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An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

OPA348

OPA2348

OPA4348

SBOS213H –NOVEMBER 2001–REVISED NOVEMBER 2016

OPAx348 1-MHz, 45-µA, CMOS, Rail-to-Rail

Operational Amplifiers

1 Features

1• Low IQ: 45 µA (Typical)

• Rail-To-Rail Input and Output

• Single Supply: 2.1 V to 5.5 V

• Input Bias Current: 0.5 pA

•Micro Size Packages:

– 5-Pin SC70

– 8-Pin SOT-23

– 14-Pin TSSOP

• Excellent Bandwidth-to-Power Consumption

Trade-off

• Number of Channels:

– OPA348: 1

– OPA2348: 2

– OPA4348: 4

2 Applications

• Portable Equipment

• Battery-Powered Equipment

• Smoke Alarms

• CO Detectors

• Medical Instrumentation

3 Description

The OPAx348 series of amplifiers are single-supply,

low-power, CMOS operational amplifiers. Featuring

an extended bandwidth of 1 MHz, and a supply

current of 45 µA, the OPAx348 series is useful for

low-power applications on single supplies of 2.1 V to

5.5 V.

A low supply current of 45 µA and an input bias

current of 0.5 pA, makes the OPAx348 series an

optimal candidate for low-power applications such as

smoke detectors and other high-impedance sensors.

The OPA348 is available in the miniature 5-pin SC70

(SOT), 5-pin SOT-23 (SOT), and 8-pin SO (SOIC)

packages. The OPA2348 is available in 8-pin SOT-23

(SOT) and 8-pin SO (SOIC) packages, and the

OPA4348 is offered in space-saving 14-pin TSSOP

and 14-pin SO (SOIC) packages. The extended

temperature range of –40°C to +125°C over all

supply voltages offers design flexibility.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)

OPA348 SOIC (8) 4.90 mm × 3.91 mm

SOT-23 (5) 2.90 mm × 1.60 mm

SC70 (5) 2.00 mm × 1.25 mm

OPA2348 SOIC (8) 4.90 mm × 3.91 mm

SOT-23 (8) 2.90 mm × 1.63 mm

VSSOP (8) 3.00 mm × 3.00 mm

OPA4348 SOIC (14) 8.65 mm × 3.91 mm

TSSOP (14) 5.00 mm × 4.40 mm

(1) For all available packages, see the orderable addendum at

the end of the data sheet.

ADC Input Driver

OPA348

OPA2348

OPA4348

SBOS213H –NOVEMBER 2001–REVISED NOVEMBER 2016

www.ti.com

Product Folder Links: OPA348 OPA2348 OPA4348

Table of Contents

1 Features.................................................................. 1

2 Applications ........................................................... 1

3 Description............................................................. 1

4 Revision History..................................................... 2

5 Pin Configuration and Functions......................... 3

6 Specifications......................................................... 6

6.1 Absolute Maximum Ratings ...................................... 6

6.2 ESD Ratings ............................................................ 6

6.3 Recommended Operating Conditions....................... 6

6.4 Thermal Information: OPA348 .................................. 7

6.5 Thermal Information: OPA2348 ................................ 7

6.6 Thermal Information: OPA4348 ................................ 7

6.7 Electrical Characteristics........................................... 7

6.8 Typical Characteristics.............................................. 9

7 Detailed Description............................................ 12

7.1 Overview ................................................................ 12

7.2 Functional Block Diagram....................................... 12

7.3 Feature Description ................................................ 12

7.4 Device Functional Modes........................................ 15

8 Application and Implementation ........................ 16

8.1 Application Information............................................ 16

8.2 Typical Application.................................................. 18

9 Power Supply Recommendations...................... 21

10 Layout................................................................... 21

10.1 Layout Guidelines ................................................. 21

10.2 Layout Example .................................................... 22

11 Device and Documentation Support................. 23

11.1 Device Support .................................................... 23

11.2 Documentation Support ........................................ 24

11.3 Receiving Notification of Documentation Updates 24

11.4 Related Links ........................................................ 24

11.5 Receiving Notification of Documentation Updates 24

11.6 Community Resources.......................................... 24

11.7 Trademarks........................................................... 24

11.8 Electrostatic Discharge Caution............................ 25

11.9 Glossary................................................................ 25

12 Mechanical, Packaging, and Orderable

Information........................................................... 25

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision G (March 2013) to Revision H Page

• Added ESD Ratings table, Feature Description section, Device Functional Modes,Application and Implementation

section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and

Mechanical, Packaging, and Orderable Information section.................................................................................................. 1

• Changed OPA348 DCK package designator from SOT to SC70 to match Package Option Addendum information .......... 3

• Deleted Lead temperature specification from Absolute Maximum Ratings table .................................................................. 6

• Reformatted Thermal Information table note ......................................................................................................................... 7

• Changed second and third paragraphs of Driving A/D Converters section to eliminate redundancy.................................. 17

Changes from Revision F (October 2012) to Revision G Page

• Changed 2nd footnote for Absolute Maximum Ratings table................................................................................................. 6

Changes from Revision E (September 2012) to Revision F Page

• Deleted Packaging and Ordering information table data ...................................................................................................... 1

V+

OUT

+IN

V-

-IN

V+

OUT

-IN

+IN

V-

V+

-IN

OUT

V-

+IN

OPA348

OPA2348

OPA4348

www.ti.com

SBOS213H –NOVEMBER 2001–REVISED NOVEMBER 2016

Product Folder Links: OPA348 OPA2348 OPA4348

5 Pin Configuration and Functions

OPA348 D Package

8-Pin SOIC

Top View

OPA348 DBV Package

5-Pin SOT-23

Top View

OPA348 DCK Package

5-Pin SC70 (Micro size)

Top View

Pin Functions: OPA348

NAME PIN I/O DESCRIPTION

DBV

(SOT-23) DCK

(SC70) D (SOIC)

–IN 4 3 2 I Negative (inverting) input

+IN 3 1 3 I Positive (noninverting) input

NC — — 1, 5, 8 — No internal connection (can be left floating)

OUT 1 4 6 O Output

V– 2 2 4 — Negative (lowest) power supply

V+ 5 5 7 — Positive (highest) power supply

V+

OUT B

-IN B

+IN B

OUT A

-IN A

+IN A

V-

OPA348

OPA2348

OPA4348

SBOS213H –NOVEMBER 2001–REVISED NOVEMBER 2016

www.ti.com

Product Folder Links: OPA348 OPA2348 OPA4348

OPA2348 D, DCN, and DGK Packages

8-Pin SOIC, SOT, and VSSOP

Top View

Pin Functions: OPA2348

PIN I/O DESCRIPTION

NAME D (SOIC) DCN

(SOT-23) DGK

(VSSOP)

–IN A 2 2 2 I Inverting input, channel A

–IN B 6 6 6 I Inverting input, channel B

+IN A 3 3 3 I Noninverting input, channel A

+IN B 5 5 5 I Noninverting input, channel B

OUT A 1 1 1 O Output, channel A

OUT B 7 7 7 O Output, channel B

V– 4 4 4 — Negative (lowest) power supply

V+ 8 8 8 — Positive (highest) power supply

OUT D

IN D

+IN D

V

+IN C

IN C

OUT C

OUTA

INA

+INA

V+

+IN B

IN B

OUT B

A D

B C

OPA348

OPA2348

OPA4348

www.ti.com

SBOS213H –NOVEMBER 2001–REVISED NOVEMBER 2016

Product Folder Links: OPA348 OPA2348 OPA4348

OPA4348 D and PW Packages

14-Pin SOIC and TSSOP

Top View

Pin Functions: OPA4348

PIN I/O DESCRIPTION

NAME D (SOIC) PW

(TSSOP)

–IN A 2 2 I Inverting input, channel A

–IN B 6 6 I Inverting input, channel B

–IN C 9 9 I Inverting input, channel C

–IN D 13 13 I Inverting input, channel D

+IN A 3 3 I Noninverting input, channel A

+IN B 5 5 I Noninverting input, channel B

+IN C 10 10 I Noninverting input, channel C

+IN D 12 12 I Noninverting input, channel D

OUT A 1 1 O Output, channel A

OUT B 7 7 O Output, channel B

OUT C 8 8 O Output, channel C

OUT D 14 14 O Output, channel D

V– 11 11 — Negative (lowest) power supply

V+ 4 4 — Positive (highest) power supply

OPA348

OPA2348

OPA4348

SBOS213H –NOVEMBER 2001–REVISED NOVEMBER 2016

www.ti.com

Product Folder Links: OPA348 OPA2348 OPA4348

(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may

degrade device reliability. These are stress ratings only. Functional operation of the device at these conditions, or beyond the specified

operating conditions, is not implied.

(2) Input terminals are not diode-clamped to the power-supply rails. Input signals that can swing more than 0.5 V beyond the supply rails

must be current-limited to 10 mA or less.

(3) Short-circuit to ground, one amplifier per package.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN MAX UNIT

Voltage Supply voltage, VS= (V+) – (V–) 7.5 V

Signal input terminals, voltage(2) (V–) – 0.5 (V+) + 0.5

Current Signal input terminals, current(2) 10 mA

Output short-circuit(3) Continuous

Temperature Junction, TJ150 °COperating, TA–65 150

Storage, Tstg –65 150

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings VALUE UNIT

V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V

Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±500

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT

Supply voltage 2.1 5.5 V

Specified temperature –40 125 °C

OPA348

OPA2348

OPA4348

www.ti.com

SBOS213H –NOVEMBER 2001–REVISED NOVEMBER 2016

Product Folder Links: OPA348 OPA2348 OPA4348

(1) For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics (SPRA953).

6.4 Thermal Information: OPA348

THERMAL METRIC(1) OPA348

UNITDBV (SOT-23) DCK (SC70) D (SOIC)

5 PINS 5 PINS 8 PINS

RθJA Junction-to-ambient thermal resistance 229 267 142 °C/W

RθJC(top) Junction-to-case (top) thermal resistance 99 81 90 °C/W

RθJB Junction-to-board thermal resistance 55 55 83 °C/W

ψJT Junction-to-top characterization parameter 7.7 1.2 40 °C/W

ψJB Junction-to-board characterization parameter 54 54 82 °C/W

RθJC(bot) Junction-to-case (bottom) thermal resistance — — — °C/W

(1) For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics (SPRA953).

6.5 Thermal Information: OPA2348

THERMAL METRIC(1) OPA2348

UNITD (SOIC) DGK (VSSOP) DCN (SOT-23)

8 PINS 8 PINS 8 PINS

RθJA Junction-to-ambient thermal resistance 134 191 147 °C/W

RθJC(top) Junction-to-case (top) thermal resistance 90 83 115 °C/W

RθJB Junction-to-board thermal resistance 79 112 32 °C/W

ψJT Junction-to-top characterization parameter 30 18 38 °C/W

ψJB Junction-to-board characterization parameter 78 110 33 °C/W

RθJC(bot) Junction-to-case (bottom) thermal resistance — — — °C/W

(1) For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics (SPRA953).

6.6 Thermal Information: OPA4348

THERMAL METRIC(1) OPA4348

UNITD (SOIC) PW (TSSOP)

14 PINS 14 PINS

RθJA Junction-to-ambient thermal resistance 78 121 °C/W

RθJC(top) Junction-to-case (top) thermal resistance 35 49 °C/W

RθJB Junction-to-board thermal resistance 33 63 °C/W

ψJT Junction-to-top characterization parameter 7 5.9 °C/W

ψJB Junction-to-board characterization parameter 33 62 °C/W

RθJC(bot) Junction-to-case (bottom) thermal resistance — — °C/W

6.7 Electrical Characteristics

at VS= 2.5 V to 5.5 V, TA= 25°C, RL= 100 kΩconnected to VS/ 2, and VOUT = VS/ 2 (unless otherwise noted)

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

OFFSET VOLTAGE

VOS Input offset voltage VS= 5 V, VCM = (V–) + 0.8 V 1 5 mV

VS= 5 V, VCM = (V–) + 0.8 V,

at TA= –40°C to 125°C 6

dVOS /dT Input offset voltage drift At TA= –40°C to 125°C 4 µV/°C

PSRR Input offset voltage versus power supply VS= 2.5 V to 5.5 V, VCM < (V+) – 1.7 V 60 175 µV/V

At TA= –40°C to 125°C, VS= 2.5 V to 5.5 V,

VCM < (V+) – 1.7 V 300

Channel separation At dc 0.2 µV/V

At f = 1 kHz 134 dB

INPUT VOLTAGE RANGE

VCM Common-mode voltage range (V–) – 0.2 (V+) + 0.2 V

OPA348

OPA2348

OPA4348

SBOS213H –NOVEMBER 2001–REVISED NOVEMBER 2016

www.ti.com

Product Folder Links: OPA348 OPA2348 OPA4348

Electrical Characteristics (continued)

at VS= 2.5 V to 5.5 V, TA= 25°C, RL= 100 kΩconnected to VS/ 2, and VOUT = VS/ 2 (unless otherwise noted)

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

CMRR Common-mode rejection ratio

(V–) – 0.2 V < VCM < (V+) – 1.7 V 70 82

(V–) < VCM < (V+) – 1.7 V,

at TA= –40°C to 125°C 66

VS= 5.5 V, (V–) – 0.2 V < VCM < (V+) + 0.2 V 60 71

VS= 5.5 V, (V–) < VCM < (V+),

at TA= –40°C to 125°C 56

INPUT BIAS CURRENT

IBInput bias current ±0.5 ±10 pA

IOS Input offset current ±0.5 ±10 pA

INPUT IMPEDANCE

Differential 1013 || 3 Ω|| pF

Common-mode 1013 || 6 Ω|| pF

NOISE

Input voltage noise VCM < (V+) – 1.7 V, f = 0.1 Hz to 10 Hz 10 µVPP

enInput voltage noise density VCM < (V+) – 1.7 V, f = 1 kHz 35 nV/Hz

inInput current noise density VCM < (V+) – 1.7 V, f = 1 kHz 4 fA/Hz

OPEN-LOOP GAIN

AOL Open-loop voltage gain

VS= 5 V, RL= 100 kΩ,

0.025 V < VO< 4.975 V 94 108

VS= 5 V, RL= 100 kΩ,

0.025 V < VO< 4.975 V,

at TA= –40°C to 125°C 90

VS= 5 V, RL= 5 kΩ,

0.125 V < VO< 4.875 V 90 98

VS= 5 V, RL= 5 kΩ, 0.125 V < VO< 4.875 V,

at TA= –40°C to 125°C 88

OUTPUT

Voltage output swing from rail

RL= 100 kΩ, AOL > 94 dB 18 25

RL= 100 kΩ, AOL > 90 dB,

at TA= –40°C to 125°C 25

RL= 5 kΩ, AOL > 90 dB 100 125

RL= 5 kΩ, AOL > 88 dB,

at TA= –40°C to 125°C 125

ISC Short-circuit current ±10 mA

CLOAD Capacitive load drive See Typical Characteristics

FREQUENCY RESPONSE

GBP Gain-bandwidth product CL= 100 pF 1 MHz

SR Slew rate CL= 100 pF, G = +1 0.5 V/µs

tSSettling time, 0.1% CL= 100 pF, VS= 5.5 V, 2-V Step, G = +1 5 µs

Settling time, 0.01% CL= 100 pF, VS= 5.5 V, 2-V Step, G = +1 7

Overload recovery time CL= 100 pF, VIN × Gain > VS1.6 µs

THD+N Total harmonic distortion + noise CL= 100 pF, VS= 5.5 V, VO= 3 VPP,

G = +1, f = 1 kHz 0.0023%

POWER SUPPLY

VSSpecified voltage 2.5 5.5 V

Operating voltage 2.1 5.5 V

IQQuiescent current (per amplifier) IO= 0 mA 45 65 µA

IO= 0 mA, at TA= –40°C to 125°C 75

Quiescent Current ( A)m

Short-Circuit Current (mA)

Supply Voltage (V)

2.5 3 3.5 4 4.5 5 5.5

ISC

Output Voltage Swing (V)

Output Current (mA)

5 10

-40 C

-40 C°

+125 C°

+25 C°

V = 2.5 V

S±

+25 C°

15 20

2.5

1.5

0.5

-0.5

-1

-1.5

-2

-2.5

Sourcing Current

Sinking Current

Output Voltage (V )

Frequency (Hz)

1 k 10 k 1 M100 k 10 M

V = 5.5 V

V = 5 V

V = 2.5 V

Channel Separation (dB)

Frequency (Hz)

100 1k 10k 100k 1M 10M

140

120

100

0.1

Open-Loop Gain (dB)

-45

-90

-135

-180

Phase ( )

Frequency (Hz)

1 10010 10k1k 100k 1M 10M

140

120

100

-20

Gain

Phase

PSRR, CMRR (dB)

Frequency (Hz)

100 1k 10k 100k 1M 10M

100

PSRR

CMRR

OPA348

OPA2348

OPA4348

www.ti.com

SBOS213H –NOVEMBER 2001–REVISED NOVEMBER 2016

Product Folder Links: OPA348 OPA2348 OPA4348

6.8 Typical Characteristics

at TA= 25°C, RL= 100 kΩconnected to VS/ 2, and VOUT = VS/ 2 (unless otherwise noted)

Figure 1. Open-Loop Gain and Phase vs Frequency Figure 2. PSRR and CMRR vs Frequency

Figure 3. Maximum Output Voltage vs Frequency Figure 4. Channel Separation vs Frequency

Figure 5. Quiescent and Short-Circuit Current vs Supply

Voltage Figure 6. Output Voltage Swing vs Output Current

-6-5-4-3-2-1 0 1 2 3 4 5 6

Offset Voltage (mV)

Percent of Amplifiers (%)

Typical production

distribution of

packaged units.

Percentage of Amplifiers (%)

Offset Voltage Drift ( V/ C)m°

1 2 3 4 5 6 7 8 9 10 11 12

Typical production

distribution of

packaged units.

Quiescent Current ( A)m

Temperature ( C)°

ISC

Short-Circuit Current (mA)

-75 -50 -25 0 25 50 75 100 125 150

Input Bias Current (pA)

10k

100

0.1

-75

Temperature ( C)

-50 -25 0 25 50 75 100 125 150

-75

Common-Mode Rejection (dB)

Temperature ( C)°

-50 -25 0 25 50 75 100 125 150

100

V < V < (V+)- - 1.7 V

V < V < V+-CM

-75

Open-Loop Gain and

Power-Supply Rejection (dB)

Temperature ( C)°

-50 -25 0 25 50 75 100 125 150

130

120

110

100

A , R = 100 kW

OL L

A , R = 5 kW

OL L

PSRR

OPA348

OPA2348

OPA4348

SBOS213H –NOVEMBER 2001–REVISED NOVEMBER 2016

www.ti.com

Product Folder Links: OPA348 OPA2348 OPA4348

Typical Characteristics (continued)

at TA= 25°C, RL= 100 kΩconnected to VS/ 2, and VOUT = VS/ 2 (unless otherwise noted)

Figure 7. Common-Mode Rejection vs Temperature Figure 8. Open-Loop Gain and PSRR vs Temperature

Figure 9. Quiescent and Short-Circuit Current vs

Temperature Figure 10. Input Bias (IB) Current vs Temperature

Figure 11. Offset Voltage Production Distribution Figure 12. Offset Voltage Drift Magnitude Production

Distribution

Voltage Noise (nV )

ÖHz

Current Noise (fA )

ÖHz

Frequency (Hz)

10 100 1k 10k 100k

10k

100

Total Harmonic Distortion + Noise (%)

Frequency (Hz)

100 1k 10k 100k

1.000

0.100

0.010

0.001

20mV/div

2 s/divm

500mV/div

10 s/divm

Overshoot (%)

Load Capacitance (pF)

10 100 1 k 10 k

G = 5 V/V, R = 100 k± W

Small-Signal Overshoot (%)

Load Capacitance (pF)

100 1 k 10 k

G = +1 V/V, R = 100 kW

G = 1 V/V, R = 5 kW- FB

G = 1 V/V, R = 100 k- W

OPA348

OPA2348

OPA4348

www.ti.com

SBOS213H –NOVEMBER 2001–REVISED NOVEMBER 2016

Product Folder Links: OPA348 OPA2348 OPA4348

Typical Characteristics (continued)

at TA= 25°C, RL= 100 kΩconnected to VS/ 2, and VOUT = VS/ 2 (unless otherwise noted)

Figure 13. Small-Signal Overshoot vs Load Capacitance Figure 14. Percent Overshoot vs Load Capacitance

G = +1 V/V, RL= 100 kΩ, CL= 100 pF

Figure 15. Small-Signal Step Response

G = +1 V/V, RL= 100 kΩ, CL= 100 pF

Figure 16. Large-Signal Step Response

Figure 17. Input Current and Voltage Noise Spectral Density

vs Frequency Figure 18. Total Harmonic Distortion + Noise vs Frequency





+IN

IN

OUT





NCH Input

Stage

PCH Input

Stage

Output

Stage

Bias Circuitry Folded

Cascode and

Gain Stage

V+

V

OPA348

OPA2348

OPA4348

SBOS213H –NOVEMBER 2001–REVISED NOVEMBER 2016

www.ti.com

Product Folder Links: OPA348 OPA2348 OPA4348

7 Detailed Description

7.1 Overview

The OPAx348 series op amps are unity-gain stable and suitable for a wide range of general-purpose

applications. The OPAx348 series features wide bandwidth with rail-to-rail input and output for increased

dynamic range.

7.2 Functional Block Diagram

7.3 Feature Description

7.3.1 Operating Voltage

The OPAx348 series op amps are fully specified and tested from 2.5 V to 5.5 V. However, supply voltage may

range from 2.1 V to 5.5 V. Parameters are tested over the specified supply range which is an unique feature of

the OPAx348 series. All temperature specifications apply from –40°C to +125°C. Most behavior remains virtually

unchanged throughout the full operating voltage range. Parameters that vary significantly with operating voltages

or temperature are shown in the Typical Characteristics section.

1V/div

G = +1V/V, V = +5V

10 s/divm

VIN

VOUT

-0.5

Offset Voltage (mV)

Common-Mode Voltage (V)

OFFSET VOLTAGE

vs FULL COMMON-MODE VOLTAGE RANGE

V-

0.5 1.51 2.52 3.53 4.5 54 5.5

1.5

0.5

-0.5

-1

-1.5

-2

V+

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OPA2348

OPA4348

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SBOS213H –NOVEMBER 2001–REVISED NOVEMBER 2016

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Feature Description (continued)

7.3.2 Common-Mode Voltage Range

The input common-mode voltage range of the OPA348 series extends 200 mV beyond the supply rails. This

extended range is achieved with a complementary input stage which is a N-channel input differential pair in

parallel with a P-channel differential pair. The N-channel pair is active for input voltages close to the positive rail,

typically (V+) – 1.2 V to 300 mV above the positive supply, while the P-channel pair is on for inputs from 300 mV

below the negative supply to approximately (V+) – 1.4 V. There is a small transition region, typically (V+) – 1.4 V

to (V+) – 1.2 V, in which both pairs are on. This 200-mV transition region, shown in Figure 19, can vary ±300 mV

with process variation. Thus, the transition region (both stages on) ranges from (V+) – 1.7 V to (V+) – 1.5 V on

the low end, up to (V+) – 1.1 V to (V+) – 0.9 V on the high end. Within the 200-mV transition region PSRR,

CMRR, offset voltage, offset drift, and THD may be degraded compared to operation outside this region.

Figure 19. Behavior of Typical Transition Region at Room Temperature

7.3.3 Rail-To-Rail Input

The input common-mode range extends from (V–) – 0.2 V to (V+) + 0.2 V. For normal operation, inputs must be

limited to this range. The absolute maximum input voltage is 500 mV beyond the supplies. Inputs greater than

the input common-mode range but less than the maximum input voltage, while not valid, do not cause any

damage to the op amp. Unlike some other op amps, if input current is limited the inputs may go beyond the

power supplies without phase inversion; see Figure 20.

Figure 20. OPA348: No Phase Inversion with Inputs Greater Than The Power-Supply Voltage

10 toW

20 W

OPA348

V+

VIN

VOUT

RLCL

5 kW

OPA348

10 mA max

+5 V

VIN

VOUT

IOVERLOAD

OPA348

OPA2348

OPA4348

SBOS213H –NOVEMBER 2001–REVISED NOVEMBER 2016

www.ti.com

Product Folder Links: OPA348 OPA2348 OPA4348

Feature Description (continued)

Normally, input currents are 0.5 pA. However, large inputs (greater than 500 mV beyond the supply rails) can

cause excessive current to flow in or out of the input pins. Therefore, as well as keeping the input voltage below

the maximum rating, it is also important to limit the input current to less than 10 mA. This limiting is easily

accomplished with an input voltage resistor, as shown in Figure 21.

Figure 21. Input Current Protection for Voltages Exceeding the Supply Voltage

7.3.4 Rail-To-Rail Output

A class AB output stage with common-source transistors is used to achieve rail-to-rail output. This output stage is

capable of driving 5-kΩloads connected to any potential between V+ and ground. For light resistive loads

(> 100 kΩ), the output voltage can typically swing to within 18 mV from supply rail. With moderately resistive

loads (10 kΩto 50 kΩ), the output voltage can typically swing to within 100 mV of the supply rails while

maintaining high open-loop gain (see Figure 6).

7.3.5 Capacitive Load and Stability

The OPA348 in a unity-gain configuration can directly drive up to 250 pF pure capacitive load. Increasing the

gain enhances the ability of the amplifier to drive greater capacitive loads (see Figure 13). In unity-gain

configurations, capacitive load drive can be improved by inserting a small (10-Ωto 20-Ω) resistor, RS, in series

with the output, as shown in Figure 22. This small resistor significantly reduces ringing while maintaining dc

performance for purely capacitive loads. However, if there is a resistive load in parallel with the capacitive load, a

voltage divider is created, introducing a direct current (dc) error at the output and slightly reducing the output

swing. The error introduced is proportional to the ratio RS/ RL, and is generally negligible.

Figure 22. Series Resistor in Unity-Gain Buffer Configuration Improves Capacitive Load Drive

OPA348

VIN

VOUT

CFB

CIN

OPA348

OPA2348

OPA4348

www.ti.com

SBOS213H –NOVEMBER 2001–REVISED NOVEMBER 2016

Product Folder Links: OPA348 OPA2348 OPA4348

Feature Description (continued)

In unity-gain inverter configuration, phase margin can be reduced by the reaction between the capacitance at the

op amp input, and the gain setting resistors, thus degrading capacitive load drive. Best performance is achieved

by using small valued resistors. For example, when driving a 500-pF load, reducing the resistor values from

100 kΩto 5 kΩdecreases overshoot from 55% to 13% (see Figure 13). However, when large valued resistors

cannot be avoided, a small (4-pF to 6-pF) capacitor, CFB, can be inserted in the feedback, as shown in Figure 23.

This configuration significantly reduces overshoot by compensating the effect of capacitance, CIN, which includes

the amplifier input capacitance and printed circuit board (PCB) parasitic capacitance.

Figure 23. Improving Capacitive Load Drive

7.4 Device Functional Modes

The OPAx348 has a single functional mode and is operational when the power-supply voltage is greater than

2.1 V (±1.05 V). The maximum power supply voltage for the OPAx348 is 5.5 V (±2.75 V).

5 V

1 V/ div

0 V

G = +1 V / V, V = 5 V

20 s / divm

Output (Inverted on Scope)

OPA348

OPA2348

OPA4348

SBOS213H –NOVEMBER 2001–REVISED NOVEMBER 2016

www.ti.com

Product Folder Links: OPA348 OPA2348 OPA4348

8 Application and Implementation

NOTE

Information in the following applications sections is not part of the TI component

specification, and TI does not warrant its accuracy or completeness. TI’s customers are

responsible for determining suitability of components for their purposes. Customers should

validate and test their design implementation to confirm system functionality.

8.1 Application Information

The OPA348 amplifier is a single-supply, CMOS op amp with 1-MHz unity-gain bandwidth and supply current of

only 45 µA. Its performance is optimized for a lower power (2.1 V to 5.5 V), single-supply application, with its

input common-mode voltage linear range extending 200 mV beyond the rails and the output voltage swing within

25 mV of either rail.

The OPA348 series features wide bandwidth and unity-gain stability with rail-to-rail input and output for increased

dynamic range. Figure 24 shows the input and output waveforms for the OPA348 in unity-gain configuration.

Operation is from a single 5-V supply with a 100-kΩload connected to VS/ 2. The input is a 5-VPP sinusoid.

Output voltage is approximately 4.98 VPP.

Power-supply pins must be bypassed with 0.01-µF ceramic capacitors.

Figure 24. OPA348 Features Rail-to-Rail Input and Output

33 pF

V+

GND

-IN

+IN

DCLOCK

Serial

Interface

1000 pF

1.5 kW

20 kW

100 kW

150 kW

510 kW

51 kW

DOUT

VREF

V+ = +2.7 V to 5 V

CS/SHDN

1000 pF

Electret

Microphone(1)

G = 100

Passband 300 Hz to 3 kHz

1 MW

NOTE: (1) Electret microphone

ADS7822

12-Bit A/D

1/2

OPA2348

1/2

OPA2348

ADS7822

12-Bit A/D

DCLOCK

DOUT

CS/SHDN

OPA348

+5 V

VIN

V+

+In

-In

VREF

4GND

Serial

Interface

0.1 Fm0.1 Fm

NOTE: A/D Input = 0 to VREF

V = 0 V to 5 V for

0 V to 5 V output.

RC network filters high frequency noise.

500 W

3300 pF

OPA348

OPA2348

OPA4348

www.ti.com

SBOS213H –NOVEMBER 2001–REVISED NOVEMBER 2016

Product Folder Links: OPA348 OPA2348 OPA4348

Application Information (continued)

8.1.1 Driving A/D Converters

The OPA348 series op amps are optimized for driving medium-speed sampling analog-to-digital converters

(ADCs). The OPA348 op amps buffer the ADC input capacitance and resulting charge injection while providing

signal gain.

Figure 25 shows the OPA348 in a basic noninverting configuration driving the ADS7822. The ADS7822 is a

12-bit, microPOWER sampling converter in the MSOP-8 package. When used with the low-power, miniature

packages of the OPA348, the combination is ideal for space-limited, low-power applications. In this configuration,

an RC network at the ADC input can be used to provide both an anti-aliasing filter and charge injection current.

Figure 25. OPA348 in Noninverting Configuration Driving ADS7822

Figure 26 illustrates the OPA2348 driving an ADS7822 in a speech-bandpass filtered data acquisition system.

This small, low-cost solution provides the necessary amplification and signal conditioning to interface directly with

an electret microphone. This circuit operates with VS= 2.7 V to 5 V with less than 250-µA typical quiescent

current.

Figure 26. OPA2348 as a Speech-Bandpass Filtered Data Acquisition System

= 1 + R

(

1 + sR C

1 1

(

OUT

f =

-3 dB

2 R Cp1 1

OPA348

RGRF

VOUT

VIN

OPA348

OPA2348

OPA4348

SBOS213H –NOVEMBER 2001–REVISED NOVEMBER 2016

www.ti.com

Product Folder Links: OPA348 OPA2348 OPA4348

8.2 Typical Application

Figure 27 shows the OPA348 in a typical noninverting application with input signal bandwidth limited by the input

low-pass filter.

Figure 27. Single-Pole, Low-Pass Filter

Equation 1 and Equation 2 show the relationships for the low-pass cutoff frequency and the low frequency gain

and the passive elements surrounding the amplifier.

(1)

(2)

8.2.1 Design Requirements

When receiving low-level signals, limiting the bandwidth of the incoming signals into the system is often required.

The simplest way to establish this limited bandwidth is to place an RC filter at the noninverting terminal of the

amplifier, as shown in Figure 27. If a steeper attenuation level is required, a two-pole or higher-order filter may be

used.

8.2.2 Detailed Design Procedure

The design goals for this circuit include these parameters:

• A noninverting gain of 10 V/V (20 dB)

• Design a single-pole response circuit with –3-dB roll-off at 15.9 kHz and 159 Hz

• Modify the design to increase attenuation level to –40-dB/decade (Sallen-Key Filter)

Use these design values:

• C1= 0 nF, 10 nF, 1 µF

• R1=1kΩ

• RG= 10 kΩ

• RF= 90 kΩ

OPA348

RGRF

VOUT

VIN

-20

-40

Gain = V /V (dB)

OUT IN

1 10 100 1 k 10 k 100 k 1 M

Frequency (Hz)

C = 1 F

C = 10 nF

C = 0

f =

2 R Cp1 1

2 1p

31-6

´ ´

f =

2 R Cp1 1

2 1p

31-8

´ ´

OPA348

OPA2348

OPA4348

www.ti.com

SBOS213H –NOVEMBER 2001–REVISED NOVEMBER 2016

Product Folder Links: OPA348 OPA2348 OPA4348

Typical Application (continued)

Figure 28 shows how the output voltage of OPA348 changes over frequency depending on the value of C1with a

constant R1of 1 kΩ. Without any filtering of the input signal (C1= 0), the –3-dB effective bandwidth is a function

of the OPA348 unity-gain bandwidth and closed-loop gain, f(–3dB) = UGBW/ACL, where ACL is closed-loop gain

and UGBW denotes unity-gain bandwidth. Thus, for a closed-loop gain = 10, f(–3dB) = 1 MHz/10 =100 kHz; refer

to Figure 28.

To further limit the output bandwidth, an appropriate choice of C1must be made: for C1= 10 nF,

= 15.9 kHz.

To further limit the bandwidth, a larger C1must be used:

choosing C1= 1 µF, = 159 Hz. See Figure 28.

8.2.3 Application Curve

Figure 28. OPA348 Single-Pole AC Gain vs Frequency Response

If even more attenuation is required, a multiple pole filter is required. The Sallen-Key filter may be used for this

task, as shown in Figure 29. For best results, the amplifier must have effective bandwidth that is at least 10 times

higher than the filter cutoff frequency. Failure to follow this guideline results in a phase shift of the amplifier,

which in turn leads to lower precision of the filter bandwidth. Additionally, in order to minimize the loading effect

between multiple RC pairs on overall the filter cutoff frequency, choose R = 10 × R1and C2= C1/10; see

Figure 29.

Figure 29. Two-Pole, Low-Pass Sallen-Key Filter

-20

-40

Gain = V /V (dB)

OUT IN

1 10 100 1 k 10 k 100 k 1 M

Frequency (Hz)

C = 1 F,

1mC = 0.1 F

R = 1 k , R = 10 k

1 2

W W

C = 10 nF,

1C = 1 nF

R = 1 k , R = 10 k

1 2

W W

f =

2 R Cp1 1R C

2 2

2p1 1 1 1

3 6 4 7- -

´ ´ ´

f =

2 R Cp1 1R C

2 2

2p1 1 1 1

3 8 4 9- -

´ ´ ´

G =

R + R

G F

=G(2 f )

s + 2 (2 s + (2

2p pf ) f )

c c

OUT(s)

IN(s)

f =

2 R Cp1 1R C

2 2

OPA348

OPA2348

OPA4348

SBOS213H –NOVEMBER 2001–REVISED NOVEMBER 2016

www.ti.com

Product Folder Links: OPA348 OPA2348 OPA4348

Typical Application (continued)

Equation 3,Equation 4, and Equation 5 show the relationships for low-pass cutoff frequency, filter transfer

function, and low frequency gain, and the surrounding passive elements.

(3)

(4)

(5)

Use these design values:

• C1= 10 nF and C2= 1 nF

• R1=1kΩand R2= 10 kΩ

• RG= 10 kΩ

• RF= 90 kΩ

Figure 30 shows the Sallen-Key filter second-order response for different RC values: for R and C values above,

= 15.9 kHz.

To further limit the bandwidth, a larger RC value must be used: increasing C values 100 times, such as C1=

1 µF and C2= 0.1 µF, with unchanged resistors, results in the second-order roll-off at

= 159 Hz. Refer to Figure 30.

Figure 30. OPA348 Two-Pole, Low-Pass Sallen-Key AC Gain vs Frequency Response

OPA348

OPA2348

OPA4348

www.ti.com

SBOS213H –NOVEMBER 2001–REVISED NOVEMBER 2016

Product Folder Links: OPA348 OPA2348 OPA4348

9 Power Supply Recommendations

The OPAx348 is specified for operation from 2.1 V to 5.5 V (±1.05 V to ±2.75 V); many specifications apply from

–40°C to +125°C. Parameters that can exhibit significant variance with regard to operating voltage or

temperature are presented in the Typical Characteristics.

CAUTION

Supply voltages larger than 5.5 V can permanently damage the device (see the

Absolute Maximum Ratings table).

Place 0.1-µF bypass capacitors close to the power-supply pins to reduce errors coupling in from noisy or high

impedance power supplies. For more detailed information on bypass capacitor placement, see Layout.

10 Layout

10.1 Layout Guidelines

For best operational performance of the device, use good PCB layout practices, including:

• Connect low equivalent series resistance (ESR), 0.1-µF ceramic bypass capacitors between each supply pin

and ground, placed as close to the device as possible. A single bypass capacitor from V+ to ground is

applicable for single-supply applications.

– Noise can propagate into analog circuitry through the power pins of the circuit as a whole and op amp

itself. Bypass capacitors are used to reduce the coupled noise by providing low-impedance power sources

local to the analog circuitry.

• Make sure to physically separate digital and analog grounds paying attention to the flow of the ground

current. Separate grounding for analog and digital portions of circuitry is one of the simplest and most-

effective methods of noise suppression. One or more layers on multilayer PCBs are usually devoted to

ground planes. A ground plane helps distribute heat and reduces EMI noise pickup.

• In order to reduce parasitic coupling, run the input traces as far away from the supply or output traces as

possible. If these traces cannot be kept separate, crossing the sensitive trace perpendicular is much better as

opposed to in parallel with the noisy trace.

• Place the external components as close to the device as possible. As shown in Figure 31, keeping RF and

RG close to the inverting input minimizes parasitic capacitance.

• Keep the length of input traces as short as possible. Always remember that the input traces are the most

sensitive part of the circuit.

• Consider a driven, low-impedance guard ring around the critical traces. A guard ring can significantly reduce

leakage currents from nearby traces that are at different potentials.

• Clean the PCB following board assembly for best performance.

• Any precision integrated circuit may experience performance shifts due to moisture ingress into the plastic

package. After any aqueous PCB cleaning process, bake the PCB assembly to remove moisture introduced

into the device packaging during the cleaning process. A low-temperature, post-cleaning bake at 85°C for 30

minutes is sufficient for most circumstances.

N/C

±IN

+IN

V±

V+

OUTPUT

N/C

VS+

GND

VS±

GND

Ground (GND) plane on another layer

VOUT

VIN

GND

Run the input traces

as far away from

the supply lines

as possible

Use low-ESR, ceramic

bypass capacitor

Place components

close to device and to

each other to reduce

parasitic errors

Use low-ESR,

ceramic bypass

capacitor

OPA348

OPA2348

OPA4348

SBOS213H –NOVEMBER 2001–REVISED NOVEMBER 2016

www.ti.com

Product Folder Links: OPA348 OPA2348 OPA4348

10.2 Layout Example

Figure 31. Operational Amplifier Board Layout for Noninverting Configuration

OPA348

OPA2348

OPA4348

www.ti.com

SBOS213H –NOVEMBER 2001–REVISED NOVEMBER 2016

Product Folder Links: OPA348 OPA2348 OPA4348

11 Device and Documentation Support

11.1 Device Support

11.1.1 Development Support

11.1.1.1 TINA-TI™ (Free Software Download)

TINA™ is a simple, powerful, and easy-to-use circuit simulation program based on a SPICE engine. TINA-TI™ is

a free, fully-functional version of the TINA software, preloaded with a library of macro models in addition to a

range of both passive and active models. TINA-TI provides all the conventional dc, transient, and frequency

domain analysis of SPICE, as well as additional design capabilities.

Available as a free download from the Analog eLab Design Center, TINA-TI offers extensive post-processing

capability that allows users to format results in a variety of ways. Virtual instruments offer the ability to select

input waveforms and probe circuit nodes, voltages, and waveforms, creating a dynamic quick-start tool.

NOTE

These files require that either the TINA software (from DesignSoft™) or TINA-TI software

be installed. Download the free TINA-TI software from the TINA-TI folder.

11.1.1.2 DIP Adapter EVM

The DIP Adapter EVM tool provides an easy, low-cost way to prototype small surface mount devices. The

evaluation tool these TI packages: D or U (SOIC-8), PW (TSSOP-8), DGK (MSOP-8), DBV (SOT23-6, SOT23-5

and SOT23-3), DCK (SC70-6 and SC70-5), and DRL (SOT563-6). The DIP Adapter EVM may also be used with

terminal strips or may be wired directly to existing circuits.

11.1.1.3 Universal Op Amp EVM

The Universal Op Amp EVM is a series of general-purpose, blank circuit boards that simplify prototyping circuits

for a variety of device package types. The evaluation module board design allows many different circuits to be

constructed easily and quickly. Five models are offered, with each model intended for a specific package type.

PDIP, SOIC, MSOP, TSSOP and SOT-23 packages are all supported.

NOTE

These boards are unpopulated, so users must provide their own devices. TI recommends

requesting several op amp device samples when ordering the Universal Op Amp EVM.

11.1.1.4 TI Precision Designs

TI Precision Designs are analog solutions created by TI’s precision analog applications experts and offer the

theory of operation, component selection, simulation, complete PCB schematic and layout, bill of materials, and

measured performance of many useful circuits. TI Precision Designs are available online at

http://www.ti.com/ww/en/analog/precision-designs/.

11.1.1.5 WEBENCH®Filter Designer

WEBENCH® Filter Designer is a simple, powerful, and easy-to-use active filter design program. The WEBENCH

Filter Designer lets you create optimized filter designs using a selection of TI operational amplifiers and passive

components from TI's vendor partners.

Available as a web-based tool from the WEBENCH® Design Center, WEBENCH® Filter Designer allows you to

design, optimize, and simulate complete multistage active filter solutions within minutes.

OPA348

OPA2348

OPA4348

SBOS213H –NOVEMBER 2001–REVISED NOVEMBER 2016

www.ti.com

Product Folder Links: OPA348 OPA2348 OPA4348

11.2 Documentation Support

11.2.1 Related Documentation

The following documents are relevant to using the OPAx348, and recommended for reference. All are available

for download at www.ti.com unless otherwise noted.

•Hardware Pace Using Slope Detection (SLAU511).

•Mobile Phone Bank Card Reader Application Report (TIDU399).

•TPS61040 Inverter Design (SLVA008).

•Op Amp Performance Analysis (SBOA054).

•Single-Supply Operation of Operational Amplifiers (SBOA059).

•Tuning in Amplifiers (SBOA067).

11.3 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper

right corner, click on Alert me to register and receive a weekly digest of any product information that has

changed. For change details, review the revision history included in any revised document.

11.4 Related Links

Table 1 lists quick access links. Categories include technical documents, support and community resources,

tools and software, and quick access to sample or buy.

Table 1. Related Links

PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL

DOCUMENTS TOOLS &

SOFTWARE SUPPORT &

COMMUNITY

OPA348 Click here Click here Click here Click here Click here

OPA2348 Click here Click here Click here Click here Click here

OPA4348 Click here Click here Click here Click here Click here

11.5 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper

right corner, click on Alert me to register and receive a weekly digest of any product information that has

changed. For change details, review the revision history included in any revised document.

11.6 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective

contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of

Use.

TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration

among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help

solve problems with fellow engineers.

Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and

contact information for technical support.

11.7 Trademarks

TINA-TI, E2E are trademarks of Texas Instruments.

WEBENCH is a registered trademark of Texas Instruments.

TINA, DesignSoft are trademarks of DesignSoft, Inc.

All other trademarks are the property of their respective owners.

OPA348

OPA2348

OPA4348

www.ti.com

SBOS213H –NOVEMBER 2001–REVISED NOVEMBER 2016

Product Folder Links: OPA348 OPA2348 OPA4348

11.8 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

11.9 Glossary

SLYZ022 —TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

PACKAGE OPTION ADDENDUM

www.ti.com 24-Aug-2018

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead/Ball Finish

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

OPA2348AID ACTIVE SOIC D 8 75 Green (RoHS

& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 OPA

2348A

OPA2348AIDCNR ACTIVE SOT-23 DCN 8 3000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 B48

OPA2348AIDCNRG4 ACTIVE SOT-23 DCN 8 3000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 B48

OPA2348AIDCNT ACTIVE SOT-23 DCN 8 250 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 B48

OPA2348AIDCNTG4 ACTIVE SOT-23 DCN 8 250 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 B48

OPA2348AIDG4 ACTIVE SOIC D 8 75 Green (RoHS

& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 OPA

2348A

OPA2348AIDGK ACTIVE VSSOP DGK 8 80 Green (RoHS

& no Sb/Br) CU NIPDAUAG Level-2-260C-1 YEAR -40 to 125 OUTQ

OPA2348AIDGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS

& no Sb/Br) CU NIPDAUAG Level-2-260C-1 YEAR -40 to 125 OUTQ

OPA2348AIDR ACTIVE SOIC D 8 2500 Green (RoHS

& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 OPA

2348A

OPA2348AIDRG4 ACTIVE SOIC D 8 2500 Green (RoHS

& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 OPA

2348A

OPA348AID ACTIVE SOIC D 8 75 Green (RoHS

& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 OPA

348A

OPA348AIDBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 A48

OPA348AIDBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 A48

OPA348AIDBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS

& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 A48

OPA348AIDBVTG4 ACTIVE SOT-23 DBV 5 250 Green (RoHS

& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 A48

OPA348AIDCKR ACTIVE SC70 DCK 5 3000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 S48

OPA348AIDCKRG4 ACTIVE SC70 DCK 5 3000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 S48

PACKAGE OPTION ADDENDUM

www.ti.com 24-Aug-2018

Addendum-Page 2

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead/Ball Finish

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

OPA348AIDCKT ACTIVE SC70 DCK 5 250 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 S48

OPA348AIDCKTG4 ACTIVE SC70 DCK 5 250 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 S48

OPA348AIDR ACTIVE SOIC D 8 2500 Green (RoHS

& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 OPA

348A

OPA4348AID ACTIVE SOIC D 14 50 Green (RoHS

& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 OPA4348A

OPA4348AIDR ACTIVE SOIC D 14 2500 Green (RoHS

& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 OPA4348A

OPA4348AIDRG4 ACTIVE SOIC D 14 2500 Green (RoHS

& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 OPA4348A

OPA4348AIPWR ACTIVE TSSOP PW 14 2500 Green (RoHS

& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 OPA

4348A

OPA4348AIPWRG4 ACTIVE TSSOP PW 14 2500 Green (RoHS

& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 OPA

4348A

OPA4348AIPWT ACTIVE TSSOP PW 14 250 Green (RoHS

& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 OPA

4348A

OPA4348AIPWTG4 ACTIVE TSSOP PW 14 250 Green (RoHS

& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 OPA

4348A

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance

do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may

reference these types of products as "Pb-Free".

RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.

Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based

flame retardants must also meet the <=1000ppm threshold requirement.

(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

PACKAGE OPTION ADDENDUM

www.ti.com 24-Aug-2018

Addendum-Page 3

(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish

value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

OTHER QUALIFIED VERSIONS OF OPA2348, OPA348, OPA4348 :

•Automotive: OPA2348-Q1, OPA348-Q1, OPA4348-Q1

NOTE: Qualified Version Definitions:

•Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm) B0

(mm) K0

(mm) P1

(mm) W

(mm) Pin1

Quadrant

OPA2348AIDCNR SOT-23 DCN 8 3000 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

OPA2348AIDCNT SOT-23 DCN 8 250 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

OPA2348AIDGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1

OPA2348AIDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1

OPA348AIDBVR SOT-23 DBV 5 3000 180.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

OPA348AIDBVR SOT-23 DBV 5 3000 178.0 9.0 3.3 3.2 1.4 4.0 8.0 Q3

OPA348AIDBVT SOT-23 DBV 5 250 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3

OPA348AIDCKR SC70 DCK 5 3000 179.0 8.4 2.2 2.5 1.2 4.0 8.0 Q3

OPA348AIDCKT SC70 DCK 5 250 179.0 8.4 2.2 2.5 1.2 4.0 8.0 Q3

OPA348AIDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1

OPA4348AIDR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1

OPA4348AIPWR TSSOP PW 14 2500 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1

OPA4348AIPWT TSSOP PW 14 250 180.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1

PACKAGE MATERIALS INFORMATION

www.ti.com 10-Jul-2018

Pack Materials-Page 1

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

OPA2348AIDCNR SOT-23 DCN 8 3000 203.0 203.0 35.0

OPA2348AIDCNT SOT-23 DCN 8 250 203.0 203.0 35.0

OPA2348AIDGKR VSSOP DGK 8 2500 366.0 364.0 50.0

OPA2348AIDR SOIC D 8 2500 367.0 367.0 35.0

OPA348AIDBVR SOT-23 DBV 5 3000 195.0 200.0 45.0

OPA348AIDBVR SOT-23 DBV 5 3000 180.0 180.0 18.0

OPA348AIDBVT SOT-23 DBV 5 250 445.0 220.0 345.0

OPA348AIDCKR SC70 DCK 5 3000 203.0 203.0 35.0

OPA348AIDCKT SC70 DCK 5 250 203.0 203.0 35.0

OPA348AIDR SOIC D 8 2500 367.0 367.0 35.0

OPA4348AIDR SOIC D 14 2500 367.0 367.0 38.0

OPA4348AIPWR TSSOP PW 14 2500 367.0 367.0 35.0

OPA4348AIPWT TSSOP PW 14 250 210.0 185.0 35.0

PACKAGE MATERIALS INFORMATION

www.ti.com 10-Jul-2018

Pack Materials-Page 2

www.ti.com

PACKAGE OUTLINE

TYP

0.22

0.08

0.25

3.0

2.6

2X 0.95

1.9

1.45 MAX

TYP

0.15

0.00

5X 0.5

0.3

TYP

0.6

0.3

TYP

1.9

3.05

2.75

1.75

1.45

(1.1)

SOT-23 - 1.45 mm max heightDBV0005A

SMALL OUTLINE TRANSISTOR

4214839/C 04/2017

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. Refernce JEDEC MO-178.

0.2 C A B

INDEX AREA

PIN 1

GAGE PLANE

SEATING PLANE

0.1 C

SCALE 4.000

www.ti.com

EXAMPLE BOARD LAYOUT

0.07 MAX

ARROUND 0.07 MIN

ARROUND

5X (1.1)

5X (0.6)

(2.6)

(1.9)

2X (0.95)

(R0.05) TYP

4214839/C 04/2017

SOT-23 - 1.45 mm max heightDBV0005A

SMALL OUTLINE TRANSISTOR

NOTES: (continued)

4. Publication IPC-7351 may have alternate designs.

5. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

SYMM

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN

SCALE:15X

PKG

SOLDER MASK

OPENING

METAL UNDER

SOLDER MASK

DEFINED

EXPOSED METAL

METAL

SOLDER MASK

OPENING

NON SOLDER MASK

DEFINED

(PREFERRED)

SOLDER MASK DETAILS

EXPOSED METAL

www.ti.com

EXAMPLE STENCIL DESIGN

(2.6)

(1.9)

2X(0.95)

5X (1.1)

5X (0.6)

(R0.05) TYP

SOT-23 - 1.45 mm max heightDBV0005A

SMALL OUTLINE TRANSISTOR

4214839/C 04/2017

NOTES: (continued)

6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

7. Board assembly site may have different recommendations for stencil design.

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL

SCALE:15X

SYMM

PKG

www.ti.com

PACKAGE OUTLINE

TYP

0.22

0.08

0.25

3.0

2.6

2X 0.95

1.9

1.45 MAX

TYP

0.15

0.00

5X 0.5

0.3

TYP

0.6

0.3

TYP

1.9

3.05

2.75

1.75

1.45

(1.1)

SOT-23 - 1.45 mm max heightDBV0005A

SMALL OUTLINE TRANSISTOR

4214839/C 04/2017

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. Refernce JEDEC MO-178.

0.2 C A B

INDEX AREA

PIN 1

GAGE PLANE

SEATING PLANE

0.1 C

SCALE 4.000

www.ti.com

EXAMPLE BOARD LAYOUT

0.07 MAX

ARROUND 0.07 MIN

ARROUND

5X (1.1)

5X (0.6)

(2.6)

(1.9)

2X (0.95)

(R0.05) TYP

4214839/C 04/2017

SOT-23 - 1.45 mm max heightDBV0005A

SMALL OUTLINE TRANSISTOR

NOTES: (continued)

4. Publication IPC-7351 may have alternate designs.

5. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

SYMM

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN

SCALE:15X

PKG

SOLDER MASK

OPENING

METAL UNDER

SOLDER MASK

DEFINED

EXPOSED METAL

METAL

SOLDER MASK

OPENING

NON SOLDER MASK

DEFINED

(PREFERRED)

SOLDER MASK DETAILS

EXPOSED METAL

www.ti.com

EXAMPLE STENCIL DESIGN

(2.6)

(1.9)

2X(0.95)

5X (1.1)

5X (0.6)

(R0.05) TYP

SOT-23 - 1.45 mm max heightDBV0005A

SMALL OUTLINE TRANSISTOR

4214839/C 04/2017

NOTES: (continued)

6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

7. Board assembly site may have different recommendations for stencil design.

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL

SCALE:15X

SYMM

PKG

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