1
Features
Incorporates the ARM7TDMI ARM® Thumb® Processor Core
High-performance 32-bit RISC Architecture
High-density 16-bit Instruction Set
Leader in MIPS/Watt
Embedded ICE (In-Circuit Emulation)
136K Bytes of On-chip SRAM
32-bit Data Bus
Single-clock Cycle Access
Fully-programmable External Bus Interface (EBI)
Maximum External Address Space of 64M Bytes
Up to Eight Chip Selects
Software Programmable 8-/16-bit External Data Bus
8-level Priority, Individually Maskable, Vectored Interrupt Controller
Four External Interrupts, Including a High-priority Low-latency Interrupt Request
32 Programmable I/O Lines
Three-channel 16-bit Timer/Counter
Three External Clock Inputs
Two Multi-purpose I/O Pins per Channel
Two USARTs
Two Dedicated Peripheral Data Controller (PDC) Channels per USART
Programmable Watchdog Timer
Advanced Power-saving Features
CPU and Peripherals Can be Deactivated Individually
Fully Static Operation: 0 Hz to 33 MHz Internal Frequency Range at 3.0 V, 85°C
1.8V to 3.6V Operating Range
Available in a 100-lead TQFP Package
Description
The AT91R40807 microcontroller is a member of the Atmel AT91 16-/32-bit microcon-
troller family, which is based on the ARM7TDMI processor core. This processor has a
high-performance 32-bit RISC architecture with a high-density 16-bit instruction set
and very low power consumption. In addition, a large number of internally banked reg-
isters result in very fast exception handling, making the device ideal for real-time
control applications.
The AT91R40807 microcontroller features a direct connection to off-chip memory,
including Flash, through the fully-programmable External Bus Interface (EBI). An
eight-level priority vectored interrupt controller, in conjunction with the Peripheral Data
Controller, significantly improves the real-time performance of the device.
The device is manufactured using Atmel’s high-density CMOS technology. By combin-
ing the ARM7TDMI processor core with a large on-chip high-speed SRAM and a wide
range of peripheral functions on a monolithic chip, the AT91R40807 is a powerful
microcontroller that offers a flexible and high-performance solution to many compute-
intensive embedded control applications.
AT91
ARM® Thumb®
Microcontroller
s
AT91R40807
Electrical
Characteristics
Rev. 1367C–01/02
2AT91R40807
1367C–01/02
Absolute Maximum Ratings*
DC Characteristics
The following characteristics are applicable to the Operating Temperature range: TA = -40°C to +85°C, unless otherwise
specified and are certified for a Junction Temperature up to TJ = 100°C.
Operating Temperature (Industrial) ....-40°C to + 85°C*NOTICE: Stresses beyond those listed under “Absolute Maxi-
mum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional
operation of the device at these or other conditions
beyond those indicated in the operational sections of
this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may
affect device reliability.
Storage Temperature........................-60°C to + 150°C
Voltage on Any Input Pin
with Respect to Ground......................-0.5V to + 3.9V
Maximum Operating Voltage ................................4.6V
DC Output Current ..............................................6 mA
Table 1. DC Characteristics
Symbol Parameter Conditions Min Typ Max Units
VDD DC Supply 1.8 3.6 V
VIL Input Low Voltage VDD = 3.0V to 3.6V -0.3 0.3 x VDD V
VIH Input High Voltage VDD= 3.0V to 3.6V 0.7 x VDD VDD + 0.3 V
VOL Output Low Voltage IOL = 0.3 mA, VDD = 3.0V 0.1 V
VOH Output High Voltage IOH = 0.3 mA, VDD = 3.0V VDD - 0.1 V
ILEAK Input Leakage Current 390 nA
IPULL Input Pull-up Current VDD = 3.6V, VIN = 0V 350 µA
CIN Input Capacitance 6.8 pF
ISC Static Current
VDD = 3.6V;
MCKI = 0 Hz TA = 25°C 45
µA
All inputs driven TMS, TDI,
TCK, NRST = 1 TA = 85°C 900
3
AT91R40807
1367C–01/02
Power
Consumption
The values in the following tables are measured values in the operating conditions indicated
(i.e., VDD = 3.3V or 2.0V, TA = 25°C) on the AT91EB40 Evaluation Board.
Table 2. Power Consumption
Mode Conditions
VDD
Units2.0V 3.3V
Reset 0.08 0.20
mW/MHz
Normal
Fetch in ARM mode out of internal SRAM
All peripheral clocks activated
1.56 5.34
Fetch in ARM mode out of internal SRAM
All peripheral clocks deactivated
1.39 4.64
Idle All peripheral clocks activated 0.41 1.34
All peripheral clocks deactivated 0.14 1.00
Table 3. Power Consumption per Peripheral
Peripheral
VDD
Units2.0V 3.3V
PIO Controller 0.03 0.12
mW/MHz
Timer/Counter Channel 0.02 0.10
Timer/Counter Block (3 Channels) 0.06 0.31
USART 0.04 0.18
4AT91R40807
1367C–01/02
Thermal and
Reliability
Considerations
Thermal Data In Table 4, the device lifetime is estimated with the MIL-217 standard in the “moderately con-
trolled” environmental model (this model is described as corresponding to an installation in a
permanent rack with adequate cooling air), depending on the device Junction Temperature.
(For details see the section “Junction Temperature” on page 5.)
Note that the user must be extremely cautious with this MTBF calculation: as the MIL-217
model is pessimistic with respect to observed values due to the way the data/models are
obtained (test under severe conditions). The life test results that have been measured are
always better than the predicted ones.
Table 5 summarizes the thermal resistance data related to the package of interest
Reliability Data The number of gates and the device die size are provided for the user to calculate reliability
data with another standard and/or in another environmental model.
Table 4. MTBF Versus Junction Temperature
Junction Temperature (TJ) (°C) Estimated Lifetime (MTBF) (Year)
100 13
125 7
150 4
175 2
Table 5. Thermal Resistance Data
Symbol Parameter Condition Package Typ Units
θJA=Junction-to-ambient thermal resistance Still Air TQFP100 40 °C/W
θJC Junction-to-case thermal resistance TQFP100 6.4
Table 6. Reliability Data
Parameter Data Unit
Number of Logic Gates 272 K gates
Number of Memory Gates 7,006 K gates
Device Die Size 59.8 mm2
5
AT91R40807
1367C–01/02
Junction
Temperature
The average chip-junction temperature TJ in °C can be obtained from the following:
1.
2.
Where:
θJA = package thermal resistance, Junction-to-ambient (°C/W), provided in Table 5 on
page 4.
θJC = package thermal resistance, Junction-to-case thermal resistance (°C/W), provided in
Table 5 on page 4.
θHEAT SINK = cooling device thermal resistance (°C/W), provided in the device datasheet.
•P
D = device power consumption (W) estimated from data provided in the section “Power
Consumption” on page 3.
•T
A = ambient temperature (°C).
From the first equation, the user can derive the estimated lifetime of the chip and thereby
decide if a cooling device is necessary or not. If a cooling device is to be fitted on the chip, the
second equation should be used to compute the resulting average chip-junction temperature
TJ in °C.
TJTAPDθJA
×()+=
TJTAP(Dθ( HEATSINK
×θ
JC ))++=
6AT91R40807
1367C–01/02
Conditions
Timing Results The delays are given as typical values in the following conditions:
VDD = 3.3V
Ambient Temperature = 25°C
Load Capacitance is 0 pF
The output level change detection is (0.5 x VDD).
The input level is (0.3 x VDD) for a low-level detection and is (0.7 x VDD) for a high level
detection.
The minimum and maximum values given in the AC characteristics tables of this datasheet
take into account the process variation and the design.
In order to obtain the timing for other conditions, the following equation should be used:
where
δ is the derating factor in temperature given in the Figure 1 on page 7.
δVDD is the derating factor for the Power Supply given in Figure 2 on page 7.
•t
datasheet is the minimum or maximum timing value given in this datasheet for a load
capacitance of 0 pF.
•C
Signal is the capacitance load on the considered output pin.(1)
δCSignal is the load derating factor depending on the capacitance load on the related output
pins given in Min and Max in this datasheet.
The input delays are given as typical value.
Note: 1. The user must take into account the package capacitance load contribution (CIN) described
in Table 1 on page 2.
tδT°δVDD
×t(DATASHEET
×CSIGNAL δCSIGNAL
×())+=
7
AT91R40807
1367C–01/02
Temperature
Derating Factor
Figure 1. Derating Curve for Different Operating Temperatures
Voltage Derating
Factor
Figure 2. Derating Curve for Different Supply Voltages
Note: This derating factor is applicable only to timings related to output pins.
0.8
0.9
1
1.1
1.2
1.3
-60 -40 -20 0 20 40 60 80 100 120 140 160 180
Operating Temperature (°C)
Derating Factor
Derating Factor for
Typ Case is 1
0.90
0.95
1.00
1.05
1.10
1.15
1.20
1.25
1.30
1.35
1.40
1.45
1.50
1.55
1.60
1.65
1.70
2.02.22.42.62.83.03.23.43.6
Supply Voltage (V)
Derating Factor
Derating Factor for
Typ Case is 1
8AT91R40807
1367C–01/02
Clock Waveforms
Figure 3. Clock Waveform
Table 7. Clock Waveform Parameters
Symbol Parameter Conditions Min Max Units
1/(tCP) Oscillator Frequency 42.6 MHz
tCP Oscillator Period 23.5
ns
tCH High Half-period 0.45 x tCP 0.55 x tCP
tCL Low Half-period 0.45 x tCP 0.55 x tCP
trRising Edge TBD
tfFalling Edge TBD
Table 8. Clock Propagation Times
Symbol Parameter Conditions Min Max Units
tCDLH Rising Edge Propagation Time CMCKO = 0 pF 4.6 7.2 ns
CMCKO derating 0.032 0.05 ns/pF
tCDHL Falling Edge Propagation Time CMCKO = 0 pF 5.8 9.0 ns
CMCKO derating 0.032 0.05 ns/pF
tCH
tCL
tCP
MCKI
MCKO
tCDLH tCDHL
0.7 VDD
trtf
0.3 VDD
0.5 VDD 0.5 VDD
9
AT91R40807
1367C–01/02
Figure 4. MCKO Relative to NRST
Table 9. NRST to MCKO
Symbol Parameter Min Max Units
tDNRST Rising Edge to MCKO Valid Time 3(tCP/2) 7(tCP/2) ns
NRST
tD
MCKO
10 AT91R40807
1367C–01/02
AC Characteristics
EBI Signals Relative to MCKI
The following tables show timings relative to operating condition limits defined in in the section “Conditions” on page 6.
See Figure 5 on page 14.
Table 10. General-purpose EBI Signals
Symbol Parameter Conditions Min Max Units
EBI1MCKI Falling to NUB Valid CNUB = 0 pF 5.9 11.6 ns
CNUB derating 0.032 0.05 ns/pF
EBI2MCKI Falling to NLB/A0 Valid CNLB = 0 pF 5.2 8.8 ns
CNLB derating 0.032 0.05 ns/pF
EBI3MCKI Falling to A1 - A23 Valid CADD = 0 pF 4.7 9.9 ns
CADD derating 0.032 0.05 ns/pF
EBI4MCKI Falling to Chip Select Change CNCS = 0 pF 5.3 10.8 ns
CNCS derating 0.032 0.05 ns/pF
EBI5NWAIT Setup before MCKI Rising 0.5 ns
EBI6NWAIT Hold after MCKI Rising 3.0 ns
11
AT91R40807
1367C01/02
Notes: 1. The derating factor is not to be applied to tCH or tCP
..
2. n = number of wait states inserted.
Table 11. EBI Write Signals
Symbol Parameter Conditions Min Max Units
EBI7MCKI Rising to NWR Active (No Wait States) CNWR = 0 pF 4.3 7.5 ns
CNWR derating 0.032 0.05 ns/pF
EBI8MCKI Rising to NWR Active (Wait States) CNWR = 0 pF 4.9 8.5 ns
CNWR derating 0.032 0.05 ns/pF
EBI9MCKI Falling to NWR Inactive (No Wait States) CNWR = 0 pF 5.1 8.8 ns
CNWR derating 0.032 0.049 ns/pF
EBI10 MCKI Rising to NWR Inactive (Wait States) CNWR = 0 pF 4.6 8.0 ns
CNWR derating 0.032 0.049 ns/pF
EBI11 MCKI Rising to D0 - D15 Out Valid CDATA = 0 pF 4.0 9.1 ns
CDATA derating 0 0.051 ns/pF
EBI12 NWR High to NUB Change CNUB = 0 pF 3.3 7.2 ns
CNUB derating 0.031 0.05 ns/pF
EBI13 NWR High to NLB/A0 Change CNLB = 0 pF 3.2 5.6 ns
CNLB derating 0.032 0.05 ns/pF
EBI14 NWR High to A1 - A23 Change CADD = 0 pF 2.7 7.1 ns
CADD derating 0.032 0.05 ns/pF
EBI15 NWR High to Chip Select Inactive CNCS = 0 pF 3.0 6.8 ns
CNCS derating 0.031 0.05 ns/pF
EBI16
Data Out Valid before NWR High (No Wait
States) (1)
C = 0 pF tCH - 1.1 ns
CDATA derating -0.051 ns/pF
CNWR derating 0.049 ns/pF
EBI17
Data Out Valid before NWR High
(Wait States) (1)
C = 0 pF n x tCP - 1.9 (2) ns
CDATA derating -0.051 ns/pF
CNWR derating 0.049 ns/pF
EBI18 Data Out Valid after NWR High 2.1 ns
EBI19
NWR Minimum Pulse Width
(No Wait States) (1)
tCH + 0.4 ns
EBI20 NWR Minimum Pulse Width (Wait States) (1) n x tCP - 1.2 (2) ns
12 AT91R40807
1367C01/02
Notes: 1. Early Read Protocol.
2. Standard Read Protocol.
3. The derating factor is not to be applied to tCH or tCP
..
4. n = number of standard wait states.
5. Only one of these two timings needs to be met.
Table 12. EBI Read Signals
Symbol Parameter Conditions Min Max Units
EBI21 MCKI Falling to NRD Active (1) CNRD = 0 pF 5.5 9.6 ns
CNRD derating 0.032 0.05 ns/pF
EBI22 MCKI Rising to NRD Active (2) CNRD = 0 pF 4.1 8.5 ns
CNRD derating 0.032 0.05 ns/pF
EBI23 MCKI Falling to NRD Inactive (1) CNRD = 0 pF 5.5 8.8 ns
CNRD derating 0.031 0.049 ns/pF
EBI24 MCKI Falling to NRD Inactive (2) CNRD = 0 pF 5.1 8.0 ns
CNRD derating 0.031 0.049 ns/pF
EBI25 D0 - D15 in Setup Before MCKI Falling (5) -1.2 ns
EBI26 D0 - D15 in Hold After MCKI Falling (5) 3.5 ns
EBI27 NRD High to NUB Change CNUB = 0 pF 3.6 7.3 ns
CNUB derating 0.031 0.05 ns/pF
EBI28 NRD High to NLB/A0 Change CNLB = 0 pF 3.2 5.1 ns
CNLB derating 0.032 0.05 ns/pF
EBI29 NRD High to A1 - A23 Change CADD = 0 pF 2.8 6.5 ns
CADD derating 0.032 0.049 ns/pF
EBI30 NRD High to Chip Select Inactive CNCS = 0 pF 3.0 6.2 ns
CNCS derating 0.031 0.049 ns/pF
EBI31 Data Setup Before NRD High (5) CNRD = 0 pF 6.9 ns
CNRD derating 0.048 ns/pF
EBI32 Data Hold After NRD High (5) CNRD = 0 pF -2.9 ns
CNRD derating -0.031 ns/pF
EBI33 NRD Minimum Pulse Width (1, 3)
CNRD = 0 pF (n + 1) x
tCP - 1.1(4)
ns
CNRD derating -0.001 ns/pF
EBI34 NRD Minimum Pulse Width (2, 3)
CNRD = 0 pF n x tCP +
(tCH - 0.5)(4)
ns
CNRD derating -0.001 ns/pF
13
AT91R40807
1367C01/02
Notes: 1. If this condition is not met, the action depends on the read protocol intended for use.
Early Read Protocol: Programing an additional tDF (Data Float Output Time) cycle.
Standard Read Protocol: Programming an additional tDF Cycle and an additional wait state.
2. Applicable only for chip select programmed with 0 wait state. If this condition is not met, at least one wait state must be
programmed.
Table 13. EBI Read and Write Control Signals. Capacitance Limitation
Symbol Parameter Conditions Min Max Units
TCPLNRD(1) Master Clock Low Due to NRD Capacitance CNRD = 0 pF 9.2 ns
CNRD derating 0.048 ns/pF
TCPLNWR(2) Master CLock Low Due to NWR Capacitance CNWR = 0 pF 9.6 ns
CNWR derating 0.049 ns/pF
14 AT91R40807
1367C01/02
Figure 5. EBI Signals Relative to MCKI
Notes: 1. Early Read Protocol.
2. Standard Read Protocol.
NCS
A1 - A23
NRD(1)
D0 - D15 Read
MCKI
NUB/NLB/A0
NRD(2)
NWAIT
NWR (No Wait States)
D0 - D15 to Write
NWR (Wait States)
No Wait Wait
EBI1/EBI2
EBI3
EBI4
EBI5EBI6
EBI7EBI9
EBI8EBI10
EBI11
EBI21
EBI22
EBI25 EBI26
EBI23
EBI4
EBI27-30
EBI12-15
EBI16 EBI18 EBI18
EBI33
EBI24
EBI34
EBI31 EBI32
EBI19
EBI20
CS
EBI17
15
AT91R40807
1367C01/02
Peripheral Signals
USART Signals The inputs must meet the minimum pulse width and period constraints shown in Table 14 and
Table 15, and represented in Figure 6.
Figure 6. USART Signals
Table 14. USART Asynchronous Mode Input Minimum Pulse Width
Symbol Parameter Min Pulse Width Units
US1SCK/RXD Minimum Pulse Width 5(tCP/2) ns
Table 15. USART Minimum Input Period
Symbol Parameter Min Input Period Units
US2SCK Minimum Input Period 9(tCP/2) ns
SCK
RXD
US1
US1
US2
16 AT91R40807
1367C01/02
Timer/Counter Signals Due to internal synchronization of input signals, there is a delay between an input event and a
corresponding output event. This delay is 3(tCP) in Waveform Event Detection mode and 4(tCP)
in Waveform Total-count Detection mode. The inputs have to meet the minimum pulse width
and minimum input period shown in Tables 16 and 17 and as represented in Figure 7.
Figure 7. Timer Input
Reset Signals A minimum pulse width is necessary as shown in Table 18 and as represented in Figure 8.
Figure 8. Reset Signal
Only the NRST rising edge is synchronized with MCKI. The falling edge is asynchronous.
Table 16. Timer Input Minimum Pulse Width
Symbol Parameter Min Pulse Width Units
TC1TCLK/TIOA/TIOB Minimum Pulse Width 3(tCP/2) ns
Table 17. Timer Input Minimum Period
Symbol Parameter Min Input Period Units
TC2 TCLK/TIOA/TIOB Minimum Input Period 5(tCP/2) ns
MCKI
TIOA/TIOB/TCLK
TC1
3(tCP/2) 3(tCP/2)
TC2
Table 18. Reset Minimum Pulse Width
Symbol Parameter Min Pulse Width Units
RST1NRST Minimum Pulse Width 10(tCP)ns
NRST
RST1
17
AT91R40807
1367C01/02
Advanced Interrupt
Controller Signals
Inputs must meet the minimum pulse width and mimimum input period shown in Table 19 and
Table 20 and represented in Figure 9.
Figure 9. AIC Signals
Parallel I/O Signals The inputs must meet the minimum pulse width shown in Table 21 and as represented in Fig-
ure 10.
Figure 10. PIO Signal
Table 19. AIC Input Minimum Pulse Width
Symbol Parameter Min Pulse Width Unit
AIC1FIQ/IRQ0/IRQ1/IRQ2/IRQ3 Minimum
Pulse Width
3(tCP/2) ns
Table 20. AIC Input Minimum Period
Symbol Parameter Min Input Period Unit
AIC2AIC Minimum Input Period 5(tCP/2) ns
MCKI
FIQ/IRQ0/IRQ1/IRQ2/IRQ3
Input
AIC1
AIC2
Table 21. PIO Input Minimum Pulse Width
Symbol Parameter Min Pulse Width Units
PIO1PIO Input Minimum Pulse Width 3(tCP/2) ns
PIO
Inputs
PIO1
18 AT91R40807
1367C01/02
ICE Interface Signals
Figure 11. ICE Interface Signals
Table 22. ICE Interface Timing Specifications
Symbol Parameter Conditions Min Max Units
ICE0NTRST Minimum Pulse width 18.8
ns
ICE1NTRST High Recovery to TCK High 1.3
ICE2NTRST High Removal from TCK High -0.3
ICE3TCK Low Half-period 41.7
ICE4TCK High Half-period 40.9
ICE5TCK Period 82.5
ICE6TDI, TMS Setup Before TCK High 0.5
ICE7TDI, TMS Hold After TCK High 0.6
ICE8TDO Hold Time 5.0
ICE9TCK Low to TDO Valid CTDO = 0 pF 10.0
CTDO derating 0.05 ns/pF
TCK
ICE3ICE4
ICE7
ICE6
ICE9
ICE8
T
MS/TDI
TDO
ICE0
ICE5
NTRST
ICE1ICE2
19
AT91R40807
1367C01/02
Document Details
Title AT91R40807 Electrical Characteristics
Literature Number Lit# 1367C
Revision History
Version A Publication Date: Apr, 2000
Version B Publication Date: Nov, 2000
Version C Publication Date: 10, Dec, 2001
Revisions Since Previous Version published on Intranet
Page: 1 Features Fully Static Operation: 0 Hz to 33 MHz Internal Frequency Range at 3.0 V, 85°C
..... frequency and range modified
Page: 4 Reliability Data paragraph modified and new table inserted. Table 6 Reliability Data
Page: 6 Timing Results Cross reference added to CSIGNAL part of equation.
Page: 8 Table 7. Master Clock Waveform Parameters. Values have been changed for Oscillator Fre-
quency and Oscillator Period. Some master clock parameters deleted.
Page: 10 Table 10. General-purpose EBI Signals. EBI4, Conditions are changed.
Page: 13 New table inserted. Table 13. Read and Write Control Signals. Capacitance Limitation. This
table adds understanding to EBI Signals Relative to MCK.
© Atmel Corporation 2001.
Atmel Corporation makes no warranty for the use of its products, other than those expressly contained in the Companys standard warranty
which is detailed in Atmels Terms and Conditions located on the Companys web site. The Company assumes no responsibility for any errors
which may appear in this document, reserves the right to change devices or specifications detailed herein at any time without notice, and does
not make any commitment to update the information contained herein. No licenses to patents or other intellectual property of Atmel are granted
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1367C01/02/0M