2/8 TAI-SAW TECHNOLOGY CO., LTD. Crystal Unit SMD 3.2x2.5 26.0MHz MODEL NO.: TZ0260A REV. NO.: 8 Revise: Rev. Rev. Page Rev. Account Date Ref. No. Revised by 1 2 3 4 5 6 7 8 N/A 3 3 3 3 3 5 4 Initial release Spec. updated Spec. updated Spec. updated Spec. updated Spec. updated Changed T/R drawing Add base 2 drawing 08/27/03 02/18/04 03/21/05 08/12/05 08/28/06 02/08/07 07/01/09 04/29/10 N/A N/A N/A N/A N/A N/A ECN-200900240 ECN-201000161 Ann Liu Ann Liu Ann Liu Ann Liu Ann Liu Ann Liu Ann Liu Ann Liu TAI-SAW TECHNOLOGY CO., LTD. TST DCC Release document 3/8 TAI-SAW TECHNOLOGY CO., LTD. Crystal Unit SMD 3.2x2.5 26.0MHz MODEL NO.: TZ0260A REV. NO.: 8 Features: RoHS Compliant Lead free Lead-free soldering Surface Mount Hermetic Package Excellent Reliability Performance Good Frequency Perturbation and Stability over temperature Ultra Miniature Package Description and Applications: Surface mount 3.2mmx2.5mm crystal unit for use in wireless communications devices, especially for a need of ultra miniature package for mobility. Electrical Specifications: TZ0260A Specification Nominal Frequency 26.000000 MHz Mode of Oscillation Fundamental Storage Temperature Range -40C to +85C Operating Temperature Range -20C to +70C Frequency Stability over Operating Temperature Range +/-10 ppm (referred to the value at 25C) Frequency Make Tolerance (FL) +/-10 ppm @ 25C +/- 3C Equivalent Series Resistance (ESR) 60 max. Nominal Drive Level 100 Uw,200uW max. Shunt Capacitance (Co) 3.0 pF max Load Capacitance (CL) 12 pF Insulation Resistance 500 M min./DC 100V Aging +/-1ppm/year Marking Laser Marking Unit Weight 0.017+/-0.005 g TAI-SAW TECHNOLOGY CO., LTD. TST DCC Release document 4/8 Mechanical Dimensions (mm): Base 1 #1 pin #2 pin #3 pin #4 pin Pin Connection IN/OUT GND IN/OUT GND Base 2 Recommended Land Pattern: (unit: mm) Marking: Line 1: Frequency (26.00) Line 2: TST Logo + Crystal Product Code + Date Code TAI-SAW TECHNOLOGY CO., LTD. TST DCC Release document 5/8 Product Code Table Date Code Table WK01 WK02 WK03 WK04 WK05 WK06 WK07 WK08 WK09 WK10 WK11 WK12 A B C D E F G H I J K L WK13 M WK14 WK15 WK16 WK17 WK18 WK19 WK20 WK21 WK22 WK23 WK24 WK25 WK26 N O P Q R S T U V W X Y Z WK27 WK28 WK29 WK30 WK31 WK32 WK33 WK34 WK35 WK36 WK37 WK38 WK39 a b c d e f g h i j k l m WK40 WK41 WK42 WK43 WK44 WK45 WK46 WK47 WK48 WK49 WK50 WK51 WK52 n o p q r s t u v w x y z Reel Dimensions (mm): TAI-SAW TECHNOLOGY CO., LTD. TST DCC Release document 6/8 Tape Dimensions (mm): [NOTE] 1 UNIT : mm. 2 UNLESS OTHERWISE SPECIFIED TOLERANCEON DIM. +/-0.1mm. 3 MATERIAL : CONDUCTIVE POLYSTYRENE. 4 COLOR : BLACK. 5 10 PITCHES CUMULATIVETOLERANCE +/-0.2mm. Packing Quantity/Packing: 3K pcs maximum per reel TAI-SAW TECHNOLOGY CO., LTD. TST DCC Release document 7/8 Reflow Profile: Note: 1.Max peak temperature: 260+/-5 deg C; Time: 10+/-2 sec 2. Temperature: 217+/-5 deg C; Time: 90~100 sec TAI-SAW TECHNOLOGY CO., LTD. TST DCC Release document 8/8 Reliability Specifications Test name Reference standard Test process / method Mechanical characteristics resistance to Soldering heat (IR reflow) Temp./ Duration : 260C /10sec x2 times Total time : 4min.(IR-reflow) Vibration Total peak amplitude : 1.5mm Vibration frequency : 10 to 55 Hz Sweep period : 1.0 minute Vibration directions : 3 mutually perpendicular Duration : 2 hr / direc. directions : 3 impacts per axis Acceleration : 3000g's, +20/-0 % Duration : 0.3 ms (total 18 shocks) Waveform : Half-sine Solder Temperature:2655C Duration time: 50.5 seconds. Mechanical Shock Solderability EIAJED-4701 -300(301)M(II) MIL-STD 202F method 201A MIL-STD 202F method 213C MIL-STD 883G method 2003 Environmental characteristics Thermal Shock Humidity test Dry heat ( Aging test ) PCT test Heat cycle conditions -55 (30min) * cycle time : 10 times 125 (30min) Temperature : 70 2 C Relative humidity : 90~95% Duration : 96 hours Temperature : 125 2 C Duration : 168 hours 2 MIL-STD 883G method 1010.7 MIL-STD 202F method 103B 5 Pressure: 2.06kg/cm (2.03*10 pa) Temperature : 121 2 C Relative humidity : 100% Duration : 24 hours TAI-SAW TECHNOLOGY CO., LTD. MIL-STD 883G method 1008.2 condition C EIAJED-4701-3 B-123A TST DCC Release document