Balun BPF
Antenna
PA
MARVELL 8686
( WLAN BB/MAC/RF )
RF Switch
Balun
EEPROM
BPF
Switch Control Signals
WLAN SDIO/ G-SPI
WLAN 1.8V DC SUPPLY
WLAN REF-CLK/ X’TAL
WLAN JTAG/ GPIO
WLAN 3.3V DC SUPPLY
WLAN SLEEP CLK
BT UART/ USB
BT REF-CLK/ X’TAL
BT SPI/ PIO
BT PCM INTERFACE
BT 3.3V DC SUPPLY
Antenna
2-WIRE/3-WIRE
COEXISTENCE
CONNECTION
Preliminary
Data Sheet May 25, 2007
Proprietary Information and Specifications are Subject to Change
4
4. Dimensions (mm):
< TOP VIEW >
PIN1
5. Module Standard Brief
5.1 Whole Module
Item Specification
Package Type 101 pins LGA SMT Component
Dimension 10.9x10.9x1.6mm
Coexistence Type 2-Wire Mode/ 3-Wire Mode*
Storage Temperature -40℃ ~ +110℃
Storage Humidity 5~95%
Ambient Operating Temperature -25℃ ~ +80℃
Operating Humidity 10~90%
Baking Condition 125 /24hrs or 45 /192hrs℃℃
NOTE: * DFCM-MGC32: with a BT EEPROM inside, supports 2-Wire Mode only.
DFCM-MGC33: without a BT EEPROM inside, supports both of 2-Wire Mode
and 3-Wire Mode, Needs Host porting to boot Bluetooth
( Please also refer to the Section 2. Model No. Definition on page 2 )
Preliminary
Data Sheet May 25, 2007
Proprietary Information and Specifications are Subject to Change
5
5.2 WLAN Section
Item Specification
Chip Solution MARVELL 8686
Product Standard Compliant with IEEE 802.11, 802.11b and 802.11g
Operation Voltage 3.0~3.3V and 1.7~1.9V
Host Interface SDIO and G-SPI
Host Requirement External 1.8V power supply and reference clock source
OS and Driver Support WinCE/ WinMobile 5.0, Linux2.6, WinXP and WinVista
Security Support 64/128-bit WEP with hardware TKIP processing, WPA and
WPA2 with AES-CCMP hardware implementation
5.3 Bluetooth Section
Item Specification
Chip Solution CSR BC4 ROM
Product Standard Compliant with Bluetooth v2.0 + EDR
Operation Voltage 2.2~3.6V
Host Interface UART and USB
Host Requirement External reference clock source
OS and Driver Support WinCE/ WinMobile 5.0, Linux2.6, WinXP and WinVista
Preliminary
Data Sheet May 25, 2007
Proprietary Information and Specifications are Subject to Change
6
6. Recommended Reflow Profile:
6.1 Reflow Soldering Profile
NOTE: 1. Reflow soldering is recommended two times maximum.
2. If your soldering conditions are different from our recommendation,
please feel free to consult with us.
No. Item Temperature (°C) Time (sec)
1 Pre-heat D1: 140 ~ D2: 200 T1: 60 ~ 120
2 Soldering D2: >= 200 T2: 80 max
3 Peak-Temp. D3: 250 °C max
6.2 Soldering Iron Condition
(1) Temperature: 350 ℃ max
(2) Duration: 4 sec max (1 part)
(3) Capacity: 30W max
Preliminary
Data Sheet May 25, 2007
Proprietary Information and Specifications are Subject to Change
7
7. WLAN Software Support:
7.1 Standard Software Platforms
Item. Host Operating System SDIO Interface G-SPI Interface
1 WinCE/ WinMobile (v5.0) Available Available
2 Linux (Kernel v2.6) Available Available
3 WinXP Available Not yet
4 WinVista Available Not yet
7.2 G-SPI Software Features
Item. Features Item Features (Continued)
1 802.11b/g Infrastructure scan,
associate and ping
15 802.11d
2 802.11b/g Ad-Hoc mode scan,
associate and ping
16 WMM (Linux only)
3 IEEE Power Save 17 Background Scan in Deep Sleep
Mode
4 Ad-Hoc Security (WEP only) 18 Bluetooth Co-existence
5 Infra WEP 19 Host Sleep (Infrastructure Mode
only)
6 Infra WPA/802.1x 20 Ad-Hoc Power Save
7 Infra WPA2 -- --
8 Reserved -- --
9 TPC -- --
10 Deep Sleep -- --
11 CCX v1 (driver and firmware
support only; no supplicant )
-- --
12 Subscribe Event API -- --
13 Local Listen Interval Field Added to
Power Save (Enter) Command
-- --
14 UAPSD -- --
Preliminary
Data Sheet May 25, 2007
Proprietary Information and Specifications are Subject to Change
8
7.3 SDIO Software Features
Item. Features Item Features (Continued)
1 802.11b/g Infrastructure scan,
associate and ping
16 WMM (Linux only)
2 802.11b/g Ad-Hoc mode scan,
associate and ping
17 Background Scan in Deep Sleep
Mode
3 IEEE Power Save 18 Bluetooth Co-existence
4 Ad-Hoc Security (WEP only) 19 Host Sleep (Infrastructure Mode
only)
5 Infra WEP 20 Ad-Hoc Power Save
6 Infra WPA/802.1x 21 Background Scan in Infra Mode
7 Infra WPA2 22 Background Scan wit Infra IEEE PS
8 SDIO interface support (SDIO only) 23 Inactivity Timeout
9 TPC 24 CCX v2 ASD (driver and firmware
support only; no supplicant )
10 Deep Sleep 25 CCX v3 ASD (driver and firmware
support only; no supplicant )
11 CCX v1 (driver and firmware
support only; no supplicant )
26 Null packet screen before Host
Wakeup
12 Subscribe Event API 27 Crypto API to host (AES, RC4)
13 Local Listen Interval Field Added to
Power Save (Enter) Command
28 UAPSD for legacy APs
14 UAPSD 29 CCX v4 ASD (driver and firmware
support only; no supplicant )
15 802.11d -- --
NOTE: Please contact DELTA to get more information about the software support for
different OS platforms.
Preliminary
Data Sheet May 25, 2007
Proprietary Information and Specifications are Subject to Change
9
10. Revision History:
Date Description Maker
2007/04/20 Initial release Jim.Chen
2007/05/25 Update the module’s photo, features, model
number definition
Jim.Chen
Contact information:
Website: http://www.deltaww.com
Email: Richard.meng@delta.com.tw (Worldwide)
