B0530
0.5A SURFACE MOUNT SCHO TTKY BARRIER RECTIFIER
Features
• Low Forward Voltage Drop
• Guard Ring Die Construction for Transient Protection
• High Conductance
• Lead, Halogen and Antimony Free, RoHS Compliant
"Green" Device (Notes 3 and 4)
Mechanical Data
• Case: SOD-123
• Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020D
• Lead Free Plating (Matte Tin Finish annealed over Alloy 42
leadframe) Solderable per MIL-STD-202, Method 208
• Polarity: Cathode Band
• Marking Information: See Page 3
• Ordering Information: See Page 3
• Weight: 0.01 grams (approximate)
Top View
Maximum Ratings @TA = 25°C unless otherwise specified
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitance load, derate current by 20%.
Characteristic Symbol Value Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR 30 V
RMS Reverse Voltage VR(RMS) 21 V
Average Rectified Output Current @ TL = 100°C IO 0.5 A
Non-Repetitive Peak Forward Surge Current 8.3ms
Single Half Sine-Wave Superimposed on Rated Load IFSM 5.5 A
Thermal Characteristics
Characteristic Symbol Value Unit
Power Dissipation (Note 1) PD 410 mW
Typical Thermal Resistance Junction to Ambient (Note 1) RθJA 244 °C/W
Operating and Storage Temperature Range TJ, TSTG -65 to +125 °C
Electrical Characteristics @TA = 25°C unless otherwise specified
Characteristic Symbol Value Unit Test Conditions
Minimum Reverse Breakdown Voltage (Note 2) V(BR)R 30 V IR = 130μA
Maximum Forward Voltage Drop VFM 0.375
0.430 V IF = 0.1A, TJ = 25°C
IF = 0.5A, TJ = 25°C
Maximum Leakage Current (Note 2) IRM 20
130 μA VR = 15V, TJ = 25°C
VR = 30V, TJ = 25°C
Total Capacitance CT 170 pF f = 1MHz, VR = 0V DC
Notes: 1. Device mounted on FR-4 PC board, 2"x2", 2 oz. Copper, single sided, Cathode pad dimensions 0.75"x1.0", Anode pad dimensions 0.25"x1.0".
2. Pulse Test: Pulse width = 300μs, Duty Cycle ≤ 2%.
3. No purposefully added lead. Halogen and Antimony Free.
4. Product manufactured with Data Code V9 (week 33, 2008) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code V9 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
B0530W
Document number: DS30139 Rev. 9 - 2 1 of 3
www.diodes.com June 2008
© Diodes Incorporated
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